CN205179499U - Polyimide is high, and heat dissipation covers membrane - Google Patents
Polyimide is high, and heat dissipation covers membrane Download PDFInfo
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- CN205179499U CN205179499U CN201520957725.XU CN201520957725U CN205179499U CN 205179499 U CN205179499 U CN 205179499U CN 201520957725 U CN201520957725 U CN 201520957725U CN 205179499 U CN205179499 U CN 205179499U
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- enhancement layer
- coverlay
- polyimide film
- heat radiation
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Abstract
The utility model relates to a polyimide is high, and heat dissipation covers membrane, including first thermoset polyimide film, first enhancement layer, high thermal film, second enhancement layer and the second thermoset polyimide film who stacks gradually, first thermoset polyimide film pastes to cover has the copper foil on the surface in the flexble printed circuit board, second thermoset polyimide film is located the top layer and its surface is the frosting, first enhancement layer and second enhancement layer are the long -fiber reinforced layer. The utility model discloses a polyimide is high, and heat dissipation covers membrane is arranged in protecting the copper foil on the flexble printed circuit board not expose at the air, has that high temperature resistance is good, interfacial adhesion intensity is high, be difficult for advantage such as warpage, has the circuit of shielding effect and decorative effect simultaneously, has very strong practicality.
Description
Technical field
The utility model relates to a kind of polyimides height heat radiation coverlay, belongs to flexible printed circuit board technical field.
Background technology
Printed circuit board (PCB) is by being composited by macromolecular material and Copper Foil of insulating, and forms conductive pattern after etching to Copper Foil, for installing electronic elements, makes to couple together between the terminal of electronic component formation circuit.The progress of information, communication industry has driven the development of microelectronic industry, and flexible printed circuit board (FPC) arises at the historic moment, and obtains fast development, is used widely at numerous areas such as cell phone, notebook computer, LCDs.Flexible printed circuit board is material indispensable in electronic product, and along with the growth of consumption electronic products demand, the demand for flexible printed circuit board also grows with each passing day.Because flexible printed circuit board has flexibility and can the characteristic such as three-dimensional space distribution, under technicalization electronic product emphasizes that gesture is driven in development that is compact, flexibility, be widely used at present computer and ancillary equipment thereof, communication product and consumption electronic products etc.
In printed circuit board (PCB) manufacturing, especially flexible printed circuit board industry, coverlay is used in flexible printed circuit board product in a large number.Green paint on the Main Function of coverlay and printed circuit board (PCB) is similar, is covered in circuit surface, and protection Copper Foil does not expose in atmosphere; avoid oxidation corrosion or the damage of Copper Foil; if do not needed gold-plated region coverlay to cover, in follow-up manufacturing process, play welding resistance effect.Polyimides has outstanding resistance to elevated temperatures, resistance to chemical corrosion, electrical insulation capability and mechanical performance, is not only suitable for being used as flexible printed circuit board base material, is also the preferred material of flexible printed circuit board coverlay.Existing flexible printed circuit board polyimides coverlay generally includes Thermocurable polyimide film, glue-line and release film, glue-line is between Thermocurable polyimide film and release film, Thermocurable polyimide film another surface relative with glue-line is for being covered on flexible printed circuit board, glue-line generally adopts epoxy glue or acrylate glue to make, adopt the glue-line of these two kinds of materials to have respective advantage, but all there is the problem of resistance to elevated temperatures difference.
In addition, existing coverlay does not have heat dispersion, and heat dispersion is vital for flexible printed circuit board, reason is: along with electronic equipment develops to compactization, flexible printed circuit board loading member density improves, make heat high aggregation, if heat dissipation design is bad, the melts soldering tin at welding electronic elements position can be made, plastic casing and insulating substrate burning, therefore, steady in a long-term in order to ensure the performance of electronic equipment, require the thermal diffusivity improving constantly flexible printed circuit board.
Along with the development of mobile phone, panel computer industry; design protection for wiring board more and more comes into one's own; most coverlay is light polyimide film in the market; even if there is the polyimide film with screening effect; also an adularescent and black covering film; the color of different main flow cannot be selected by production firm according to the feature of oneself, be formed with the circuit sheet material of oneself characteristic.
For this reason, be necessary to provide that a kind of heat-resisting quantity is good, interface binding intensity is high, not easily warpage, there is the coverlay covering circuit effect and decorative effect simultaneously.
Utility model content
The purpose of this utility model overcomes the deficiencies in the prior art, a kind of polyimides height heat radiation coverlay is provided, this polyimides height heat radiation coverlay has that heat-resisting quantity is good, interface binding intensity is high, the not easily advantage such as warpage, have simultaneously and cover circuit effect and decorative effect, there is very strong practicality.
For achieving the above object, the technical scheme taked of the utility model is as follows:
A kind of polyimides height heat radiation coverlay, comprise the first Thermocurable polyimide film 2, first enhancement layer 3, high heat dissipation film 4, second enhancement layer 5 and the second Thermocurable polyimide film 6 that stack gradually, what described first Thermocurable polyimide film 2 was covered on flexible printed circuit board has on the surface of Copper Foil, described second Thermocurable polyimide film 6 is positioned at top layer and its outer surface is frosting, and described first enhancement layer 3 and the second enhancement layer 5 are long fiber reinforcement layer.
Preferably, described high heat dissipation film 4 is three layers, and three layers are formed by height heat radiation Graphene, or intermediate layer is made up of carbon nano-tube, and two layers of surface layer is made up of height heat radiation Graphene.Graphene is the heat dispersion best material found up to now, but because its thickness is too thin, easy damage, so three-decker, its intensity can be improved to a great extent, but adopt Graphene cost higher, so intermediate layer can also be adopted carbon nano-tube, to reduce the use amount of Graphene, thus reduce production cost.
Preferably, described long fibre is glass fibre, quartz fibre, ceramic fibre, boron fibre or carbon fiber.Especially preferably adopt carbon fiber, utilize the heat conductivility of carbon fiber can improve its heat dispersion further while improvement described polyimides height heat radiation coverlay intensity.
Preferably, the long fibre in described first enhancement layer 3 and the second enhancement layer 5 is one direction arrangement, and described first enhancement layer 3 is mutually vertical with the orientation of the second enhancement layer 5 medium-length fibre.
Preferably, described long stapled line density is 500-1000dtex, and diameter is 100-200 micron.
Preferably, the thickness of described first Thermocurable polyimide film 2 and the second Thermocurable polyimide film 6 is 50-100 micron, and the thickness of described first enhancement layer 3 and the second enhancement layer 5 is 100-200 micron, and the thickness of described high heat dissipation film 4 is 10-20 micron.
The beneficial effects of the utility model are as follows:
(1) the two-layer Thermocurable polyimide film being positioned at surface provides excellent heat-resisting quantity for polyimides of the present utility model height heat radiation coverlay, common highly heat-conductive material also has electric conductivity simultaneously, by the Thermocurable polyimide film of Heat stability is good, flexible printed circuit board and high heat dissipation film are separated, can avoid being short-circuited, in addition, if the base material of flexible printed circuit board also adopts polyimide resin, so can also prevent this coverlay from peeling off from copper foil surface by compatibility good between Thermocurable polyimide film and circuit substrate
(2) surface has the second Thermocurable polyimide film of frosted finish effect especially for this coverlay provides screening effect, and has the visual effect being different from traditional bright film.
(3) the high heat dissipation film being positioned at intermediate layer provides excellent radiating effect for polyimides height heat radiation coverlay of the present utility model, greatly reduce the melts soldering tin at welding electronic elements position and the risk of plastic casing and insulating substrate burning, ensure that the performance of electronic equipment is steady in a long-term, extend its useful life.
(4) existence of enhancement layer further increases the heat radiation of polyimides of the present utility model height and covers film strength, effectively can prevent the generation of warpage.
accompanying drawing illustrates:
Fig. 1: a kind of polyimides height heat radiation covered film structure schematic diagram in the utility model.
embodiment:
Below in conjunction with the drawings and specific embodiments, the utility model is described further.
Embodiment 1
As shown in Figure 1, the polyimides height heat radiation coverlay 1 of the present embodiment, comprise the first Thermocurable polyimide film 2 stacked gradually, first enhancement layer 3, high heat dissipation film 4, second enhancement layer 5 and the second Thermocurable polyimide film 6, what the first Thermocurable polyimide film 2 was covered on flexible printed circuit board has on the surface of Copper Foil, thickness is 50 microns, second Thermocurable polyimide film 6 is positioned at top layer and its outer surface is frosting, thickness is 50 microns, first enhancement layer 3 and the second enhancement layer 5 are long fiber reinforcement layer, thickness is 100 microns, this long fibre adopts line density to be 500dtex, diameter is the long carbon fiber of 100 microns, and the long fibre in the first enhancement layer 3 and the second enhancement layer 5 is one direction arrangement, the direction of its arrangement is mutually vertical, high heat dissipation film 4 is made up of three floor heights heat radiation Graphenes, thickness is 10 microns.
Embodiment 2
As shown in Figure 1, the polyimides height heat radiation coverlay 1 of the present embodiment, comprise the first Thermocurable polyimide film 2 stacked gradually, first enhancement layer 3, high heat dissipation film 4, second enhancement layer 5 and the second Thermocurable polyimide film 6, what the first Thermocurable polyimide film 2 was covered on flexible printed circuit board has on the surface of Copper Foil, thickness is 100 microns, second Thermocurable polyimide film 6 is positioned at top layer and its outer surface is frosting, thickness is 100 microns, first enhancement layer 3 and the second enhancement layer 5 are long fiber reinforcement layer, thickness is 200 microns, this long fibre adopts line density to be 1000dtex, diameter is the long glass fiber of 200 microns, and the long fibre in the first enhancement layer 3 and the second enhancement layer 5 is one direction arrangement, the direction of its arrangement is mutually vertical, high heat dissipation film 4 is carbon nanotube layer by intermediate layer, two sides is that the trilamellar membrane of Graphene is formed, thickness is 20 microns.
Below only the utility model and execution mode thereof are described; this description is not restricted; shown in accompanying drawing is also one of execution mode of the present utility model; actual structure is not limited thereto; if those skilled in the art enlighten by it; when not departing from the utility model and creating aim, design the structure similar to this technical scheme and execution mode thereof without creationary, all should work as and belong to protection range of the present utility model.
Claims (7)
1. a polyimides height heat radiation coverlay, it is characterized in that, described polyimides height heat radiation coverlay (1) comprises the first Thermocurable polyimide film (2) stacked gradually, first enhancement layer (3), high heat dissipation film (4), second enhancement layer (5) and the second Thermocurable polyimide film (6), what described first Thermocurable polyimide film (2) was covered on flexible printed circuit board has on the surface of Copper Foil, described second Thermocurable polyimide film (6) is positioned at top layer and its outer surface is frosting, described first enhancement layer (3) and the second enhancement layer (5) are long fiber reinforcement layer.
2. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, described high heat dissipation film (4) is three layers, and three layers are formed by height heat radiation Graphene.
3. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, described high heat dissipation film (4) is three layers, and intermediate layer is made up of carbon nano-tube, and two layers of surface layer is made up of height heat radiation Graphene.
4. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, described long fibre is glass fibre, quartz fibre, ceramic fibre, boron fibre or carbon fiber.
5. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, long fibre in described first enhancement layer (3) and the second enhancement layer (5) is one direction arrangement, and described first enhancement layer (3) is mutually vertical with the orientation of the second enhancement layer (5) medium-length fibre.
6. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, described long stapled line density is 500-1000dtex, and diameter is 100-200 micron.
7. polyimides height heat radiation coverlay as claimed in claim 1, it is characterized in that, the thickness of described first Thermocurable polyimide film (2) and the second Thermocurable polyimide film (6) is 50-100 micron, the thickness of described first enhancement layer (3) and the second enhancement layer (5) is 100-200 micron, and the thickness of described high heat dissipation film (4) is 10-20 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520957725.XU CN205179499U (en) | 2015-11-26 | 2015-11-26 | Polyimide is high, and heat dissipation covers membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520957725.XU CN205179499U (en) | 2015-11-26 | 2015-11-26 | Polyimide is high, and heat dissipation covers membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205179499U true CN205179499U (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520957725.XU Expired - Fee Related CN205179499U (en) | 2015-11-26 | 2015-11-26 | Polyimide is high, and heat dissipation covers membrane |
Country Status (1)
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| CN (1) | CN205179499U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028746A (en) * | 2016-06-21 | 2016-10-12 | 太仓鸿鑫精密压铸有限公司 | Combined cooling fin for computer |
| CN107743339A (en) * | 2017-10-25 | 2018-02-27 | 维沃移动通信有限公司 | A kind of flexible PCB and its manufacture method |
-
2015
- 2015-11-26 CN CN201520957725.XU patent/CN205179499U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028746A (en) * | 2016-06-21 | 2016-10-12 | 太仓鸿鑫精密压铸有限公司 | Combined cooling fin for computer |
| CN107743339A (en) * | 2017-10-25 | 2018-02-27 | 维沃移动通信有限公司 | A kind of flexible PCB and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20191126 |