CN204516803U - Great power LED low thermal resistance radiator structure - Google Patents
Great power LED low thermal resistance radiator structure Download PDFInfo
- Publication number
- CN204516803U CN204516803U CN201520042487.XU CN201520042487U CN204516803U CN 204516803 U CN204516803 U CN 204516803U CN 201520042487 U CN201520042487 U CN 201520042487U CN 204516803 U CN204516803 U CN 204516803U
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- Prior art keywords
- metal substrate
- radiator
- led
- heat
- die bond
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- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 230000004807 localization Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 230000005619 thermoelectricity Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 silicon lipid Chemical class 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of great power LED low thermal resistance radiator structure and comprise LED chip and radiator, described radiator comprises for installing the heat dissipation metal substrate treating thermal component, described LED chip comprises the die bond metal substrate of carrying LED grain, and described die bond metal substrate and described heat dissipation metal substrate are same substrate; Namely described die bond metal substrate is directly as heat dissipation metal substrate.The utility model simplifies the passage of heat of LED light source, be conducive to the reliability improving LED light source cooling system, reduce the heat radiation thermal resistance of LED light source, when other radiating conditions are identical, adopt the utility model can promote the power density of high-power LED light source and the lifting of light energy output density, if under Same Efficieney density conditions, adopt the utility model that LED light source can be made better to be dispelled the heat, be conducive to the life-span extending LED light source.
Description
Technical field
The utility model relates to a kind of great power LED low thermal resistance radiator structure.
Background technology
In the application of LED, need for LED chip provides good radiating condition, to ensure that LED chip maintains safe temperature range, reduce the failure probability of LED, reduce light decay, extend its useful life.
The heat dissipation technology of LED when high-power applications field or radiating condition limited, seem and be even more important.The best technology of current application is the LED or the integrated LED product that adopt the encapsulation of thermoelectricity separating technology, by making the die bond metal substrate of carrying LED grain and specific radiator close contact, realizes the heat radiation of LED chip.After such as applying heat-conducting silicone grease on the die bond metal substrate of integrated LED, be pressed on radiator, or be pressed on radiator paste heat-conducting glue or heat conduction with phase change pad on the die bond metal substrate of integrated LED after.There is reliability deficiency in above-mentioned radiating mode, the shortcoming that thermal resistance is bigger than normal.To be pressed to the scheme of radiator after apply heat-conducting silicone grease on die bond metal substrate, there is the thermal conductive silicon lipid layer capacity of heat transmission unstable, the problems such as impaction state is unstable.And thermal conductive silicon lipid layer can not keep good heat conductivility for a long time, the method for mechanical compaction also may lose efficacy, and caused cooling system to lose efficacy.
In addition, be no matter heat-conducting silicone grease or heat-conducting glue and heat conduction with phase change pad, thermal resistance is all larger.Be the heat-conducting glue of 2 for conductive coefficient, if installing fixing rear bondline thickness is 0.2 millimeter, for the LED of the power of consumption 150W, metal substrate and the radiator contact area of supposing LED are 16 square centimeters, between the LED metal substrate and radiator on heat-conducting glue two sides, point usually to there is the temperature difference of about 10 degree.In high-power and that power density requirements is higher application scenario, above-mentioned heat sink conception limits the lifting of power density.
Utility model content
The purpose of this utility model is to provide a kind of great power LED low thermal resistance radiator structure, can promote great power LED cooling ability, unit are power density and light energy output density.
Utility model object of the present utility model is realized by following technical measures: a kind of great power LED low thermal resistance radiator structure, comprise LED chip and radiator, described radiator comprises for installing the heat dissipation metal substrate treating thermal component, described LED chip comprises the die bond metal substrate of carrying LED grain, and described die bond metal substrate and described heat dissipation metal substrate are same substrate; Namely described die bond metal substrate is directly as heat dissipation metal substrate.
Described LED grain is mounted on described die bond metal substrate upper surface by crystal-bonding adhesive, and after described LED grain serial or parallel connection, electrode is drawn by the pcb board be mounted on equally on described die bond metal substrate.
The lower surface structure of described metal substrate is suitable with the thermal component shape of described radiator, and is welded and fixed, and increases heat transfer property like this, also convenient welding.
Described radiator can be finned radiator or heat-pipe radiator or liquid cooling heat radiator.
Relative to prior art, the utility model has following beneficial effect: the die bond metal substrate of LED chip and radiator do not adopt mechanical system to compress in prior art by the utility model for another example, do not need to use the heat trnasfer that the heat conduction auxiliary material such as heat-conducting silicone grease promotes between die bond metal substrate and radiator yet, be conducive to the reliability improving LED light source cooling system, LED grain is the equal of directly be arranged on the heat dissipation metal substrate of radiator by the utility model, decrease hot road link, reduce the thermal resistance of LED light source heat radiation, compared to existing various heat sink conception, improve the heat-sinking capability of LED light source, when other radiating conditions (as the die bond metal substrate of LED and the contact area of radiator) are identical, adopt the utility model can promote the power density of high-power LED light source and the lifting of light energy output density, if under Same Efficieney density conditions, adopt the utility model that LED light source can be made better to be dispelled the heat, be conducive to the life-span extending LED light source.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the structural representation of the utility model embodiment three.
Embodiment
embodiment one
Fig. 1 is the structural representation of LED heat-pipe radiator; as shown in the figure; adopt thermoelectricity separating technology; LED grain or die array 12 are mounted on the surface of copper heat-radiating substrate 11 by crystal-bonding adhesive 13 by the copper heat-radiating substrate 11 of heat-pipe radiator; be used for the pcb board 14 of being drawn by the electrode of LED grain in the surface mount of copper heat-radiating substrate 11 simultaneously; the copper heat-radiating substrate 11 of heat-pipe radiator adopts soldering processes or cold-press process to be fixed on the tube wall of heat pipe 15 one end, and the tube wall of heat pipe 15 other end is provided with heat dissipation metal fin 16.
In no particular order, final what realize is the die bond metal substrate making the copper heat-radiating substrate 11 of heat-pipe radiator simultaneously become LED grain die bond for die bond technique involved in above-described embodiment and heat pipe soldering or cold-press process.
embodiment two
Fig. 2 is the structural representation of LED liquid cooling as water-filled radiator.Implement two to be with the difference of embodiment one; radiator in embodiment two is liquid cooling heat radiator; LED grain or die array 12 ' are mounted on the front of the heat dissipation metal substrate 11 ' of liquid cooling heat radiator with pcb board 14 ', and the heat dissipation metal substrate 11 ' back side is the heat dissipation channel 17 ' of liquid communication.
embodiment three
Fig. 3 is the structural representation of LED finned radiator.Embodiment three is with the difference of embodiment one; radiator in embodiment three is finned radiator; LED grain or die array 12 " and pcb board 14 " are mounted on the heat dissipation metal substrate 11 of finned radiator " front, heat dissipation metal substrate 11 " back side is vertically installed with multiple heat dissipation metal fin 16 parallel to each other to each other ".
Utilize the utility model structure, by UCM-700-3, UCM-900-3, the great power LED die bond metal substrate of these three kinds of models of UCM-1200-3 is directly as the heat dissipation metal substrate of radiator, namely LED grain or die array are directly fixed on copper heat-radiating substrate, when the total power dissipation of LED integrated in the surface area of every square centimeter is up to 60W, the temperature of die bond metal substrate near LED grain side maintains less than 70 DEG C all the time, heat dispersion promotes greatly compared to prior art, for improving the reliability of LED light source, the life-span extending LED light source provides improvement project.
The utility model is in specific implementation process, adopt first die bond on substrate, then have employed the process of integral back-flow weldering, the remainder on the die bond metal substrate comprising LED grain array and radiator except heat dissipation metal substrate is welded together, formation LED radiator structure.
Below in conjunction with the production method of LED heat dissipation structure under the introduction of heat pipe heat radiation implement body.
1) obtain the die bond metal substrate of the carrying LED grain adopting the encapsulation of thermoelectricity separating technology, this place adopts copper base, namely in the upper surface carrying LED grain of copper base;
2) select melting temperature lower than 150 degrees Celsius of solders, the present embodiment select melting temperature be 138 degrees Celsius low temperature tin slurry as solder, its melting temperature is lower than the baking temperature 150 degrees Celsius of LED die bond process;
3) protective cover is adopted to cover the pcb board of pressing on LED grain on copper base and copper coin, and by screw, copper base is closely connected with protective cover, protect the pcb board part of pressing on LED grain and copper coin to make it directly not heat by the high-temperature atmosphere of Reflow Soldering, make the heating air flow of each heating period in welding process directly can not blow to LED grain;
4) to carry the heat dissipation metal substrate of copper base as radiator of LED grain, the lower surface of copper base is used for being welded and fixed heat pipe and fin, and copper base lower surface has arc groove, like this with weld heat pipe, fin shape suitable, increase heat transfer property, also convenient welding; The parts such as heat spreader metals heat-radiating substrate, heat pipe and heat dissipation metal fin weld simultaneously, and require in whole welding process, and most high ambient temperature controls below 150 degrees Celsius.
Welding process concrete steps are as follows:
4-1) preheating needs each parts and the localization tool of welding, and make their temperature slowly rise to melting temperature close to solder, warm-up time specifically can set according to the concrete condition of different welding objects.Heating process is divided into two stages, first stage is preheating, also first warm area can be called, object makes welding object various piece all reach close to welding temperature, in this temperature range, workpiece can experience the decay that longer heating time also can not cause aspect of performance, so just to reducing requirement the heating time of warm-up phase, also the sufficient time is had to make workpiece various piece homogeneous temperature in heating process, after preheating, workpiece temperature is close to welding temperature, and the heating for the next stage provides the initial condition of a stable and consistent.Need before preheating, various piece pre-determined bit, to assemble according to assembly relation exactly, first keep in touch between each.Second stage is the heating process being warmed to welding temperature, , also second warm area can be called, due to first stage workpiece heat to relatively welding temperature, and each local homogeneous temperature of workpiece, so this stage can set stricter heating time, workpiece reaches time of welding temperature can be more consistent, avoid temperature time some workpiece carries out welding inadequate, it also avoid the time that some workpiece continue after temperature reaches welding temperature longly just enters temperature-fall period, thus avoid the decay causing device or performance even to damage.Temperature rises to more than the melting temperature of solder by the melting temperature close to solder, be placed in solder fusing on above-mentioned each parts and gravity and solder self surface tension effects current downflow, penetrate into gap between the component contact faces such as heat dissipation metal substrate, heat pipe and heat dissipation metal fin;
4-2) adopt localization tool that each parts are correctly located, wait after completing heating process, solder can flow, then all parts is accurately located, and various piece is combined closely, also can be populated by solder in conjunction with gap place.Localization tool also will continue to keep various piece on tram, lowers the temperature to each parts simultaneously, after solder solidification, removes localization tool, namely completes the welding between each parts of LED radiator.
Execution mode of the present utility model is not limited thereto; according to foregoing of the present utility model; according to ordinary technical knowledge and the customary means of this area; do not departing under the utility model basic fundamental thought prerequisite; to the amendment of other various ways that the utility model said structure is made, replacement or change, all drop within protection range of the present utility model.
Claims (4)
1. a great power LED low thermal resistance radiator structure, comprise LED chip and radiator, described radiator comprises for installing the heat dissipation metal substrate treating thermal component, described LED chip comprises the die bond metal substrate of carrying LED grain, it is characterized in that, described die bond metal substrate and described heat dissipation metal substrate are same substrate; Namely described die bond metal substrate is directly as heat dissipation metal substrate.
2. great power LED low thermal resistance radiator structure according to claim 1, it is characterized in that, described LED grain is mounted on described die bond metal substrate upper surface by crystal-bonding adhesive, described LED grain is connected and/or after parallel connection, electrode is drawn by the pcb board be mounted on equally on described die bond metal substrate.
3. great power LED low thermal resistance radiator structure according to claim 1, is characterized in that, the lower surface structure of described metal substrate is suitable with the thermal component shape of described radiator, and is welded and fixed.
4. the great power LED low thermal resistance radiator structure according to claim 1 or 3, is characterized in that, described radiator is finned radiator or heat-pipe radiator or liquid cooling heat radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520042487.XU CN204516803U (en) | 2015-01-22 | 2015-01-22 | Great power LED low thermal resistance radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520042487.XU CN204516803U (en) | 2015-01-22 | 2015-01-22 | Great power LED low thermal resistance radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204516803U true CN204516803U (en) | 2015-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520042487.XU Expired - Fee Related CN204516803U (en) | 2015-01-22 | 2015-01-22 | Great power LED low thermal resistance radiator structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN204516803U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659199A (en) * | 2015-01-22 | 2015-05-27 | 汪广才 | High-power LED low-thermal-resistance heat dissipation method and LED heat dissipation structure and production method thereof |
| CN110289473A (en) * | 2019-06-24 | 2019-09-27 | 西安电子工程研究所 | A kind of long active heating integrated device of array antenna structure-of compact lightweight type fibre |
-
2015
- 2015-01-22 CN CN201520042487.XU patent/CN204516803U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659199A (en) * | 2015-01-22 | 2015-05-27 | 汪广才 | High-power LED low-thermal-resistance heat dissipation method and LED heat dissipation structure and production method thereof |
| CN110289473A (en) * | 2019-06-24 | 2019-09-27 | 西安电子工程研究所 | A kind of long active heating integrated device of array antenna structure-of compact lightweight type fibre |
| CN110289473B (en) * | 2019-06-24 | 2020-11-17 | 西安电子工程研究所 | Active array antenna structure-heat integrated device and iterative design method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171027 Address after: 518000 building 3, building B1, Hang Kong Industrial District, Pinghu street, Longgang District, Shenzhen, Guangdong Patentee after: Shenzhen post Technology Co., Ltd. Address before: Zengcha Road, Baiyun District of Guangzhou City, Guangdong province 510165 No. 18 Xihua garden building 826 room Patentee before: Wang Guangcai |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20170122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |