CN207398123U - Heat dissipation device and layout structure of power device and electromagnetic heating appliance - Google Patents
Heat dissipation device and layout structure of power device and electromagnetic heating appliance Download PDFInfo
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- CN207398123U CN207398123U CN201721093210.5U CN201721093210U CN207398123U CN 207398123 U CN207398123 U CN 207398123U CN 201721093210 U CN201721093210 U CN 201721093210U CN 207398123 U CN207398123 U CN 207398123U
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- power device
- radiator
- substrate
- layout structure
- heat radiation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 title claims abstract description 16
- 230000005855 radiation Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 33
- 238000009434 installation Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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Abstract
The utility model discloses a heat abstractor, layout structure and electromagnetic heating utensil of power device, wherein, heat abstractor is used for the power device heat dissipation include: the first bottom surface is provided with first radiating fins vertical to the first bottom surface and used for mounting a first power device; the second bottom surface is connected with the first bottom surface at a preset angle, and is provided with a second heat radiation fin vertical to the second bottom surface and used for mounting a second power device. The power devices are dispersedly arranged on the two vertical bottom surfaces, and compared with the power devices arranged on the same bottom surface in a straight line, the width of the heat dissipation device can be reduced, the occupied space of the heat dissipation device is reduced, the two bottom surfaces are provided with the heat dissipation fins, the heat dissipation efficiency of the two bottom surfaces can be improved simultaneously, and the two bottom surfaces can be enabled to dissipate heat quickly.
Description
Technical field
The present invention relates to family's electro-technical fields, and in particular to a kind of radiator of power device, layout structure and electricity
Magnetic heats utensil.
Background technology
Heating electrical appliance in present kitchen appliance using it is more be to be heated using electromagnetic coil, for example, electromagnetic heating
(induction heat, IH) electric cooker, is heated using electromagnetic coil.Now common IH electric cookers coil panel can use one section
Winding mode, coil correspond to a control module.It heats up for more precise control, makes fever evenly, used mode
Multistage winding mode can be used for coil panel, and each section of coiling can separate independent control, and this causes the control member that needs radiate
Number of devices increases.
However, in the prior art, the arrangement of the control component of heat dissipation is generally mode as shown in Figure 1, a word
Arrangement, with increasing for power device 3, the width of radiator 1 can increase so that the heat radiation layout structure of power device 3 occupies
Space increases, and wind turbine air supply areas can not cover entire radiator, cause to radiate bad.
The content of the invention
The technical problem to be solved in the present invention is that the heat radiation layout structure occupied space of power device is excessive, and heat dissipation is not
It is good.
For this purpose, according in a first aspect, an embodiment of the present invention provides a kind of radiator, for radiating to power device,
The device includes：First bottom surface is provided with the first radiating fin with the first plane perpendicular, for installing the first power device；
Second bottom surface is connected in predetermined angle with the first bottom surface, the second radiating fin with the second plane perpendicular is provided with, for pacifying
Fill the second power device.
Optionally, the first bottom surface and the second plane perpendicular.
Optionally, radiator further includes：3rd bottom surface, it is parallel with the second bottom surface, it is connected, sets with the first plane perpendicular
There is the 3rd radiating fin, for installing the 3rd power device.
Optionally, offered on the first bottom surface, the second bottom surface and the 3rd bottom surface for the mounting groove of installation power device；Peace
Offer to fasten the mounting hole of power device in tankage.
According to second aspect, the embodiment of the present invention has also carried a kind of heat radiation layout structure of power device, including：It is such as above-mentioned
The radiator of first aspect any one description；First power device, on the first bottom surface of radiator；Second work(
Rate device, on the second bottom surface of radiator.
Optionally, the first power device and the second power device pass through the screw corresponding installation for being fastened on the first bottom surface respectively
In slot and the mounting groove of the second bottom surface.
Optionally, the heat radiation layout structure of power device further includes：Substrate, for installing radiator and power device.
Optionally, the first bottom surface of radiator and the second plane perpendicular are in substrate；The pin of first power device and
The pin straight cutting of two power devices passes through and is welded and fixed on substrate.
Optionally, the first bottom surface is parallel to substrate, and the second plane perpendicular is in substrate；The pin of first power device is to substrate
Direction bending is inserted on substrate, and is passed through and be welded and fixed；The pin straight cutting of second power device passes through welding on substrate
It is fixed.
Optionally, the heat radiation layout structure of power device further includes：3rd power device, mounted on the of radiator
On three bottom surfaces.
Optionally, the heat radiation layout structure of power device further includes：Wind turbine on substrate, is acted in heat dissipation
The wind of device.
According to the third aspect, an embodiment of the present invention provides a kind of electromagnetic heating utensil, including：Electromagnetic heating utensil sheet
Body；And the heat radiation layout structure of the power device as described in above-mentioned second aspect any one.
Optionally, electromagnetic heating utensil includes：Electric cooker and/or electromagnetic oven.
Radiator provided in an embodiment of the present invention, layout structure and electromagnetic heating utensil, radiator can include two
A bottom surface, the first bottom surface and the second bottom surface are connected in predetermined angle, and the first bottom surface is for the first power device of installation, the second bottom surface
For installing the second power device, by power device scattering device on two vertical bottom surfaces, compared to word order same
On one bottom surface, the width of radiator, the occupied space of radiator can be reduced, there are radiating fin in two bottom surfaces, can
To improve the radiating efficiency of two bottom surfaces simultaneously, ensure that two bottom surfaces being capable of rapid cooling.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in describing below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 shows prior art power device layout structure schematic diagram；
Fig. 2 shows that the present invention applies the schematic diagram of the radiator of example；
Fig. 3 shows the heat radiation layout structure schematic diagram of the power device of the embodiment of the present invention；
Fig. 4 shows the heat radiation layout structure schematic diagram of another embodiment of the present invention power device.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's all other embodiments obtained without making creative work, belong to the scope of protection of the invention.
In the description of the present invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, it can be with
It is the connection inside two elements, can is wireless connection or wired connection.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
An embodiment of the present invention provides a kind of radiator, for radiating to power device, as shown in Fig. 2, the dress
Put including：
First bottom surface 10 is provided with first radiating fin 11 vertical with the first bottom surface 10, for installing the first power device
Part；Second bottom surface 20 is connected in predetermined angle with the first bottom surface 10, is provided with second radiating fin vertical with the first bottom surface 10
21, for installing the second power device.In the present embodiment, alleged first power device and the second power device can be identical
Power device, or different power devices.In the present embodiment, the first power device can be IGBT device, the
Two power devices can be rectifier bridge.First power device or rectifier bridge, the second power device are IGBT device.Or
Person, the first power device and the second power device are any one in IGBT device or rectifier bridge.First bottom surface 10 and second
The angle of bottom surface 20 can be acute angle, can be obtuse angle, in the present embodiment, the first bottom surface 10 is vertical with the second bottom surface 20.It will
Power device scattering device is on two vertical bottom surfaces, compared to word order on same bottom surface, can reduce heat dissipation
The width of device, the occupied space of radiator, meanwhile, the first radiating fin 11, the second bottom surface are provided on the first bottom surface 10
The second radiating fin 21 is provided on 20, the first radiating fin 11 can be set parallel to the second bottom surface 20, increase by the first bottom surface
10 radiating efficiency, the second radiating fin 21 can be set parallel to the first bottom surface 10, increase the radiating efficiency of the second bottom surface 20,
Conventional section bar processing technology can be met, can accomplish more intensive radiating fin, so as to increase radiating efficiency.Two bottom surfaces
There is radiating fin, the radiating efficiency of two bottom surfaces can be improved simultaneously, ensure that two bottom surfaces being capable of rapid cooling.In this implementation
In example, radiating fin could be provided as wide fin up and down, may be set to be from connection bottom surface to free end thickness by
Decrescence small fin.
When power device further increases, to ensure that radiating element occupies smaller space, in an alternate embodiment of the invention,
As shown in Fig. 2, the radiator can also include：3rd bottom surface 30, it is parallel with the second bottom surface 20, it is vertical with the first bottom surface 10 to connect
It connects, is provided with the 3rd radiating fin, for installing the 3rd power device.In the present embodiment, the 3rd power device can be with
One or both of one power device and the second power device are identical, can also be with the first power device and the second power device not
Together.3rd bottom surface 30 is arranged in parallel relatively with the second bottom surface 20, and the 3rd radiating fin is provided on the 3rd bottom surface 30 (in Fig. 2 not
Show), the 3rd radiating fin is oppositely arranged with the second radiating fin 21, parallel to the first bottom surface 10.
In an alternate embodiment of the invention, as shown in Fig. 2, being offered on the first bottom surface 10, the second bottom surface 20 and the 3rd bottom surface 30
For the mounting groove 40 of installation power device；Offer to fasten the mounting hole 41 of power device in mounting groove 40.In this reality
It applies in example, power device is mounted in mounting groove 40,40 bottom surface of mounting groove and 40 side of mounting groove can increase power device
Heat dissipation area, be conducive to the heat dissipation of power device.Power device is fastened in mounting groove 40 by screw, work(can be increased
The contact area of rate device and mounting groove 40 increases radiating efficiency.In the present embodiment, in power device and mounting groove 40 also
Heat-conducting silicone grease can be increased, further to increase the contact area of power device and mounting groove 40.
The embodiment of the present invention additionally provides a kind of heat radiation layout structure of power device, as shown in figure 3, the layout structure bag
It includes：
Radiator 100 described in above-described embodiment, the first power device 200, mounted on the first of radiator 100
On bottom surface 10, the second power device 300, on the second bottom surface 20 of radiator 100.Power device scattering device is existed
On two vertical bottom surfaces, compared to word order on same bottom surface, the width of radiator, radiator can be reduced
Occupied space, meanwhile, the first radiating fin 11 is provided on the first bottom surface 10, the second heat radiating fin is provided on the second bottom surface 20
Piece 21, the first radiating fin 11 can be set parallel to the second bottom surface 20, and the second radiating fin 21 can be parallel to the first bottom surface
10 are set, and can meet conventional section bar processing technology, can accomplish more intensive radiating fin, so as to increase radiating efficiency.
There are radiating fin in two bottom surfaces, can improve the radiating efficiency of two bottom surfaces simultaneously, ensure that two bottom surfaces being capable of rapid cooling.
When power device further increases, to ensure that radiating element occupies smaller space, in an alternate embodiment of the invention,
It can also include the 3rd power device 400, on the 3rd bottom surface, the pin straight cutting of the 3rd power device 400 is simultaneously welded on
On substrate 500.
In an alternate embodiment of the invention, the first power device 200 and the second power device 300 are fastened by the way that screw is corresponding respectively
In the mounting groove 40 of 40 and second bottom surface 20 of mounting groove of the first bottom surface 10.Power device is mounted in mounting groove 40, peace
40 bottom surface of tankage and 40 side of mounting groove can increase the heat dissipation area of power device, be conducive to the heat dissipation of power device.Pass through
Power device is fastened in mounting groove 40 by screw, can increase the contact area of power device and mounting groove 40, increases heat dissipation
Efficiency.In the present embodiment, heat-conducting silicone grease can also be increased in power device and mounting groove 40, further to increase power device
The contact area of part and mounting groove 40.
In an alternate embodiment of the invention, which can also include：Substrate 500, for installing radiator 100 and work(
Rate device.In the present embodiment, there are two types of the mounting means of radiator 100 and power device on substrate 500.Such as Fig. 3 institutes
Show, mounting means of the radiator 100 on substrate 500 can be the first bottom surface 10 and the second bottom surface 20 of radiator 100
Perpendicular to substrate 500；The pin straight cutting of the pin of first power device 200 and the second power device 300 on substrate 500, and
By being welded and fixed.As shown in figure 4, mounting means of the radiator 100 on substrate 500 is also possible that the first bottom surface 10 is flat
Row is in substrate 500, and the second bottom surface 20 is perpendicular to substrate 500；The pin of first power device 200 bends to 500 direction of substrate and inserts
On substrate 500, and pass through and be welded and fixed；The pin straight cutting of second power device 300 passes through welding on substrate 500
It is fixed.In the present embodiment, when the first bottom surface 10 is parallel to substrate 500, it is necessary to by the pin of the first power device 200 to base
500 direction of plate is bent, specifically, can bend as the first bottom surface 10 vertically, inserting is welded on substrate 500.Two kinds of installations
Mode can make choice according to the needs of actual conditions.Wherein, radiator 100 can be mounted on base by screw or buckle
On plate 500, mounting means is relatively conventional, is no longer described in detail in the present embodiment.
In an alternate embodiment of the invention, heat radiation layout structure can also include：Wind turbine 600 on substrate 500, generates
The wind of radiator 100 is acted on, in the present embodiment, wind turbine 600 forms air passage to radiator 100, improves radiating efficiency.
The embodiment of the present invention additionally provides a kind of electromagnetic heating utensil, including：Electromagnetic heating utensil body and, it is above-mentioned
The heat radiation layout structure of power device described in embodiment.Alleged electromagnetic heating utensil can be electromagnetic heating (induction
Heat, IH) electric cooker, or electromagnetic oven.
Although being described in conjunction with the accompanying embodiments of the present invention, those skilled in the art can not depart from this hair
Various modification can be adapted in the case of bright spirit and scope and modification, and such modifications and variations are each fallen within by appended claims
Within limited range.
Claims (13)
1. a kind of radiator, for radiating to power device, which is characterized in that including：
First bottom surface is provided with the first radiating fin with first plane perpendicular, for installing the first power device；
Second bottom surface is connected with first bottom surface in predetermined angle, is provided with the second heat dissipation with second plane perpendicular
Fin, for installing the second power device.
2. radiator as described in claim 1, which is characterized in that
First bottom surface and second plane perpendicular.
3. radiator as claimed in claim 2, which is characterized in that further include：
3rd bottom surface is oppositely arranged in parallel with second bottom surface, and is connected with first plane perpendicular, is provided with the 3rd and is dissipated
Hot fin, for installing the 3rd power device.
4. radiator as claimed in claim 3, which is characterized in that first bottom surface, second bottom surface and described
It is offered on three bottom surfaces for the mounting groove of installation power device；
Offer to fasten the mounting hole of the power device in the mounting groove.
5. a kind of heat radiation layout structure of power device, which is characterized in that including：
Radiator as described in claim 1-4 any one；
First power device, on the first bottom surface of the radiator；
Second power device, on the second bottom surface of the radiator.
6. the heat radiation layout structure of power device as claimed in claim 5, which is characterized in that first power device and
By screw, correspondence is fastened in the mounting groove of first bottom surface and the mounting groove of second bottom surface two power devices respectively.
7. the heat radiation layout structure of power device as claimed in claim 5, which is characterized in that further include：
Substrate, for installing the radiator and the power device.
8. the heat radiation layout structure of power device as claimed in claim 7, which is characterized in that
First bottom surface of the radiator and the second plane perpendicular are in the substrate；
The pin straight cutting of the pin of first power device and second power device on the substrate, and passes through welding
It is fixed.
9. the heat radiation layout structure of power device as claimed in claim 7, it is characterised in that；
First bottom surface is parallel to the substrate, and second plane perpendicular is in the substrate；
The pin of first power device inserts on the substrate to orientation substrate bending, and passes through and be welded and fixed；
The pin straight cutting of second power device on the substrate, and passes through and is welded and fixed.
10. the heat radiation layout structure of the power device as described in claim 5-9 any one, which is characterized in that further include：The
Three power devices, on the 3rd bottom surface of the radiator.
11. the heat radiation layout structure of the power device as described in claim 7-9 any one, which is characterized in that further include：
Wind turbine, installation on the substrate, are acted in the wind of the radiator.
12. a kind of electromagnetic heating utensil, it is characterised in that including：
Electromagnetic heating utensil body；And
The heat radiation layout structure of power device as described in claim 5-11 any one.
13. electromagnetic heating utensil as claimed in claim 12, which is characterized in that including：
Electric cooker and/or electromagnetic oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093210.5U CN207398123U (en) | 2017-08-28 | 2017-08-28 | Heat dissipation device and layout structure of power device and electromagnetic heating appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093210.5U CN207398123U (en) | 2017-08-28 | 2017-08-28 | Heat dissipation device and layout structure of power device and electromagnetic heating appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398123U true CN207398123U (en) | 2018-05-22 |
Family
ID=62418656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721093210.5U Active CN207398123U (en) | 2017-08-28 | 2017-08-28 | Heat dissipation device and layout structure of power device and electromagnetic heating appliance |
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| Country | Link |
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| CN (1) | CN207398123U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996613A (en) * | 2019-11-26 | 2020-04-10 | 珠海格力电器股份有限公司 | Power module heat abstractor and electric rice cooker |
| US10674640B1 (en) | 2018-12-12 | 2020-06-02 | Delta Electronics, Inc. | Integrated electronic device |
| TWI720382B (en) * | 2018-12-12 | 2021-03-01 | 台達電子工業股份有限公司 | Integrated electronic device |
| CN113141122A (en) * | 2020-01-20 | 2021-07-20 | 珠海格力电器股份有限公司 | Intelligent power module and preparation method thereof |
| TWI757654B (en) * | 2019-11-08 | 2022-03-11 | 立德電子股份有限公司 | Electrically and thermally conductive structures for high-power power supplies |
-
2017
- 2017-08-28 CN CN201721093210.5U patent/CN207398123U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10674640B1 (en) | 2018-12-12 | 2020-06-02 | Delta Electronics, Inc. | Integrated electronic device |
| TWI720382B (en) * | 2018-12-12 | 2021-03-01 | 台達電子工業股份有限公司 | Integrated electronic device |
| TWI757654B (en) * | 2019-11-08 | 2022-03-11 | 立德電子股份有限公司 | Electrically and thermally conductive structures for high-power power supplies |
| CN110996613A (en) * | 2019-11-26 | 2020-04-10 | 珠海格力电器股份有限公司 | Power module heat abstractor and electric rice cooker |
| CN113141122A (en) * | 2020-01-20 | 2021-07-20 | 珠海格力电器股份有限公司 | Intelligent power module and preparation method thereof |
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