CN207459002U - A kind of OLED encapsulating structures - Google Patents
A kind of OLED encapsulating structures Download PDFInfo
- Publication number
- CN207459002U CN207459002U CN201721503975.1U CN201721503975U CN207459002U CN 207459002 U CN207459002 U CN 207459002U CN 201721503975 U CN201721503975 U CN 201721503975U CN 207459002 U CN207459002 U CN 207459002U
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- oled
- side closed
- lower glass
- encapsulating structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The utility model proposes a kind of OLED encapsulating structures,Including lower glass substrate,OLED chip electrodes are equipped among the upper surface of the lower glass substrate,The top of OLED chip electrodes is equipped with top glass substrate,And connection ring seat is equipped at the top surface edge of lower glass substrate,The lower surface side edge of the top glass substrate is equipped with clamping ring,It is clamped ring and connection ring seat is corresponding up and down,The upper surface side edge of the lower glass substrate and the lower surface side edge of top glass substrate are equipped with side closed plate,It can be closed for the first time by being clamped ring and connection ring seat,So that closing is more rigorous,It can thoroughly be closed by the connection of side closed-loop and side closed plate,So that closing is more thorough,So that OLED service lifes are longer,The OLED encapsulating structures and method for packing,It is simple in structure,It is easy for installation,Step is simple,Not only so that closing is more rigorous,Sealing,And encapsulation is more convenient.
Description
Technical field
The utility model is related to OLED encapsulation technologies fields, are specially a kind of OLED encapsulating structures.
Background technology
Luminescent device is that this studied to obtain considerable content in recent years, and display of organic electroluminescence OLED is as a kind of
Emerging flat-panel monitor especially attracts the concern of people, because they have application and are dived in many electroluminescent devices
In application value, it is known that traditional OLED displays have good color contrast, actively shine, wide viewing angle, can be slim
Change, fast response time and the advantages that low energy consumption, however traditional OLED displays, be particularly at electrode therein and organic
Layer, it is easy to make hydraulic performance decline, serious shadow when being acted on because being leaked in ambient enviroment into the oxygen in OLED displays and moisture
The service life of OLED is rung, if the electrode in OLED displays and organic layer opened with the isolation of ambient enviroment air hermetic,
Then the service life of OLED displays will dramatically increase, however this process for sealing that hermetically sealing is carried out for active display
Desirable is extremely difficult to, seriously affects the service life of OLED.
Utility model content
The technical problems to be solved in the utility model is to overcome the defects of existing, provides a kind of OLED encapsulating structures and encapsulation
Method, simple in structure, easy for installation, step is simple, and not only so that closing is more rigorous, seals, and encapsulation is more convenient, can
Effectively to solve the problems, such as in background technology.
To achieve the above object, the utility model proposes：A kind of OLED encapsulating structures, including lower glass substrate, under described
OLED chip electrodes are equipped among the upper surface of glass substrate, the top of OLED chip electrodes is equipped with top glass substrate, and
Connection ring seat is equipped at the top surface edge of lower glass substrate, the lower surface side edge of the top glass substrate is equipped with clamping ring,
It is clamped ring and corresponding, the upper surface side edge of the lower glass substrate and the lower surface side of top glass substrate above and below connection ring seat
Place is equipped with side closed plate, and side closed plate is located at connection ring seat and is clamped the outside of ring.
A kind of optimal technical scheme as the utility model：Side envelope in the lower glass substrate and top glass substrate
Closing plate is corresponding up and down, and the outside of the side closed plate is equipped with side closed-loop.
A kind of optimal technical scheme as the utility model：The section of the side closed plate is L-type structure, with side
The corresponding side closed-loop of closed plate is concave character type structure.
A kind of optimal technical scheme as the utility model：Silicon is equipped between the lower glass substrate and top glass substrate
Glue drying layer, silica dehydrator layer are located at the inside of side closed plate.
A kind of optimal technical scheme as the utility model：U-shaped structure is in the section of the connection ring seat, the clamping
Ring is corresponding with the groove for connecting ring seat.
A kind of optimal technical scheme as the utility model：The lower glass substrate and top glass substrate are transparent glass
Glass, and lower glass substrate and top glass substrate are corresponding up and down.
The utility model also provides a kind of method for packing of OLED encapsulating structures：Comprise the following steps：
S1）OLED chip electrodes are installed：OLED chip electrodes are installed to the upper surface of lower glass substrate first；
S2）Silica dehydrator layer is fixed：Then the upper surface of lower glass substrate is fixed on by silica dehydrator layer, does silica gel
Dry layer is fixed on the outside of connection ring seat；
S3）Top glass substrate is fixed：The groove of the connection ring seat of lower glass substrate is subjected to brush coating, then again by upper glass
The outside of the clamping ring of substrate carries out brush coating, then the connection ring seat of the clamping ring of top glass substrate and lower glass substrate is fastened,
S4）Close ring seal in side：Brush coating will be carried out on the outside of the structure side combined, then side closed-loop is fixed to
On the outside of the structure combined, lower glass substrate with two side closed plates of top glass substrate is connected with this, is pacified with this
Dress.
A kind of optimal technical scheme as the utility model：First to lower glass before installation OLED chip electrodes installation
The upper surface of glass substrate is cleared up, and during installation, the lower surface of OLED chip electrodes is made to cling to the upper table of lower glass substrate
Face.
A kind of optimal technical scheme as the utility model：In the clamping ring and lower glass substrate to top glass substrate
It is cleared up before connection ring seat brush coating, and it is dried by hot wind after installing.
A kind of optimal technical scheme as the utility model：The front and rear side to combining structure of closed-loop installation in side
It is cleared up in the groove of side closed-loop, drying is continued to combining structure by hot gas after installation.
Compared with prior art, the beneficial effects of the utility model are：Connection ring seat is provided on this OLED encapsulating structures
With clamping ring, can be closed for the first time by being clamped ring and connection ring seat so that closing is more rigorous, passes through side closed-loop
Connection with side closed plate can be closed thoroughly so that closing is more thorough so that OLED service lifes are longer, OLED envelopes
Assembling structure and method for packing, simple in structure, easy for installation, step is simple, not only so that closing is more rigorous, seals, Er Qiefeng
It fills more convenient.
Description of the drawings
Fig. 1 is a kind of structure chart of OLED encapsulating structures of the utility model；
Fig. 2 is a kind of structure chart in OLED encapsulating structures section of the utility model；
Fig. 3 is the structure chart amplified at a kind of OLED encapsulating structures A of the utility model.
In figure：1 top glass substrate, 2 side closed plates, 3 lower glass substrates, 4 OLED chip electrodes, 5 connection ring seats, 6
It is clamped ring, 7 side closed-loops, 8 silica dehydrator layers.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides following technical scheme：A kind of OLED encapsulating structures, including lower glass base
Plate 3, the upper surface centre of lower glass substrate 3 are equipped with OLED chip electrodes 4, and the top of OLED chip electrodes 4 is equipped with upper glass
Substrate 1, lower glass substrate 3 and top glass substrate 1 are transparent glass, and lower glass substrate 3 and top glass substrate are right about 1
Should, and connection ring seat 5 is equipped at the top surface edge of lower glass substrate 3, the lower surface side edge of top glass substrate 1 is equipped with card
Ring 6 is connect, clamping ring 6 and connection ring seat are corresponding about 5, can be closed for the first time by being clamped ring 6 and connection ring seat 5 so that
Closing is more rigorous, and the upper surface side edge of lower glass substrate 3 and the lower surface side edge of top glass substrate 1 are equipped with side envelope
Closing plate 2, side closed plate 2 are located at connection ring seat 5 and are clamped the outside of ring 6, the side in lower glass substrate 3 and top glass substrate 1
Banding closing plate is corresponding about 2, and the outside of side closed plate 2 is equipped with side closed-loop 7, and the section of side closed plate 2 is L-type knot
Structure is concave character type structure with 2 corresponding side closed-loop 7 of side closed plate, is set between lower glass substrate 3 and top glass substrate 1
There is silica dehydrator layer 8, can thoroughly be closed by the connection of side closed-loop 7 and side closed plate 2 so that closing is more thorough
Bottom so that OLED service lifes are longer, and silica dehydrator layer 8 is located at the inside of side closed plate 2, can be with by silica dehydrator layer 8
Water in air is filtered, OLED chip electrodes 4 are protected with this so that OLED chip electrodes 4 use the longevity
Order longer, U-shaped structure is in the section of connection ring seat 5, and clamping ring 6 is corresponding with the groove of connection ring seat 5, by being clamped 6 He of ring
The groove for connecting ring seat 5 is corresponding so that clamping ring 6 connects even closer, the OLED encapsulating structures and encapsulation with being connected ring seat 5
Method, simple in structure, easy for installation, step is simple, not only so that closing is more rigorous, seals, and encapsulates more convenient.
A kind of method for packing of OLED encapsulating structures, comprises the following steps：
S1OLED chip electrodes are installed：OLED chip electrodes 4 are installed to the upper surface of lower glass substrate 3 first,
Installation OLED chip electrodes 4 first clear up the upper surface of lower glass substrate 3 before installing so that lower glass substrate 3 it is upper
Surface is more convenient, during installation, the lower surface of OLED chip electrodes 4 is made to cling to the upper surface of lower glass substrate 3；
S2 silica dehydrator layers are fixed：Then the upper surface of lower glass substrate 3 is fixed on by silica dehydrator layer 8, makes silica gel
Drying layer 8 is fixed on the outside of connection ring seat 5；
S3 top glass substrates are fixed：The groove of the connection ring seat 5 of lower glass substrate 3 is subjected to brush coating, then again by upper glass
The outside of the clamping ring 6 of glass substrate 1 carries out brush coating, then top glass substrate 1 is clamped ring 6 and the connection ring of lower glass substrate 3
Seat 5 fastens, and clears up, and pacifies before 5 brush coating of connection ring seat to the clamping ring 6 of top glass substrate 1 and lower glass substrate 3
It is dried by hot wind after dress；
Close ring seal in S4 sides：Brush coating will be carried out on the outside of the structure side combined, then side closed-loop 7 is fixed to
On the outside of the structure combined, two side closed plates 2 of lower glass substrate 3 and top glass substrate 1 are connected with this, are carried out with this
Front and rear to being cleared up in the side of combining structure and the groove of side closed-loop 7, installation is installed in installation in side closed-loop 7
After drying continued to combining structure by hot gas.
The utility model benefit：It can be closed for the first time by being clamped ring 6 and connection ring seat 5 so that closing is tighter
Sincerely, can thoroughly be closed by the connection of side closed-loop 7 and side closed plate 2 so that closing is more thorough so that OLED makes
With longer life expectancy, the OLED encapsulating structures and method for packing, simple in structure, easy for installation, step is simple, not only so that closing more
Add rigorous, sealing, and encapsulate more convenient.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that in the case where not departing from the principle of the utility model and spirit can these embodiments be carried out with a variety of variations, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of OLED encapsulating structures, including lower glass substrate（3）, it is characterised in that：The lower glass substrate（3）Upper surface
Centre is equipped with OLED chip electrodes（4）, OLED chip electrodes（4）Top be equipped with top glass substrate（1）, and lower glass base
Plate（3）Top surface edge at be equipped with connection ring seat（5）, the top glass substrate（1）Lower surface side edge be equipped with clamping ring
（6）, it is clamped ring（6）With being connected ring seat（5）It is corresponding up and down, the lower glass substrate（3）Upper surface side edge and upper glass base
Plate（1）Lower surface side edge be equipped with side closed plate（2）, side closed plate（2）Positioned at connection ring seat（5）With clamping ring
（6）Outside.
2. a kind of OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）On side closed plate（2）It is corresponding up and down, the side closed plate（2）Outside be equipped with side closed-loop（7）.
3. a kind of OLED encapsulating structures according to claim 2, it is characterised in that：The side closed plate（2）Section be L
Type structure, with side closed plate（2）Corresponding side closed-loop（7）For concave character type structure.
4. a kind of OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）Between be equipped with silica dehydrator layer（8）, silica dehydrator layer（8）Positioned at side closed plate（2）Inside.
5. a kind of OLED encapsulating structures according to claim 1, it is characterised in that：The connection ring seat（5）Section to be U-shaped
Structure, the clamping ring（6）With being connected ring seat（5）Groove it is corresponding.
6. a kind of OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）It is transparent glass, and lower glass substrate（3）And top glass substrate（1）It is corresponding up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721503975.1U CN207459002U (en) | 2017-11-13 | 2017-11-13 | A kind of OLED encapsulating structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721503975.1U CN207459002U (en) | 2017-11-13 | 2017-11-13 | A kind of OLED encapsulating structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207459002U true CN207459002U (en) | 2018-06-05 |
Family
ID=62279198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721503975.1U Expired - Fee Related CN207459002U (en) | 2017-11-13 | 2017-11-13 | A kind of OLED encapsulating structures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207459002U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107819082A (en) * | 2017-11-13 | 2018-03-20 | 潘景航 | A kind of OLED encapsulating structures and method for packing |
-
2017
- 2017-11-13 CN CN201721503975.1U patent/CN207459002U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107819082A (en) * | 2017-11-13 | 2018-03-20 | 潘景航 | A kind of OLED encapsulating structures and method for packing |
| CN107819082B (en) * | 2017-11-13 | 2024-05-28 | 深圳市中教光电有限公司 | OLED packaging structure and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019205342A1 (en) | Oled packaging structure and oled display panel | |
| CN104505465A (en) | OLED packaging structure and packaging method thereof | |
| CN101582488B (en) | Packaging cover plate of organic electroluminescence device | |
| CN104659269A (en) | OLED encapsulation method and OLED encapsulation structure | |
| TWM579382U (en) | Airtight packaging structure for solar cell | |
| CN109216486A (en) | A kind of membrane photovoltaic component encapsulating structure and method | |
| CN207459002U (en) | A kind of OLED encapsulating structures | |
| CN103730598A (en) | Organic light-emitting device and preparation method thereof | |
| CN207009453U (en) | A kind of membrane photovoltaic component encapsulating structure | |
| CN103022374A (en) | Displaying device packaging structure and method | |
| CN100511723C (en) | Packaging structure for dye sensitized solar cell plate | |
| CN103811668A (en) | Organic electroluminescent device and method for producing same | |
| CN104993063A (en) | A package member and a manufacture method therefor, and an OLED device | |
| CN104269497B (en) | Organic light-emitting diode packaging structure and display device | |
| CN107819082A (en) | A kind of OLED encapsulating structures and method for packing | |
| CN206497906U (en) | OLED packaging part | |
| CN203134869U (en) | Organic light emitting diode (OLED) glass packaging device | |
| CN101030544A (en) | Method for packing photoelectric device | |
| CN107611282A (en) | Encapsulating structure and display device | |
| CN106784383A (en) | The OLED encapsulated with the cover plate for having Back Word connected in star | |
| CN203085551U (en) | Packaging structure for OLED panel | |
| CN206370445U (en) | The OLED encapsulated with the cover plate for having Back Word connected in star | |
| CN206574741U (en) | A kind of waterproof encapsulation structure of LED array device | |
| CN103971939A (en) | Potting and packaging method for dye-sensitized solar cell module | |
| CN107565047A (en) | A kind of method for packing of flexible OLED devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180605 Termination date: 20201113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |