CN205454216U - Printed circuit board of optical module - Google Patents
Printed circuit board of optical module Download PDFInfo
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- CN205454216U CN205454216U CN201521076075.4U CN201521076075U CN205454216U CN 205454216 U CN205454216 U CN 205454216U CN 201521076075 U CN201521076075 U CN 201521076075U CN 205454216 U CN205454216 U CN 205454216U
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- solder resist
- golden finger
- printed circuit
- circuit board
- pcb
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Abstract
The utility model relates to an integrated circuit field especially relates to a printed circuit board of optical module, include: the base plate, lay in conducting wire and at least one golden finger of substrate surface, its characterized in that, cover the solder resist on the base plate, the solder resist with contactless between the golden finger, the problem of lead to the fastener and golden finger contact failure of outside slot among the prior art because of solder resist coating is solved.
Description
Technical field
This utility model relates to integrated circuit fields, particularly relates to the printed circuit board (PCB) of a kind of optical module.
Background technology
Printed circuit board (PCB) (PCB, printedcircuitboard), also known as printed substrate or printed circuit board, with insulation board as base material, it is cut into certain size, at least with a conductive pattern on it, and cloth porose (such as component hole, fastener hole, plated through-hole etc.), it is used for replacing the chassis of conventional device electronic devices and components, and realizes being connected with each other between electronic devices and components.
Golden finger is numerous flavous conductive contact blades, because its surface gold-plating and arrangement are such as finger-shaped, so referred to as " golden finger ", has that non-oxidizability is extremely strong, wearability good and feature that conductivity is the strongest.Therefore it is widely used in pluggable printed circuit board (PCB), such as memory bar or video card etc., is the connection member between printed circuit board (PCB) and slot, is used for realizing the in electrical contact of printed circuit board (PCB) and other electric components.Solder resist is a kind of protective layer, is coated in printed circuit board and is not required on circuit and the base material of welding, it is therefore an objective to the line pattern that digital preservation is formed.
In prior art, solder resist is covered the root to golden finger, as shown in Figure 1.Owing to the thickness of one layer of solder resist is higher than the thickness of golden finger, therefore, when the golden finger of external equipment clamping printed circuit board, easily it is engaged to solder resist, as shown in dotted line in Fig. 2.Due to the padded retaining part of external equipment of solder resist, as shown in the amplification unit in Fig. 3, fastener and golden finger loose contact can be caused, hinder the in electrical contact of printed circuit board (PCB) and other electric components.
Utility model content
This utility model embodiment provide a kind of optical module printed circuit board (PCB), in order to solve in prior art because solder resist coating and cause the fastener of external slot and the problem of golden finger loose contact.
The printed circuit board (PCB) of a kind of optical module that this utility model embodiment provides, including: substrate, the conducting wire being layed in described substrate surface and at least one golden finger；Cover solder resist on described substrate, do not contact between described solder resist with described golden finger.
Printed circuit board (PCB) in this utility model above-described embodiment, reserves a certain distance between solder resist and golden finger so that the distance between bottom solder resist and printed circuit board (PCB) is more than the fastener length at slot.Thus, during fastener clamping golden finger, the solder resist covered on a printed circuit will not be touched.Avoid the solder resist that there is insulation between the fastener in slot and golden finger, solve fastener and golden finger loose contact that solder resist causes, hinder the problem in electrical contact of printed circuit board (PCB) and other electric components.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the printed circuit board (PCB) of optical module in prior art；
Fig. 2 is printed circuit board (PCB) and the sectional view of slot of optical module in prior art；
Fig. 3 is printed circuit board (PCB) and the partial enlarged drawing of slot of optical module in prior art；
Fig. 4 is the schematic diagram of SFP type printed circuit board (PCB) in this utility model embodiment；
Fig. 5 is printed circuit board (PCB) and the sectional view of slot of optical module in this utility model embodiment；
Fig. 6 is printed circuit board (PCB) and the partial enlarged drawing of slot of optical module in this utility model embodiment；
Fig. 7 is the schematic diagram of XFP type printed circuit board (PCB) in this utility model embodiment.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, this utility model is described in further detail, it is clear that described embodiment is only this utility model some embodiments rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
This utility model embodiment provides a kind of printed circuit board (PCB), is mainly used in optical module field.
Fig. 4 shows the front schematic view of the printed circuit board (PCB) that this utility model embodiment provides.As shown in Figure 4, this printed circuit board (PCB) includes substrate 1, the conducting wire 2 being layed in described substrate surface and at least one golden finger 31, solder resist 4 is covered on substrate 1, solder resist 4 is covered on substrate 1 and conducting wire 2, the thickness of solder resist 4 is higher than the thickness of golden finger 31, and do not contact between solder resist 4 with golden finger 31, in Fig. 4, part conducting wire 2 is covered by solder resist 4.
In the golden finger of some printed circuit board (PCB)s, some has extending part 5, and such as SFP (SmallFormfactorPluggable) the type circuit board in Fig. 4, wherein golden finger 31 has extending part 5.In prior art, solder resist 4 covers the extending part 5 of golden finger.Owing to the thickness of extending part 5 is identical with the thickness of golden finger 31, after covering solder resist 4, the thickness that extending part 5 and solder resist 4 are superimposed substantially can be higher than the thickness of golden finger 31, if the fastener in external slot 6 clamps golden finger, it is clamped to the position that solder resist 4 covers, due to the insulating properties of solder resist, the problem that golden finger and external slot loose contact can be caused.Therefore, the area that solder resist 4 coats is reduced by this utility model embodiment, make to reserve certain distance between solder resist 4 and golden finger 31, solder resist 4 is avoided to contact with the fastener 6 in external slot, as shown in Fig. 5 and Fig. 6 institute, the problem solving golden finger and the fastener loose contact caused because of solder resist.
Solder resist in this utility model embodiment can cover the extending part 5 of golden finger, golden finger on some printed circuit board (PCB)s does not has extending part 5, therefore solder resist only covers the conducting wire being connected with golden finger, as shown in the golden finger 32 in Fig. 7, wherein, golden finger 32 is not covered by solder resist 4, and the conducting wire 2 being connected with golden finger 32 is covered by solder resist 4.Owing to the thickness of golden finger 32 is identical with the thickness of conducting wire 2, also contacting of golden finger 32 and fastener 6 can be affected after covering solder resist on conducting wire 2, therefore, also need to reduce the area coverage of solder resist 4, make to leave certain distance between solder resist 4 and golden finger 32, prevent fastener 6 to be clamped to solder resist 4.
And solder resist is not covered to the conducting wire on printed circuit board (PCB), and the extending part 5 on golden finger does not covers solder resist 4 yet.Owing to the thickness of solder resist coating one layer is higher than the thickness of golden finger, although solder resist is simply coated to the edge of golden finger, but when fastener 6 clamps golden finger, the solder resist exceeding golden finger thickness still can cause golden finger and external slot loose contact.
Solder resist has obvious action for printed circuit board (PCB), as all circuits and copper face all covered in welding process, and the short circuit that causes when preventing welding, and ensure that the part needing welding is welded, it is to avoid the waste of solder；The most such as, it is possible to prevent the infringement of dampness and various electrolyte to make circuit oxidation endanger electrical properties, and prevents external mechanical wounding to maintain the superperformance in plate face；For another example, owing to the live width on printed circuit board (PCB) is away from more and more thin, therefore the Insulation Problems between conductor all the more highlights, and solder resist has high-insulativity, can make circuit densification.Additionally, cover solder resist and do not cover solder resist and can cause the change of conducting wire 2 impedance, producing the transmission of signal and necessarily affect, for covering the conducting wire of solder resist, the length not covering solder resist is the longest, and the impact on impedance is the biggest.Therefore, the distance between solder resist 4 and golden finger can not be the biggest.On the other hand, it is contemplated that the range of error in the design such as the fabrication error of the fabrication error of fastener, golden finger and manufacturing process, the longest distance that the distance minimum between solder resist 4 and golden finger can need to be clamped in view of fastener in range of error in external slot.Therefore, specifically, in this utility model embodiment, distance between solder resist 4 and golden finger is 0.6mm to 1mm.It is preferred that the spacing of solder resist 4 and golden finger is 0.8mm.
For the printed circuit board (PCB) of different model, solder resist is different from the definition of the spacing of golden finger.As for SFP type printed circuit board (PCB), owing to the length of all golden fingers is identical, the position of arrangement is the most identical, and therefore, the spacing of solder resist and golden finger is the distance that solder resist arrives between all golden fingers, as shown in Figure 3.And for XFP (10GigabitSmallFormFactorPluggable) type printed circuit board (PCB), owing to the length of golden finger is different, the length of golden finger distance solder resist is the most different, such as Fig. 7, therefore, distance between solder resist and golden finger is that in the distance that solder resist arrives between the golden finger that solder resist edge is farthest, i.e. Fig. 7, solder resist is required to be 0.6mm to 1mm apart from the distance between golden finger 32.
It is preferred that in this utility model embodiment, solder resist is liquid photopolymerizable solder resist, further, this liquid photopolymerizable solder resist is green oil.
Above-described embodiment shows, will reserve a certain distance between solder resist and golden finger, it is ensured that when the fastener of external slot clamps golden finger, will not touch the solder resist covered on a printed circuit.Avoid the solder resist that there is insulation between fastener and golden finger, solve fastener and golden finger loose contact that solder resist causes, hinder the problem in electrical contact of printed circuit board (PCB) and other electric components.
Although having been described for preferred embodiment of the present utility model, but those skilled in the art once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of this utility model scope.
Obviously, those skilled in the art can carry out various change and modification without deviating from spirit and scope of the present utility model to this utility model.So, if these amendments of the present utility model and modification belong within the scope of this utility model claim and equivalent technologies thereof, then this utility model is also intended to comprise these change and modification.
Claims (9)
1. the printed circuit board (PCB) of an optical module, including: substrate, the conducting wire being layed in described substrate surface and at least one golden finger, it is characterized in that, solder resist is covered on described substrate, the thickness of described solder resist is higher than the thickness of described golden finger, and does not contacts between described solder resist with described golden finger.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that cover solder resist on described substrate, including: covering described solder resist on described conducting wire, the thickness of shown conducting wire is equal to the thickness of described golden finger.
3. printed circuit board (PCB) as claimed in claim 1, it is characterised in that cover solder resist on described substrate, including: do not cover described solder resist on described conducting wire.
4. printed circuit board (PCB) as claimed in claim 1, it is characterised in that do not contact between described solder resist with described golden finger, including:
Described solder resist is 0.6mm to 1mm with the spacing of described golden finger.
5. printed circuit board (PCB) as claimed in claim 4, it is characterised in that described solder resist is 0.8mm with the spacing of described golden finger.
6. printed circuit board (PCB) as claimed in claim 4, it is characterised in that including multiple golden finger, the length of the plurality of golden finger is equal, the spacing of described solder resist and described golden finger is described solder resist to the distance between all golden fingers.
7. printed circuit board (PCB) as claimed in claim 4, it is characterized in that, including multiple golden fingers, the length of described golden finger is unequal, and the spacing of described solder resist and described golden finger is described solder resist to the distance between the golden finger farthest from described solder resist edge.
8. the printed circuit board (PCB) as described in as arbitrary in claim 1～7, it is characterised in that described solder resist is liquid photopolymerizable solder resist.
9. printed circuit board (PCB) as claimed in claim 8, it is characterised in that described liquid photopolymerizable solder resist is green oil.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521076075.4U CN205454216U (en) | 2015-12-21 | 2015-12-21 | Printed circuit board of optical module |
| US15/258,330 US9999130B2 (en) | 2015-12-21 | 2016-09-07 | Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate |
| US15/982,240 US10912200B2 (en) | 2015-12-21 | 2018-05-17 | Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521076075.4U CN205454216U (en) | 2015-12-21 | 2015-12-21 | Printed circuit board of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205454216U true CN205454216U (en) | 2016-08-10 |
Family
ID=56585242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521076075.4U Active CN205454216U (en) | 2015-12-21 | 2015-12-21 | Printed circuit board of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205454216U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900136A (en) * | 2015-12-21 | 2017-06-27 | 青岛海信宽带多媒体技术有限公司 | A kind of printed circuit board (PCB) of optical module |
| US10912200B2 (en) | 2015-12-21 | 2021-02-02 | Hisense Broadband Multimedia Technologies Co., Ltd. | Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group |
-
2015
- 2015-12-21 CN CN201521076075.4U patent/CN205454216U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900136A (en) * | 2015-12-21 | 2017-06-27 | 青岛海信宽带多媒体技术有限公司 | A kind of printed circuit board (PCB) of optical module |
| US10912200B2 (en) | 2015-12-21 | 2021-02-02 | Hisense Broadband Multimedia Technologies Co., Ltd. | Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group |
| CN106900136B (en) * | 2015-12-21 | 2021-06-04 | 青岛海信宽带多媒体技术有限公司 | Printed circuit board of optical module |
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| GR01 | Patent grant |