CN206451697U - MULTILAYER COMPOSITE heat conduction structure body - Google Patents
MULTILAYER COMPOSITE heat conduction structure body Download PDFInfo
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- CN206451697U CN206451697U CN201621385754.4U CN201621385754U CN206451697U CN 206451697 U CN206451697 U CN 206451697U CN 201621385754 U CN201621385754 U CN 201621385754U CN 206451697 U CN206451697 U CN 206451697U
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- heat transfer
- heat
- structure body
- thermosphere
- multilayer composite
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Abstract
The utility model proposes a kind of MULTILAYER COMPOSITE heat conduction structure body, it is included：An at least flexible heat conductive glue-line, with the heat transfer powder for being uniformly distributed combination, wherein flexible heat conductive glue-line, configuration is contacted with the surface of electronic component；And an at least heat transfer thermosphere, at least it is stacked and is bonded by metal level and non-metallic layer, the heat transfer number of metal level and non-metallic layer is higher than flexible heat conductive glue-line；The flexible heat conductive glue-line of wherein at least one and at least a heat transfer thermosphere is stacked combination each other.Heat conduction structure body of the present utility model, the high-effect heat transfer in 3 D stereo direction can be formed, it is adapted to configuration and makees three-dimensional conduction transfer heat between electronic component heating surface and radiator, reach the rapid heat dissipation of comprehensive diffusion, the hyperpyrexia produced by electronic component is excluded with certain conduction, operational efficiency and service life for ensuring electronic component, possess industrial utilization.
Description
Technical field
The utility model is related to a kind of MULTILAYER COMPOSITE heat conduction structure body, more particularly to a kind of to have 3 D stereo direction high
The MULTILAYER COMPOSITE heat conduction structure body of efficiency heat transfer.
Background technology
Press, many electronic components, especially large-scale integrated circuit, microprocessor etc., it is generally unavoidable in operation
Ground can be along with generation hyperpyrexia.And if this hyperpyrexia can not be excluded in time, can not only detract the operational efficiency of electronic component and make
With the life-span, in addition will cause electronic component failure and loss of function.Particularly electronic product is frivolous short in order to meet now
Skilful epoch trend, associated microprocessor mostly gradually adopts high integration (degree of integration) design side
Formula, the heat multiplication for being discharged the per unit area of element, therefore harmful effect or infringement caused by the cooling of deficiency,
To be very serious.
It is currently used for promoting the means of electric equipment products heat dissipation, typically by the electric elements and radiating that can be generated heat
Heat eliminating medium is configured between device, such as heat-conducting silica gel sheet, heat-conducting cream, heat-conducting double-sided adhesive tape and solid-state turn liquid heat conductive phase change
Material, so as to effectively will heat produced by heat-generating electronic elements be transferred on radiator, with up to cooling electric equipment purpose.
But the boundary material of this heat eliminating medium focuses on to do the heat of electronic component is vertically transferred to radiator up and down
On, then radiated by radiator.Only this technology (is such as moulded when electronic apparatus mechanism (shell) is not good heat sink material
Material), or when can not use other radiators in finite state machine conformational space and narrow confined space, cannot effectively reach cooling electricity
The purpose of subcomponent or electronic and electrical equipment.
Thus prior art could be improved and improve.
Utility model content
In view of above-mentioned problem of the prior art, a purpose therein of the present utility model is to provide a kind of MULTILAYER COMPOSITE
Heat conduction structure body, primarily forms the high-effect heat transfer in 3 D stereo direction, has high flexural property concurrently, and can implement the structure that insulate
Make, be adapted to configuration between electronic component heating surface and radiator, and high deflections are arranged on having for electronic apparatus mechanism
Limit in space or narrow confined space, three-dimensional conduction transfer heat can be made, reach that comprehensive diffusion is radiated rapidly effect
Can, the hyperpyrexia produced by electronic component is excluded with certain conduction, operational efficiency and service life for ensuring electronic component possess
Industrial utilization.
For up to above-mentioned purpose, the utility model proposes a kind of MULTILAYER COMPOSITE heat conduction structure body, it is included：At least one is flexible
Heat-conducting glue layer, with the heat transfer powder for being uniformly distributed combination, wherein flexible heat conductive glue-line, configuration is contacted with the table of electronic component
Face；And an at least heat transfer thermosphere, at least it is stacked and is bonded by metal level and non-metallic layer, metal level and non-metallic layer
Heat transfer number is higher than flexible heat conductive glue-line；The flexible heat conductive glue-line of wherein at least one and at least a heat transfer thermosphere is stacked knot each other
Close.
It is preferred that can further include colloid, metal level is set to be stacked combination each other with non-metallic layer.
It is preferred that the metal level is copper foil layer, aluminium foil layer or tinfoil paper layer, the non-metallic layer is that graphite linings or graphite are fine
Tie up layer.
It is preferred that heat conduction structure body can be intermeshed by multiple flexible heat conductive glue-lines and multiple heat transfer thermospheres is stacked knot
Close and constitute.
It is preferred that an at least heat transfer thermosphere can intermesh to be stacked by multiple metal levels and multiple non-metallic layers combines structure
Into.
It is stacked it is preferred that MULTILAYER COMPOSITE heat conduction structure body can be separated by flexible heat conductive glue-line combination heat transfer thermosphere by two
It is bonded.
It is bonded it is preferred that an at least heat transfer thermosphere can be stacked by two non-metallic layer being separated by combination metal levels.
It is preferred that the heat transfer thermosphere away from the heat-generating electronic elements in an at least heat transfer thermosphere can combine it is another
Flexible heat conductive glue-line.
It is preferred that the flexible heat conductive glue-line away from the heat-generating electronic elements in an at least flexible heat conductive glue-line can be combined
Another heat transfer thermosphere.
It is preferred that an at least flexible heat conductive glue-line can be stacked glued fixation with an at least heat transfer thermosphere.
It is incorporated into it is preferred that an at least flexible heat conductive glue-line can be coated with an at least heat transfer thermosphere.
From the above, according to the utility model, it can have one or more following advantages：
Heat conduction structure body of the present utility model, can form the high-effect heat transfer in 3 D stereo direction, be adapted to configuration in electricity
Make three-dimensional conduction transfer heat between subcomponent heating surface and radiator, reach that comprehensive diffusion is radiated rapidly effect
Can, the hyperpyrexia produced by electronic component is excluded with certain conduction, operational efficiency and service life for ensuring electronic component possess
Industrial utilization.
Heat conduction structure body of the present utility model has high flexural property, and high deflections are arranged on the limited of electronic apparatus mechanism
In space or narrow confined space.
Brief description of the drawings
The section amplification figure of the composite thermal conductance structure of Fig. 1 the utility model first embodiments.
The section amplification figure of Fig. 2 the utility model second embodiments.
The structure chart of Fig. 3 the utility model 3rd embodiments.
The use state figure of Fig. 4 the utility model fourth embodiments.
The use state figure of the embodiment of Fig. 5 the utility model the 5th.
The use state figure of Fig. 6 the utility model sixth embodiments.
The use state figure of the embodiment of Fig. 7 the utility model the 7th.
Embodiment
Advantage of the present utility model, feature and the technical method reached will enter with reference to exemplary embodiments and institute's accompanying drawings
Row is more fully described and is easier to understand, and the utility model can be realized in different forms, therefore not it is understood that being only limitted to
Embodiments set forth herein, on the contrary, for art tool usually intellectual, the embodiment provided will make
This exposure is more thoroughly with comprehensively and intactly passing on category of the present utility model, and the utility model will only be attached Shen
Please the scope of the claims defined.
One or more following embodiments of the utility model disclose a kind of MULTILAYER COMPOSITE heat conduction structure body, and coordinate figure
Formula is described as follows：First, the 1st to 3 figure is referred to, MULTILAYER COMPOSITE heat conduction structure body of the present utility model possesses 3 D stereo side
To heat transfer efficiency, in heat conduction structure body embodiment as depicted, passed including at least a flexible heat conductive glue-line 10 and a heat
Heat-conducting layer 20, flexible heat conductive glue-line 10 can select such as heat-conducting silica gel sheet, heat conduction colloid, or turn liquid phase-change using tool solid-state
The heat conduction materials such as the heat conduction phase change material of high polymer material, and heat transfer thermosphere 20, at least by a metal level 202 and a non-metallic layer
201 are bonded by colloid 203 to be stacked each other, the optional apparatus high heat-conduction coefficient of metal level 201 and vertical direction heat conduction
Property good metal material, such as copper foil, aluminium foil or tinfoil paper material, and the optional apparatus high heat-conduction coefficient of non-metallic layer 201 and flat
The good nonmetallic materials of face direction thermal conductivity, such as graphite or graphitized filamentary material.The present embodiment flexible heat conductive glue-line 10 and heat
The conduction thickness of thermosphere 20 can respectively select 0.01mm ~ 15mm, make it is stacked on top of each other between each material layer combine closely, it is multiple to form multilayer
Close heat conduction structure body.
In the preferred embodiment shown in Fig. 1 to Fig. 3, it may be selected with single flexible heat conductive glue-line 10 or multiple flexible heat conductives
Glue-line 10,11,12 coordinates single heat transfer thermosphere 20 or multiple heat transfer thermospheres 20,21, and it is each other to interact cross-bedding
It is stacked multilayer materials.The heat transfer thermosphere 20,21, may be selected with single non-metallic layer 201 or multiple non-metallic layers
201st, 204,211,214 coordinate single metal levels 202 or multiple metal levels 202,205,212, its each other with colloid 203,
213 interaction intersecting composition heat transfer thermospheres 20,21, to obtain the complex structure body for possessing Three Dimensional Thermal conductive performance；Again originally
The multilayer materials of form have quality flexible and flexible material property, therefore can be closely affixed on and can produce the electricity of thermal source
In subcomponent 30, so that efficiently the heat derives of electronic component 30 are sent on radiator 40, or electronics electricity is sent to
Device mechanism (shell) 50, it is to avoid the accumulation heat on electronic component 30, causes failure；So as to solve electronics (electrical equipment) element at one stroke
Heat dissipation problem during 30 operation.
As shown in Fig. 2 the MULTILAYER COMPOSITE heat conduction structure body combines one by two flexible heat conductive being separated by glue-lines 10,11
Heat transfer thermosphere 20, which is stacked, to be bonded, i.e. a heat transfer thermosphere 20 is located between two flexible heat conductive glue-lines 10,11, and is combined into
MULTILAYER COMPOSITE heat conduction structure body.
As shown in Fig. 2 an at least heat transfer thermosphere 20 by two non-metallic layers being separated by 201,204 with reference to the gold
Category layer 202, which is stacked, to be bonded, i.e. a metal level 202 is located between two non-metallic layers 201,204, and is combined into heat transfer thermosphere
20。
Flexible heat conductive glue-line 10 and colloid 203,213 in above-mentioned multilayer materials include heat transfer powder, and
For combining the glue material of foregoing heat transfer powder particles, and the heat transfer powder is set to be uniformly distributed in glue material using processing procedure is kneaded
In, it is then fixed-type.Wherein, the heat transfer powder can select such as：Aluminum oxide, aluminium nitride, boron nitride, graphite, aluminium powder, copper
Powder, cupric oxide, zinc oxide ... etc., the heat transfer powder are probably one of previous materials or mixed by more than two kinds materials
And winner.And heat transfer powder body material is irregular type particle, from about 0.1 μm ~ 100 μm of suitable particle mean size.
And the glue material then can select such as：Epoxy resin, acryl resin, phenolic resin, polyester resin, polyvinyl acetate tree
Fat (PVAC), silica gel (Silicon) or synthetic rubber ... etc., also, the glue material can be one of previous materials or by two
Above material is planted to mix.
Above-mentioned epoxy resin, acryl resin, phenolic resin, polyester resin, polyvinyl acetate resin (PVAC), silica gel
(Silicon) or synthetic rubber ... etc., coming under high molecular weight material, but every kind of different glue material (resin) etc. all has it
Decomposition, cladding, the fusion of optimal dissolved dilution (SP) agent (low molecule amount), obtain (low molecule amount) control glue material (high score
Son amount) minimum conjugation glass softening point, so then can obtain molecular weight from the glue material of 1000 ~ 1000000 molecular weight, this
Glue material can because molecular size range or else with temperature under do the change of solid liquid phase, will not produce gas phase or carbonization in glass softening point
Change, we are referred to as low temperature phase change colloid to such a glue material, and low temperature phase change colloid is from 35 DEG C ~ 105 DEG C.
Foregoing flexible heat conductive glue-line 10 is normally manufactured as the planar or en plaque of 0.02 ~ 15mm thickness, and because flexibility is led
The texture material of hot glue layer 10 is flexible, possesses the characteristic of pliability and plastic deformation, therefore configuration that can be close, docile is in heating
The surface of electronic component 30, to reduce the thermal contact resistance at interface, is arranged so that the rapid heat by produced by electronic component 30 conducts
Remove.
Furthermore, flexible heat conductive glue-line 10 and colloid 203,213 can be mixed by glue material with the different proportion of heat transfer powder,
To obtain desired heat transfer property and other material properties：General principle, when the heat transfer powder occupation ratio in mixing material
Example is higher, and its heat conductive efficiency is better, but the physical property such as flexible and plasticity of material is then poor.Conversely, the ratio occupied when glue material
More, heat conductive efficiency is poor, and the physical property such as flexible and plasticity of material is then preferable.Generally from the glue material between 10% ~ 70% with
Heat transfer powder collocation between 90% ~ 30%, makes flexible heat conductive glue-line 10 and colloid 203,213 to obtain about 0.5W/mk ~ 12W/
The mk coefficients of heat conduction.In addition, when from high electrical resistance powders such as aluminium nitride, aluminum oxide or boron nitride, flexibility can be led
Hot glue layer 10 and colloid 203,213 have the electrical impedance (10 of high insulation6~1019 Ω.cm)。
In the present embodiment, en plaque can be made in the mixing material of flexible heat conductive glue-line 10 with thermoforming way, and
It is surface-treated, then gluing is sticked on the apparent surface of the metal level 202 of heat transfer thermosphere 20 or non-metallic layer 201.Remove
, also can be using coating (spraying or blade coating etc.) mode or screen painting mode, in the metal level 202 of heat transfer thermosphere 20 outside this
Or the surface of non-metallic layer 201 makes the flexible heat conductive glue-line 10 that a thickness is about 0.02 ~ 0.3mm, and the molecule for passing through its glue material
Structure positions the equally distributed heat transfer powder such as this to combine.Similarly, the mixing material of colloid 203 also can be to be hot pressed into
En plaque is made in type mode, and is surface-treated, then gluing is close in the metal level 202 or nonmetallic of heat transfer thermosphere 20
On the apparent surface of layer 201.In addition, also can be using coating (spraying or blade coating etc.) mode or screen painting mode, in heat
The metal level 202 or the surface of non-metallic layer 201 for conducting thermosphere 20 make the colloid 203 that a thickness is about 0.01mm, to make metal
Layer 202 and non-metallic layer 201 are stacked combination each other.
It is closely connected on the heating surface of electronic component 30 in the flexible heat conductive glue-line 10 shown in Fig. 1, shifting can be effectively conducted
Turn heat to the metal level 202 and non-metallic layer 201 of heat transfer thermosphere 20, to carry out overall diffusion radiating, while by heat
High efficiency export is sent on radiator 40.In addition, also can be as shown in Fig. 2 by the metal level 202 of the heat transfer thermosphere 20
And the overall diffusion of non-metallic layer 201 conducts heat to another relative flexibility heat-conducting glue layer 11, electricity is sent to insulation mode export
Sub- electrical apparatus mechanism (shell) 50.
It is the flexible heat conductive glue-line 10 of the present embodiment composite thermal conductance structure and the metal level 202 of heat transfer thermosphere 20, non-
Metal level 201 and colloid 203 possess deflection characteristic, therefore can carry out any flexure as shown in Figure 4 and Figure 5, and thermal source is made
Three-dimensional conduction is passed to appropriate location and carries out thermal diffusion and samming.
In the embodiment shown in Fig. 4 and Fig. 5, flexible heat conductive glue-line 10 is closely connected on the heating surface of electronic component 30,
And metal level 202, non-metallic layer 201 and the colloid 203 of heat transfer thermosphere 20 are laminated on flexible heat conductive glue-line 10 and deflection
Be C-shaped (such as Fig. 4) or S fonts (such as Fig. 5), and the heat transfer thermosphere 20 away from electronic component 30 extension combine it is another
Flexible heat conductive glue-line 13, makees three-dimensional conduction by thermal source and is passed to appropriate location progress thermal diffusion and samming.Except this it
Outside, flexible heat conductive glue-line 10 it can also be closely attached to as shown in Figure 6 and Figure 7 on the heating surface of electronic component 30, and in flexible heat conductive
Stacking thermally conductive heat layer 20 on glue-line 10, then the stacking flexible heat conductive glue-line 11 on heat transfer thermosphere 20, and flexible heat conductive glue-line
11 deflections are C-shaped (such as Fig. 6) or S fonts (such as Fig. 7), and in the stretching of the flexible heat conductive glue-line 11 away from electronic component 30
Portion combines metal level 222, non-metallic layer 221 and the colloid 223 of another heat transfer thermosphere 22.Therefore flexibility of the present utility model
Heat-conducting glue layer and heat transfer thermosphere energy high deflections are arranged in the confined space of electronic apparatus mechanism or narrow confined space, energy
Enough make three-dimensional conduction transfer heat, reach the rapid heat dissipation of comprehensive diffusion.
The utility model MULTILAYER COMPOSITE heat conduction structure body primarily forms the high-effect heat transfer in 3 D stereo direction, has height concurrently
Flexural property, and insulation structure can be implemented, it is adapted to configuration between electronic component heating surface and radiator, and height is scratched
Song is arranged in the confined space of electronic apparatus mechanism or narrow confined space, can make three-dimensional conduction transfer heat,
The rapid heat dissipation of comprehensive diffusion is reached, the hyperpyrexia produced by electronic component is excluded with certain conduction, for ensuring electronic component
Operational efficiency and service life, possess industrial utilization, in accordance with the law propose new patent application.
Embodiment provided above only uses the utility model for convenience of description, and is not in a limitative way, new not from this practicality
Type scope, is familiar with various simple changes and modification that this industry those skilled in the art can make, should include in following Shen
Please be in the scope of the claims.
Claims (11)
1. a kind of MULTILAYER COMPOSITE heat conduction structure body, it is characterised in that include：
An at least flexible heat conductive glue-line, with the heat transfer powder for being uniformly distributed combination, wherein a flexible heat conductive glue-line, configuration connects
Touch in the surface of an electronic component；And
An at least heat transfer thermosphere, is at least stacked and is bonded by a metal level and a non-metallic layer, the metal level and this is non-
The coefficient of heat conduction of metal level is higher than the flexible heat conductive glue-line；
Wherein, an at least flexible heat conductive glue-line and an at least heat transfer thermosphere are stacked combination each other.
2. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that also comprising colloid, makes described
Metal level is stacked combination each other with the non-metallic layer.
3. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that the metal level be copper foil layer,
Aluminium foil layer or tinfoil paper layer, the non-metallic layer are graphite linings or graphite fibre layer.
4. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that the MULTILAYER COMPOSITE heat transfer knot
Structure body intermeshes to be stacked and is bonded by multiple flexible heat conductive glue-lines with multiple heat transfer thermospheres.
5. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least heat transfer thermosphere
Intermesh to be stacked with multiple non-metallic layers by multiple metal levels and be bonded.
6. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that the MULTILAYER COMPOSITE heat transfer knot
Structure body is stacked with reference to a heat transfer thermosphere by two flexible heat conductive being separated by glue-lines and is bonded.
7. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least heat transfer thermosphere
It is stacked and is bonded with reference to the metal level by two non-metallic layers being separated by.
8. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least heat transfer thermosphere
In a heat transfer thermosphere away from the electronic component combine another flexible heat conductive glue-line.
9. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least flexible heat conductive glue
A flexible heat conductive glue-line away from the electronic component in layer combines another heat transfer thermosphere.
10. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least flexible heat conductive
Glue-line is stacked glued fixation with an at least heat transfer thermosphere.
11. MULTILAYER COMPOSITE heat conduction structure body according to claim 1, it is characterised in that an at least flexible heat conductive
Glue-line, which is coated with, to be incorporated on an at least heat transfer thermosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385754.4U CN206451697U (en) | 2016-12-16 | 2016-12-16 | MULTILAYER COMPOSITE heat conduction structure body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621385754.4U CN206451697U (en) | 2016-12-16 | 2016-12-16 | MULTILAYER COMPOSITE heat conduction structure body |
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| CN206451697U true CN206451697U (en) | 2017-08-29 |
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ID=59674165
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411688A (en) * | 2018-08-30 | 2019-03-01 | 广州倬粤动力新能源有限公司 | The connection method of grid and tab |
| CN114675478A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| CN114675480A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
-
2016
- 2016-12-16 CN CN201621385754.4U patent/CN206451697U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411688A (en) * | 2018-08-30 | 2019-03-01 | 广州倬粤动力新能源有限公司 | The connection method of grid and tab |
| CN114675478A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| CN114675480A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| US11714344B2 (en) | 2020-12-24 | 2023-08-01 | Coretronic Corporation | Wavelength conversion module and projector |
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