CN205405375U - Power transmission device - Google Patents

Abstract

A power transmission device includes a first circuit board, a conductive seat, a connecting element, a second circuit board and a fixing element. The conductive seat is fixed on the first circuit board. The connecting element is arranged on the conductive seat. The second circuit board is fixed on the connecting element. The fixing element is arranged on the second circuit board and is connected to the conductive seat through the second circuit board and the connecting element. The first circuit board is electrically connected to the second circuit board via the conductive seat and the connecting element.

Description

power transmission device

technical field

The utility model mainly relates to a power transmission device, in particular to a power transmission device for computer equipment.

Background technique

Most of the computer devices that consume a large amount of power, such as network servers, are equipped with a power transmission device to transmit and supply the power supplied by the power supply device to the motherboard.

Since there are many electronic components used for voltage stabilization and power management on the power transmission device, in order to properly utilize the internal space of the computer equipment. As shown in FIG. 1 , generally, the electronic components P30 of the power transmission device P1 are disposed on two circuit boards P10 , P20 stacked on top of each other. In addition, since the amount of current passing through the power transmission device P1 is relatively large, it is also convenient to maintain by disposing the electronic components P30 on different circuit boards P10 and P20 respectively.

In the conventional technology, the power transmission device P1 uses copper pillars P40 to support the upper circuit board P20 and separate the two circuit boards P10 and P20 from each other. In addition, the power transmission device P1 utilizes two electrical connectors P50 to be disposed on the circuit boards P10 and P20 respectively, and is connected to the two electrical connectors P50 by means of wires P60 .

However, although the current power transmission device meets the purpose of its use, it has not yet met the requirements of many other aspects. Therefore, it is necessary to provide an improved solution for the power transmission device, which can reduce the manufacturing cost of the power transmission device.

Utility model content

The purpose of the utility model is to improve the power transmission device and reduce the production cost of the power transmission device.

The utility model provides a power transmission device, which comprises a first circuit board, a conductive seat, a connecting element, a second circuit board and a fixing element. The conductive seat is fixed on the first circuit board. The connection element is arranged on the conductive seat. The second circuit board is fixed on the connecting element. The fixing element is arranged on the second circuit board, and passes through the second circuit board and the connection element to connect with the conductive seat. The first circuit board is electrically connected to the second circuit board via the conductive seat and the connecting element.

In some embodiments, the power transmission device further includes a conductive material, and the second circuit board further includes a conductive layer, wherein the conductive material is disposed on the conductive layer, and the connecting element is connected to the conductive layer through the conductive material.

In some embodiments, the conductive layer includes a copper foil layer.

In some embodiments, the fixing element is a screw locked on the conductive base.

In some embodiments, wherein the fixing element is conductive, it is directly contacted and electrically connected to the conductive base, the connecting element, and the second circuit board.

The utility model provides a power transmission device, comprising a first circuit board, a first conductive seat, a second circuit board, a second conductive seat, a connecting element, a first fixing element and a second fixing element. The first conductive seat is fixed on the first circuit board. The second circuit board is located above the first circuit board. The second conductive seat is fixed on the second circuit board. The connecting element connects the first conductive seat and the second conductive seat. The first fixing element passes through the connecting element and is connected to the first conductive base. The second fixing element passes through the connecting element and is connected to the second conductive base. The first circuit board is electrically connected to the second circuit board via the first conductive seat, the connecting element, and the second conductive seat.

In some embodiments, the first fixing element is a screw locked to the first conductive base, and the second fixing element is a screw locked to the second conductive base.

In some embodiments, wherein the first fixing element and the second fixing element are conductive, the first fixing element directly contacts and is electrically connected to the first conductive seat and the connecting element, and the second fixing element The element directly contacts and is electrically connected to the second conductive base and the connection element.

In some embodiments, the second circuit board has a through hole adjacent to the second conductive seat, and the connecting element passes through the through hole.

In some embodiments, the connection element has a first connection portion connected to the first conductive seat, a second connection portion connected to the second conductive seat, and a second connection portion connected to the first connection portion and the second A central connecting portion of the connecting portion, wherein the second circuit board has a through hole, and the central connecting portion passes through the through hole.

In some embodiments, the connecting element is a Z-shaped structure.

To sum up, the power transmission device of the present invention utilizes the conductive base, the connecting element and the fixing element to electrically connect the two circuit boards, and to support the upper circuit board, so it can replace the traditional technology used to electrically connect the two circuit boards. The electrical connector can also replace or reduce the copper pillars in the traditional technology, thereby reducing the manufacturing cost of the power transmission device.

Description of drawings

FIG. 1 is a schematic diagram of a conventional power transmission device.

Fig. 2 is a perspective view of the computer equipment of the present invention.

FIG. 3 is a perspective view of a first embodiment of the power transmission device of the present invention.

FIG. 4 is an exploded view of the first embodiment of the power transmission device of the present invention.

FIG. 5 is a cross-sectional view of a first embodiment of the power transmission device of the present invention.

FIG. 6 is a flow chart of the manufacturing method of the power transmission device of the present invention.

7 is a schematic diagram of the manufacturing method of the power transmission device of the present invention at an intermediate stage of the manufacturing process.

FIG. 8 is a perspective view of a second embodiment of the power transmission device of the present invention.

FIG. 9 is an exploded view of a second embodiment of the power transmission device of the present invention.

FIG. 10 is a cross-sectional view of a second embodiment of the power transmission device of the present invention.

Wherein, the reference signs are explained as follows:

first circuit board 10

upper surface 11

Jack 12

second circuit board 20

upper surface 21

lower surface 22

Conductive hole 23

Conductive layer 24

piercing 25

Conductive seat 30, 30a, 30b

Conductive body 31

Conductive top surface 331

Fixing hole 332

Pin 32

Connection element 40

Connection body 41

Connect the top surface 411

Connect the bottom surface 412

protrusion 42

Connection hole 43

first connection part 44

second connection part 45

central connection part 46

Fixing elements 50, 50a, 50b

Screw head 51

Screw 52

Computer equipment A1

Case A10

Motherboard A20

Main Electronics A30

Power supply unit A40

Power transmission device A50

First connector B10

The first electronic component B20

Second connector B30

Second electronic component B40

Arrangement direction D1

Conductive material M1

Power transmission device P1

Circuit board P10, P20

Electronic components P30

Copper pillar P40

Electrical connector P50

Wire P60

detailed description

The following description provides many different embodiments, or examples, for implementing different features of the present invention. The components and arrangements described in the following specific examples are only used to express the utility model in a concise manner, which are only examples and are not intended to limit the utility model. For example, a description of a first feature on or over a second feature includes direct contact between the first and second features, or another feature disposed between the first and second features such that the second feature The first and second features are not in direct contact.

In addition, in this specification, the same reference numerals and/or characters are used in different examples. The aforementioned repetition is only for simplification and clarity, and does not mean that different embodiments and settings must be related.

Words such as first and second in this specification are only for the purpose of clear explanation, and are not used to correspond to or limit the scope of patents. In addition, terms such as first feature and second feature are not limited to the same or different features.

The shapes, dimensions, thicknesses, and angles of inclination in the drawings may not be drawn to scale or be simplified for the purpose of clarity, and are provided for illustration purposes only.

FIG. 2 is a perspective view of the computer equipment A1 of the present invention. The computer device A1 can be a server, such as a web server. The computer equipment A1 includes a casing A10, a motherboard A20, a plurality of main electronic components A30, a power supply unit A40 and a power transmission unit A50. The motherboard A20 is disposed in the case A10. The main electronic component A30 is disposed on the motherboard A20. The main electronic component A30 may include a central processing unit, a display chip, a memory, and the like.

The power supply device A40 is used to supply power to the power transmission device A50. The power supply device A40 can be used to convert the alternating current into direct current, and supply the direct current to the power transmission device A50. The power transmission device A50 is connected to the motherboard A20 and the power supply device A40.

The power transmission device A50 is used to transmit the power transmitted by the power supply device A40 to the motherboard A20. In some embodiments of Power over Ethernet (PoE) switch equipment, the power transmission device A50 can stabilize, step down and reduce the current of the power provided by the power supply device A40, and then transmit the power to the motherboard A20.

In some embodiments, the power supply device A40 supplies 12V and 60A. The power transmission device A50 reduces the voltage of 12V to 5V, and outputs multiple sets of currents to the motherboard A20 respectively, so as to supply suitable power to the main electronic component A30 respectively.

FIG. 3 is a perspective view of a first embodiment of the power transmission device A50 of the present invention. FIG. 4 is an exploded view of the first embodiment of the power transmission device A50 of the present invention. FIG. 5 is a cross-sectional view of a first embodiment of a power transmission device A50 of the present invention. The power transmission device A50 includes a first circuit board 10 , a second circuit board 20 , two conductive seats 30 , two connecting elements 40 and two fixing elements 50 .

The first circuit board 10 and the second circuit board 20 are spaced apart from each other. In this embodiment, the first circuit board 10 and the second circuit board 20 are substantially parallel to each other. The first circuit board 10 , the conductive seat 30 , the connection element 40 and the fixing element 50 are arranged in an arrangement direction D1 .

In this embodiment, the power transmission device A50 further includes a first connector B10, a plurality of first electronic components B20, a second connector B30 and a plurality of second electronic components B40. The first connector B10 and the first electronic component B20 are disposed on an upper surface 11 of the first circuit board 10 . In this embodiment, the first connector B10 and the first electronic component B20 are directly fixed and electrically connected to the first circuit board 10 . The first connector B10 is electrically connected to the first electronic component B20 via the first circuit board 10 .

The first connector B10 is used for connecting the power supply device A40 in FIG. 2 . In other words, the power generated by the power supply device A40 is transmitted to the first circuit board 10 through the first connector B10. For example, the first electronic component B20 can be a voltage stabilizing component, an overcurrent protection component, a resistor, a capacitor, and the like.

In this embodiment, the conductive seat 30 , the connecting element 40 and/or the fixing element 50 respectively form two electrode structures, wherein one of the above two electrode structures is a positive electrode structure, and the other is a negative electrode structure.

The second circuit board 20 is electrically connected to the first circuit board 10 through the above-mentioned electrode structure (conductive seat 30 , connecting element 40 and/or fixing element 50 ). In other words, the power supplied by the power supply device A40 is processed by the first electronic component B20 and then transmitted to the second circuit board 20 through the above-mentioned electrode structure.

In this embodiment, the above-mentioned electrode structure is used to replace the high-cost electrical connector in the conventional technology to electrically connect the first circuit board 10 and the second circuit board 20 , thereby reducing the manufacturing cost of the power transmission device.

The second connector B30 and the second electronic component B40 are disposed on an upper surface 21 of the second circuit board 20 . In this embodiment, the second connector B30 and the second electronic component B40 are directly fixed and electrically connected to the second circuit board 20 . The second electronic component B40 is electrically connected to the above-mentioned electrode structure through the second circuit board 20 .

The conductive seat 30 is fixed on the first circuit board 10 . The conductive seat 30 is conductive and made of conductive material, and is electrically connected to the first circuit board 10 . In this embodiment, the conductive base 30 is a power terminal, and the two conductive bases 30 are respectively a positive conductive terminal and a negative conductive terminal.

The conductive seat 30 includes a conductive body 31 and a plurality of pins 32 . The conductive body 31 has a conductive top surface 331 and a fixing hole 332 . In this embodiment, the conductive top surface 331 is a plane and may be substantially parallel to the first printed circuit board. The conductive top surface 331 is spaced apart from the upper surface 11 . The fixing hole 332 is formed in the center of the conductive top surface 331 .

The pin 32 is connected to the conductive body 31 and integrally formed with the conductive body 31 . The pins 32 are inserted into the holes 12 of the first circuit board 10 and are electrically connected to the first circuit board 10 . The socket 12 is formed on the upper surface 11 of the first circuit board 10 . In this embodiment, the pins 32 are soldered to the first printed circuit board, so that the conductive seat 30 is fixed on the upper surface 11 of the first circuit board 10 .

The connection element 40 is fixed on the second circuit board 20 and disposed on the conductive base 30 . The connection element 40 is conductive and made of conductive material. The connecting element 40 is electrically connected to the second circuit board 20 . In this embodiment, the connecting element 40 can be a surface mounted device (SMDnuts).

The connection element 40 includes a connection body 41 and a protrusion 42 . The connection body 41 can be a plate-shaped structure, and has a connection top surface 411 and a connection bottom surface 412 . The connection top surface 411 is opposite to the connection bottom surface 412 . The protrusion 42 is disposed at the center of the connecting top surface 411 . The connection body 41 further includes a connection hole 43 passing through the center of the connection body 41 and the protruding portion 42 .

In this embodiment, the connection top surface 411 is substantially parallel to the connection bottom surface 412 , and both the connection top surface 411 and the connection bottom surface 412 are planes. The connection bottom surface 412 contacts the conductive top surface 331 . Since the connection bottom surface 412 and the conductive top surface 331 are both flat, there is a good electrical connection between the connection element 40 and the conductive base 30 .

The connecting top surface 411 of the connecting element 40 contacts the lower surface 22 of the second circuit board 20 , and the protrusion 42 is located in a conductive hole 23 of the second circuit board 20 . In this embodiment, the lower surface 22 faces the upper surface 11 of the first circuit board 10 .

In this embodiment, the second circuit board 20 further includes a conductive layer 24 located on the lower surface 22 of the second circuit board 20 . In some embodiments, the conductive layer 24 is also located on the sidewall and/or the upper surface 21 of the conductive hole 23 .

In this embodiment, there is a conductive material M1 between the connection element 40 and the second circuit board 20 , in other words, the conductive material M1 is disposed between the connection element 40 and the second circuit board 20 . The connection element 40 is connected to the conductive layer 24 via the conductive material M1.

The fixing element 50 is disposed on the second circuit board 20 , and is connected to the conductive seat 30 after passing through the second circuit board 20 and the connecting element 40 . In some embodiments, the fixing element 50 is conductive, and is directly contacted and electrically connected to the conductive seat 30 , the connecting element 40 and the second circuit board 20 . In some embodiments, the fixing element 50 is insulating.

In this embodiment, the fixing element 50 is a screw, which is locked on the conductive base 30 . The fixing element 50 has a screw head 51 and a screw rod 52 . The screw head 51 is connected to the screw rod 52 and integrally formed with the screw rod 52 . The screw head 51 is connected to the upper surface 21 of the second circuit board 20 . The screw 52 passes through the conductive hole 23 and the connecting hole 43 to reach the fixing hole 332 . As shown in FIG. 5 , one end of the screw rod 52 is locked to the fixing hole 332 of the conductive base 30 .

In this embodiment, since the conductive seat 30 is fixed on the first circuit board 10, and the connecting element 40 is fixed on the second circuit board 20, when assembling the power transmission device A50, the connecting element 40 can be placed on the conductive After that, the fixing element 50 passes through the second circuit board 20 and the connecting element 40 and then is locked or fixed on the conductive seat 30 to complete the assembly easily.

When the power transmission device A50 is disassembled, the first circuit board 10 and the second circuit board 20 can be easily separated after the fixing element 50 is removed. Since the conductive layer 24 and the conductive material M1 on the lower surface 22 of the second circuit board 20 will not be worn when the power transmission device A50 is assembled or disassembled, the service life of the power transmission device A50 can be increased.

In this embodiment, the electrode structure (conductive seat 30, connecting element 40 and fixing element 50) is made of rigid material such as metal, and the electrode structure can firmly support the second circuit board 20, and make the first circuit board 10 and the second circuit board 10 The two circuit boards 20 are spaced apart from each other. Therefore, the electrode structure can replace or reduce the copper pillars in the conventional technology, thereby reducing the manufacturing cost of the power transmission device.

FIG. 6 is a flowchart of a manufacturing method of the power transmission device A50 of the present invention. FIG. 7 is a schematic diagram of the manufacturing method of the power transmission device A50 of the present invention at an intermediate stage of the manufacturing process. It can be understood that, among the steps in the methods of the following embodiments, additional steps can be added before, after and during each step, and some of the aforementioned steps can be replaced, deleted or moved.

In step S101 , the first connector B10 , the first electronic component B20 and the conductive base 30 are fixed on the first circuit board 10 . In step S103 , as shown in FIG. 7 , the conductive material M1 is coated on the conductive layer 24 of the second circuit board 20 and adjacent to the conductive hole 23 . At this time, the conductive material M1 is in a paste, molten or liquid state.

In this embodiment, the conductive layer 24 can be a copper foil layer, and the conductive material M1 can be solder paste or conductive glue. Since the conductive material M1 covers the conductive layer 24 , there is no need to plate precious metals such as gold or silver on the conductive layer 24 to avoid oxidation of the conductive layer 24 , thereby reducing the manufacturing cost of the power transmission device A50 .

In step S105 , before the conductive material M1 in paste, molten or liquid state is solidified, the connecting element 40 is disposed on the conductive material M1 (as shown in FIG. 5 ). Since the conductive material M1 is in paste, molten or liquid state at this time, the conductive material M1 can be well connected to the connection element 40 and the conductive layer 24 of the second circuit board 20 .

After the conductive material M1 is cured, the connecting element 40 is fixed on the second circuit board 20 through the cured conductive material M1. In this embodiment, the second circuit board 20 may be left for a period of time such as one minute to allow the conductive material M1 to solidify.

After that, the second connector and the second electronic component B40 can be fixed on the second circuit board 20 . The step of fixing the second connector and the second electronic component B40 to the second circuit board 20 can also be implemented before the step S103.

In step S107 , place the connecting element 40 on the conductive seat 30 . In step S109 , the fixing element 50 passes through the second circuit board 20 , the connecting element 40 , and is connected to the conductive base 30 to fix the second circuit board 20 to the first circuit board 10 .

FIG. 8 is a perspective view of a second embodiment of the power transmission device A50 of the present invention. FIG. 9 is an exploded view of a second embodiment of the power transmission device A50 of the present invention. FIG. 10 is a cross-sectional view of a second embodiment of the power transmission device A50 of the present invention.

The conductive seat 30 includes a plurality of conductive seats 30a and a plurality of conductive seats 30b. The conductive seat 30 a is fixed on the first circuit board 10 . The conductive seat 30b is fixed on the second circuit board 20 . The second circuit board 20 is located above the first circuit board 10 . The second circuit board 20 has a through hole 25 adjacent to the conductive seat 30b.

The connection element 40 connects the conductive seat 30a and the conductive seat 30b. The first circuit board 10 is electrically connected to the second circuit board 20 via the conductive seat 30a, the connecting element 40, and the conductive seat 30b. In this embodiment, the connecting element 40 is a Z-shaped structure. The connection element 40 passes through the through hole 25 of the second circuit board 20 , and the conductive base 30 a is located below the through hole 25 .

In this embodiment, the connecting element 40 has a first connecting portion 44 , a second connecting portion 45 and a central connecting portion 46 . The first connecting portion 44 is connected to the conductive top surface 331 of the conductive seat 30 a , the second connecting portion 45 is connected to the conductive top surface 331 of the conductive seat 30 b , and the central connecting portion 46 is connected to the first connecting portion 44 and the second connecting portion 45 . The central connecting portion 46 passes through the perforation 25 .

The fixing element 50 includes a fixing element 50a and a fixing element 50b. The fixing element 50a passes through the first connecting portion 44 of the connecting element 40 and is connected to the conductive base 30a. The fixing element 50b passes through the second connecting portion 45 of the connecting element 40 and is connected to the conductive base 30b.

In this embodiment, the fixing element 50a is a screw, which is locked to the conductive base 30a, and the fixing element 50b is a screw, which is locked to the conductive base 30b.

In this embodiment, the fixing element 50a and the fixing element 50b are conductive. The fixing element 50 a directly contacts and is electrically connected to the conductive seat 30 a and the connecting element 40 , and the fixing element 50 b directly contacts and electrically connects to the conductive seat 30 b and the connecting element 40 .

In this embodiment, the lengths of the first connecting portion 44 , the second connecting portion 45 and/or the central connecting portion 46 can be changed to match the first circuit board 10 and the second circuit board 20 of different designs. In other words, the relative position between the conductive seat 30 a and the conductive seat 30 b can be adjusted according to the design of the first circuit board 10 and the second circuit board 20 . For example, in some embodiments, the conductive seat 30 a may not be located under the through hole 25 .

To sum up, the power transmission device of the present invention utilizes the conductive base, the connecting element and the fixing element to electrically connect the two circuit boards, and to support the upper circuit board, so it can replace the traditional technology used to electrically connect the two circuit boards. The electrical connector can also replace or reduce the copper pillars in the traditional technology, thereby reducing the manufacturing cost of the power transmission device.

The features disclosed above can be combined, modified, substituted or transferred with one or more disclosed embodiments in any appropriate manner, and are not limited to specific embodiments.

Although the utility model is disclosed above with various embodiments, it is only for reference rather than to limit the scope of the utility model. Make some tweaks and tweaks. Therefore, the above-mentioned embodiments are not intended to limit the scope of the present utility model, and the protection scope of the present utility model should be defined by the appended claims.

Claims (11)

1. A power transmission device, characterized in that, comprising: a first circuit board; a conductive base, fixed on the first circuit board; a connecting element arranged on the conductive seat; a second circuit board fixed on the connecting element; and a fixing element is arranged on the second circuit board, and passes through the second circuit board and the connection element to connect with the conductive seat, Wherein the first circuit board is electrically connected with the second circuit board via the conductive base and the connecting element. 2. The power transmission device according to claim 1, further comprising a conductive material, and the second circuit board further comprises a conductive layer, wherein the conductive material is disposed on the conductive layer, and the connection The element is connected with the conductive layer via the conductive material. 3. The power transmission device according to claim 2, wherein the conductive layer comprises a copper foil layer. 4. The power transmission device according to claim 1, wherein the fixing element is a screw, which is locked to the conductive base. 5 . The power transmission device according to claim 1 , wherein the fixing element is conductive, and directly contacts and is electrically connected to the conductive seat, the connecting element, and the second circuit board. 6. A power transmission device, characterized in that it comprises: a first circuit board; a first conductive base, fixed on the first circuit board; a second circuit board located above the first circuit board; a second conductive base, fixed on the second circuit board; a connection element, connecting the first conductive seat and the second conductive seat; A first fixing element passes through the connecting element and is connected to the first conductive base; and A second fixing element passes through the connecting element and is connected to the second conductive seat, Wherein the first circuit board is electrically connected to the second circuit board via the first conductive seat, the connecting element, and the second conductive seat. 7. The power transmission device according to claim 6, wherein the first fixing element is a screw and is locked to the first conductive seat, and the second fixing element is a screw and is locked to the second conductive seat. 8. The power transmission device according to claim 6, wherein the first fixing element and the second fixing element are conductive, and the first fixing element directly contacts and is electrically connected to the first fixing element. The conductive seat is connected to the connecting element, and the second fixing element is in direct contact with and electrically connected to the second conductive seat and the connecting element. 9 . The power transmission device as claimed in claim 6 , wherein the second circuit board has a through hole adjacent to the second conductive seat, and the connecting element passes through the through hole. 10. The power transmission device according to claim 6, wherein the connection element has a first connection portion connected to the first conductive seat, a second connection portion connected to the second conductive seat And a central connection part connected to the first connection part and the second connection part, wherein the second circuit board has a through hole, and the central connection part passes through the through hole. 11. The power transmission device as claimed in claim 6, wherein the connection element is a Z-shaped structure.