CN207200671U - A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering - Google Patents
A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering Download PDFInfo
- Publication number
- CN207200671U CN207200671U CN201720612150.7U CN201720612150U CN207200671U CN 207200671 U CN207200671 U CN 207200671U CN 201720612150 U CN201720612150 U CN 201720612150U CN 207200671 U CN207200671 U CN 207200671U
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- CN
- China
- Prior art keywords
- arc
- stack shell
- bezel ring
- wall line
- high speed
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- 239000013078 crystal Substances 0.000 title claims abstract description 21
- 239000010453 quartz Substances 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 239000004576 sand Substances 0.000 claims abstract description 9
- 238000010276 construction Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010431 corundum Substances 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model, which is created, is related to semiconductor, crystal production field, particularly a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering.A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering, including stack shell, arc bezel ring, is set at the top of stack shell, arc bezel ring, middle position sets sand inlet, stack shell bottom sets arc egative film, stack shell and arc bezel ring, intersection and stack shell and arc bezel ring, bottom setting rotating shaft tooth, arc bezel ring, are consistent with arc chassis construction；The stack shell inwall is provided with spiral wavy wall line or toroidal helical wall line, and rotation road is formed between spiral wavy wall line or toroidal helical wall line.
Description
Technical field
The invention is related to semiconductor, crystal production field, particularly a kind of quartz crystal undulating helical high speed chamfering
Waveform cylinder.
Background technology
In quartz wafer manufacturing process, using AT-CUT cutting technique, frequency is to belong to thickness to cut in oscillatory process
The pattern of vibration is cut, at this time due to the relation of wafer shape（Cuboid）It is easy for producing the edge effect of vibration, so as to shadow
The Energy distribution to vibration is rung, drastically influence the temperature and electrical characteristic of crystal oscillator, and because crystal is in the undaform of certain speed
Grinding diamond dust under running orbit with surrounding collides, so as to produce physical deformation to the rectangular corner angle of crystal, but
The surface of crystal can not be damage, so limiting time and frequency are needed in manufacture craft, but this control can reduce system
Make benefit；
Roller bearing machine, it is a kind of mesa structure, its surface is provided with several rotary roller bearings, and roller bearing is motor
Rotated by same gear-linked or single one roller bearing is rolled, be mainly used in transmitting or rolled article
It is dynamic.
The content of the invention
The utility model is to invent a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering.
The utility model is achieved through the following technical solutions：A kind of waveform of quartz crystal undulating helical high speed chamfering
Cylinder, including stack shell, stack shell top set arc bezel ring, and arc bezel ring, middle position sets sand inlet, and stack shell bottom sets arc
Egative film, stack shell and arc bezel ring, intersection and stack shell and arc bezel ring, bottom set rotating shaft tooth, arc bezel ring, and arc egative film knot
Structure is consistent；
The stack shell inwall is provided with spiral wavy wall line or toroidal helical wall line, and stack shell overall length is 36cm, and stack shell is wide
The width of 13cm, each spiral wavy wall line or toroidal helical wall line is 6cm, between spiral wavy wall line or toroidal helical wall line
Rotation road is formed, the radian of the arc bezel ring, and arc egative film is 160 ~ 180 degree.
Layer is sanded in the Buddha's warrior attendant for having 2000 mesh as the preferred stack shell inner wall surface gluing, and thickness is received at 1 millimeter to 6.5
Rice.
As preferably described sand inlet insertion sealing axle, the head end for sealing axle is socketed rolling bearing.
Compared with background technology, what is had has the advantages that the utility model：It is simple particularly convenient, that 2- can be reached
The process condition of 70000 or so edger, if combining energy roller bearing and promoting mechanical arm etc. to be forced through the row to crystal motion
Dynamic rail mark, using fixed speed and control grinding-material（Sand）Volume and quantity etc. enable chip vibrational energy
It is evenly distributed, eliminates edge effect caused by chip vibration, and do not damage plane of crystal flatness, realizes the width temperature of quartz crystal
Required well with electrical characteristic, grinding technics consumption price is extremely cheap, and consumptive material compares less milling tool.
Brief description of the drawings
Fig. 1 is the utility model structure chart.
Fig. 2 is sealing axle improved structure figure.
Embodiment
Below by embodiment, with reference to accompanying drawing, technical scheme is described in further detail：
Embodiment 1 is as shown in figure 1, a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering, including stack shell（1）, cylinder
Arc bezel ring, is set at the top of body（2）, arc bezel ring, middle position sets sand inlet（3）, stack shell bottom sets arc egative film（4）,
Stack shell and arc bezel ring, intersection and stack shell and arc bezel ring, bottom set rotating shaft tooth（5）, arc bezel ring, and arc chassis construction
Unanimously；
The stack shell inwall is provided with spiral wavy wall line or toroidal helical wall line（6）, stack shell overall length is 36cm, and stack shell is wide
The width of 13cm, each spiral wavy wall line or toroidal helical wall line is 6cm, between spiral wavy wall line or toroidal helical wall line
Form rotation road（7）, the radian of the arc bezel ring, and arc egative film is 160 ~ 180 degree.
Layer is sanded in the Buddha's warrior attendant for having 2000 mesh as the preferred stack shell inner wall surface gluing, and thickness is received at 1 millimeter to 6.5
Rice.
As preferably described sand inlet insertion sealing axle（8）, seal axle head end socket rolling bearing（9）.
Embodiment：First poured into from top curve lid arrival end and be mixed with the predominantly diamond dust that volume is 6 ~ 10 cubic centimetres
Abrasive, then place into overall length 3cm ~ 5cm quartz crystal original stone chip, amount to and be no more than 22, minimum 10, seal
Sand inlet simultaneously carries out encapsulation process, is laterally placed in the motor platform of roller bearing or the roller bearing of rotating shaft edge-falled machine or roller bearing machine
Or roller gear（10）On, rolling grinding is carried out, the rotating speed of motor is transferred to 250 ~ 1250RPM scopes according to actual wafer requirement
It is interior, chip vibrational energy is evenly distributed, eliminate edge effect caused by chip vibration, quartz wafer is along waveform roller
Spiral wall carry out circular motion, and carry out the chamfering operation at the end of chip four, after the completion of poured out by the outlet of top curve lid, enter
Row washing and cleaning operation；
Embodiment 2, for standard roll, so to control this product in the roller bearing scope of roller bearing, particularly
Prevent after being once put into multiple waveform cylinders, situation about can collide between each other, if placed using bearing is unified, then mutually
Between the bearing of waveform cylinder also can mutually transmit dynamics, and engage, will not shift position, the unification that can also build up speed and
The special delivery of rotation dynamics.
Embodiment 3, the inwall of embodiment 1 is smooth, but really utilizable, and we can be such as ceramics
Production method equally carries out baking vanish bonding corundum coating, this general 2000 mesh of corundum coating or so, and thickness arrives at 1 millimeter
6.5 nanometers, when roll grinding, the coating on inwall can also help to be ground, but the manner can not complete generation
Calculated for dosage and ratio using abrasive, abrasive simpler, it is easier to operate.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology belonging to the present invention is led
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Claims (3)
1. a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering, it is characterized in that：Including stack shell（1）, stack shell top is set
Arc bezel ring,（2）, arc bezel ring, middle position sets sand inlet（3）, stack shell bottom sets arc egative film（4）, stack shell and arc
Bezel ring, intersection and stack shell and arc bezel ring, bottom set rotating shaft tooth（5）, arc bezel ring, is consistent with arc chassis construction；
The stack shell inwall is provided with spiral wavy wall line or toroidal helical wall line（6）, stack shell overall length is 36cm, and stack shell is wide
The width of 13cm, each spiral wavy wall line or toroidal helical wall line is 6cm, between spiral wavy wall line or toroidal helical wall line
Form rotation road（7）, the radian of the arc bezel ring, and arc egative film is 160 ~ 180 degree.
2. a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering according to claim 1, it is characterized in that：The cylinder
Layer is sanded in the Buddha's warrior attendant that body inner wall surface gluing has 2000 mesh, and thickness is at 1 millimeter to 6.5 nanometers.
3. a kind of waveform cylinder of quartz crystal undulating helical high speed chamfering according to claim 1, it is characterized in that：It is described enter
Sand mouth insertion sealing axle（8）, seal axle head end socket rolling bearing（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720612150.7U CN207200671U (en) | 2017-05-29 | 2017-05-29 | A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720612150.7U CN207200671U (en) | 2017-05-29 | 2017-05-29 | A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207200671U true CN207200671U (en) | 2018-04-06 |
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ID=61793706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720612150.7U Active CN207200671U (en) | 2017-05-29 | 2017-05-29 | A kind of waveform cylinder of quartz crystal undulating helical high speed chamfering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207200671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113306028A (en) * | 2021-05-10 | 2021-08-27 | 中山市海晶电子有限公司 | Preparation method of quartz wafer with 3225-8MHZ resonator mounted on surface of ultra-small resistor |
-
2017
- 2017-05-29 CN CN201720612150.7U patent/CN207200671U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113306028A (en) * | 2021-05-10 | 2021-08-27 | 中山市海晶电子有限公司 | Preparation method of quartz wafer with 3225-8MHZ resonator mounted on surface of ultra-small resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20241105 Address after: No. 895 Xinhong Road, Qiubin Street, Wucheng District, Jinhua City, Zhejiang Province 321000 Patentee after: Zhejiang Huilong Chip Technology Co.,Ltd. Country or region after: China Address before: 321000 Huilong Electronics (Jinhua) Co.,Ltd., Industrial Park, Jinhua Economic Development Zone, Zhejiang Province Patentee before: HUILONG ELECTRONIC (JINHUA) CO.,LTD. Country or region before: China |