CN204881578U - Micron order NULL instrument of wafer is exclusively used in - Google Patents
Micron order NULL instrument of wafer is exclusively used in Download PDFInfo
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- CN204881578U CN204881578U CN201520500904.0U CN201520500904U CN204881578U CN 204881578 U CN204881578 U CN 204881578U CN 201520500904 U CN201520500904 U CN 201520500904U CN 204881578 U CN204881578 U CN 204881578U
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Abstract
The utility model provides a micron order NULL instrument of wafer is exclusively used in, including the base, establish at the amesdial of base left end, establish at base right -hand member and amesdial cooperation carrying on measuring micrometer, the micrometer is parallel with the top needle shaft line of amesdial, be equipped with a reference surface that is used for placing the wafer on the base, be equipped with 3 parallel arrangement's recess on the reference surface, a benchmark frame that contacts with the wafer is constituteed to two adjacent recesses, and touch with the benchmark bridge joint measuring wafer bottom surface of. The effectual prior art problem of having solved can reach 0.001mm to the measurement accuracy of wafer, carries out quick effectual stepping to batch thin slice type wafer, measure accurate, work efficiency is high.
Description
Technical field
The utility model relates to wafer survey instrument field, is specifically related to a kind of micron accuracies surveying instrument being exclusively used in wafer.
Background technology
Milscale is also known as micrometer caliper, its measuring accuracy can be accurate to 0.01mm, the measuring accuracy demand of most product can be met, but when wafer profile is measured, general miking precision is inadequate, need to obtain more accurate size, especially when carrying out high-acruracy survey to the wafer of single sheet of thin, the phenomenon that wafer is caught broken easily is there is in general milscale in the process of clamping, thus the phenomenon that generation cannot be measured, improve production cost, strengthen measuring difficulty, when measuring Circular wafer, measure more difficult.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of micron accuracies surveying instrument being exclusively used in wafer, effectively solve prior art problem, 0.001mm can be reached to the measuring accuracy of wafer, stepping is fast and effectively carried out to batch sheet type wafer, measures accurately, work efficiency is high.
For solving above-mentioned existing technical matters, the utility model adopts following scheme: a kind of micron accuracies surveying instrument being exclusively used in wafer, comprise pedestal, be located at the clock gauge of pedestal left end, be located at pedestal right-hand member and coordinate the milscale carrying out measuring with clock gauge, the thimble axis being parallel of described milscale and clock gauge, described pedestal is provided with one for placing the reference field of wafer, described reference field is provided with 3 grooves be arranged in parallel, described two adjacent grooves form one with the benchmark frame of contact wafers, the wafer bottom surface that measure and benchmark bridge joint touch.
As preferably, described pedestal and be equipped with a mount pad between clock gauge and milscale, described mount pad is connected with adopting screw rod between pedestal, when measuring distance is inadequate, only need change the measurement that mount pad just can realize different distance, the mode connected by screw rod, convenient when making replacing.
As preferably, the top of described clock gauge be provided with one with the round platform of contact wafers, when measuring wafer, the contact area of round table surface is larger, more convenient than the measurement of thimble when measuring sheet type wafer, better to the wafer measuring accuracy of circle.
Beneficial effect:
The utility model adopts technique scheme to provide a kind of micron accuracies surveying instrument being exclusively used in wafer, when carrying out linear measure longimetry to sheet type wafer, by the multiple measurement of the good clock gauge of milscale, measuring accuracy can be reached 0.001mm, stepping can also be carried out to the wafer of same batch by this survey instrument, time wafer sort easier, the thimble axis being parallel of milscale and clock gauge, and Energizer is positioned on same axis, when can measure wafer, measuring accuracy is more accurate, when wafer is placed on reference field, by 3 grooves that the mode removing material is processed into, effectively can reduce the contact area of bottom of wafer and reference field, make wafer precision when measuring higher, and wafer is carrying out in the process contacted with reference field, bottom of wafer only with the surface contact of two benchmark framves, while obtaining better measuring accuracy, more convenient laying and extraction wafer, and existing surveying instrument also has some similar milscales and clock gauge to carry out the survey instrument combined, but existing survey instrument is not then owing to having reference field to lean on, be difficult to the accurate measurement sheet type wafer of circle being carried out to diameter, this structure then effectively solves prior art problem and technological deficiency, 0.001mm can be reached to the measuring accuracy of wafer, stepping is fast and effectively carried out to batch sheet type wafer, measure accurately, work efficiency is high.
Accompanying drawing explanation
Fig. 1 is front view of the present utility model;
Fig. 2 is vertical view of the present utility model.
Embodiment
As depicted in figs. 1 and 2, a kind of micron accuracies surveying instrument being exclusively used in wafer, comprise pedestal 5, be located at the clock gauge 1 of pedestal 5 left end, be located at pedestal 5 right-hand member and coordinate the milscale 8 carrying out measuring with clock gauge 1, the thimble axis being parallel of described milscale 8 and clock gauge 1, described pedestal 5 is provided with one for placing the reference field 7 of wafer, described reference field 7 is provided with 3 grooves be arranged in parallel 4, described two adjacent grooves 4 form one with the benchmark frame 6 of contact wafers, the wafer bottom surface that measure contacts with benchmark frame 6; Described pedestal 5 and be equipped with a mount pad 2 between clock gauge 1 and milscale 8, described mount pad 2 adopts screw rod to be connected with between pedestal 5; The top of described clock gauge 1 be provided with one with the round platform 3 of contact wafers.
During real work, the wafer size measured as required chooses suitable pedestal 5, when the length of pedestal 5 is chosen, be divided into 20mm, 45mm, this three class of 70mm, thus reach the full-scale covering of measurement, wafer is placed on the accurate frame 6 of two foundation on reference field 7, adjustment milscale 8, after touching wafer during milscale 8 spiral rotating, clock gauge 1 will correspondingly be walked about, when clock gauge 1 goes to 0 time, see that the reading of milscale 8 is exactly the value measured, when needing the wafer to same batch to carry out stepping process, first check standard component, milscale 8 is fixed, the scale of clock gauge 1 is adjusted to 0, see that the numerical value of clock gauge 1 is inclined 0 and is classified as 0 grade, size polarization 5um is exactly positive 5um, by that analogy, just can realize stepping fast, work efficiency is better, effectively solve prior art problem, 0.001mm can be reached to the measuring accuracy of wafer, stepping is fast and effectively carried out to batch sheet type wafer, measure accurately, work efficiency is high.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Claims (3)
1. one kind is exclusively used in the micron accuracies surveying instrument of wafer, it is characterized in that: comprise pedestal (5), be located at the clock gauge (1) of pedestal (5) left end, be located at pedestal (5) right-hand member and coordinate the milscale (8) carrying out measuring with clock gauge (1), the thimble axis being parallel of described milscale (8) and clock gauge (1), described pedestal (5) is provided with one for placing the reference field (7) of wafer, described reference field (7) is provided with 3 grooves be arranged in parallel (4), the benchmark frame (6) of described two adjacent groove (4) compositions one and contact wafers, the wafer bottom surface measured contacts with benchmark frame (6).
2. a kind of micron accuracies surveying instrument being exclusively used in wafer according to claim 1, it is characterized in that: described pedestal (5) and be equipped with a mount pad (2) between clock gauge (1) and milscale (8), between described mount pad (2) with pedestal (5), adopt screw rod to be connected.
3. a kind of micron accuracies surveying instrument being exclusively used in wafer according to claim 1, is characterized in that: the top of described clock gauge (1) be provided with one with the round platform (3) of contact wafers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520500904.0U CN204881578U (en) | 2015-07-10 | 2015-07-10 | Micron order NULL instrument of wafer is exclusively used in |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520500904.0U CN204881578U (en) | 2015-07-10 | 2015-07-10 | Micron order NULL instrument of wafer is exclusively used in |
Publications (1)
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CN204881578U true CN204881578U (en) | 2015-12-16 |
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CN201520500904.0U Active CN204881578U (en) | 2015-07-10 | 2015-07-10 | Micron order NULL instrument of wafer is exclusively used in |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109994784A (en) * | 2019-02-28 | 2019-07-09 | 天津力神电池股份有限公司 | A polymer battery core rolling needle debugging tool |
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2015
- 2015-07-10 CN CN201520500904.0U patent/CN204881578U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109994784A (en) * | 2019-02-28 | 2019-07-09 | 天津力神电池股份有限公司 | A polymer battery core rolling needle debugging tool |
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