CN208240677U - A kind of LED packaging and display panel - Google Patents

Abstract

The utility model discloses a kind of LED packaging and display panels, comprising: substrate, force fit plate, packaging plastic and is formed in substrate front side, the pixel unit array being made of n row, m column pixel unit；Each pixel unit includes three LED luminescence chips with different luminescent colors；The setting of respective pixel unit goes out optical channel through force fit plate on force fit plate, and substrate and force fit plate are connect by pressure-sensitive adhesive, and pixel unit is located in optical channel, and optical channel forms the first reflector out, and the rim of a cup of the first reflector is higher than the upper surface of LED luminescence chip；Packaging plastic is filled in the first reflector, and covers LED luminescence chip.LED packaging provided by the utility model, manufacturing process is simple, is easy to implement the LED packaging of small size, and then reduce the spacing between pixel unit, improves the resolution ratio of display panel；The sealing performance of device is improved simultaneously, and then improves the reliability when use of display panel open air.

Description

A kind of LED packaging and display panel

Technical field

The utility model embodiment is related to LED display technique more particularly to a kind of LED packaging and display panel.

Background technique

LED display due to high gray scale, the advantages such as visible angle is big, small power consumption and customized screen shape, It is widely used in the every field such as industry, traffic, commercial advertisement, information publication.

Either indoor or outdoor, LED display all develops towards small spacing, high-resolution and high reliability.Nowadays, Indoor small space distance LED display screen has marched toward the pel spacing P1.0 epoch, and outdoor small space distance LED display screen just enters pixel In the spacing P3.0 epoch, cause the resolution ratio of outdoor LED display screen lower.In the prior art, outdoor LED packaging mostly uses greatly Discrete top surface shines PLCC (Plastic Leaded Chip Carrier, the plastic chip carrier with lead) structure.Fig. 1 It is the front wiring figure of the LED packaging of the luminous PLCC structure in discrete top surface of the prior art, Fig. 2 is that LED is encapsulated in Fig. 1 The back wiring figure of device, Fig. 3 are that sectional view of the LED packaging along the direction A-A ' should with reference to Fig. 1, Fig. 2 and Fig. 3 in Fig. 1 LED packaging includes the LED luminescence chip of Insulating frame, metallic support and three different luminescent colors.Metallic support is embedded In Insulating frame, Insulating frame includes the cup-like portion 12 of base part 11 and formation reflector, base part 11 and cup-shaped Part 12 is integrated injection molding.Metallic support includes being located at the positive part of base part 11, and the part is in reflector bottom The part of exposing forms pad, and the pin positioned at 10 back side of Insulating frame is located at 10 side wall of Insulating frame, for connect pad with The coupling part of pin.In this way, forming four pads 21,22,23 and 24 and four pins 25,26,27 and 28, three LED cores Piece is separately fixed on the first die bond pad 21, the second die bond pad 22 and third die bond pad 23, the anode of three LED chips It is connected on common-anode pad 24, the cathode of three LED chips is respectively connected to respective cathode pad.Packaging plastic 30 filling with In reflector.

It is found that the discrete top surface of the prior art shines, the LED packaging of PLCC structure is manufactured in small size above When, on the one hand since the preparation process difficulty of Insulating frame and metallic support is high, still further aspect, packaging plastic in discrete part It is small in size, cause the binding force of packaging plastic and Insulating frame on the weak side, sealing performance is bad, and waterproof performance is weaker, and reliability far reaches Less than outdoor requirement.Therefore outdoor small spacing development is more slow.

Utility model content

The utility model provides a kind of LED packaging and display panel, it is therefore intended that reduces the ruler of LED packaging It is very little, the sealing performance of LED packaging is improved, and then improve the resolution ratio and reliability when LED display panel uses outdoors.

In a first aspect, the utility model embodiment provides a kind of LED packaging, comprising:

Substrate, and be formed in substrate front side, the pixel unit array being made of n row, m column pixel unit, n and m are equal For the positive integer more than or equal to 2；Each pixel unit includes three LED luminescence chips with different luminescent colors；

Force fit plate, the setting of respective pixel unit goes out optical channel through force fit plate on force fit plate, and substrate passes through with force fit plate Pressure-sensitive adhesive connects, and pixel unit is located in optical channel, and optical channel forms the first reflector out, and the rim of a cup of the first reflector is higher than The upper surface of LED luminescence chip；

Packaging plastic, packaging plastic are filled in the first reflector, and cover LED luminescence chip.

Optionally, m=2, n=2.

Optionally, force fit plate includes the protrusion for being formed in force fit plate edge, and protrusion forms the second reflector, the The rim of a cup of two reflectors is higher than the rim of a cup of the first reflector；Packaging plastic is filled in the first reflector and the second reflector, and is covered Cover LED luminescence chip.

Optionally, the front of substrate is formed with several pads and/or metal routing, and the back side of substrate is formed with several pins And/or metal routing, pad are electrically connected by metallic vias with the corresponding pin of substrate back is located at, or by metallic vias with Metal routing pin corresponding with substrate back is located at positioned at substrate front side and/or the back side is electrically connected.

Optionally, the pad and/or metal routing positioned at substrate front side edge are not contacted with force fit plate.

Optionally, out the side wall of optical channel along light direction hatching be straightway or curved section.

Optionally, the light-emitting window of optical channel is rectangular, round or ellipse out.

Optionally, the slot being recessed outward is arranged close to one end of substrate for optical channel out.

Optionally, force fit plate and/or substrate are set as dark.

Optionally, the spacing between adjacent pixel unit is less than or equal to 3.0mm.

Optionally, substrate with a thickness of 0.2mm~2.0mm, the height of rim of a cup to the substrate front side of the first reflector is 0.15mm~1.2mm.

Second aspect, the utility model embodiment additionally provide a kind of LED display panel, including the utility model first party Any LED packaging in face.

LED packaging provided by the embodiment of the utility model, substrate and force fit plate can separately add during production Force fit plate is directly pressed together on substrate front side by work, and simple process is easy to implement the LED packaging of small size, and then reduced image Spacing between plain unit improves the resolution ratio of display panel；Meanwhile in a LED packaging, the volume of packaging plastic increases, Packaging plastic is stronger in conjunction with substrate, improves sealing performance, and then improves the reliability when use of display panel open air.

Detailed description of the invention

Fig. 1 is the front wiring figure of the LED packaging of the luminous PLCC structure in discrete top surface of the prior art；

Fig. 2 is the back wiring figure of LED packaging in Fig. 1；

Fig. 3 be in Fig. 1 LED packaging along the sectional view in the direction A-A '；

Fig. 4 is a kind of front wiring figure for LED packaging that the utility model embodiment one provides；

Fig. 5 is that the utility model embodiment one provides a kind of sectional view in LED packaging direction B-B ' along Fig. 1；

Fig. 6 is the section in the LED packaging direction B-B ' along Fig. 4 of another that the utility model embodiment one provides Figure；

Fig. 7 is the back wiring figure of LED packaging in Fig. 4；

Fig. 8 is a kind of top view for LED packaging that the utility model embodiment one provides；

Fig. 9 is the top view for another LED packaging that the utility model embodiment one provides；

Figure 10 be in Fig. 7 LED packaging along the sectional view in the direction C-C '.

Specific embodiment

The utility model is described in further detail with reference to the accompanying drawings and examples.It is understood that herein Described specific embodiment is used only for explaining the utility model, rather than the restriction to the utility model.It further needs exist for It is bright, part relevant to the utility model is illustrated only for ease of description, in attached drawing rather than entire infrastructure.

In the utility model embodiment, in the absence of explanation to the contrary, the noun of locality used such as " upper and lower, top, Bottom " be usually for direction shown in the drawings for either for vertically, vertically or gravity direction on for each component Mutual alignment relation describes word.

Embodiment one

The utility model embodiment one provides a kind of LED packaging, and Fig. 4 is one that the utility model embodiment one provides The front wiring figure of kind LED packaging, Fig. 5 are that the utility model embodiment one provides a kind of LED packaging along Fig. 1 The sectional view in the direction B-B ', as shown in Figure 4 and Figure 5, the LED packaging include substrate 100, force fit plate 200, packaging plastic 300 And be formed on 100 front of substrate, the pixel unit array being made of n row, m column pixel unit, n and m are to be greater than or wait In 2 positive integer.

Each pixel unit includes three LED luminescence chips with different luminescent colors, and respectively the first LED shines core Piece 401, the 2nd LED luminescence chip 402 and the 3rd LED luminescence chip 403.Illustratively, in the present embodiment and subsequent implementation In example, 2 are equal to m and n, the embodiment of the utility model is illustrated, which includes four array arrangements Pixel unit, each pixel unit include a red, a green and a BLUE LED emissions chip.

The position setting of respective pixel unit runs through the optical channel that goes out of force fit plate 200, substrate 100 and pressure on force fit plate 200 Plywood 200 is connect and is pressed by pressure-sensitive adhesive, and optical channel forms the first reflector out, and pixel unit is located at what optical channel was formed Reflector bottom, the rim of a cup of the first reflector are higher than the upper surface of LED luminescence chip.In this way, leading between adjacent pixel unit It crosses force fit plate to keep apart, avoids that optical crosstalk phenomenon occurs between adjacent pixel unit.Packaging plastic 300 is filled in the first reflector It is interior, and cover LED luminescence chip.Optionally, the upper surface of packaging plastic 300 is horizontal, and flushes with the upper surface of force fit plate 200.

LED packaging provided by the embodiment of the utility model, substrate and force fit plate can separately add during production Force fit plate is directly pressed together on substrate front side by work, and simple process is easy to implement the LED packaging of small size, and then reduced image Spacing between plain unit improves the resolution ratio of display panel；In addition, being increased by encapsulating n × m pixel unit together The volume of single package device facilitates welding to operate when manufacturing display panel；Meanwhile in a LED packaging, encapsulation The volume of glue increases, and packaging plastic is stronger in conjunction with substrate, improves sealing performance, and then improve the use of display panel open air When reliability.

With reference to LED packaging shown in fig. 5, packaging plastic is injected in the first reflector one by one by glue-injection machine, When LED packaging volume is larger, the rim of a cup of the first reflector is also larger, at this point, injecting glue operation is relatively more convenient, passes through four times Injecting glue operation, completes the injecting glue process of LED packaging.But as the size of LED packaging becomes small, first is anti- The rim of a cup for penetrating cup is also smaller and smaller, and in injecting glue, operation will be very inconvenient.Therefore, the utility model embodiment provides another Kind of LED packaging, Fig. 6 are the LED packaging of another that provides of the utility model embodiment one directions B-B ' along Fig. 4 Sectional view, as shown in fig. 6, optionally, force fit plate 200 includes the protrusion 210 for being formed in 200 edge of force fit plate, protrusion Part 210 surrounds an enclosed region in 200 marginal surface of force fit plate, forms the second reflector, and the rim of a cup of the second reflector is higher than The rim of a cup of first reflector.Packaging plastic 300 is filled in the first reflector and the second reflector, and covers LED luminescence chip.Such as This, the rim of a cup of the second reflector is much larger than the rim of a cup of the first reflector, and injecting glue is facilitated to operate；Simultaneously as the second reflector Rim of a cup is higher than the rim of a cup of the first reflector, and in injecting glue, after the first reflector fills, glue can overflow and flow to adjacent first Reflector, and finally fill up the first reflector and the second reflector.Therefore, it need to only be operated by an injecting glue, LED can be completed The injecting glue process of packaging improves packaging efficiency.

Optionally, the front of substrate 100 is formed with several pads and/or metal routing, if the back side of substrate 100 is formed with Dry pin and/or metal routing, pad is electrically connected by metallic vias pin corresponding with 100 back side of substrate is located at, or is passed through It metallic vias and is electrically connected positioned at the metal routing at the front of substrate 100 and/or the back side with positioned at the corresponding pin in 100 back side of substrate It connects.Fig. 7 is the back wiring figure of LED packaging in Fig. 4, and illustratively, with reference to Fig. 4 and Fig. 7, which includes 4 pixel units of array arrangement, each pixel unit include a common cathode pad 120, one of die bond pad 110, one First anode pad, a second plate pad 140 and a third anode pad.LED luminescence chip in each pixel unit Arrangement it is identical, be successively from top to bottom that the first LED luminescence chip 401, the 2nd LED luminescence chip 402 and the 3rd LED shine core Piece 403.In each column pixel unit, die bond pad 110, common cathode pad 120 and the second plate pad 140 of each pixel unit Arrangement it is identical with position, except that arrangement and the position of first anode pad and third anode pad.In the present embodiment And in subsequent embodiment, identical label is continued to use in identical part, and spy explains herein.

In the present embodiment, the 3rd LED luminescence chip 403 is single electrode chip, has an anode and a cathode, sun Pole and cathode are located at LED luminescence chip two sides up and down, and anode is located at the upper surface of the 3rd LED luminescence chip 403, cathode institute It is contacted in side with die bond pad 110.The cathode of 3rd LED luminescence chip 403 is fixed on die bond pad 110 by conducting resinl, First LED luminescence chip 401 and the 2nd LED luminescence chip 402 are fixed on die bond pad 110 by insulating cement, wherein conductive Glue can be conductive silver glue.

Die bond pad 110 shines for fixing the first LED luminescence chip 401, the 2nd LED luminescence chip 402 and the 3rd LED Chip 403；The cathode of first LED luminescence chip 401, the 2nd LED luminescence chip 402 and the 3rd LED luminescence chip 403 is connected to On common cathode pad 120, the sun of the first LED luminescence chip 401, the 2nd LED luminescence chip 402 and the 3rd LED luminescence chip 403 Pole is connected on first anode pad, second plate pad and third anode pad.

With in one-row pixels unit, the die bond pad 110 and common cathode pad 120 of two pixel units are same metal welding The different piece of disk, the metal pad are connected by metallic vias common cathode pin N1 or N2 directly corresponding with the row pixel unit It connects.It should be noted that the common cathode pad 120 of two pixel units is also possible to walk by metal in every row pixel unit Two metal pads of line connection pass through metallic vias common cathode corresponding with the row pixel unit in the specific position of metal routing The connection of pole pin.

In same row pixel unit:

Positioned at the first row pixel unit first anode pad 131 by metallic vias directly with first anode pad 131 First anode pin P1 corresponding with 132 is connected；First anode pad 132 positioned at the pixel unit of the second row passes through metal mistake Hole extends to the back side of substrate 100, and the first back metal cabling 161 by being located at 100 back side of substrate is welded with the first anode The corresponding negative electrode pin P1 of disk 131 and 132 is connected；

Two second plate pads 140 are the different piece of same metal pad, and the metal pad is straight by metallic vias Connect negative electrode pin P2 connection corresponding with second plate pad 140；

Positioned at the second row pixel unit third anode pad 152 by metallic vias directly with third anode pad 151 Negative electrode pin P3 corresponding with 152 is connected, just positioned at the third anode pad 151 of the first row pixel unit and positioned at substrate 100 One end of the first front metal cabling 162 in face connects, and the other end of the first front metal cabling 162 is extended through metallic vias To the back side of substrate 100, and the second back metal cabling 163 by being located at 100 back side of substrate and third anode pad 151 and 152 corresponding negative electrode pin P3 connections.

LED packaging provided in this embodiment facilitates welding to operate by encapsulating n × m pixel unit together, Improve sealing performance；In addition, forming n+3m pin of LED packaging, single package device by foregoing circuit structure In, pin number increases, and the solder joint contacted with pcb board increases, and then improves the fastness of solder joint；Pin is located at substrate back simultaneously Face and inwardly receipts, side wall exposes without pin, and when during forming display panel, the amount of encapsulating is reduced, and reduces LED display panel Cost.

In the LED packaging of the luminous PLCC structure in the discrete top surface of the prior art, metallic support is embedded in insulation frame In frame, since Insulating frame and metallic support are different materials (plastics and metal), the two thermal expansion coefficient difference is larger, when When outdoor temperature changes greatly, Insulating frame and metallic support can be removed mutually, and then the sealing performance of device is caused to decline, and be led Cause waterproofness and the against weather of such device poor.For this problem, in the LED packaging of the present embodiment, it is located at substrate The pad and/or metal routing of 100 front edges are not contacted with force fit plate 200.With continued reference to Fig. 4, Fig. 5 and Fig. 6, substrate 100 In front edge, force fit plate 200 is directly pressed together on the insulated part of substrate 100, not with the pad of 100 front edge of substrate 131,140 and 152 contact, increase substrate 100 and force fit plate 200 contact area, due to the two material it is same or similar (all for Plastics), thermal expansion coefficient is close, and then enhances the waterproofness and against weather of device.

Optionally, out the side wall of optical channel along light direction hatching be straightway or curved section.Preferably, in order to increase The contact area of big packaging plastic 300 and substrate 100, while meeting good spotlight effect, the side wall of optical channel is along light side out out To hatching be straightway, i.e., out the side wall of optical channel perpendicular to substrate 100 front, as shown in Figure 5 and Figure 6.

Optionally, the light-emitting window of optical channel is rectangular, round or ellipse out.Fig. 8 is that the utility model embodiment one mentions A kind of top view of the LED packaging supplied, Fig. 9 are another LED packagings that the utility model embodiment one provides Top view, Figure 10 be in Fig. 7 LED packaging along the direction C-C ' sectional view, with reference to Fig. 8, Fig. 9 and Figure 10.It is logical to go out light in Fig. 8 The light-emitting window in road be it is rectangular, out the side wall of optical channel perpendicular to substrate 100 front, then, in this embodiment, second reflection Side wall of the side wall of cup with the first reflector close to LED packaging edge is overlapped, and sectional view is as shown in Figure 10.Go out in Fig. 9 The light-emitting window of optical channel is circle, and the sectional view of corresponding position can refer to Fig. 6, wherein the shape of light-emitting window is also possible to Ellipse is the rectangular of arc with 4 angles, and details are not described herein.

Optionally, the slot (not shown) being recessed outward is arranged close to one end of substrate 100 for optical channel out, can increase The bonded area of packaging plastic 300 and substrate 100 improves the bond strength of substrate 100 and packaging plastic 300, enhances the gas of LED component Close property.

Optionally, force fit plate and/or substrate are set as dark.In one embodiment, substrate 100 and force fit plate 200 It all is coated with black ink for black or the first reflector inner wall, the inner wall of the second reflector and bottom, enhances LED wrapper The contrast of part, so that the display effect of LED packaging is more preferable.

Optionally, the spacing between adjacent pixel unit is less than or equal to 3.0mm.Substrate 100 with a thickness of 0.2mm~ 2.0mm, the rim of a cup of the first reflector to the positive height of substrate 100 are 0.15mm~1.2mm.

It is filled with the first insulating materials in metallic vias, the first insulating materials includes a kind of resin (the common second of PCB industry Alkenyl esters resin) or green oil, the upper and lower surface without departing from substrate 100 of the first insulating materials, fill is advantageous in that in this way When device encapsulates below, reinforces the binding force of the first packaging plastic 300 and substrate 100, improve sealing performance.

With continued reference to Fig. 7, the back side of substrate 100 is equipped with the second insulating materials 170, and the covering of the second insulating materials 170 is located at The back metal cabling at 100 back side of substrate, the second insulating materials 170 include white oil, resin or green oil etc., play insulation and protection Effect.

100 back side of substrate is provided with identification label 180, for identification the polarity of pin, in the present embodiment, identification label 180 be substrate 200 itself, and the surface of identification label 180 is not covered by the second insulating materials 170, and identifies the periphery of label 180 It is covered with the second insulating materials 170, since the color difference of substrate 100 and the second insulating materials 170 is so as to form identification mark Note 180.

Embodiment two

The utility model embodiment two provides any institute in a kind of LED display panel, including the utility model embodiment one The LED packaging stated.

Note that above are only the preferred embodiment and institute's application technology principle of the utility model.Those skilled in the art's meeting Understand, the utility model is not limited to specific embodiment described here, is able to carry out for a person skilled in the art various bright Aobvious variation, readjustment and substitution is without departing from the protection scope of the utility model.Therefore, although passing through above embodiments The utility model is described in further detail, but the utility model is not limited only to above embodiments, is not departing from It can also include more other equivalent embodiments in the case that the utility model is conceived, and the scope of the utility model is by appended Scope of the claims determine.

Claims (12)

1. a kind of LED packaging characterized by comprising

Substrate, and be formed in the substrate front side, the pixel unit array being made of n row, m column pixel unit, n and m are equal For the positive integer more than or equal to 2；Each pixel unit includes three LED luminescence chips with different luminescent colors；

Force fit plate corresponds to the pixel unit setting on the force fit plate through the force fit plate and goes out optical channel, the substrate It is connect with force fit plate by pressure-sensitive adhesive, the pixel unit is located in the optical channel out, and it is anti-that the optical channel out forms first Cup is penetrated, the rim of a cup of first reflector is higher than the upper surface of the LED luminescence chip；

Packaging plastic, the packaging plastic are filled in first reflector, and cover the LED luminescence chip.

2. LED packaging according to claim 1, which is characterized in that the m=2, n=2.

3. LED packaging according to claim 1, which is characterized in that the force fit plate includes being formed in pressing edges of boards The protrusion of edge, the protrusion form the second reflector, and the rim of a cup of second reflector is higher than first reflection The rim of a cup of cup；The packaging plastic is filled in first reflector and the second reflector, and covers the LED luminescence chip.

4. LED packaging according to claim 1, which is characterized in that the front of the substrate is formed with several pads And/or metal routing, the back side of the substrate are formed with several pins and/or metal routing, the pad passes through metallic vias Pin corresponding with the substrate back is located at is electrically connected, or by metallic vias and is located at the substrate front side and/or the back side Metal routing be electrically connected with the corresponding pin of the substrate back is located at.

5. LED packaging according to claim 1, which is characterized in that positioned at the substrate front side edge pad and/ Or metal routing is not contacted with the force fit plate.

6. LED packaging according to claim 1, which is characterized in that the side wall of the optical channel out is along light direction Hatching be straightway or curved section.

7. LED packaging according to claim 1, which is characterized in that the light-emitting window of the optical channel out is rectangular, circle Shape or ellipse.

8. LED packaging according to claim 1, which is characterized in that the optical channel out is close to the one of the substrate The slot that end setting is recessed outward.

9. LED packaging according to claim 1, which is characterized in that the force fit plate and/or the substrate are set as It is dark.

10. LED packaging according to claim 1, which is characterized in that the spacing between adjacent pixel unit be less than or Equal to 3.0mm.

11. LED packaging according to claim 1, which is characterized in that the substrate with a thickness of 0.2mm~ The height of 2.0mm, rim of a cup to the substrate front side of first reflector are 0.15mm~1.2mm.

12. a kind of LED display panel, which is characterized in that including the LED packaging any in claim 1-11.