CN204925022U - Novel flat four -wire type oxygen sensor chip - Google Patents
Novel flat four -wire type oxygen sensor chip Download PDFInfo
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- CN204925022U CN204925022U CN201520272793.2U CN201520272793U CN204925022U CN 204925022 U CN204925022 U CN 204925022U CN 201520272793 U CN201520272793 U CN 201520272793U CN 204925022 U CN204925022 U CN 204925022U
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Abstract
The utility model relates to a chip the structure, concretely relates to novel flat four -wire type oxygen sensor chip. Adopt five linear structures among the prior art in order to overcome, manufacturing cost is high, shortcoming that production efficiency is low, the utility model provides a novel flat four -wire type oxygen sensor chip is including porous protective layer, outer electrode, oxygen pump base member, inner electrode, conductor diffusion barrier, platinum electrode, base member layer, reference electrode, reference gas channel layer on, insulating layer, heating electrode, time insulating layer, heater base member. The beneficial effects of the utility model are that five linear structures through with traditional make four linear structures into, have reduced the process process of oxygen sensor production, have reduced manufacturing cost, through being connected outer electrode and signal line pin II, reduced by the 5th piece -root grafting line, through the length that has reduced the inner electrode for required platinum reduces with the whole chip structure of messenger is compacter, the manufacturing is more convenient.
Description
Technical field
The utility model relates to a kind of chip structure, is specifically related to a kind of novel flat four-wire type oxygen sensor chip.
Background technology
In recent years, along with the significantly increase of motor vehicles in use amount, the automobile exhaust pollution problem not reaching emission standard is relatively serious, and the appearance of automobile oxygen sensor well solves the relatively serious problem of automobile exhaust pollution, significantly reduces the harm of car exhaust gas to air.
Lambda sensor utilizes the oxygen voltage in Ceramic sensible devices measured automobiles gas exhaust duct, corresponding oxygen concentration is calculated by chemical equilibrium theory, reach monitor and forecast air-fuel ratio (ratio of the quality in combination gas between air and fuel), to ensure product quality and exhaust emissions measuring sensor up to standard.Oxygen sensor in use for car principle of work is similar to dry cell, and the zirconia element in sensor plays similar electrolytic solution.Its basic functional principle is: under certain condition, utilizes the difference in oxygen concentration of both sides inside and outside zirconia, and produce potential difference (PD), and concentration difference is larger, potential difference (PD) is larger.In air, the content of oxygen is 21%, and the waste gas after rich mixture burning is in fact oxygen-free, contains more oxygen in the waste gas generated or the waste gas because of scarce fire generation after lean combustion, but still than the oxygen much less in air.Under the catalysis of high temperature and platinum, electronegative oxonium ion is adsorbed on the surfaces externally and internally of zirconia sleeve pipe.Because the oxygen in air is more than the oxygen in waste gas, more negative ion is adsorbed than waste gas side in side that sleeve pipe communicates with air, and the concentration difference of both sides ion produces electromotive force.Lambda sensor is formed by combining by chip and protective casing, wherein measures the electric signal that obtains and is connected with exterior strands by four of chip afterbody or five pins, is transmitted out to enter next processing controls link.
Flat wide region type lambda sensor of the prior art is all five linear structures, as shown in Figure 1, namely needs five external cablings.In modern industry, use flat wide region type lambda sensor then to have advantage to the air-fuel ration control for whole dense burning and lean burn scope, this kind of lambda sensor make use of oxygen concentration cell principle and electrochemistry oxygen pump principle simultaneously.As depicted in figs. 1 and 2, it is made up of 2 batteries: pump battery and sensing battery, as shown in Figure 2, the principle of this lambda sensor is that tail gas enters into chip internal by the sulculus of pump battery, when mixture strength is low, λ (λ is the ratio of actual mixing ratio and chemically correct fuel) is greater than 1, and oxygen just pumps by pump battery from combination gas; When mixture strength height (when λ is less than 1), oxygen just pumps into from outward in test chamber by changing pump sense of current by pump battery; Equal 1 place at λ, do not have oxygen to need to pump or pump into.Just can be controlled the combination gas in test chamber like this by control pump electric current, make the air-fuel ratio that the concentration of combination gas reaches desirable.Because pump electric current becomes certain proportionate relationship with the concentration of oxygen, so the rare or dense of combination gas just can be known by testing pump electric current.In wide-range lambda sensor, add special control circuit to obtain pump electric current, using pump electric current as the parameter detecting waste gas air excess factor.
In existing conventional art, flat wide region type lambda sensor is all the structure of the outer pin of employing five line, pick out due to five lines must be had, whole lambda sensor needs when chip is connected with exterior strands to pick out five lines and five string holes, the manufacturing procedure process of producing, production cost is high and production efficiency is low.
Utility model content
(1) technical matters that will solve
The utility model adopts five linear structures to overcome in prior art, and the manufacturing procedure process of producing, production cost is high, the shortcoming that production efficiency is low, and the technical problems to be solved in the utility model is to provide a kind of novel flat four-wire type oxygen sensor chip.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides so a kind of novel flat four-wire type oxygen sensor chip, includes porous protective layer, external electrode, oxygen pump matrix, interior electrode, conductor diffusion barrier, platinum electrode, base layer, reference electrode, reference gas channel layer, upper insulation course, heating electrode, lower insulation course, heater substrate, heater wire pin I, heater wire pin, heater wire II, heater wire I, signal wire I, signal wire II, signal wire pin I and signal wire pin II;
Oxygen pump matrix above and below is respectively arranged with external electrode and interior electrode, the top of external electrode one end is provided with porous protective layer, the other end is connected with signal wire pin II, interior electrode issues and is provided with conductor diffusion barrier, platinum electrode is provided with below conductor diffusion barrier, base layer is provided with below platinum electrode, reference electrode is provided with below base layer, reference electrode one end is connected with signal wire pin I by signal wire I, and signal wire I is through that the string holes be arranged on oxygen pump matrix is connected with signal wire pin I; Reference gas channel layer is arranged on the below of reference electrode, reference gas passage is provided with in the middle of reference gas channel layer, reference gas passage is the square structure of break-through whole reference gas channel layer, is respectively arranged with insulation course, heating electrode, lower insulation course and heater substrate below reference gas channel layer.Heating electrode is surrounded by the cube structure that upper insulation course and lower insulation course are formed, heating electrode one end is provided with two terminals, and two terminals are connected with the heater wire pin I be arranged on below heater substrate and heater wire pin II respectively by heater wire I and heater wire II;
Air hole is provided with in the middle of porous protective layer; oxygen pump matrix immediately below air hole is also provided with the air hole of formed objects; conductor diffusion barrier is also middle is also provided with air hole, and the air hole when mounted on conductor diffusion barrier communicates with the air hole on oxygen pump matrix.
Preferably, described oxygen pump matrix, base layer, reference gas channel layer and heater substrate are all zirconia ceramics material.
Preferably, described external electrode, interior electrode, platinum electrode and reference electrode material are all platinum.
Preferably, described air hole diameter is 0.5-1mm.
(3) beneficial effect
The beneficial effect that the utility model has is: (1), by making five traditional linear structures into four-wire type structure, significantly decreases the process that lambda sensor is produced, reduces production cost; (2) by external electrode is connected with signal wire pin II, decrease the 5th wiring, decrease a ground wire pin; (3) by decreasing the length of interior electrode, make required platinum reduce and make whole chip structure compacter, manufacture more convenient.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional prior art.
Fig. 2 is the detonation configuration schematic diagram of traditional prior art.
Fig. 3 detonation configuration schematic diagram of the present utility model.
Being labeled as in accompanying drawing: 1-porous protective layer, 2-external electrode, 3-oxygen pump matrix; electrode in 4-, 5-conductor diffusion barrier, 6-platinum electrode; 7-base layer, 8-reference electrode, 9-reference gas channel layer; the upper insulation course of 10-, 11-heating electrode, insulation course under 12-; 13-heater substrate; 14-heater wire pin I, 15-heater wire pin II, 16-heater wire II; 17-heater wire I; 18-reference gas passage, 19-signal wire I, 20-signal wire II; 21-string holes; 22-signal wire pin I, 23-signal wire pin II, 24-ground wire pin.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
embodiment 1
A kind of novel flat four-wire type oxygen sensor chip, as shown in Figure 3, porous protective layer 1, external electrode 2, oxygen pump matrix 3, interior electrode 4, conductor diffusion barrier 5, platinum electrode 6, base layer 7, reference electrode 8, reference gas channel layer 9, upper insulation course 10, heating electrode 11, lower insulation course 12, heater substrate 13, heater wire pin I 14, heater wire pin, heater wire II 16, heater wire I 17, signal wire I 19, signal wire II 20, signal wire pin I 22 and signal wire pin II 23 is included;
Oxygen pump matrix 3 above and below is respectively arranged with external electrode 2 and interior electrode 4, the top of external electrode 2 one end is provided with porous protective layer 1, the other end is connected with signal wire pin II 23, interior electrode 4 issues and is provided with conductor diffusion barrier 5, platinum electrode 6 is provided with below conductor diffusion barrier 5, base layer 7 is provided with below platinum electrode 6, reference electrode 8 is provided with below base layer 7, reference electrode 8 one end is connected with signal wire pin I 22 by signal wire I 19, and signal wire I 19 is through that the string holes 21 be arranged on oxygen pump matrix 3 is connected with signal wire pin I 22; Reference gas channel layer 9 is arranged on the below of reference electrode 8, reference gas passage 18 is provided with in the middle of reference gas channel layer 9, reference gas passage 18 is the square structure of break-through whole reference gas channel layer 9, is respectively arranged with insulation course 10, heating electrode 11, lower insulation course 12 and heater substrate 13 below reference gas channel layer 9.Heating electrode 11 is surrounded by the cube structure that upper insulation course 10 and lower insulation course 12 are formed, heating electrode 11 one end is provided with two terminals, and two terminals are connected with the heater wire pin I 14 be arranged on below heater substrate 13 and heater wire pin II 15 with heater wire II 16 respectively by heater wire I 17;
Air hole is provided with in the middle of porous protective layer 1; oxygen pump matrix 3 immediately below air hole is also provided with the air hole of formed objects; conductor diffusion barrier 5 is also middle is also provided with air hole, and the air hole when mounted on conductor diffusion barrier 5 communicates with the air hole on oxygen pump matrix 3.
Embodiment 2
A kind of novel flat four-wire type oxygen sensor chip, as shown in Figure 3, porous protective layer 1, external electrode 2, oxygen pump matrix 3, interior electrode 4, conductor diffusion barrier 5, platinum electrode 6, base layer 7, reference electrode 8, reference gas channel layer 9, upper insulation course 10, heating electrode 11, lower insulation course 12, heater substrate 13, heater wire pin I 14, heater wire pin, heater wire II 16, heater wire I 17, signal wire I 19, signal wire II 20, signal wire pin I 22 and signal wire pin II 23 is included;
Oxygen pump matrix 3 above and below is respectively arranged with external electrode 2 and interior electrode 4, the top of external electrode 2 one end is provided with porous protective layer 1, the other end is connected with signal wire pin II 23, interior electrode 4 issues and is provided with conductor diffusion barrier 5, platinum electrode 6 is provided with below conductor diffusion barrier 5, base layer 7 is provided with below platinum electrode 6, reference electrode 8 is provided with below base layer 7, reference electrode 8 one end is connected with signal wire pin I 22 by signal wire I 19, and signal wire I 19 is through that the string holes 21 be arranged on oxygen pump matrix 3 is connected with signal wire pin I 22; Reference gas channel layer 9 is arranged on the below of reference electrode 8, reference gas passage 18 is provided with in the middle of reference gas channel layer 9, reference gas passage 18 is the square structure of break-through whole reference gas channel layer 9, is respectively arranged with insulation course 10, heating electrode 11, lower insulation course 12 and heater substrate 13 below reference gas channel layer 9.Heating electrode 11 is surrounded by the cube structure that upper insulation course 10 and lower insulation course 12 are formed, heating electrode 11 one end is provided with two terminals, and two terminals are connected with the heater wire pin I 14 be arranged on below heater substrate 13 and heater wire pin II 15 with heater wire II 16 respectively by heater wire I 17;
Air hole is provided with in the middle of porous protective layer 1; oxygen pump matrix 3 immediately below air hole is also provided with the air hole of formed objects; conductor diffusion barrier 5 is also middle is also provided with air hole, and the air hole when mounted on conductor diffusion barrier 5 communicates with the air hole on oxygen pump matrix 3.
Described oxygen pump matrix 3, base layer 7, reference gas channel layer 9 and heater substrate 13 are all zirconia ceramics material.
Described external electrode 2, interior electrode 4, platinum electrode 6 and reference electrode 8 material are all platinum.
Embodiment 3
A kind of novel flat four-wire type oxygen sensor chip, as shown in Figure 3, porous protective layer 1, external electrode 2, oxygen pump matrix 3, interior electrode 4, conductor diffusion barrier 5, platinum electrode 6, base layer 7, reference electrode 8, reference gas channel layer 9, upper insulation course 10, heating electrode 11, lower insulation course 12, heater substrate 13, heater wire pin I 14, heater wire pin, heater wire II 16, heater wire I 17, signal wire I 19, signal wire II 20, signal wire pin I 22 and signal wire pin II 23 is included;
Oxygen pump matrix 3 above and below is respectively arranged with external electrode 2 and interior electrode 4, the top of external electrode 2 one end is provided with porous protective layer 1, the other end is connected with signal wire pin II 23, interior electrode 4 issues and is provided with conductor diffusion barrier 5, platinum electrode 6 is provided with below conductor diffusion barrier 5, base layer 7 is provided with below platinum electrode 6, reference electrode 8 is provided with below base layer 7, reference electrode 8 one end is connected with signal wire pin I 22 by signal wire I 19, and signal wire I 19 is through that the string holes 21 be arranged on oxygen pump matrix 3 is connected with signal wire pin I 22; Reference gas channel layer 9 is arranged on the below of reference electrode 8, reference gas passage 18 is provided with in the middle of reference gas channel layer 9, reference gas passage 18 is the square structure of break-through whole reference gas channel layer 9, is respectively arranged with insulation course 10, heating electrode 11, lower insulation course 12 and heater substrate 13 below reference gas channel layer 9.Heating electrode 11 is surrounded by the cube structure that upper insulation course 10 and lower insulation course 12 are formed, heating electrode 11 one end is provided with two terminals, and two terminals are connected with the heater wire pin I 14 be arranged on below heater substrate 13 and heater wire pin II 15 with heater wire II 16 respectively by heater wire I 17;
Air hole is provided with in the middle of porous protective layer 1; oxygen pump matrix 3 immediately below air hole is also provided with the air hole of formed objects; conductor diffusion barrier 5 is also middle is also provided with air hole, and the air hole when mounted on conductor diffusion barrier 5 communicates with the air hole on oxygen pump matrix 3.
Described oxygen pump matrix 3, base layer 7, reference gas channel layer 9 and heater substrate 13 are all zirconia ceramics material.
Described external electrode 2, interior electrode 4, platinum electrode 6 and reference electrode 8 material are all platinum.
Described air hole diameter is 0.8mm.
The beneficial effect that the utility model has is by making five traditional linear structures into four-wire type structure, significantly decreases the process that lambda sensor is produced, reduces production cost; By external electrode 2 is connected with signal wire pin II 23, decreases the 5th wiring, decrease a ground wire pin 24; By decreasing the length of interior electrode 4, make required platinum reduce and make whole chip structure compacter, manufacture more convenient.
The above embodiment only have expressed preferred implementation of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion, improvement and substitute, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (4)
1. a novel flat four-wire type oxygen sensor chip, it is characterized in that, include porous protective layer (1), external electrode (2), oxygen pump matrix (3), interior electrode (4), conductor diffusion barrier (5), platinum electrode (6), base layer (7), reference electrode (8), reference gas channel layer (9), upper insulation course (10), heating electrode (11), lower insulation course (12), heater substrate (13), heater wire pin I (14), heater wire pin, heater wire II (16), heater wire I (17), signal wire I (19), signal wire II (20), signal wire pin I (22) and signal wire pin II (23),
On oxygen pump matrix (3), be respectively arranged with external electrode (2) and interior electrode (4) below, the top of external electrode (2) one end is provided with porous protective layer (1), the other end is connected with signal wire pin II (23), interior electrode (4) issues and is provided with conductor diffusion barrier (5), conductor diffusion barrier (5) below is provided with platinum electrode (6), platinum electrode (6) below is provided with base layer (7), base layer (7) below is provided with reference electrode (8), reference electrode (8) one end is connected with signal wire pin I (22) by signal wire I (19), signal wire I (19) is through that the string holes (21) be arranged on oxygen pump matrix (3) is connected with signal wire pin I (22), reference gas channel layer (9) is arranged on the below of reference electrode (8), reference gas passage (18) is provided with in the middle of reference gas channel layer (9), reference gas passage (18) is the square structure of break-through whole reference gas channel layer (9), and reference gas channel layer (9) below is respectively arranged with insulation course (10), heating electrode (11), lower insulation course (12) and heater substrate (13), heating electrode (11) is surrounded by the cube structure that upper insulation course (10) and lower insulation course (12) are formed, heating electrode (11) one end is provided with two terminals, and two terminals are connected with the heater wire pin I (14) and heater wire pin II (15) being arranged on heater substrate (13) below with heater wire II (16) respectively by heater wire I (17),
Air hole is provided with in the middle of porous protective layer (1); oxygen pump matrix (3) immediately below air hole is also provided with the air hole of formed objects; conductor diffusion barrier (5) is also middle is also provided with air hole, and the air hole when mounted on conductor diffusion barrier (5) communicates with the air hole on oxygen pump matrix (3).
2. a kind of novel flat four-wire type oxygen sensor chip according to claim 1, is characterized in that, described oxygen pump matrix (3), base layer (7), reference gas channel layer (9) and heater substrate (13) are all zirconia ceramics material.
3. a kind of novel flat four-wire type oxygen sensor chip according to claim 1, is characterized in that, described external electrode (2), interior electrode (4), platinum electrode (6) and reference electrode (8) material are all platinum.
4. a kind of novel flat four-wire type oxygen sensor chip according to claim 1, it is characterized in that, described air hole diameter is 0.5-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520272793.2U CN204925022U (en) | 2015-04-30 | 2015-04-30 | Novel flat four -wire type oxygen sensor chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520272793.2U CN204925022U (en) | 2015-04-30 | 2015-04-30 | Novel flat four -wire type oxygen sensor chip |
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| CN204925022U true CN204925022U (en) | 2015-12-30 |
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| CN201520272793.2U Expired - Fee Related CN204925022U (en) | 2015-04-30 | 2015-04-30 | Novel flat four -wire type oxygen sensor chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109870494A (en) * | 2019-03-20 | 2019-06-11 | 深圳安培龙科技股份有限公司 | A kind of household limit-current type oxygen sensor and preparation method thereof |
| CN112198205A (en) * | 2020-09-16 | 2021-01-08 | 苏州禾苏传感器科技有限公司 | Oxygen sensor chip with short response time |
-
2015
- 2015-04-30 CN CN201520272793.2U patent/CN204925022U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109870494A (en) * | 2019-03-20 | 2019-06-11 | 深圳安培龙科技股份有限公司 | A kind of household limit-current type oxygen sensor and preparation method thereof |
| CN112198205A (en) * | 2020-09-16 | 2021-01-08 | 苏州禾苏传感器科技有限公司 | Oxygen sensor chip with short response time |
| CN112198205B (en) * | 2020-09-16 | 2022-11-29 | 浙江新瓷智能科技股份有限公司 | Oxygen sensor chip with short response time |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20170430 |