CN205364250U - Silicon bulk evolution equipment - Google Patents
Silicon bulk evolution equipment Download PDFInfo
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- CN205364250U CN205364250U CN201620109497.5U CN201620109497U CN205364250U CN 205364250 U CN205364250 U CN 205364250U CN 201620109497 U CN201620109497 U CN 201620109497U CN 205364250 U CN205364250 U CN 205364250U
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Abstract
The utility model provides a silicon bulk evolution equipment, include: the frame, on locating the frame, be used for bearing the silicon bulk plummer of waiting to cut the silicon bulk, locating on the frame and wire -electrode cutting unit that relative silicon bulk plummer moved, becoming the line of cut of cutting gauze in the wire -electrode cutting unit including tangible, the line of cut is controlled to on the silicon bulk plummer wait to cut silicon bulk cutting, and on locating the frame, be used for the adjustment to wait to cut the position adjustment mechanism of the position of silicon bulk for wait to cut in the silicon bulk and to treat corresponding to the line of cut of wire -electrode cutting unit that the cutting plane was by originally firstly treat that the cutting plane is adjusted into the second and treats the cutting plane, the second is treated cutting plane and first and is treated in the cutting plane to wait to cut other at least half's in the silicon bulk width corresponding to the cutting width less than or equal to of line of cut. Utilize the utility model discloses when silicon bulk evolution equipment carries out the silicon bulk evolution, have that effective line segment is short, stretch -draw fluctuation is little, advantages such as cutting stability height and progress height.
Description
Technical field
This utility model relates to silicon ingot evolution field, particularly relates to a kind of silicon ingot evolution equipment.
Background technology
Silicon chip is as making one of chip or the requisite raw material of solar battery sheet, its manufacturing process is substantially: will purify and silicon material after processing carries out long crystalline substance and casts silicon ingot, silicon ingot is cut into the silico briquette being of the required size again, then silico briquette is cut into slices, obtain silicon chip then through after a series of processing.In each operation above-mentioned, the process that silicon ingot cuts into the silico briquette being of the required size is called evolution operation.With common open operation, firstly the need of silicon ingot bonding agent is bonded in crystal holder during evolution, then the crystal holder being bonded with silicon ingot is placed in the cutting chamber of excavation machine, cutting chamber has the guider for controlling line of cut position, a plurality of line of cut is formed over cutting gauze at silicon ingot after walking around guider, cutting head in cutting chamber drives this cutting gauze from top to bottom to move, every line of cut all moves along its length direction simultaneously, thus silicon ingot is cut into the silico briquette (can referring to Fig. 1) being of the required size by the mode of scroll saw.
nullFrom figure 1 above，Silicon ingot is generally individually be by tiling in the way of be arranged in crystal holder (namely，The face that in polycrystal silicon ingot 100, area is maximum is contacted with crystal holder)，So，It is arranged in the line of cut 102 being wound on cutting roller 101 above polycrystal silicon ingot 100 just long for the effectively cutting line segment of correspondence cutting polycrystal silicon ingot 100，In cutting process，Effective line will be subject to the stop of polycrystal silicon ingot 100 and be subject to stretch-draw，The more long then Effective line of the cutting width of polycrystal silicon ingot 100 is more long，Line of cut 102 is easier to be subject to the impact of silicon ingot，Produced by different parts in Effective line, the difference of stretch-draw impact is more big，Thus causing the stretch-draw of different parts in Effective line unbalanced，Cause the damage to line of cut，It is more easy to and occurs line of cut weares and teares the unbalanced or problem such as break，Even can affect cutting efficiency and cut quality (such as after cutting, the flatness of silico briquette facet is poor).
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is in that to provide a kind of silicon ingot evolution equipment, unbalanced for solving existing silicon ingot evolution technology is cut the stretch-draw of different parts in line segment, cause the damage to line of cut, the unbalanced or problem such as break of wearing and tearing.
For achieving the above object and other relevant purposes, this utility model provides a kind of silicon ingot evolution equipment, including:
Support；
It is located on described support, for carrying the silicon ingot plummer of silicon ingot to be cut；
The line cutter unit being located on described support and move relative to described silicon ingot plummer, includes the line of cut forming cutting gauze in described line cutter unit；Described line of cut is controlled to be cut the silicon ingot described to be cut on described silicon ingot plummer；And
It is located on described support, for adjusting the position adjusting mechanism of the position of described silicon ingot to be cut so that the face to be cut of the line of cut corresponding to described line cutter unit in described silicon ingot to be cut is adjusted to the second face to be cut by original described first face to be cut；Corresponding to the cutting width of described line of cut less than or equal to the width of 1st/2 of other faces in described silicon ingot to be cut in described second face to be cut and described first face to be cut.
This utility model silicon ingot evolution equipment is further improved by: offer cutting seam to hold described line of cut corresponding to the described line of cut in described line cutting net on described silicon ingot plummer.
This utility model silicon ingot evolution equipment is further improved by: described line cutter unit also includes: cutting roll stand；And it being arranged at least one the cutting roller group in described cutting roll stand, each described cutting roller group includes two cutting rollers that spacing is arranged, and described line of cut correspondence is wrapped on two described cutting rollers to form line cutting net.
This utility model silicon ingot evolution equipment is further improved by: described line cutter unit also includes: cutting rack；And it is arranged at the multipair cutting wheels on described cutting rack, cut wheels described in every a pair and include two cutting wheels that spacing is arranged, to form line cutting net on each described cutting wheel that described line of cut correspondence is wound in multipair cutting wheels.
This utility model silicon ingot evolution equipment is further improved by: the end face of described silicon ingot to be cut is as face to be cut, described support is provided with a pair slide rail moved towards up and down, two cutting rollers in the cutting roller group of described line cutter unit or the multipair cutting wheels in described line cutter unit are the described line of cut end face across described silicon ingot to be cut that left and right arranged and made winding, and described line cutter unit is controlled to be moved up and down along slide rail described in a pair and cut from the end face entrance of described silicon ingot to be cut by described line of cut；And described position adjusting mechanism, including: for clamping the holder of described silicon ingot to be cut and for controlling the described holder electric rotating machine along a horizontal rotating shaft or a vertical axis of rotation.
This utility model silicon ingot evolution equipment is further improved by: described slide rail is chute, and the described cutting roller erection in described line cutter unit has the pulley being suitable to described chute；Or, described slide rail is provided with pulley, and the described cutting roller erection in described line cutter unit has the chute of corresponding described pulley.
This utility model silicon ingot evolution equipment is further improved by: the side of described silicon ingot to be cut is as face to be cut, described support is provided with a pair slide rail of left and right trend, two cutting rollers in the cutting roller group of described line cutter unit or the multipair cutting wheels in described line cutter unit are setting up and down and make the described line of cut being wound around across the side of described silicon ingot to be cut, and described line cutter unit is controlled to be moved left and right along slide rail described in a pair and cut from the side entrance of described silicon ingot to be cut by described line of cut；And described position adjusting mechanism, including being positioned at below described silicon ingot plummer and support the swivel bearing of described silicon ingot plummer and the electric rotating machine driving described swivel bearing to rotate to drive described silicon ingot plummer；Or, including Telescopic rotary platform and control described Telescopic rotary platform protrude upward and silicon ingot to be cut described in pushing and withstanding disengage it from described silicon ingot plummer after rotate the Telescopic rotating motor that drives described silicon ingot to be cut to rotate again.
This utility model silicon ingot evolution equipment is further improved by: described slide rail is chute, and the described cutting roller erection in described line cutter unit has the pulley being suitable to described chute；Or, described slide rail is provided with pulley, and the described cutting roller erection in described line cutter unit has the chute of corresponding described pulley.
This utility model silicon ingot evolution equipment is further improved by: described line cutter unit is located on described support by a cutting support, and described line cutter unit is more pivoted on described cutting support to adjust the cutting angle between the face to be cut of described line of cut and described silicon ingot to be cut.
This utility model silicon ingot evolution equipment is further improved by: described cutting angle is 0 ° to 60 °.
nullSilicon ingot evolution equipment provided by the utility model，Including support、Silicon ingot plummer、Line cutter unit、And position adjusting mechanism，Driving line cutter unit to move towards silicon ingot plummer by the first drive motor and driving cutting roller to rotate by the second drive motor drives line of cut to walk about，By line of cut, the silicon ingot to be cut carried on silicon ingot plummer is carried out automatization's cutting and completes silicon ingot evolution operation，Save labour turnover and improve production efficiency，Especially，Silicon ingot will have the less leptoprosopy of width as face to be cut (cutting width of face to be cut corresponding with described line of cut in the described silicon ingot to be cut width less than or equal to 1st/2 of other faces)，In cutting process，In described line of cut just shorter with the Effective line that described face to be cut contacts，Described line of cut can be subject to the stop of silicon ingot as few as possible，Stretch-draw fluctuating margin is little，Line of cut has higher equilibrium degree，What guarantee in cutting process is relatively stable，Not only protect line of cut and extend the service life of line of cut，More can ensure that precision and reliability that silicon ingot cuts，Improve the cut quality (such as after cutting, the flatness of silico briquette facet is higher) of silicon ingot.
Accompanying drawing explanation
Fig. 1 is the view in prior art, polycrystal silicon ingot cut.
Fig. 2 is this utility model silicon ingot evolution equipment structural representation in a preferred embodiment.
Fig. 3 to Fig. 7 is applied to the silicon ingot evolution equipment shown in Fig. 2 to carry out the structural representation in silicon ingot evolution operation process in a preferred embodiment.
Fig. 8 to Figure 11 is this utility model silicon ingot evolution equipment and is applied to this silicon ingot evolution equipment and carries out the structural representation in silicon ingot evolution operation process in a further preferred embodiment.
Figure 12 is this utility model silicon ingot evolution equipment structural representation in a further preferred embodiment.
Figure 13 to Figure 17 is applied to the silicon ingot evolution equipment shown in Figure 12 to carry out the structural representation in silicon ingot evolution operation process in another preferred embodiment.
Element numbers illustrates:
100 polycrystal silicon ingots
101 cutting rollers
102 lines of cut
200,300,400 silicon ingots to be cut
201,401 first faces to be cut
202,402 second faces to be cut
21,41 supports
241,411 slide rails
22,42 silicon ingot plummers
221,421 cutting seams
23,43 line cutter units
231,431 cutting roll stand
232,432 cutting rollers
233,333,433 lines of cut
234,434 cutting supports
24,44 carrying stands
331 cutting racks
332 cutting wheels
Detailed description of the invention
In the prior art, silicon ingot is generally individually is place and cut in the way of tiling, so, it is arranged in the line of cut above silicon ingot just long for the effectively cutting line segment of correspondence cutting silicon ingot, in cutting process, Effective line will be subject to the stop of silicon ingot and be subject to stretch-draw, causes stretch-draw unbalanced, affects line of cut and silicon ingot cut quality.In view of this, this utility model provides new silicon ingot evolution equipment, realize line of cut there is the less leptoprosopy of width from silicon ingot to enter and cut, line of cut in cutting process is made to have higher equilibrium degree, not only can prolong by line of cut, more can ensure that precision and reliability that silicon ingot cuts, improve the cut quality of silicon ingot.
Below by way of specific instantiation, embodiment of the present utility model being described, those skilled in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.This utility model can also be carried out by additionally different detailed description of the invention or apply, and the every details in this specification based on different viewpoints and application, can also carry out various modification or change under without departing from spirit of the present utility model.It should be noted that, when not conflicting, following example and the feature in embodiment can be mutually combined.
It should be noted that, the diagram provided in following example only illustrates basic conception of the present utility model in a schematic way, then assembly that in graphic, only display is relevant with this utility model but not component count when implementing according to reality, shape and size drafting, during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout kenel is likely to increasingly complex.
Refer to Fig. 2, be shown as this utility model silicon ingot evolution equipment structural representation in a preferred embodiment.This utility model provides a kind of silicon ingot evolution equipment, for silicon ingot is carried out evolution operation.As shown in Figure 2, this utility model silicon ingot evolution equipment includes support 21, is located on support 21, for carrying the silicon ingot plummer 22 of silicon ingot to be cut and being located on support 21 and the relative vertically movable line cutter unit 23 so that silicon ingot to be cut to be cut of support 21.
Silicon ingot plummer 22 is fixedly arranged on support 21, is used for carrying silicon ingot 200 to be cut.In the present embodiment, silicon ingot 200 to be cut is rectangular structure, wherein, the size of at least one dimension in silicon ingot 200 to be cut to be significantly less than the size (such as the length of a dimension is less than the width of at least two equal to other faces/mono-) of other dimensions.Therefore, silicon ingot 200 to be cut is carried utilizing silicon ingot plummer 22, it is that silicon ingot 200 to be cut is placed in silicon ingot plummer 22 in an upright manner, that is: the plane that two dimensions being shorter in silicon ingot 200 to be cut relative to the storing face of silicon ingot plummer 22 are constituted is (for convenience of description, in being described below in the present embodiment, two dimensions shorter in silicon ingot 200 to be cut are called width and thickness, and that longer dimension is then called height).In order to enable more securely to carry silicon ingot 200 to be cut: can design on the one hand the width with silicon ingot 200 to be cut or the suitable clip slot (not showing in the drawings) of thickness on silicon ingot plummer 22, so that silicon ingot to be cut 200 can make a decision in described clip slot；Also silicon ingot to be cut 200 can be arranged on the other hand clamp the clamping device (not display in the drawings) of silicon ingot 200 to be cut or for living the penetrating mechanism of silicon ingot 200 to be cut at opposite sides pushing and withstanding in opposite sides on silicon ingot plummer 22, so that can more securely realize location.The arranging simultaneously to adopt of the setting of above-mentioned clip slot and clamping device/penetrating mechanism can also select an employing.
Line cutter unit 23 carries stand 24 by one and is located on support 21.In the present embodiment, line cutter unit 23 is moved relative to silicon ingot plummer 22 by the first drive motor (not display in the drawings).Further, line cutter unit 23 includes cutting roll stand 231 and is arranged at least one the cutting roller group in cutting roll stand 231, each described cutting roller group includes two cutting rollers 232 that spacing is arranged, line of cut 233, and for driving second drive motor (not display in the drawings) of two cutting rollers 232, wherein, line of cut 233 correspondence is wrapped on two cutting rollers 232 to form line cutting net, silicon ingot to be cut 200 on silicon ingot plummer 22 is then cut by the line of cut 233 being wound around on cutting roller 232 under the driving of described second drive motor.Preferably, line of cut 233 is diamond wire.In the present embodiment: line cutter unit 23 is to be located on carrying stand 24 in a cutting support 234 of described first drive motor by being in transmission connection, cutting support 234 is in П type structure, including back timber and the support beam being positioned at back timber opposite sides, line cutter unit 23 is just located on two described support beams.Preferably, line cutter unit 23 is more pivotably in cutting support 234, thus when necessary, the cutting angle (described cutting angle is 0 ° to 60 °) of line of cut 233 and the face to be cut of silicon ingot 200 to be cut can be adjusted by rotational line cutter unit 23, so, line cutter unit 23 can pivoting point be that waving of certain angle is made in the center of circle, line of cut 233 in line cutter unit 23 and silicon ingot 200 to be cut are in point contact mode, greatly reduce the contact surface length of line of cut 233 and silicon ingot 200 to be cut, namely Cutting Drag is reduced, decrease the abrasion of line of cut 233, improve the service life of line of cut 233, simultaneously, improve cutting power and cutting accuracy.
For cutting, further, as previously mentioned, silicon ingot 200 to be cut is placed in silicon ingot plummer 22 in an upright manner, we using the end face of silicon ingot 200 to be cut as face to be cut (cutting width of end face corresponding with line of cut 233 in the silicon ingot 200 to be cut width less than or equal to 1st/2 of other faces), being provided with a pair slide rail 241 moved towards up and down on support 21, two cutting rollers in the cutting roller group of line cutter unit 23 232 are arranged in left and right and the line of cut 233 that makes to be wrapped on two cutting rollers 232 is across the end face of silicon ingot 200 to be cut.So, line cutter unit 23 moves up and down along a pair slide rail 241 under the driving of described first drive motor and is cut from the end face entrance of silicon ingot 200 to be cut by the line of cut 233 on cutting roller 232.Realize moving up and down along a pair slide rail 241 as aforesaid line cutter unit 23, in one example, the bottom that slide rail 241 can be such as the cutting roll stand 231 in chute and line cutter unit 23 is provided with the pulley being suitable to described chute, but it is not limited thereto, in other instances, the cutting roll stand 231 that slide rail 241 is provided with in pulley and line cutter unit 23 is provided with the chute of corresponding described pulley.
Additionally, so that the line of cut 233 on cutting roller 232 can cut after entering from the side of silicon ingot 200 to be cut smoothly, especially, silicon ingot plummer 22 offer corresponding to each line of cut 233 on two cutting rollers 232 to hold multiple cutting seams (not display in the drawings) of line of cut 233, making, line of cut 233 falls into when cutting silicon ingot 200 to be cut in cutting seam.
Further, silicon ingot plummer 22 is additionally provided with for rotating silicon ingot 200 to be cut to adjust the position adjusting mechanism (not display in the drawings) of face to be cut.In one example, described rotating mechanism can include the holder for clamping silicon ingot 200 to be cut and for controlling the electric rotating machine that described holder rotates.Utilize described electric rotating machine can by the silicon ingot to be cut that clamped by described holder along horizontal rotating shaft or a vertical axis of rotation, thus the rotation of silicon ingot to be cut 200 realizing carrying on silicon ingot plummer 22 is to adjust face to be cut.In the ordinary course of things, for silicon ingot 200 to be cut, the angle that face to be cut is made to rotate is 90 ° or 270 °, i.e. the face to be cut of front and back cutting twice is adjacent two silicon ingot faces of the cuboid silicon ingot as silicon ingot 200 to be cut.
Also have, described silicon ingot evolution equipment is also configured with cutting liquid automatic spraying device (not display in the drawings), described cutting liquid automatic spraying device is assemblied in support 21, for spraying the cutting liquid cutting position to line of cut and silicon ingot to be cut 200 when silicon ingot 200 to be cut cuts.In actual applications, described cutting liquid automatic spraying device can include multiple cutting liquid automatic nozzle.
Refer to Fig. 3 to Fig. 7, carry out the structural representation in silicon ingot evolution operation process in a preferred embodiment for being applied to the silicon ingot evolution equipment shown in Fig. 2.
Below in conjunction with Fig. 2 to Fig. 7, carry out silicon ingot evolution operation for the silicon ingot evolution equipment being applied in a preferred embodiment to be described in detail, in this example, silicon ingot 200 to be cut is block structure, such as silicon ingot 200 to be cut is rectangular structure, wherein, the size of at least one dimension in silicon ingot 200 to be cut to be significantly less than the size (such as the length of a dimension is less than the width of at least two equal to other faces/mono-) of other dimensions.
First, silicon ingot 200 to be cut is placed on silicon ingot plummer 22 in an upright manner, make first face 201 (the first end face) the to be cut line of cut 233 corresponding to line cutter unit 23 of silicon ingot 200 to be cut, wherein, the first face 201 to be cut corresponds to the cutting width of line of cut 233 less than or equal to the width (as shown in Figure 2) of 1st/2 of other faces in silicon ingot 200 to be cut.
Then, driving line cutter unit 23 to move towards silicon ingot plummer 22 along a pair slide rail 241 and rotated by described second drive motor driving cutting roller 232 by described first drive motor drives the line of cut 233 being wrapped to walk about, entered from the first face 201 to be cut of silicon ingot 200 to be cut by line of cut 233 and carry out first time cutting, in cutting process, spraying cutting liquid (as shown in Figure 3) to the cutting position of line of cut 233 and silicon ingot to be cut 200.
Then, declined along a pair slide rail 241 by line of cut 233 and cut silicon ingot 200 to be cut until line of cut 233 cut to silicon ingot 200 to be cut in relative to the first face 201 to be cut the cutting back side at a distance of a safe distance time, halted by described first drive motor control line cutter unit 23 and silicon ingot plummer 22 move to exit (as shown in Figure 5) dorsad.Specifically be, in the first time cutting operation of silicon ingot 200 to be cut, the cutting back side relative to the first face 201 to be cut of silicon ingot 200 to be cut is reserved with a safe distance, so, in first time cutting operation, by line of cut 233, silicon ingot 200 to be cut is cut until when cutting to safe distance, controlled after silicon ingot plummer 22 stops advancing and rise further along a pair slide rail 241 and exit (certainly by described first drive motor, after cutting on line unit 23 exits, it is possible to controlled cutting roller 232 by described second drive motor and decommission).From the foregoing, it will be observed that by arranging safe distance, it can be ensured that silicon ingot 200 to be cut each cut portion after first time cutting operation links together yet by corresponding that part of safe distance and does not scatter.
After having cut for the first time, the position of silicon ingot 200 to be cut is adjusted so that silicon ingot 200 to be cut is adjusted to adjacent the second face 202 (the second end face) to be cut corresponding to the face to be cut of the line of cut 233 of line cutter unit 23 by the first original face 201 (the first end face) to be cut by described position adjusting mechanism.In the present embodiment, the position being adjusted silicon ingot 200 to be cut by described position adjusting mechanism can be overturn silicon ingot 200 to be cut and realize by clamping the horizontal rotating shaft of silicon ingot 200 tailing edge one to be cut, silicon ingot 200 to be cut may finally be made to change face to be cut (as shown in Figure 6) by half-twist or 270 °, wherein, the second face 202 to be cut corresponds to the cutting width of line of cut 233 less than or equal to the width of 1st/2 of other faces in silicon ingot 200 to be cut.
After adjusting the position of silicon ingot 200 to be cut, driving line cutter unit 23 to decline towards silicon ingot plummer 22 along a pair slide rail 241 and rotated by described second drive motor driving cutting roller 232 by the first drive motor drives line of cut 233 to walk about, entered from the second face 202 to be cut of silicon ingot 200 to be cut by line of cut 233 and carry out second time cutting (spraying cutting liquid to the cutting position of line of cut 233 and silicon ingot to be cut 200 cutting process), until cutting completely, and line of cut 233 drops in the cutting seam (not display in the drawings) arranged on silicon ingot plummer 22, complete the evolution operation (as shown in Figure 7) of silicon ingot 200 to be cut.By the cutting of twice so that the cutting finished product of silicon ingot 200 to be cut is in bulk.
What also need to supplement is, can each face to be cut (such as first face 201 to be cut and the second face 202 to be cut) to silicon ingot 200 to be cut more swimmingly for reaching line of cut 233, no matter it is in first time cutting operation or second time cutting operation converge, all right rotational line cutter unit 23, adjust the cutting angle (as shown in Figure 4) of the line of cut 233 in line cutter unit 23 and the face to be cut of silicon ingot 200 to be cut, to be more beneficial for the line of cut 233 cutting to silicon ingot 200 to be cut.
Please continue to refer to Fig. 8, it is shown that this utility model silicon ingot evolution equipment structural representation in a further preferred embodiment.Difference with another preferred embodiment shown in Fig. 2 essentially consists in, and in the silicon ingot evolution equipment shown by Fig. 8, the structure of the line cutter unit adopted is different.As shown in Figure 8, in this another preferred embodiment, described line cutter unit includes: two cutting racks 331 that spacing is arranged；Multipair cutting wheels, cut wheels and include two cutting wheels 332 described in every a pair, two cutting wheels 332 are respectively arranged on two cutting racks 331；Line of cut 333, correspondence is wound on each cutting wheel 332 in multipair cutting wheels to form line cutting net, further, wheels are cut for every a pair, one of them cutting wheel 332 can be designed as and actively cut wheel (such as, this actively cuts wheel can by motor control), another cutting roller 332 is then designed as passively.In conjunction with Fig. 8 to Figure 11, show and utilize the silicon ingot evolution equipment in this another preferred embodiment that silicon ingot 300 to be cut is carried out the structural representation in silicon ingot evolution operation process, wherein, Fig. 8 show line cutter unit silicon ingot 300 to be cut is cut before view, Fig. 9 shows that the first face to be cut of silicon ingot 300 to be cut is carried out the view after cutting for the first time by line cutter unit, Figure 10 shows that silicon ingot 300 to be cut adjusts the cutting position view to be adjusted to the second face to be cut by the first face to be cut after the first cutting by rotating, Figure 11 shows that the second face to be cut of silicon ingot 300 to be cut is carried out after second time is cut to complete the view of the evolution operation of silicon ingot 300 to be cut by line cutter unit.In Fig. 8 to Figure 11, idiographic flow is similar with above-mentioned Fig. 2 to Fig. 7, does not repeat them here.
Refer to Figure 12, be shown as this utility model silicon ingot evolution equipment structural representation in another preferred embodiment.This utility model provides a kind of silicon ingot evolution equipment, for silicon ingot is carried out evolution operation.As shown in figure 12, this utility model silicon ingot evolution equipment includes support 41, is located on support 41, for carrying the silicon ingot plummer 42 of silicon ingot to be cut and being located on support 41 and relative support 41 transverse shifting line cutter unit 43 so that silicon ingot to be cut to be cut.
Silicon ingot plummer 42 is fixedly arranged on support 41 by carrying stand 44, is used for carrying silicon ingot 400 to be cut.In the present embodiment, silicon ingot 400 to be cut is rectangular structure, wherein, the size of at least one dimension in silicon ingot 400 to be cut to be significantly less than the size (such as the length of a dimension is less than the width of at least two equal to other faces/mono-) of other dimensions.Therefore, silicon ingot 400 to be cut is carried utilizing silicon ingot plummer 42, it is that silicon ingot 400 to be cut is placed in silicon ingot plummer 42 in the way of tiling, that is: the plane that two dimensions being longer in silicon ingot 400 to be cut relative to the storing face of silicon ingot plummer 42 are constituted is (for convenience of description, in being described below in the present embodiment, two dimensions longer in silicon ingot 400 to be cut are called long and wide, and that shorter dimension is then called thickness).Additionally, it should be noted that, in fig. 12, although silicon ingot plummer 42 is fixedly arranged on support 41 by carrying stand 44, but it is not limited thereto, say, that silicon ingot plummer 42 also have to be fixedly arranged on support 41, in other change case, silicon ingot plummer 42 can also be slid laterally in support 41 by such as slide rail.
Line cutter unit 43 is located on support 41.In the present embodiment, line cutter unit 43 is moved relative to silicon ingot plummer 42 by the first drive motor (not display in the drawings).Further, line cutter unit 43 includes cutting roll stand 431 and is arranged at least one the cutting roller group in cutting roll stand 431, each described cutting roller group includes two cutting rollers 432 that spacing is arranged, line of cut 433, and for driving second drive motor (not display in the drawings) of two cutting rollers 432, wherein, line of cut 433 correspondence is wrapped on two cutting rollers 432 to form line cutting net, silicon ingot to be cut 400 on silicon ingot plummer 42 is then cut by the line of cut 433 being wound around on cutting roller 432 under the driving of described second drive motor.Preferably, line of cut 433 is diamond wire.In the present embodiment: line cutter unit 43 is to be located on support 41 by being in transmission connection in a cutting support 434 of described first drive motor, cutting support 434 is in П type structure, including back timber and the support beam being positioned at back timber opposite sides, line cutter unit 43 is just located on two described support beams.Preferably, line cutter unit 43 is more pivotably in cutting support 434, thus when necessary, the cutting angle (described cutting angle is 0 ° to 60 °) of line of cut 433 and the face to be cut of silicon ingot 400 to be cut can be adjusted by rotational line cutter unit 43, so, line cutter unit 43 can pivoting point be that waving of certain angle is made in the center of circle, line of cut 433 in line cutter unit 43 and silicon ingot 400 to be cut are in point contact mode, greatly reduce the contact surface length of line of cut 433 and silicon ingot 400 to be cut, namely Cutting Drag is reduced, decrease the abrasion of line of cut 433, improve the service life of line of cut 433, simultaneously, improve cutting power and cutting accuracy.
For cutting, further, as previously mentioned, silicon ingot 400 to be cut is placed in silicon ingot plummer 42 in the way of tiling, we using the side of silicon ingot 400 to be cut as face to be cut (cutting width of side corresponding with line of cut 433 in the silicon ingot 400 to be cut width less than or equal to 1st/2 of other faces), being provided with a pair slide rail 411 of left and right trend on support 41, two cutting rollers 432 in the cutting roller group of line cutter unit 43 are setting up and down and make the line of cut 433 being wrapped on two cutting rollers 432 across the side of silicon ingot 400 to be cut.So, line cutter unit 43 moves left and right along a pair slide rail 411 under the driving of described first drive motor and is cut from the side entrance of silicon ingot 400 to be cut by the line of cut 433 on cutting roller 432.Realize moving left and right along a pair slide rail 411 as aforesaid line cutter unit 43, in one example, the bottom that slide rail 411 can be such as the cutting roll stand 431 in chute and line cutter unit 43 is provided with the pulley being suitable to described chute, but it is not limited thereto, in other instances, the cutting roll stand 431 that slide rail 411 is provided with in pulley and line cutter unit 43 is provided with the chute of corresponding described pulley.Additionally, so that the line of cut 433 on cutting roller 432 can cut after entering from the side of silicon ingot 400 to be cut smoothly, especially, silicon ingot plummer 42 offer corresponding to each line of cut 433 on two cutting rollers 432 to hold multiple cutting seams 421 of line of cut 433, making, line of cut 433 falls into when cutting silicon ingot 400 to be cut in cutting seam 421.
Further, silicon ingot plummer 42 is additionally provided with for rotating silicon ingot 400 to be cut to adjust the position adjusting mechanism (not display in the drawings) of face to be cut.In one example, described position adjusting mechanism can be in below silicon ingot plummer 42 and support the rotating shaft of silicon ingot plummer 42 and the electric rotating machine driving described swivel bearing to rotate to drive silicon ingot plummer 42, so, utilize described electric rotating machine and the rotatable silicon ingot plummer 42 of described rotating shaft, thus the rotation of silicon ingot to be cut 400 realizing carrying on silicon ingot plummer 42 is to adjust face to be cut.In another example, described position adjusting mechanism can also be can realize Telescopic rotary platform flexible up and down and for controlling the Telescopic rotating motor of described Telescopic rotary platform, when needs rotate silicon ingot 400 to be cut, protruded upward by the described Telescopic rotating motor described Telescopic rotary platform of control and pushing and withstanding silicon ingot to be cut 400 disengages it from silicon ingot plummer 42 and rotates to drive silicon ingot 400 to be cut to rotate afterwards again, after adjusting the face to be cut of silicon ingot 400 to be cut, control described Telescopic rotary platform retracted downward again and silicon ingot 400 to be cut is placed on silicon ingot plummer 42 again.Or, in another example, described position adjusting mechanism is be positioned at the turntable below silicon ingot plummer 42, and silicon ingot plummer 42 has elevating function, when needs rotate silicon ingot 400 to be cut, silicon ingot plummer 42 declines and lower than described turntable, the silicon ingot to be cut 400 being originally placed on silicon ingot plummer 42 is made to fall on described turntable, implemented to rotarily drive silicon ingot 400 to be cut by described turntable to rotate to adjust face to be cut, after adjusting the face to be cut of silicon ingot 400 to be cut, described turntable stops the rotation, silicon ingot plummer 42 rises back to original position, silicon ingot 400 to be cut is placed on silicon ingot plummer 42 again.In the ordinary course of things, for silicon ingot 400 to be cut, the angle that face to be cut is made to rotate is 90 ° or 270 °, i.e. the face to be cut of front and back cutting twice is adjacent two silicon ingot faces of the cuboid silicon ingot as silicon ingot 400 to be cut.
Also have, described silicon ingot evolution equipment is also configured with cutting liquid automatic spraying device (not display in the drawings), described cutting liquid automatic spraying device is assemblied in support 41, for spraying the cutting liquid cutting position to line of cut and silicon ingot to be cut 400 when silicon ingot 400 to be cut cuts.In actual applications, described cutting liquid automatic spraying device can include multiple cutting liquid automatic nozzle.
Refer to Figure 13 to Figure 17, in another preferred embodiment, carry out the structural representation in silicon ingot evolution operation process for being applied to the silicon ingot evolution equipment shown in Figure 12.Below in conjunction with Figure 12 to Figure 17, carry out silicon ingot evolution operation for the silicon ingot evolution equipment being applied in another preferred embodiment to be described in detail, in this example, silicon ingot 400 to be cut is block structure, such as silicon ingot 400 to be cut is rectangular structure, wherein, the size of at least one dimension in silicon ingot 400 to be cut to be significantly less than the size (such as the length of a dimension is less than the width of at least two equal to other faces/mono-) of other dimensions.
First, the mode that silicon ingot 400 1 to be cut tiles is placed on silicon ingot plummer 42, make first face 401 (the first side) the to be cut line of cut 433 corresponding to line cutter unit 43 of silicon ingot 400 to be cut, wherein, the first face 401 to be cut corresponds to the cutting width of line of cut 433 less than or equal to the width (as shown in figure 12) of 1st/2 of other faces in silicon ingot 400 to be cut.
Then, driving line cutter unit 43 to move towards silicon ingot plummer 42 along a pair slide rail 411 and rotated by described second drive motor driving cutting roller 432 by described first drive motor drives the line of cut 433 being wrapped to walk about, it is directed at cutting seam 421 by line of cut 433 enter from the first face 401 to be cut of silicon ingot 400 to be cut and carry out first time cutting, in cutting process, sprays cutting liquid (as shown in figure 13) to the cutting position of line of cut 433 and silicon ingot to be cut 400.
Then, by fall into cutting seam 421 inscribe secants 433 move ahead along a pair slide rail 411 and cut silicon ingot 400 to be cut until line of cut 433 cut to silicon ingot 400 to be cut in relative to the first face 401 to be cut the cutting back side at a distance of a safe distance time, halted by described first drive motor control line cutter unit 43 and silicon ingot plummer 42 move to exit (as shown in figure 15) dorsad.Specifically be, in the first time cutting operation of silicon ingot 400 to be cut, the cutting back side relative to the first face 401 to be cut of silicon ingot 400 to be cut is reserved with a safe distance, so, in first time cutting operation, stitched 421 by line of cut 433 along the cutting on silicon ingot plummer 42 and silicon ingot 400 to be cut is cut until when cutting to safe distance, stopped advancing and exiting along cutting seam 421 rear (certain further along a pair slide rail 411 by described first drive motor control silicon ingot plummer 42, after cutting on line unit 43 exits, also can be controlled cutting roller 432 by described second drive motor to decommission).From the foregoing, it will be observed that by arranging safe distance, it can be ensured that silicon ingot 400 to be cut each cut portion after first time cutting operation links together yet by corresponding that part of safe distance and does not scatter.
After having cut for the first time, the position of silicon ingot 400 to be cut is adjusted by described position adjusting mechanism, make in silicon ingot 400 to be cut the face to be cut of the line of cut 433 corresponding to line cutter unit 43 by the first original face 401 (the first side) to be cut be adjusted to adjacent second face to be cut 402 (the second side, as shown in figure 16).In the present embodiment, the position being adjusted silicon ingot 400 to be cut by described position adjusting mechanism both can realize silicon ingot 400 to be cut by integral-rotation silicon ingot plummer 42, can also realize by individually rotating silicon ingot 400 to be cut, silicon ingot 400 to be cut may finally be made to change face to be cut by half-twist or 270 °, wherein, the second face 402 to be cut corresponds to the cutting width of line of cut 433 less than or equal to the width of 1st/2 of other faces in silicon ingot 400 to be cut.
After adjusting the position of silicon ingot 400 to be cut, driving line cutter unit 43 to move towards silicon ingot plummer 42 along a pair slide rail 411 and rotated by described second drive motor driving cutting roller 432 by the first drive motor drives line of cut 433 to walk about, it is directed at cutting seam 421 by line of cut 433 enter from the second face 402 to be cut of silicon ingot 400 to be cut and carry out second time cutting (spraying cutting liquid to the cutting position of line of cut 433 and silicon ingot to be cut 400 cutting process), until cutting completely, complete the evolution operation (as shown in figure 17) of silicon ingot 400 to be cut.By the cutting of twice so that the cutting finished product of silicon ingot 400 to be cut is in bulk.
What also need to supplement is, can each face to be cut (such as first face 401 to be cut and the second face 402 to be cut) to silicon ingot 400 to be cut more swimmingly for reaching line of cut 433, no matter it is in first time cutting operation or second time cutting operation converge, all right rotational line cutter unit 43, adjust the cutting angle (as shown in figure 14) of the line of cut 433 in line cutter unit 43 and the face to be cut of silicon ingot 400 to be cut, to be more beneficial for the line of cut 433 cutting to silicon ingot 400 to be cut.
nullIn sum，Silicon ingot evolution equipment provided by the utility model，Including support、Silicon ingot plummer、Line cutter unit、And position adjusting mechanism，Driving line cutter unit to move towards silicon ingot plummer by the first drive motor and driving cutting roller to rotate by the second drive motor drives line of cut to walk about，By line of cut, the silicon ingot to be cut carried on silicon ingot plummer is carried out automatization's cutting and completes silicon ingot evolution operation，Save labour turnover and improve production efficiency，Especially，Silicon ingot will have the less leptoprosopy of width as face to be cut (cutting width of face to be cut corresponding with described line of cut in the described silicon ingot to be cut width less than or equal to 1st/2 of other faces)，In cutting process，In described line of cut just shorter with the Effective line that described face to be cut contacts，Described line of cut can be subject to the stop of silicon ingot as few as possible，Stretch-draw fluctuating margin is little，Line of cut has higher equilibrium degree，What guarantee in cutting process is relatively stable，Not only protect line of cut and extend the service life of line of cut，More can ensure that precision and reliability that silicon ingot cuts，Improve the cut quality (such as after cutting, the flatness of silico briquette facet is higher) of silicon ingot.
Above-described embodiment only illustrative principle of the present utility model and effect thereof, not for restriction this utility model.Above-described embodiment all under spirit of the present utility model and category, can be modified or change by any those skilled in the art.Therefore, art has all equivalence modification or changes that usually intellectual completes under the spirit disclosed without departing from this utility model with technological thought such as, must be contained by claim of the present utility model.
Claims (10)
1. a silicon ingot evolution equipment, it is characterised in that including:
Support；
It is located on described support, for carrying the silicon ingot plummer of silicon ingot to be cut；
The line cutter unit being located on described support and move relative to described silicon ingot plummer, includes the line of cut forming cutting gauze in described line cutter unit；Described line of cut is controlled to be cut the silicon ingot described to be cut on described silicon ingot plummer；And
It is located on described support, for adjusting the position adjusting mechanism of the position of described silicon ingot to be cut so that the face to be cut of the line of cut corresponding to described line cutter unit in described silicon ingot to be cut is adjusted to the second face to be cut by original described first face to be cut；Corresponding to the cutting width of described line of cut less than or equal to the width of 1st/2 of other faces in described silicon ingot to be cut in described second face to be cut and described first face to be cut.
2. silicon ingot evolution equipment as claimed in claim 1, it is characterised in that offer cutting seam to hold described line of cut corresponding to the described line of cut in described line cutting net on described silicon ingot plummer.
3. silicon ingot evolution equipment as claimed in claim 1, it is characterised in that described line cutter unit also includes:
Cutting roll stand；And
Being arranged at least one the cutting roller group in described cutting roll stand, each described cutting roller group includes two cutting rollers that spacing is arranged, and described line of cut correspondence is wrapped on two described cutting rollers to form line cutting net.
4. silicon ingot evolution equipment as claimed in claim 1, it is characterised in that described line cutter unit also includes:
Cutting rack；And
It is arranged at the multipair cutting wheels on described cutting rack, cuts wheels described in every a pair and include two cutting wheels that spacing is arranged, to form line cutting net on each described cutting wheel that described line of cut correspondence is wound in multipair cutting wheels.
5. the silicon ingot evolution equipment as described in claim 3 or 4, it is characterised in that
The end face of described silicon ingot to be cut is as face to be cut, described support is provided with a pair slide rail moved towards up and down, two cutting rollers in the cutting roller group of described line cutter unit or the multipair cutting wheels in described line cutter unit are the described line of cut end face across described silicon ingot to be cut that left and right arranged and made winding, and described line cutter unit is controlled to be moved up and down along slide rail described in a pair and cut from the end face entrance of described silicon ingot to be cut by described line of cut；And
Described position adjusting mechanism, including: for clamping the holder of described silicon ingot to be cut and for controlling the described holder electric rotating machine along a horizontal rotating shaft or a vertical axis of rotation.
6. silicon ingot evolution equipment as claimed in claim 5, it is characterised in that
Described slide rail is chute, and the described cutting roller erection in described line cutter unit has the pulley being suitable to described chute；Or
Described slide rail is provided with pulley, and the described cutting roller erection in described line cutter unit has the chute of corresponding described pulley.
7. the silicon ingot evolution equipment as described in claim 3 or 4, it is characterised in that
The side of described silicon ingot to be cut is as face to be cut, described support is provided with a pair slide rail of left and right trend, two cutting rollers in the cutting roller group of described line cutter unit or the multipair cutting wheels in described line cutter unit are setting up and down and make the described line of cut being wound around across the side of described silicon ingot to be cut, and described line cutter unit is controlled to be moved left and right along slide rail described in a pair and cut from the side entrance of described silicon ingot to be cut by described line of cut；And
Described position adjusting mechanism, including being positioned at below described silicon ingot plummer and support the swivel bearing of described silicon ingot plummer and the electric rotating machine driving described swivel bearing to rotate to drive described silicon ingot plummer；Or, including Telescopic rotary platform and control described Telescopic rotary platform protrude upward and silicon ingot to be cut described in pushing and withstanding disengage it from described silicon ingot plummer after rotate the Telescopic rotating motor that drives described silicon ingot to be cut to rotate again.
8. silicon ingot evolution equipment as claimed in claim 7, it is characterised in that
Described slide rail is chute, and the described cutting roller erection in described line cutter unit has the pulley being suitable to described chute；Or
Described slide rail is provided with pulley, and the described cutting roller erection in described line cutter unit has the chute of corresponding described pulley.
9. silicon ingot evolution equipment as claimed in claim 1, it is characterized in that, described line cutter unit is located on described support by a cutting support, and described line cutter unit is more pivoted on described cutting support to adjust the cutting angle between the face to be cut of described line of cut and described silicon ingot to be cut.
10. silicon ingot evolution equipment as claimed in claim 9, it is characterised in that described cutting angle is 0 ° to 60 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109497.5U CN205364250U (en) | 2016-02-02 | 2016-02-02 | Silicon bulk evolution equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620109497.5U CN205364250U (en) | 2016-02-02 | 2016-02-02 | Silicon bulk evolution equipment |
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| CN205364250U true CN205364250U (en) | 2016-07-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690582A (en) * | 2016-02-02 | 2016-06-22 | 上海日进机床有限公司 | Silicon ingot cutting equipment and silicon ingot cutting method |
| CN107584687A (en) * | 2017-10-31 | 2018-01-16 | 乐山新天源太阳能科技有限公司 | Annular diamond wire extracting machine |
| CN112895159A (en) * | 2021-03-26 | 2021-06-04 | 厦门品河机械制造有限公司 | Transverse reciprocating type diamond wire multi-wire cutting machine |
-
2016
- 2016-02-02 CN CN201620109497.5U patent/CN205364250U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690582A (en) * | 2016-02-02 | 2016-06-22 | 上海日进机床有限公司 | Silicon ingot cutting equipment and silicon ingot cutting method |
| CN107584687A (en) * | 2017-10-31 | 2018-01-16 | 乐山新天源太阳能科技有限公司 | Annular diamond wire extracting machine |
| CN107584687B (en) * | 2017-10-31 | 2024-03-26 | 乐山新天源太阳能科技有限公司 | Annular diamond wire squaring machine |
| CN112895159A (en) * | 2021-03-26 | 2021-06-04 | 厦门品河机械制造有限公司 | Transverse reciprocating type diamond wire multi-wire cutting machine |
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Effective date of registration: 20180528 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |