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CN205208491U - 一种led玉米灯散热模组 - Google Patents

一种led玉米灯散热模组 Download PDF

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Publication number
CN205208491U
CN205208491U CN201521013045.9U CN201521013045U CN205208491U CN 205208491 U CN205208491 U CN 205208491U CN 201521013045 U CN201521013045 U CN 201521013045U CN 205208491 U CN205208491 U CN 205208491U
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CN
China
Prior art keywords
led
mount pad
heat radiation
base
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521013045.9U
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English (en)
Inventor
陈柏州
刘阿生
刘奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Xianglong Hardware Products Co Ltd
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Dongguan Xianglong Hardware Products Co Ltd
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Priority to CN201521013045.9U priority Critical patent/CN205208491U/zh
Application granted granted Critical
Publication of CN205208491U publication Critical patent/CN205208491U/zh
Priority to PCT/CN2016/099355 priority patent/WO2017097003A1/zh
Priority to US15/491,968 priority patent/US20170219199A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本实用新型公开了一种LED玉米灯散热模组，其包括底座，其还包括若干LED散热模块，所述若干LED散热模块按间隔距离呈圆形分布于所述底座上，所述LED散热模块包括固定支架、散热鳍片和由金属材料制成的LED安装座，所述固定支架固定于所述底座上，所述散热鳍片固定于所述LED安装座的背面，所述散热鳍片与所述固定支架固定连接，所述LED安装座的正面朝向所述底座的外侧。本实用新型其结构设计合理巧妙，装配工艺简单，制造成本低，通过采用散热鳍片和由金属材料制成的LED安装座，能够快速、安全地将LED工作时产生的热量散掉，不会对LED灯造成不良影响。

Description

一种LED玉米灯散热模组
技术领域
本实用新型涉及LED灯，特别涉及一种LED玉米灯散热模组。
背景技术
现有技术中，LED玉米灯指的是LED灯的排列像玉米一样的LED灯组。目前市面上所看到的玉米灯普遍结构都很复杂，为了达到较好的散热效果，通常设置了风扇进行散热。但这样的设计增加了生产上装配的难度，并且增加了材料成本，同时由于风扇的使用，也增加了安全隐患，如果风扇电路出现故障，会导致LED灯散热不及时，从而过热烧坏。
一种不需要用到风扇的LED玉米灯散热模组成为了需求。
实用新型内容
本实用新型的目的在于，针对上述问题，提供一种LED玉米灯散热模组，其结构设计合理巧妙，装配工艺简单，制造成本低，通过采用散热鳍片和由金属材料制成的LED安装座，能够快速、安全地将LED工作时产生的热量散掉，不会对LED灯造成不良影响。
本实用新型为实现上述目的所采用的技术方案为：
一种LED玉米灯散热模组，其包括底座，其还包括若干LED散热模块，所述若干LED散热模块按间隔距离呈圆形分布于所述底座上，所述LED散热模块包括固定支架、散热鳍片和由金属材料制成的LED安装座，所述固定支架固定于所述底座上，所述散热鳍片固定于所述LED安装座的背面，所述散热鳍片与所述固定支架固定连接，所述LED安装座的正面朝向所述底座的外侧。
所述LED安装座的正面垂直所述底座。
所述散热鳍片与所述LED安装座为铆合固定。
所述LED散热模块的数量为12个。
所述LED安装座的正面上设有用于插接LED灯的插槽。
所述LED安装座的背面上设有若干连接凹槽，于所述散热鳍片上对应所述连接凹槽设有连接块。
本实用新型的有益效果为：本实用新型其结构设计合理巧妙，装配工艺简单，制造成本低，通过采用散热鳍片和由金属材料制成的LED安装座，能够快速、安全地将LED工作时产生的热量散掉，不会对LED灯造成不良影响。
下面结合附图与实施例，对本实用新型进一步说明。
附图说明
图1是本实用新型的结构示意图；
图2是图1中LED散热模块的结构示意图。
具体实施方式
实施例：如图1和图2所示，本实用新型一种LED玉米灯散热模组，其包括底座1，其还包括若干LED散热模块2，所述若干LED散热模块2按间隔距离呈圆形分布于所述底座1上，所述LED散热模块2包括固定支架21、散热鳍片22和由金属材料制成的LED安装座23，所述固定支架21固定于所述底座1上，所述散热鳍片22固定于所述LED安装座23的背面，所述散热鳍片22与所述固定支架21固定连接，所述LED安装座23的正面朝向所述底座1的外侧。
所述LED安装座23的正面垂直所述底座1。
所述散热鳍片22与所述LED安装座23为铆合固定。
所述LED散热模块2的数量为12个。
所述LED安装座23的正面上设有用于插接LED灯的插槽231。
所述LED安装座23的背面上设有若干连接凹槽232，于所述散热鳍片22上对应所述连接凹槽232设有连接块221。
本实用新型其结构设计合理巧妙，装配工艺简单，制造成本低，通过采用散热鳍片22和由金属材料制成的LED安装座23，能够快速、安全地将LED工作时产生的热量散掉，不会对LED灯造成不良影响。
如本实用新型实施例所述，与本实用新型相同或相似结构的其他LED玉米灯散热模组，均在本实用新型保护范围内。

Claims (6)

1.一种LED玉米灯散热模组，其包括底座，其特征在于：其还包括若干LED散热模块，所述若干LED散热模块按间隔距离呈圆形分布于所述底座上，所述LED散热模块包括固定支架、散热鳍片和由金属材料制成的LED安装座，所述固定支架固定于所述底座上，所述散热鳍片固定于所述LED安装座的背面，所述散热鳍片与所述固定支架固定连接，所述LED安装座的正面朝向所述底座的外侧。
2.根据权利要求1所述LED玉米灯散热模组，其特征在于，所述LED安装座的正面垂直所述底座。
3.根据权利要求2所述LED玉米灯散热模组，其特征在于，所述散热鳍片与所述LED安装座为铆合固定。
4.根据权利要求1述LED玉米灯散热模组，其特征在于，所述LED散热模块的数量为12个。
5.根据权利要求1所述LED玉米灯散热模组，其特征在于，所述LED安装座的正面上设有用于插接LED灯的插槽。
6.根据权利要求3述LED玉米灯散热模组，其特征在于，所述LED安装座的背面上设有若干连接凹槽，于所述散热鳍片上对应所述连接凹槽设有连接块。
CN201521013045.9U 2015-12-08 2015-12-08 一种led玉米灯散热模组 Expired - Fee Related CN205208491U (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201521013045.9U CN205208491U (zh) 2015-12-08 2015-12-08 一种led玉米灯散热模组
PCT/CN2016/099355 WO2017097003A1 (zh) 2015-12-08 2016-09-19 灯具散热模组及灯具
US15/491,968 US20170219199A1 (en) 2015-12-08 2017-04-19 Heat dissipation module for lamp and lamp with the same

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Application Number Priority Date Filing Date Title
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