CN205187841U - Can alleviate MEMS packaging structure of apron stress - Google Patents
Can alleviate MEMS packaging structure of apron stress Download PDFInfo
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- CN205187841U CN205187841U CN201520906989.2U CN201520906989U CN205187841U CN 205187841 U CN205187841 U CN 205187841U CN 201520906989 U CN201520906989 U CN 201520906989U CN 205187841 U CN205187841 U CN 205187841U
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- cover plate
- mems chip
- sealing ring
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- apron
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Abstract
The utility model discloses a can alleviate MEMS packaging structure of apron stress, including MEMS chip, apron and electric conduction structure, the MEMS chip has the functional areas a plurality of weld pads peripheral with being located functional areas, the apron first surface has the cavity, is formed with a plurality of recesses and an at least opening on the apron second surface, and the first surface of apron is in the same place with the function face bonded of MEMS chip, makes the cavity cover the functional areas of MEMS chip, electricity conduction structure is on the second surface of apron, and its electrical property causes on the weld pad of MEMS chip through the opening. The utility model discloses a to lap and design into one and have the cavity on the surface, another structure of carving out a plurality of recesses on the surface is in the time of can alleviating the apron with MEMS chip bonded, because the apron stress that the cavity leads to to reduce the angularity, improve the bonded effect of apron and MEMS chip. Welding stress in the time of can also alleviating the apron with circuit board (function base plate) bonded to improve the package reliability of MEMS chip.
Description
Technical field
The utility model relates to the wafer-level packaging of MEMS chip, particularly relates to a kind of MEMS package structure alleviating cover plate stress.
Background technology
MEMS (Micro-Electro-MechanicalSystems) chip, as accelerometer, in encapsulation process, in order to ensure the normal work of its functional areas precision components, reduce external environment to the adverse effect of functional areas, the cover plate of usual use one with cavity, is bonded on the functional surfaces of MEMS chip, for sealed environment built by its assembly.
But only a surface has the cover plate of cavity to be dissymmetrical structure, be easy to cause cover plate to have warpage, and bonding technology has tighter management and control to warpage, the cover plate that therefore warpage is serious easily produces the first-class exception of the non-bonding in edge, so that brings the problem of chip reliability.In addition, MEMS chip counter stress is more responsive, in encapsulation process, also needs to consider chip and is finally welded to stress distribution problem on feature board.
Summary of the invention
In order to solve the problems of the technologies described above, the utility model proposes a kind of MEMS package structure alleviating cover plate stress, by becoming one to have cavity on the surface the deck design of MEMS package structure, another carves the structure of some grooves on the surface, when can alleviate cover plate and MEMS chip bonding, due to the cover plate stress that cavity causes, to cut down angularity, improve the bonding effect of cover plate and MEMS chip.Welding stress when cover plate and circuit board (function substrate) bonding can also be alleviated, to improve the package reliability of MEMS chip.
The technical solution of the utility model is achieved in that
Alleviate a MEMS package structure for cover plate stress, comprising:
MEMS chip, described MEMS chip has functional areas and is positioned at some weld pads of functional areas periphery;
Cover plate, described cover plate has first surface and second surface corresponding thereto, described first surface has cavity, described second surface is formed with some grooves, described cover plate is also formed with through at least one opening, the first surface of described cover plate and the functional surfaces of described MEMS chip are bonded together, and make described cavity cover the functional areas of described MEMS chip;
Conduct structure, be formed on the second surface of described cover plate, it is electrically caused by described opening on the weld pad of described MEMS chip.
Further, the shape of cross section of some described grooves comprises one or more in square, triangle, polygon, circle, ellipse, rhombus and irregular figure.
Further, the circumscribed circle diameter scope of described groove cross section shape is 2 ~ 5 μm; The degree of depth of described groove is 1 ~ 10 μm.
Further, the overall area occupied of some described grooves is greater than 1/3 of described lid surface area.
Further, the functional surfaces of described MEMS chip carries out bonding with the first surface of described cover plate by a sealing ring and some first weld parts and is connected, make the sealing ring sealing ring after bonding around the functional areas of described MEMS chip, and described in conduct the weld pad being electrically connected described MEMS chip after structure causes described cover plate first surface by described first weld part.
Further, the region except functional areas and weld pad is coated with a layer insulating for the functional surfaces of described MEMS chip, described insulating barrier is provided with the sealing ring tie point with setting width and setting height around described functional areas, and each described weld pad is manufactured with micro convex point tie point; The first surface correspondence position of described cover plate is provided with the sealing ring with setting width and setting height, the first surface correspondence position of described cover plate is manufactured with solder micro convex point, and this solder micro convex point is electrically connected with the structure that conducts of the first surface causing described cover plate, between described sealing ring with described sealing ring tie point, bonded seal is connected, and between described solder micro convex point with described micro convex point tie point, bonding is electrically connected.
Further, the outward flange of described sealing ring extends and near the edge of described MEMS chip, and to be separated by one first distance with the edge of described MEMS chip; Described solder micro convex point is embedded in described sealing ring, and an and external series gap of being separated by between described sealing ring.
Further, conduct structure described in comprise:
Passivation layer, covers on the second surface of described cover plate, in described groove and on the sidewall of described opening;
Metallic circuit, is formed on described passivation layer, and it is electrically caused by described opening on the weld pad of described MEMS chip;
Protective layer, on the metallic circuit on the metallic circuit being formed at described cover plate second surface and in described opening; Described protective layer is formed with some second weld parts of the described metallic circuit of electrical connection;
Separately be provided with circuit board, described circuit board is electrically connected with described second weld part.
The beneficial effects of the utility model are: the utility model provides a kind of MEMS package structure alleviating cover plate stress, the cover plate first surface of this MEMS package structure is provided with cavity, the second surface of this cover plate is carved with some grooves, the functional surfaces bonding of cover plate first surface and MEMS chip, cavity and MEMS chip functional areas form confined space; Cover plate is provided with through opening, and be formed on the second surface of cover plate and conduct structure, the electrical of the weld pad of MEMS chip functional surfaces is caused on second surface by cover plate first surface, the second weld part is set conducting in structure, such as soldered ball, by soldered ball circuit connectable plate.In said structure, by becoming one to have cavity on the surface the deck design of MEMS package structure, another carves the structure of some grooves on the surface, when can alleviate cover plate and MEMS chip bonding, due to the cover plate stress that cavity causes, to cut down angularity, improve the bonding effect of cover plate and MEMS chip.And this some groove, welding stress when cover plate and circuit board (function substrate) bonding can also be alleviated, to improve the package reliability of MEMS chip.Preferably, the functional surfaces of MEMS chip is connected with the bonding of the first surface of cover plate and is realized by a sealing ring and some first weld parts, sealing ring sealing ring is around the functional areas of MEMS chip, functional unit for functional areas provides the working space of sealing, first weld part electrical connection causes the weld pad conducting structure and MEMS chip of cover plate first surface, with the second surface electrically causing cover plate of the weld pad by MEMS chip.Better, the outward flange of sealing ring extends and near the edge of MEMS chip, and to be separated by one first distance with the edge of MEMS chip; First weld part (solder micro convex point) is embedded in sealing ring, and an and external series gap of being separated by between sealing ring.Like this, the width of sealing ring is increased, and adds the Bonding area of sealing ring and MEMS chip and cover plate, thus strengthens cohesion, ensure that sealability, and improves anti-air pressure ability, increases reliability.
Accompanying drawing explanation
Fig. 1 is the sectional view of the utility model MEMS package structure one embodiment;
Fig. 2 is the sectional view of Fig. 1 cover plate;
Fig. 3 is at A place structure for amplifying schematic diagram in Fig. 2;
Fig. 4 is the top view of the utility model cover plate second surface groove;
Fig. 5 is the sectional view of another embodiment of the utility model MEMS package structure;
By reference to the accompanying drawings, make the following instructions:
1-MEMS chip 101-functional areas
102-weld pad 2-cover plate
201-first surface 202-second surface
203-cavity 204-groove
205-opening 3-sealing ring
4-first weld part 5-passivation layer
6-metallic circuit 7-protective layer
8-second weld part 9-circuit board
Detailed description of the invention
For enabling the technical solution of the utility model more understandable, below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail.For convenience of description, in the structure of embodiment accompanying drawing, each part does not press normal rates convergent-divergent, therefore does not represent the actual relative size of each structure in embodiment.Wherein said structure or face above or upside, comprise the middle situation also having other layers.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, a kind of MEMS package structure alleviating cover plate stress, comprising:
One MEMS chip 1, described MEMS chip has functional areas 101 and is positioned at some weld pads 102 of functional areas periphery;
One cover plate 2, described cover plate has first surface 201 and second surface corresponding thereto 202, described first surface has cavity 203, described second surface is formed with some grooves 204, described cover plate is also formed with through at least one opening 205, the first surface of described cover plate and the functional surfaces of described MEMS chip are bonded together, and make described cavity cover the functional areas of described MEMS chip;
One conducts structure, is formed on the second surface of described cover plate, and it is electrically caused by described opening on the weld pad of described MEMS chip.The described structure that conducts comprises:
One passivation layer 5, covers on the second surface of described cover plate, in described groove and on the sidewall of described opening;
One metallic circuit 6, is formed on described passivation layer, and it is electrically caused by described opening on the weld pad of described MEMS chip;
Layer protective layer 7, on the metallic circuit on the metallic circuit being formed at described cover plate second surface and in described opening; Described protective layer is formed with some second weld parts 8 of the described metallic circuit of electrical connection;
Separately be provided with circuit board 9, described circuit board is electrically connected with described second weld part.
In said structure, by forming cavity on the surface at cover plate one, after this cavity bonding, cover on the top of the functional areas of MEMS chip, the functional unit that can be functional areas provides the working space of sealing.By carving the structure of some grooves on the surface at another of cover plate, when can alleviate cover plate and MEMS chip bonding, due to the cover plate stress that cavity causes, to cut down angularity, improve the bonding effect of cover plate and MEMS chip.And this some groove, welding stress when cover plate and circuit board (function substrate) bonding can also be alleviated, to improve the package reliability of MEMS chip.
Some grooves of cover plate first surface, its shape of cross section type without particular/special requirement, preferably, the shape of cross section of some described grooves comprise in square, triangle, polygon, circle, ellipse, rhombus and irregular figure one or more.See Fig. 4, the shape of cross section of groove is square, more excellent, and the circumscribed circle diameter scope of described groove cross section shape is 2 ~ 5 μm; The degree of depth of described groove is 1 ~ 10 μm.
Preferably, the overall area occupied of some described grooves is greater than 1/3 of described lid surface area.Due to the One's name is legion of groove, the position of nonmetallic line and non-opening can be distributed in, effectively to disperse cover plate upper stress.
The mode that the first surface of cover plate and the functional surfaces of MEMS chip are bonded together is a lot, can adopt the conventional form supporting cofferdam.Preferably, the functional surfaces of described MEMS chip carries out bonding with the first surface of described cover plate by a sealing ring 3 and some first weld parts 4 and is connected, make the sealing ring sealing ring after bonding around the functional areas of described MEMS chip, and described in conduct the weld pad being electrically connected described MEMS chip after structure causes described cover plate first surface by described first weld part.Wherein, sealing ring sealing ring is around the functional areas of MEMS chip, functional unit for functional areas provides the working space of sealing, and the first weld part electrical connection causes the weld pad conducting structure and MEMS chip of cover plate first surface, with the second surface electrically causing cover plate of the weld pad by MEMS chip.
This first weld part can be soldered ball, as tin ball, can be solder micro convex point, or be directly UBM, or be copper post, as a kind of preferred embodiment, can adopt solder micro convex point.Concrete enforcement structure is: the region except functional areas and weld pad is coated with a layer insulating for the functional surfaces of described MEMS chip, described insulating barrier is provided with the sealing ring tie point with setting width and setting height around described functional areas, and each described weld pad is manufactured with micro convex point tie point; The first surface correspondence position of described cover plate is provided with the sealing ring with setting width and setting height, the first surface correspondence position of described cover plate is manufactured with solder micro convex point, and this solder micro convex point is electrically connected with the structure that conducts of the first surface causing described cover plate, between described sealing ring with described sealing ring tie point, bonded seal is connected, and between described solder micro convex point with described micro convex point tie point, bonding is electrically connected.In said structure, insulating barrier is used for isolating the silicon in MEMS chip, and prevent short circuit, the material of insulating barrier can be Inorganic Non-metallic Materials, as silica, can be also insulating polymeric material, as photoresist etc.In the present embodiment, usually by the width design of sealing ring more than 10 μm, and the solder micro convex point at sealing circle and edge separates certain distance, and concrete width is formulated according to MEMS chip size.Preferably, underfill is filled with between sealing ring and solder micro convex point.
More excellent, see Fig. 5, the outward flange of described sealing ring extends and near the edge of described MEMS chip, and to be separated by one first distance with the edge of described MEMS chip; Described solder micro convex point is embedded in described sealing ring, and an and external series gap of being separated by between described sealing ring.Like this, the width of sealing ring is increased, and adds the Bonding area of sealing ring and MEMS chip and cover plate, thus strengthens cohesion, ensure that sealability, and improves anti-air pressure ability, increases reliability.
In the present embodiment, the shape of opening is straight hole, and the first weld part of cover plate first surface is solder micro convex point, and the second weld part of second surface is soldered ball.The solder micro convex point of cover plate first surface is electrically guided on the soldered ball of second surface by straight hole by metallic circuit.The weld pad bonding of solder micro convex point and MEMS chip and electrical communication, thus by the second surface electrically guiding to cover plate of MEMS chip.
The utility model embodiment can alleviate the method for packing of the MEMS package structure of cover plate stress, comprises the steps:
A, the wafer providing to comprise some MEMS chip, each MEMS chip has functional areas and is positioned at some weld pads of functional areas periphery; There is provided the cover plate of a wafer size, this cover plate has first surface and second surface corresponding thereto;
B, on the second surface of described cover plate, form the opening of some through described cover plates;
C, on the second surface of described cover plate, form some grooves; Here photoetching process and etching technics can be used, first etched recesses, can also first etching opening;
D, on described cover plate, make corresponding each MEMS chip conduct structure, this conducts structure makes the electrical of cover plate second surface extend to cover plate first surface by opening;
E, to make on described cover plate first surface just to the cavity of the functional areas of each MEMS chip;
The functional surfaces of cover plate first surface and described wafer described in F, bonding, and the weld pad of each MEMS chip is electrically connected with the structure that conducts causing cover plate first surface;
G, make some second weld parts conducting in structure of described cover plate second surface, cutting cover plate and wafer, form single MEMS package structure.
Preferably, the making conducting structure comprises the steps:
A, lay one deck passivation layer at cover plate second surface and opening inwall;
B, on described passivation layer, lay metallic circuit, described metallic circuit is caused the first surface of cover plate through described opening by cover plate second surface, the MEMS chip weld pad corresponding with it is electrical connected;
C, on described cover plate and in described opening, lay protective layer, this protective layer covers metallic circuit, and opening is stayed in the position of presetting the second weld part on the metallic circuit of cover plate second surface, makes the second weld part be electrically connected with described metallic circuit.
Preferably, hit in groove cover one deck passivation layer at cover plate second surface, opening sidewalls, make the first metallic circuit over the passivation layer, first metallic circuit extends to open bottom from the second surface of cover plate, cover at the first metallic circuit and opening inwall or fill protective layer, and the protective layer presetting the position of the first weld part at the first metallic circuit does opening; Do thinning at the back side of cover plate second surface, and expose the metallic circuit of open bottom, form first surface, insulating barrier is covered at first surface, first metallic circuit of insulating layer exposing open bottom, and making the second metallic circuit and sealing ring Seed Layer on the insulating layer, the second metallic circuit connects the first metallic circuit of insulating layer exposing; Long second weld part on the second metallic circuit, simultaneously long sealing ring in sealing ring Seed Layer, this second weld part has identical setting height with sealing ring.
Optionally, the type of opening comprises straight hole or inclined hole, and see Fig. 1 and Fig. 4, opening is straight hole.
To sum up, the utility model provides a kind of MEMS package structure alleviating cover plate stress, by becoming one to have cavity on the surface the deck design of MEMS package structure, another carves the structure of some grooves on the surface, when can alleviate cover plate and MEMS chip bonding, due to the cover plate stress that cavity causes, to cut down angularity, improve the bonding effect of cover plate and MEMS chip.And this some groove, welding stress when cover plate and circuit board (function substrate) bonding can also be alleviated, to improve the package reliability of MEMS chip.Preferably, the outward flange of sealing ring extends and near the edge of MEMS chip, and to be separated by one first distance with the edge of MEMS chip; First weld part (solder micro convex point) is embedded in sealing ring, and an and external series gap of being separated by between sealing ring.Like this, the width of sealing ring is increased, and adds the Bonding area of sealing ring and MEMS chip and cover plate, thus strengthens cohesion, ensure that sealability, and improves anti-air pressure ability, increases reliability.
Above embodiment is with reference to accompanying drawing, is described in detail to preferred embodiment of the present utility model.Novel wafer level MEMS package structure described in the utility model is applicable to the encapsulation of all MEMS chip.Those skilled in the art is by carrying out amendment on various forms or change to above-described embodiment; or applied to the encapsulating structure of different MEMS chip; but when not deviating from essence of the present utility model, all drop within protection domain of the present utility model.
Claims (8)
1. can alleviate a MEMS package structure for cover plate stress, it is characterized in that: comprising:
MEMS chip (1), described MEMS chip has functional areas (101) and is positioned at some weld pads (102) of functional areas periphery;
Cover plate (2), described cover plate has first surface (201) and second surface corresponding thereto (202), described first surface has cavity (203), described second surface is formed with some grooves (204), described cover plate is also formed with through at least one opening (205), the first surface of described cover plate and the functional surfaces of described MEMS chip are bonded together, and make described cavity cover the functional areas of described MEMS chip;
Conduct structure, be formed on the second surface of described cover plate, it is electrically caused by described opening on the weld pad of described MEMS chip.
2. the MEMS package structure alleviating cover plate stress according to claim 1, is characterized in that: the shape of cross section of some described grooves comprise in square, triangle, polygon, circle, ellipse, rhombus and irregular figure one or more.
3. the MEMS package structure alleviating cover plate stress according to claim 1, is characterized in that: the circumscribed circle diameter scope of described groove cross section shape is 2 ~ 5 μm; The degree of depth of described groove is 1 ~ 10 μm.
4. the MEMS package structure alleviating cover plate stress according to claim 1, is characterized in that: the overall area occupied of some described grooves is greater than 1/3 of described lid surface area.
5. the MEMS package structure alleviating cover plate stress according to claim 1, it is characterized in that: the functional surfaces of described MEMS chip carries out bonding with the first surface of described cover plate by a sealing ring (3) and some first weld parts (4) and is connected, make the sealing ring sealing ring after bonding around the functional areas of described MEMS chip, and described in conduct the weld pad being electrically connected described MEMS chip after structure causes described cover plate first surface by described first weld part.
6. the MEMS package structure alleviating cover plate stress according to claim 5, it is characterized in that: the region except functional areas and weld pad is coated with a layer insulating for the functional surfaces of described MEMS chip, described insulating barrier is provided with the sealing ring tie point with setting width and setting height around described functional areas, and each described weld pad is manufactured with micro convex point tie point; The first surface correspondence position of described cover plate is provided with the sealing ring with setting width and setting height, the first surface correspondence position of described cover plate is manufactured with solder micro convex point, and this solder micro convex point is electrically connected with the structure that conducts of the first surface causing described cover plate, between described sealing ring with described sealing ring tie point, bonded seal is connected, and between described solder micro convex point with described micro convex point tie point, bonding is electrically connected.
7. the MEMS package structure alleviating cover plate stress according to claim 6, is characterized in that: the outward flange of described sealing ring extends and near the edge of described MEMS chip, and to be separated by one first distance with the edge of described MEMS chip; Described solder micro convex point is embedded in described sealing ring, and an and external series gap of being separated by between described sealing ring.
8. the MEMS package structure alleviating cover plate stress according to claim 1, is characterized in that: described in conduct structure and comprise:
Passivation layer (5), covers on the second surface of described cover plate, in described groove and on the sidewall of described opening;
Metallic circuit (6), is formed on described passivation layer, and it is electrically caused by described opening on the weld pad of described MEMS chip;
Protective layer (7), on the metallic circuit on the metallic circuit being formed at described cover plate second surface and in described opening; Described protective layer is formed with some second weld parts (8) of the described metallic circuit of electrical connection;
Separately be provided with circuit board (9), described circuit board is electrically connected with described second weld part.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520906989.2U CN205187841U (en) | 2015-11-13 | 2015-11-13 | Can alleviate MEMS packaging structure of apron stress |
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| CN201520906989.2U CN205187841U (en) | 2015-11-13 | 2015-11-13 | Can alleviate MEMS packaging structure of apron stress |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105347292A (en) * | 2015-11-13 | 2016-02-24 | 华天科技（昆山）电子有限公司 | Micro-electro-mechanical-systems (MEMS) capsulation structure capable of relieving cover plate stress and capsulation method thereof |
| CN109642711A (en) * | 2016-08-22 | 2019-04-16 | 市光工业株式会社 | Lamps apparatus for vehicle |
| CN113555291A (en) * | 2021-07-16 | 2021-10-26 | 芯知微(上海)电子科技有限公司 | System-level packaging method and packaging structure |
-
2015
- 2015-11-13 CN CN201520906989.2U patent/CN205187841U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105347292A (en) * | 2015-11-13 | 2016-02-24 | 华天科技（昆山）电子有限公司 | Micro-electro-mechanical-systems (MEMS) capsulation structure capable of relieving cover plate stress and capsulation method thereof |
| CN109642711A (en) * | 2016-08-22 | 2019-04-16 | 市光工业株式会社 | Lamps apparatus for vehicle |
| CN113555291A (en) * | 2021-07-16 | 2021-10-26 | 芯知微(上海)电子科技有限公司 | System-level packaging method and packaging structure |
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