CN205755087U - A kind of atomizing type overlay film reaction unit - Google Patents
A kind of atomizing type overlay film reaction unit Download PDFInfo
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- CN205755087U CN205755087U CN201620620410.0U CN201620620410U CN205755087U CN 205755087 U CN205755087 U CN 205755087U CN 201620620410 U CN201620620410 U CN 201620620410U CN 205755087 U CN205755087 U CN 205755087U
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- China
- Prior art keywords
- liquid medicine
- high pressure
- overlay film
- pressure reaction
- atomising device
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Abstract
The utility model discloses a kind of atomizing type overlay film reaction unit, it includes liquid medicine storage cylinder, atomising device and the high pressure reaction assembly being sequentially connected with, also including that gas emission pipe, described gas emission pipe one end are connected to described high pressure reaction assembly, the other end is connected to described liquid medicine storage cylinder.First liquid medicine entered atomising device by liquid medicine storage cylinder, enters high pressure reaction assembly after atomization, and the liquid medicine after atomization fully reacts with copper face in high pressure reaction assembly, forms the overlay film effectively combined.Do not use immersion type processing mode; and liquid medicine is after atomization; it is effectively increased its utilization rate; reduce the use cost of liquid medicine; and liquid medicine processes through atomization can reach molecule rank; reaction with copper face is more efficient thoroughly, can form more reliable organic protective film, solves the problem that overlay film is bad, film body easily departs from.
Description
Technical field
This utility model belongs to printed circuit board technical field of surface, relates in particular to a kind of atomizing type overlay film anti-
Answer device.
Background technology
It is the one in process of surface treatment that organic membrane is covered on printed circuit board surface, for reducing cost, protection environment, mainly
Select OSP technique (Organic Solderability Preservatives, organic guarantor welds film), i.e. at clean naked copper table
Face is exchanged by liquid medicine with chemical method and last layer organic membrane is covered in circulation, and this organic membrane has anti-oxidation, heat shock resistance, humidity
Etc. character, copper face not oxidized or sulfuration under normal environment can be protected.
Coating technique flow process is predominantly by horizontal line at present, uses the flat electric plating method of similar water, uses liquid medicine to soak
And circulation, make copper face be covered with organic membrane, but this method there is problems in that owing to wiring board needs to be immersed in liquid medicine,
Need in cylinder body to have enough can the liquid medicine of submergence coated products, liquid medicine is relatively costly；Immersion type reaction is difficulty with effectively
The combination of copper face and overlay film, the problems such as bad, the film body separation of overlay film easily occur.
Utility model content
To this end, this utility model is just intended to solve problem present in existing immersion type coating technique, thus one is proposed
Processing cost is low, organic membrane is combined effect more preferable atomizing type overlay film reaction unit with copper face.
For solving above-mentioned technical problem, the technical solution of the utility model is:
This utility model provides a kind of atomizing type overlay film reaction unit, and it includes liquid medicine storage cylinder, the atomization being sequentially connected with
Device and high pressure reaction assembly, also include that gas emission pipe, described gas emission pipe one end are connected to described reaction under high pressure
Device, the other end is connected to described liquid medicine storage cylinder.
As preferably, described high pressure reaction assembly top is provided with product clamper, treats that coated products is mounted on described product
Fixture.
As preferably, described atomising device is soniclizer, and described atomising device is by liquid medicine pipeline and described medicine
Water storage cylinder connects.
As preferably, described high pressure reaction assembly is gases at high pressure reaction cylinder, described gases at high pressure reaction cylinder and described mist
Gasifying device is by being atomized pipeline connection.
As preferably, described liquid medicine pipeline is arranged between described liquid medicine storage cylinder and described atomising device, is stored up by liquid medicine
The liquid medicine deposited in cylinder is delivered to atomising device.
As preferably, described atomization pipeline is arranged between described atomising device and described high pressure reaction assembly, will atomization
After liquid medicine input high pressure reaction assembly.
As preferably, in described high pressure reaction assembly, pressure is 0.6-1.6MPa.
Technique scheme of the present utility model has the advantage that compared to existing technology
Atomizing type overlay film reaction unit described in the utility model, it includes liquid medicine storage cylinder, the atomization dress being sequentially connected with
Put and high pressure reaction assembly, also include that gas emission pipe, described gas emission pipe one end are connected to described reaction under high pressure dress
Putting, the other end is connected to described liquid medicine storage cylinder.First liquid medicine entered atomising device by liquid medicine storage cylinder, enters height after atomization
Pressure reaction unit, the liquid medicine after atomization fully reacts with copper face in high pressure reaction assembly, forms the overlay film effectively combined.Do not adopt
Use immersion type processing mode, and liquid medicine is after atomization, is effectively increased its utilization rate, reduces the use cost of liquid medicine, and
And liquid medicine processes through atomization and can reach molecule rank, the reaction with copper face is more efficient thoroughly, can be formed more reliable
Organic protective film, solves the problem that overlay film is bad, film body easily departs from.
Accompanying drawing explanation
In order to make content of the present utility model be more likely to be clearly understood, it is embodied as below according to of the present utility model
Example also combines accompanying drawing, is described in further detail this utility model, wherein
Fig. 1 is the atomizing type overlay film reaction unit structural representation described in this utility model embodiment.
In figure, reference is expressed as: 1-liquid medicine storage cylinder；2-atomising device；3-high pressure reaction assembly；4-gas discharges
Pipeline；5-product clamper；6-wiring board；7-liquid medicine pipeline；8-is atomized pipeline；
Detailed description of the invention
Embodiment
The present embodiment provides a kind of atomizing type overlay film reaction unit, as it is shown in figure 1, it includes that the liquid medicine being sequentially connected with stores
Cylinder 1, atomising device 2 and high pressure reaction assembly 3, also include that gas emission pipe 4, described gas emission pipe 4 one end are connected to
Described high pressure reaction assembly 3, the other end is connected to described liquid medicine storage cylinder 1.Described high pressure reaction assembly 3 top is provided with product
Fixture 5, treats that wiring board 6 product of overlay film is mounted on described product clamper 5 and carries out overlay film in high pressure reaction assembly 3.Described
Product clamper 5 can be multiple, and high pressure reaction assembly 3 can process multiple wiring board 6 simultaneously, and overlay film efficiency is high.
Further, described atomising device 2 is soniclizer, and it is by liquid medicine pipeline 7 and described liquid medicine storage cylinder 1
Connection, described liquid medicine pipeline 7 is arranged between described liquid medicine storage cylinder 1 and described atomising device 2, by liquid medicine storage cylinder 1
Liquid medicine is delivered to atomising device 2, liquid medicine in atomising device 2 by ultrasonic atomization.
Described high pressure reaction assembly 3 is gases at high pressure reaction cylinder, described gases at high pressure reaction cylinder and described atomising device 2 by
Atomization pipeline 8 connects, and described atomization pipeline 8 is arranged between described atomising device 2 and described high pressure reaction assembly 3, will atomization
After liquid medicine input high pressure reaction assembly 3, carry out chemical reaction with the copper face of wiring board 6, form protecting film, during reaction, described
Pressure in gases at high pressure reaction cylinder is 0.6-1.6MPa, is preferably 1MPa in the present embodiment.
The work process of the atomizing type overlay film reaction unit described in the present embodiment is:
After adding the original liquid medicine of organic protective film in liquid medicine storage cylinder 1, wiring board 6 product is sent into high pressure reaction assembly
In 3, and hang on product clamper 5, close high pressure reaction assembly 3, liquid medicine is inputted atomising device 2 by liquid medicine pipeline 7 and carries out
Ultrasonic atomization, is filled with high pressure reaction assembly 3 by the liquid medicine of atomization by being atomized pipeline 8 afterwards, seals high pressure reaction assembly 3, makes
Atomization liquid medicine reacts 10-30s with wiring board 5 copper face, slowly opens gas emission pipe 4 and discharges organic gas, discharge organic
Gas enters liquid medicine storage cylinder 1, the product after finally taking-up process via gas emission pipe 4.It is filled with at high pressure reaction assembly 3
During liquid medicine after atomization, the original gas in reaction unit can be entered in liquid medicine storage cylinder 1 by gas emission pipe 4.Reaction
Device reaction gases concentration reaches more than 90%, can seal reaction unit and start reaction, and air pressure during reaction needs to protect
Hold at 0.6-1.6MPa, it is ensured that gas fully reacts with copper face.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among the protection domain still in this utility model creation.
Claims (7)
1. an atomizing type overlay film reaction unit, it is characterised in that include liquid medicine storage cylinder, atomising device and the height being sequentially connected with
Pressure reaction unit, also includes that gas emission pipe, described gas emission pipe one end are connected to described high pressure reaction assembly, another
End is connected to described liquid medicine storage cylinder.
Atomizing type overlay film reaction unit the most according to claim 1, it is characterised in that described high pressure reaction assembly top sets
It is equipped with product clamper, treats that coated products is mounted on described product clamper.
Atomizing type overlay film reaction unit the most according to claim 2, it is characterised in that described atomising device is ultrasonic fog
Changing device, described atomising device is connected with described liquid medicine storage cylinder by liquid medicine pipeline.
Atomizing type overlay film reaction unit the most according to claim 3, it is characterised in that described high pressure reaction assembly is high pressure
Gas reaction cylinder, described gases at high pressure reaction cylinder and described atomising device are by being atomized pipeline connection.
Atomizing type overlay film reaction unit the most according to claim 4, it is characterised in that described liquid medicine pipeline is arranged at described
Between liquid medicine storage cylinder and described atomising device, the liquid medicine in liquid medicine storage cylinder is delivered to atomising device.
Atomizing type overlay film reaction unit the most according to claim 5, it is characterised in that described atomization pipeline is arranged at described
Between atomising device and described high pressure reaction assembly, by the liquid medicine input high pressure reaction assembly after atomization.
Atomizing type overlay film reaction unit the most according to claim 6, it is characterised in that pressure in described high pressure reaction assembly
For 0.6-1.6MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620620410.0U CN205755087U (en) | 2016-06-22 | 2016-06-22 | A kind of atomizing type overlay film reaction unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620620410.0U CN205755087U (en) | 2016-06-22 | 2016-06-22 | A kind of atomizing type overlay film reaction unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755087U true CN205755087U (en) | 2016-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620620410.0U Expired - Fee Related CN205755087U (en) | 2016-06-22 | 2016-06-22 | A kind of atomizing type overlay film reaction unit |
Country Status (1)
| Country | Link |
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| CN (1) | CN205755087U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
| CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
-
2016
- 2016-06-22 CN CN201620620410.0U patent/CN205755087U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
| CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20200622 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |