CN208045002U - High contrast integration packaging display module structure - Google Patents
High contrast integration packaging display module structure Download PDFInfo
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- CN208045002U CN208045002U CN201721409941.6U CN201721409941U CN208045002U CN 208045002 U CN208045002 U CN 208045002U CN 201721409941 U CN201721409941 U CN 201721409941U CN 208045002 U CN208045002 U CN 208045002U
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- group substrates
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- high contrast
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Abstract
The utility model discloses a kind of high contrast integration packaging display module structures, including：Module group substrates, circuit-line, the circuit-line can be 3-7 sandwich circuit structure compositions, driving IC for connecting the positive LED light emitting structures of module group substrates and the back side, module group substrates front circuit reserves pad and is used for the die bond of LED chip, bonding wire, and module group substrates back side line construction reserves the patch that pad is used to drive the devices such as IC, resistance；It is set to the positive multigroup LED chip of module group substrates；The positive high transparency packing colloid of module group substrates is set, and the high transparency packing colloid transmissivity reaches 85-99%；It is set to the black ink or black thin film on high transparency packing colloid surface.The structure design and process route of the traditional filling spread powder in packaging plastic of the utility model change, dumb light powder, it realizes in colloid surface Darkening process, the Darkening process can be that ink-jet or the high single side extinction film thoroughly of patch improve product and display contrast under the premise of ensureing product light extraction efficiency.
Description
Technical field
The utility model is related to display screen module encapsulation and LED encapsulation technologies field, more particularly to high comparisons
Spend integration packaging display module structure.
Background technology
As the demand of the continuous improvement of indoor display application technology and terminal market is higher and higher, high contrast height is aobvious to be become
Indoor small spacing screen factory and encapsulation factory promote the Main way of product competitiveness.Conventional SMD LED are due to by patch back light
The influence of foot tin cream, aberration is restricted in terms of contrast promotion.With it is uncommon up to electronics, Ao Leida, Wei Qiao along etc. for representative enterprise
Industry has carried out COB integration packaging patterns, optimizes processing to lamp face, improves the contrast of display screen.But it is directed to lamp bead
Internal pads, gold thread, chip it is reflective caused by poor contrast problem, can not provide preferable ameliorative way in the market.
Therefore, a display screen for solving the problems, such as aberration inside lamp bead is developed, the contrast of display screen is promoted with larger potential
Market value.
The utility model uses new design concept, carries out ultra-thin Darkening process to colloid surface, the blackening layer is internal
The Transmission Attenuation influence of portion's light is smaller, there is apparent absorption display therefore can be improved the absorptivity of extraneous light
The contrast of product.
Utility model content
In view of this, the utility model provide a kind of Transmission Attenuation on internal light influence it is smaller, to extraneous light
Absorptivity have apparent absorption, while can be improved display product contrast high contrast integration packaging show mould
Group structure.
To achieve the above object, the utility model provides the following technical solutions：
High contrast integration packaging display module structure, which is characterized in that including：Module group substrates are set to the module
Circuit-line on substrate, the circuit-line can be 3-7 sandwich circuit structure compositions, positive for connecting the module group substrates
LED light emitting structures and the driving IC at the back side, module group substrates front circuit reserve pad and are used for the die bond of LED chip, bonding wire,
Module group substrates back side line construction reserves the patch that pad is used to drive IC, resistance；It is set to the module group substrates front
Multigroup LED chip；The positive high transparency packing colloid of module group substrates is set, and the high transparency packing colloid transmissivity reaches 85-
99%；It is set to the black ink or black thin film on high transparency packing colloid surface.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates thickness is
1mm-3mm, color are black.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates back side setting
IC patch pads, front setting LED chip place pad, and front LED density spacing is set as P0.5-P1.0.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates are built-in with picture
Vegetarian refreshments, each pixel are made of three chips, and the LED chip can be positive cartridge chip, pass through wire bonding and module
Substrate connection；Or be flip-chip, it is connected by tin cream, elargol and module group substrates.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates bonding wire is laggard
Row molding sealing, the high transparency packing colloid is white clear, and material can be epoxy resin or silica gel.
Preferably, it in a kind of above-mentioned high contrast integration packaging display module structure, is carried out after the module sealing black
Change matte management, the melanism matte management can be ink-jet or brush ink or pad pasting, and the melanism layer thickness is 2-50um.
Preferably, in a kind of above-mentioned high contrast integration packaging display module structure, the module group substrates back side setting
Driving IC can be electric current drive IC, row sweep, arrange and sweep IC or other driving elements.
It can be seen via above technical scheme that compared with prior art, the utility model, which discloses, provides a kind of high comparison
Integration packaging display module structure is spent, including：Module group substrates, circuit-line, the circuit-line can be 3-7 layer line line structure groups
At the driving IC for connecting the positive LED light emitting structures of module group substrates and the back side, module group substrates front circuit is reserved pad and used
Die bond, bonding wire in LED chip, module group substrates back side line construction reserve the patch that pad is used to drive the devices such as IC, resistance；
It is set to the positive multigroup LED chip of module group substrates；The positive high transparency packing colloid of module group substrates, the high transparency envelope are set
It fills colloid transmissivity and reaches 85-99%；It is set to the black ink or black thin film on high transparency packing colloid surface.This practicality is new
The structure design and process route of the traditional filling spread powder in packaging plastic of type change, dumb light powder, realize black in colloid surface
Change is handled, and the Darkening process can be ink-jet or the high single side extinction film thoroughly of patch, under the premise of ensureing product light extraction efficiency, improve
Product displays contrast.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 attached drawings are the stereogram of the utility model.
Fig. 2 attached drawings are the side view of the utility model.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
The utility model embodiment discloses a kind of on smaller, the suction to extraneous light of the Transmission Attenuation of internal light influence
Yield has apparent absorption, while the high contrast integration packaging display module knot of the contrast of display product can be improved
Structure.
Attached drawing 1, attached drawing 2 are please referred to, is a kind of high contrast integration packaging display module structure disclosed by the utility model,
It specifically includes：
Module group substrates 1, the circuit-line being set on module group substrates 1, circuit-line can be 3-7 sandwich circuit structure compositions,
Driving IC3 for connecting 1 positive LED light emitting structures 2 of module group substrates and the back side, 1 front circuit of module group substrates reserve pad
Die bond, bonding wire for LED chip, 1 back side line construction of module group substrates reserve pad for driving the devices such as IC3, resistance
Patch；It is set to the positive multigroup LED chip of module group substrates 2；The positive high transparency packing colloid 4 of module group substrates is set, it is high saturating
4 transmissivity of bright packing colloid reaches 85-99%；It is set to the black ink or black thin film 5 on 4 surface of high transparency packing colloid.
The utility model carries out ultra-thin Darkening process, Transmission Attenuation shadow of the blackening layer to internal light to colloid surface
Sound is smaller, has apparent absorption to the absorptivity of extraneous light, therefore, the contrast of display product can be improved.Its base
Present principles are：The gold that PCB front metal pad reflectives go out, is affected to the contrast of screen, black by packaging plastic surface
Change is handled, and under the influence of reducing extraneous light, the reflection of front pad color improves aobvious screen contrast.
In order to advanced optimize above-mentioned technical proposal, technological process is：A, module group substrates back side IC, resistance, capacitance fitting；
B, module group substrates carry out dehumidification treatments；C, module group substrates die bond；D, the substrate after die bond is subjected to bonding wire；E, by the base after bonding wire
Plate carries out molding sealing；F, film on surface Darkening process is carried out.
In order to advanced optimize above-mentioned technical proposal, module group substrates thickness is 1mm-3mm, and color is black, material BT
Substrate, FR4 substrates, the one of which of ceramic substrate or several mixing.
In order to advanced optimize above-mentioned technical proposal, IC patch pads, front setting LED core is arranged in 1 back side of module group substrates
Piece places pad, and front LED density spacing is set as P0.5-P1.0.
In order to advanced optimize above-mentioned technical proposal, module group substrates 1 are built-in with pixel, and each pixel is by three chips
(feux rouges, green light, blue light) forms, and LED chip can be positive cartridge chip, be connect with module group substrates by wire bonding；Or to fall
Cartridge chip is connected by tin cream, elargol and module group substrates.
In order to advanced optimize above-mentioned technical proposal, molding sealing, high transparency packing colloid are carried out after 1 bonding wire of module group substrates
4 be white clear, and material can be epoxy resin or silica gel.
In order to advanced optimize above-mentioned technical proposal, melanism matte management is carried out after module sealing, melanism matte management can
It is 2-50um for ink-jet or the forms such as brush ink or pad pasting, melanism layer thickness
In order to advanced optimize above-mentioned technical proposal, the driving IC3 of 1 back side of module group substrates setting can be that electric current drives
IC, row are swept, arrange and sweep other driving elements such as IC.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty.
Claims (7)
1. a kind of high contrast integration packaging display module structure, including, module group substrates, the electricity being set on the module group substrates
Route road, the circuit-line can be 3-7 sandwich circuit structure compositions, for connecting the positive LED light-emitting junctions of the module group substrates
Structure and the driving IC at the back side, module group substrates front circuit reserve pad and are used for the die bond of LED chip, bonding wire, the module group substrates back side
Line construction reserves the patch that pad is used to drive IC, resistance；It is set to the positive multigroup LED chip of module group substrates；Mould is set
The positive high transparency packing colloid of group substrate, high transparency packing colloid transmissivity reach 85-99%；It is set to high transparency packing colloid
The black ink or black thin film on surface.
2. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that module group substrates
Thickness is 1mm-3mm, and color is black.
3. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
The front setting LED chip of substrate places pad, and front LED density spacing is set as P0.5-P1.0.
4. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
Substrate is built-in with pixel, and each pixel is made of three LED chips, and LED chip can be positive cartridge chip, pass through wire bonding
It is connect with module group substrates；Or be flip-chip, it is connected by tin cream, elargol and module group substrates.
5. a kind of high contrast integration packaging display module structure according to claim 1, which is characterized in that the module
Molding sealing is carried out after substrate bonding wire, high transparency packing colloid 4 is white clear, and material can be epoxy resin or silica gel.
6. a kind of high contrast integration packaging display module structure according to claim 1, after the module group substrates sealing
Melanism matte management is carried out, melanism matte management can be ink-jet or brush ink or pad pasting, and melanism layer thickness is 2-50um.
7. a kind of high contrast integration packaging display module structure according to claim 1, the module group substrates back side is set
The driving IC3 set can be that electric current drives IC, row sweep, arrange and sweep IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409941.6U CN208045002U (en) | 2017-10-30 | 2017-10-30 | High contrast integration packaging display module structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409941.6U CN208045002U (en) | 2017-10-30 | 2017-10-30 | High contrast integration packaging display module structure |
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| CN208045002U true CN208045002U (en) | 2018-11-02 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111122601A (en) * | 2019-12-27 | 2020-05-08 | 苏州晶台光电有限公司 | Method for inspecting internal appearance defects of COB module after glue sealing |
| CN111682019A (en) * | 2020-05-11 | 2020-09-18 | 安徽芯瑞达科技股份有限公司 | Manufacturing process of Mini RGB LED module |
| CN113001955A (en) * | 2021-03-09 | 2021-06-22 | 北京柒彩智显科技有限公司 | Treatment process for surface consistency of LED module |
| CN113130466A (en) * | 2021-03-26 | 2021-07-16 | 杭州美卡乐光电有限公司 | LED display module and manufacturing method thereof |
| CN113560154A (en) * | 2021-07-28 | 2021-10-29 | 盐城东山精密制造有限公司 | Method for realizing matte surface by surface coating |
| WO2022011780A1 (en) * | 2020-07-13 | 2022-01-20 | 东莞市中麒光电技术有限公司 | Display module and manufacturing method therefor, and led display module and led display screen |
| CN114944115A (en) * | 2022-05-07 | 2022-08-26 | 深圳市艾比森光电股份有限公司 | Mini LED display module, preparation method thereof and electronic equipment |
-
2017
- 2017-10-30 CN CN201721409941.6U patent/CN208045002U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111122601A (en) * | 2019-12-27 | 2020-05-08 | 苏州晶台光电有限公司 | Method for inspecting internal appearance defects of COB module after glue sealing |
| CN111682019A (en) * | 2020-05-11 | 2020-09-18 | 安徽芯瑞达科技股份有限公司 | Manufacturing process of Mini RGB LED module |
| WO2022011780A1 (en) * | 2020-07-13 | 2022-01-20 | 东莞市中麒光电技术有限公司 | Display module and manufacturing method therefor, and led display module and led display screen |
| CN113001955A (en) * | 2021-03-09 | 2021-06-22 | 北京柒彩智显科技有限公司 | Treatment process for surface consistency of LED module |
| CN113130466A (en) * | 2021-03-26 | 2021-07-16 | 杭州美卡乐光电有限公司 | LED display module and manufacturing method thereof |
| CN113560154A (en) * | 2021-07-28 | 2021-10-29 | 盐城东山精密制造有限公司 | Method for realizing matte surface by surface coating |
| CN114944115A (en) * | 2022-05-07 | 2022-08-26 | 深圳市艾比森光电股份有限公司 | Mini LED display module, preparation method thereof and electronic equipment |
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