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CN204867826U - UV laser cutting machine - Google Patents

UV laser cutting machine Download PDF

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Publication number
CN204867826U
CN204867826U CN201520577606.1U CN201520577606U CN204867826U CN 204867826 U CN204867826 U CN 204867826U CN 201520577606 U CN201520577606 U CN 201520577606U CN 204867826 U CN204867826 U CN 204867826U
Authority
CN
China
Prior art keywords
laser
laser cutting
slide unit
cutting machine
blowing platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520577606.1U
Other languages
Chinese (zh)
Inventor
刘涛
罗鹭
梁晖
万坤峰
文春平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Ryan Automation Technology Co Ltd
Original Assignee
Suzhou Ryan Automation Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Ryan Automation Technology Co Ltd filed Critical Suzhou Ryan Automation Technology Co Ltd
Priority to CN201520577606.1U priority Critical patent/CN204867826U/en
Application granted granted Critical
Publication of CN204867826U publication Critical patent/CN204867826U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Laser Beam Processing (AREA)

Abstract

The utility model discloses a UV laser cutting machine, put on the shelf, put on the shelf the cutting assembly who surrounds, the display module of locating the outside of putting on the shelf including chassis, chassis top. The utility model discloses a blowing platform is put into in X, the linkage of Y diaxon, work piece, and automatic absorption of vacuum is fixed, adopts the automatic positioning of high accuracy CCD, auto focus, and the figure is complicated again, and also light reply saves time and saves worry, and laser cutting belongs to the non -contact and processes, and during the clipper circuit board, easier protection circuit does not receive the damage, adopt laser life long, maintenance and replacement cost are low.

Description

A kind of UV laser cutting machine
Technical field
This practicality belongs to machinery and laser equipment field, particularly relates to a kind of UV laser cutting machine.
Background technology
The mould that adopts such as current flexible board (FPC), cover layer (CVL), Rigid Flex (RF) and thin multi-layer sheet die-cut more.Product for different size all will make mould, and make mold cycle long, cost is high, the more more difficult manufacture of complicated die of die-cut figure, even needs that many molds are die-cut just can be completed, therefore inefficiency, and die cutting accuracy is lower, trimming is more coarse, even also likely makes circuit impaired.
Utility model content
The purpose of this utility model overcomes the deficiencies in the prior art, provides a kind of UV laser cutting machine without the need to mould.
The technical solution of the utility model is as follows:
A kind of UV laser cutting machine, comprise above underframe, underframe added, by the cutting assembly of added encirclement, the display module being located at added outside, the switch S 1 be describedly addedly provided with out glass door, controlling upward-acting door, the switch S 2 controlling cutting assembly; Described cutting assembly comprises horizontal boom above bottom Y slide unit, the X slide unit that Y slide unit moves back and forth, the blowing platform that X slide unit moves back and forth, blowing platform, is located at the UV laser instrument above horizontal boom, the Z slide unit be connected with horizontal boom free end and the laser cutting head be fixed on Z slide unit; Described laser cutting head receives the laser of UV laser instrument and emits; Described blowing platform surface is provided with some vacuum absorption holes.
Preferably, described laser cutting head comprises galvanometer, field lens; Described galvanometer forms primarily of X-Y optical scanning head, electric drive amplifier and optical emitting eyeglass.
Preferably, described UV laser instrument transmitting terminal is connected with beam expanding lens.
This money of the utility model UV laser cutting machine is mainly applicable to PCB manufacturer for the cutting of flexible board (FPC), cover layer (CVL), Rigid Flex (RF) and thin multi-layer sheet, is also applicable to semicon industry for etch thin film and suit silicon chip etc.; Blowing platform put into by workpiece, and vacuum automatic absorbing is fixed, and employing high accuracy CCD locates automatically, auto-focusing, and figure is complicated again, also easily tackles, and saves time and saves worry, and laser cutting belongs to noncontact processing, and during clipper circuit plate, easier protection circuit is not damaged; Employing laser life-span is long, maintenance and replacement cost low.
Accompanying drawing explanation
Fig. 1 is the outline drawing of the utility model laser cutting machine;
Fig. 2 is the added structural representation of the utility model laser cutting machine;
Fig. 3 is the cutting assembly structural representation of the utility model laser cutting machine.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
See Fig. 1 to Fig. 3, the utility model provides a kind of UV laser cutting machine, comprise above underframe 1, underframe 1 added 2, by added 2 cutting assemblies surrounded 3, the display module 4 being located at added outside, described added 2 switch S 221 being provided with out glass door 20, controlling the switch S 1 of upward-acting door, control cutting assembly; Described cutting assembly 3 comprises horizontal boom 33 above bottom Y slide unit 30, the X slide unit 31 that Y slide unit 30 moves back and forth, the blowing platform 32 that X slide unit 31 moves back and forth, blowing platform 32, is located at the UV laser instrument 34 above horizontal boom 33, the Z slide unit 35 be connected with horizontal boom 33 free end and the laser cutting head 36 be fixed on Z slide unit 35; Described laser cutting head 36 receives the laser of UV laser instrument 34 and emits; Described blowing platform 32 surface is provided with some vacuum absorption holes.
Described laser cutting head 36 comprises galvanometer 360, field lens 361; Described galvanometer 360 forms primarily of X-Y optical scanning head, electric drive amplifier and optical emitting eyeglass.
Described UV laser instrument 34 transmitting terminal is connected with beam expanding lens 37.
See Fig. 3, in the utility model, the Z-direction location of the X of blowing platform 32, the location of Y-direction, laser cutting head 36 all can by realizing with the numerical control of display module 4, set up that high accuracy CCD locates automatically, auto-focusing needing to read the parts place of coordinate position, this kind of location technology is mechanical numerical control field routine techniques, this is not done to repeating further.
Utility model works principle is:
See Fig. 1 to Fig. 3, open on board and open glass door 20, put processed product on blowing platform 32, in display module 4, graphics processing is wanted in input, closes and closes out glass door 20, start automatic processing by switch S 221; The laser of 355nm wavelength launched by UV laser instrument 34, through 8 power beam expansion lens 37, and the diameter of expanded beam, what reduce laser beam sends out scattering angle; The signal that computer controller provides by the drive amplification circuit drives X-Y optical scanning head of galvanometer 360, thus controls the deflection of laser beam at X-Y plane; Field lens 361 is assembled galvanometer 360 light source out further, make the laser facula that emits from field lens 361 more concentrated, the hot spot emitted is irradiated on the workpiece of below, the laser facula that workpiece is subject to high power density irradiates, the localized hyperthermia of more than 10000 DEG C can be produced, make workpiece transient evaporation, the numerical control program that display module 4 imports can control blowing platform 32 and constantly adjust cutting position at X-Y plane, until work piece cut operation completes.
These are only preferred embodiment of the present utility model, be not limited to the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection domain of the present utility model.

Claims (3)

1. a UV laser cutting machine, comprise above underframe, underframe added, by the cutting assembly of added encirclement, the display module being located at added outside, the switch S 1 it is characterized in that, be describedly addedly provided with out glass door, controlling upward-acting door, control the switch S 2 of cutting assembly; Described cutting assembly comprises horizontal boom above bottom Y slide unit, the X slide unit that Y slide unit moves back and forth, the blowing platform that X slide unit moves back and forth, blowing platform, is located at the UV laser instrument above horizontal boom, the Z slide unit be connected with horizontal boom free end and the laser cutting head be fixed on Z slide unit; Described laser cutting head receives the laser of UV laser instrument and emits; Described blowing platform surface is provided with some vacuum absorption holes.
2. UV laser cutting machine according to claim 1, is characterized in that, described laser cutting head comprises galvanometer, field lens; Described galvanometer forms primarily of X-Y optical scanning head, electric drive amplifier and optical emitting eyeglass.
3. UV laser cutting machine according to claim 1, is characterized in that, described UV laser instrument transmitting terminal is connected with beam expanding lens.
CN201520577606.1U 2015-08-04 2015-08-04 UV laser cutting machine Expired - Fee Related CN204867826U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520577606.1U CN204867826U (en) 2015-08-04 2015-08-04 UV laser cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520577606.1U CN204867826U (en) 2015-08-04 2015-08-04 UV laser cutting machine

Publications (1)

Publication Number Publication Date
CN204867826U true CN204867826U (en) 2015-12-16

Family

ID=54812251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520577606.1U Expired - Fee Related CN204867826U (en) 2015-08-04 2015-08-04 UV laser cutting machine

Country Status (1)

Country Link
CN (1) CN204867826U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105856437A (en) * 2016-05-25 2016-08-17 肇庆市宏华电子科技有限公司 High-speed intelligent cutting machine for chip-type electronic components
CN106695135A (en) * 2017-01-11 2017-05-24 温州中壹技术服务有限公司 Automatic laser cutting machine
CN106735933A (en) * 2016-12-27 2017-05-31 天津曼科科技有限公司 A kind of solar energy silicon crystal chip automatic gas cutting machine
CN107124824A (en) * 2017-06-01 2017-09-01 上达电子(深圳)股份有限公司 The production system of flexible PCB
CN107809846A (en) * 2017-10-20 2018-03-16 珠海元盛电子科技股份有限公司 A kind of method for making FPC hollowed-out boards that opened a window using laser
CN110757555A (en) * 2018-07-27 2020-02-07 维嘉数控科技(苏州)有限公司 Control method and device for cutting PCB (printed Circuit Board) by board separator
CN112108780A (en) * 2020-09-02 2020-12-22 锐莱特精密光电技术无锡有限公司 High-precision laser glass cutting machine
CN114850707A (en) * 2022-06-02 2022-08-05 湖南峰博医疗器械科技有限公司 Closed medical cutting system

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105856437A (en) * 2016-05-25 2016-08-17 肇庆市宏华电子科技有限公司 High-speed intelligent cutting machine for chip-type electronic components
CN105856437B (en) * 2016-05-25 2018-05-04 肇庆市宏华电子科技有限公司 A kind of electronic element high-speed intelligent cutting machine
CN106735933A (en) * 2016-12-27 2017-05-31 天津曼科科技有限公司 A kind of solar energy silicon crystal chip automatic gas cutting machine
CN106695135A (en) * 2017-01-11 2017-05-24 温州中壹技术服务有限公司 Automatic laser cutting machine
CN107124824A (en) * 2017-06-01 2017-09-01 上达电子(深圳)股份有限公司 The production system of flexible PCB
CN107809846A (en) * 2017-10-20 2018-03-16 珠海元盛电子科技股份有限公司 A kind of method for making FPC hollowed-out boards that opened a window using laser
CN110757555A (en) * 2018-07-27 2020-02-07 维嘉数控科技(苏州)有限公司 Control method and device for cutting PCB (printed Circuit Board) by board separator
CN110757555B (en) * 2018-07-27 2021-01-12 维嘉数控科技(苏州)有限公司 Control method and device for cutting PCB (printed Circuit Board) by board separator
CN112108780A (en) * 2020-09-02 2020-12-22 锐莱特精密光电技术无锡有限公司 High-precision laser glass cutting machine
CN114850707A (en) * 2022-06-02 2022-08-05 湖南峰博医疗器械科技有限公司 Closed medical cutting system

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151216

Termination date: 20190804

CF01 Termination of patent right due to non-payment of annual fee