CN204289443U - Disjunctor full-color light-emitting diode and LED show module - Google Patents
Disjunctor full-color light-emitting diode and LED show module Download PDFInfo
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- CN204289443U CN204289443U CN201420843585.9U CN201420843585U CN204289443U CN 204289443 U CN204289443 U CN 204289443U CN 201420843585 U CN201420843585 U CN 201420843585U CN 204289443 U CN204289443 U CN 204289443U
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims 1
- 238000004020 luminiscence type Methods 0.000 description 19
- 238000005452 bending Methods 0.000 description 7
- 239000003086 colorant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
本实用新型适用于发光二极管领域，提供了一种连体全彩发光二极管，包括封装壳体和呈一列封装于封装壳体中的至少两个全彩发光单元；各全彩发光单元包括多个发光芯片和分别与各发光芯片电性相连的多个金属支架，各金属支架的具有引伸并折弯至封装壳体的背面的引脚端；多个发光芯片包括蓝光LED芯片、绿光LED芯片和红光LED芯片，多个金属支架包括共极引脚架、蓝光引脚架、绿光引脚架和红光引脚架，蓝光LED芯片、红光LED芯片及绿光LED芯片均与共极引脚架电性相连。通过将两个全彩发光单元封装于一个封装壳体中，从而提高该封装壳体中全彩LED的密度，进而提高形成的LED显示模组的全彩LED密度。
The utility model is applicable to the field of light-emitting diodes, and provides a conjoined full-color light-emitting diode, which comprises a package casing and at least two full-color light-emitting units packaged in a row in the package casing; each full-color light-emitting unit includes a plurality of Light-emitting chips and a plurality of metal supports electrically connected to each light-emitting chip, each metal support has a pin end that is extended and bent to the back of the package housing; the plurality of light-emitting chips include blue LED chips, green LED chips and red LED chip, a plurality of metal brackets including common pole lead frame, blue light lead frame, green light lead frame and red light lead frame, blue LED chip, red light LED chip and green light LED chip are all connected to common pole The lead frames are electrically connected. By encapsulating two full-color light-emitting units in one encapsulation shell, the density of the full-color LEDs in the encapsulation shell is increased, thereby increasing the density of the full-color LEDs of the formed LED display module.
Description
Technical field
The utility model belongs to light-emitting diode field, particularly relates to a kind of disjunctor full-color light-emitting diode and uses the LED of this disjunctor full-color light-emitting diode to show module.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor device, and it directly can be converted into light electricity.It changes the principle of the luminescence of incandescent lamp tungsten filament and the luminescence of electricity-saving lamp tricolor powder, and adopts electroluminescence.Clearly, the life-span is long, light efficiency is high, radiationless and low-power consumption for the feature of LED.
The spectrum of LED almost all concentrates on visible light frequency band .LED light source and can utilize the red, green, blue principle of three primary colours, under computer technology controls, three kinds of colors are made to have 256 grades of gray scales and mixing arbitrarily, 256 × 256 × 256=16777216 kind color can be produced, form different photochromic combination changeful, realize colourful dynamic change effect and various image.
Along with the development of LED technology, LED display is applied in the multiple occasions such as indoor and outdoor more and more.LED display generally shows module by some LED and is spliced.Refer to Fig. 1 and Fig. 2, each LED display module is then welded on circuit board 92 by multiple SMD all-colour LED 91 and is formed.And along with the raising people of quality of the life are to the definition of display screen, the density of pixel, imaging effect all proposes higher requirement.This also just requires that the density of the all-colour LED 91 of LED display module is higher.And prior art is generally produce full-color light-emitting diode lamp pearl one by one, more each lamp bead weld is connected on circuit board 92.And when welding, gap between each full-color light-emitting diode lamp pearl, can be there is, this just causes LED to show the density refractory of the all-colour LED of module to improve.
Utility model content
The purpose of this utility model is to provide a kind of disjunctor full-color light-emitting diode, is intended to solve the problem that the all-colour LED density of existing LED display module is lower.
The utility model is achieved in that a kind of disjunctor full-color light-emitting diode, comprises encapsulating housing and is packaged at least two full-color light-emitting unit in described encapsulating housing in row; Multiple metallic supports that each described full-color light-emitting unit comprises the multiple luminescence chip for sending RGB tri-coloured light and is electrical connected with each described luminescence chip respectively, the having of each described metallic support extend and bending to the leads ends at the back side of described encapsulating housing; Multiple described luminescence chip comprises blue-light LED chip, green LED chip and red LED chip, the blue light pin frame that multiple described metallic support comprises copolar pin frame, be electrical connected with described blue-light LED chip, the green glow pin frame be electrical connected with described green LED chip and the ruddiness pin frame be electrical connected with described red LED chip, described blue-light LED chip, described red LED chip and described green LED chip are all electrical connected with described copolar pin frame.
Further, described encapsulating housing comprises the supporting seat supporting each described metallic support and the Lamp cup be fixed on by each described metallic support on described supporting seat, the position described Lamp cup corresponding to each described full-color light-emitting unit offers the cavity exposing described full-color light-emitting unit, is filled with packaging plastic in each described cavity.
Further, the position side of described supporting seat corresponding to each described metallic support offers the groove of accommodating corresponding described metallic support.
Further, described encapsulating housing comprises the first limit and Second Edge that lay respectively at these encapsulating housing length direction both sides; The leads ends of the described blue light pin frame of each described full-color light-emitting unit and the leads ends of described green glow pin frame by described first Edge Bend to the back side of described encapsulating housing; The leads ends of the described ruddiness pin frame of each described full-color light-emitting unit and the leads ends of described copolar pin frame by described Second Edge bending to the back side of described encapsulating housing.
Further, the described red LED chip of each described full-color light-emitting unit, described blue-light LED chip and described green LED chip are that in-line distribution is arranged.
Further, the described red LED chip of each described full-color light-emitting unit, described blue-light LED chip and described green LED chip are all fixed on described ruddiness pin frame.
Further, described ruddiness pin frame is L-shaped, and one end is the leads ends of this ruddiness pin frame, and its other end extends to the medium position of the subregion on the corresponding described encapsulating housing of corresponding described full-color light-emitting unit.
Further, described blue light pin frame lays respectively at the relative both sides of the other end of described ruddiness pin frame with described copolar pin frame; Described blue light pin frame and described green glow pin frame are positioned at the side of described ruddiness pin frame away from its leads ends.
Further, the some wires being electrically connected each described luminescence chip and corresponding described metallic support respectively are also comprised.
The utility model passes through multiple full-color light-emitting unit package in an encapsulating housing, thus improve the density of all-colour LED in this encapsulating housing, and then when the welding of this disjunctor full-color light-emitting diode forms LED display module on circuit boards, the LED that can improve formation shows the all-colour LED density of module.
Another object of the present utility model is to provide a kind of LED to show module, comprises circuit board and is installed on the disjunctor full-color light-emitting diode some as above on described circuit board.
LED of the present utility model shows module and employs above-mentioned disjunctor full-color light-emitting diode, thus makes the all-colour LED density of this LED display module higher, and pixel is higher, and definition is better.
Accompanying drawing explanation
Fig. 1 be the full-color light-emitting diode lamp pearl that provides of prior art face structural representation;
Fig. 2 is the structure for amplifying schematic diagram of the subregion of the LED display module that prior art provides.
Fig. 3 be the disjunctor full-color light-emitting diode that provides of the utility model embodiment face structural representation;
Fig. 4 is the right TV structure schematic diagram of the disjunctor full-color light-emitting diode of Fig. 3;
Fig. 5 be the disjunctor full-color light-emitting diode of Fig. 3 look up structural representation;
Fig. 6 is the backsight structural representation of the disjunctor full-color light-emitting diode of Fig. 3.
Fig. 7 is the structure for amplifying schematic diagram of the subregion of the LED display module that the utility model embodiment provides.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 3, Fig. 4, Fig. 5 and Fig. 6, a kind of disjunctor full-color light-emitting diode 100 that the utility model embodiment provides, comprise encapsulating housing 4 and at least two full-color light-emitting unit 1; At least two full-color light-emitting unit 1 are arranged in row, and at least two full-color light-emitting unit 1 are all encapsulated in encapsulating housing 4.
Each full-color light-emitting unit 1 comprises multiple luminescence chip 10 and multiple metallic support 20; Multiple luminescence chip 10 is respectively used to send RGB (red, green, blue) three coloured light, and multiple metallic support 20 is electrical connected with each luminescence chip 10 respectively, is used for as each luminescence chip 10 common-battery; For convenience of being connected with circuit board, each metallic support 20 have extend and bending to the leads ends 201 at the back side of encapsulating housing 4, by leads ends 201 bending to the back side of encapsulating housing 4, thus form SMD pin.Above-mentioned multiple luminescence chips 10 comprise blue-light LED chip 13, green LED chip 12 and red LED chip 11.Above-mentioned multiple metallic supports 20 comprise copolar pin frame 24, blue light pin frame 22, green glow pin frame 21 and ruddiness pin frame 23; And copolar pin frame 24, blue light pin frame 22, green glow pin frame 21 and ruddiness pin frame 23 all have leads ends 201.Blue light pin frame 22 and blue-light LED chip 13 are electrical connected, green glow pin frame 21 and green LED chip 12 are electrical connected, ruddiness pin frame 23 and red LED chip 11 are electrical connected, and blue-light LED chip 13, red LED chip 11 and green LED chip 12 are all electrical connected with copolar pin frame 24.Blue-light LED chip 13 is used for sending blue light, and green LED chip 12 is used for sending green light, and red LED chip 11 is used for sending red light, thus makes this full-color light-emitting unit 1 can send different colors.Blue light pin frame 22 and copolar pin frame 24 are electrical connected with the two poles of the earth of blue-light LED chip 13 respectively, to power for blue-light LED chip 13; Green glow pin frame 21 and copolar pin frame 24 are electrical connected with the two poles of the earth of green LED chip 12 respectively, to power for green LED chip 12; Ruddiness pin frame 23 and copolar pin frame 24 are electrical connected with the two poles of the earth of red LED chip 11 respectively, to power for red LED chip 11.
By at least two full-color light-emitting unit 1 are packaged in an encapsulating housing 4, thus improve the density of all-colour LED in this encapsulating housing 4, and then when this disjunctor full-color light-emitting diode 100 weld formed on circuit boards LED show module time, the LED that can improve formation shows the all-colour LED density of module.
Refer to Fig. 3, Fig. 4 and Fig. 5, in the present embodiment, each full-color light-emitting unit 1 comprises three luminescence chips 10, and namely blue-light LED chip 13, red LED chip 11 and green LED chip 12 are respectively one.Three luminescence chips 10 in rods arranged in horizontal line, thus reach the video display effect of homogeneous and higher color fidelity.
Further, three luminescence chips 10 are all fixed on ruddiness pin frame 23, namely the red LED chip 11 of each full-color light-emitting unit 1, blue-light LED chip 13 and green LED chip 12 are all fixed on ruddiness pin frame 23, thus can be dispelled the heat to three luminescence chips 10 by ruddiness pin frame 23.
This disjunctor full-color light-emitting diode 100 also comprises the some wires 15 being electrically connected each luminescence chip 10 and corresponding metallic support 20 respectively; Namely blue-light LED chip 13 is electrically connected by wire 15 and blue light pin frame 22, green LED chip 12 is electrically connected by wire 15 and green glow pin frame 21, and blue-light LED chip 13, green LED chip 12 and red LED chip 11 are all be electrical connected respectively by wire 15 and copolar pin frame 24.Connected by wire 15, easy for installation, cost is low.
Encapsulating housing 4 comprises supporting seat 45 and Lamp cup 46, and position Lamp cup 46 corresponding to each full-color light-emitting unit 1 offers cavity 461, to expose corresponding full-color light-emitting unit 1; Be filled with packaging plastic (not shown) in each cavity 461, by packaging plastic, each full-color light-emitting unit 1 carried out encapsulation and be fixed in Lamp cup 46.And supporting seat 45 is used for supporting each metallic support 20, Lamp cup 46 is made on supporting seat 45, and is fixed on supporting seat 45 by each metallic support 20.Preferably, supporting seat 45 and Lamp cup 46 can injection mo(u)ldings.The leads ends 201 of each metallic support 20 then bending to the back side of supporting seat 45.
Further, the position side of supporting seat 45 corresponding to each metallic support 20 offers the groove (not marking in figure) of accommodating respective metal support 20.On the side of supporting seat 45, correspondence offers groove, each metallic support 20 is placed in corresponding groove, the opposite exterior lateral sides face of the subregion of the corresponding metallic support 20 of the side of supporting seat 45 can be made to maintain an equal level mutually with the side of supporting seat 45 and Lamp cup 46, or make the side of Lamp cup 46 stretch out the opposite exterior lateral sides face of the subregion of the corresponding metallic support 20 of side of supporting seat 45.Show the contrast of module to improve LED, encapsulating housing 4 is generally set to black, and namely Lamp cup 46 and supporting seat 45 are generally black; Then often silver-plated etc. on metallic support 20, to improve the conductance of metallic support 20, reduce its resistance.And groove is set, metallic support 20 is placed in corresponding groove, the side of Lamp cup 46 can be made to block the opposite exterior lateral sides of the subregion of metallic support 20 corresponding to supporting seat 45 side, prevent light tone silver-plated on metallic support 20 from exposing, thus improve contrast further.Confirm through experiment, contrast can promote 20%-30%.
Refer to Fig. 3, Fig. 4 and Fig. 6, encapsulating housing 4 comprises the both sides that the first limit 41 and Second Edge 42, first limit 41 and Second Edge 42 lay respectively at this encapsulating housing 4 length direction.
Further, the leads ends 221 of the blue light pin frame 22 of full-color light-emitting unit 1 and the leads ends 211 of green glow pin frame 21 by the first limit 41 bending of encapsulating housing 4 to the back side of this encapsulating housing 4; The leads ends 231 of the ruddiness pin frame 23 of full-color light-emitting unit 1 and the leads ends 241 of copolar pin frame 24 by Second Edge 42 bending of encapsulating housing 4 to the back side of this encapsulating housing 4.Like this leads ends 201 of each metallic support 20 is distributed in the both sides of encapsulating housing 4, facilitates the layout of each metallic support 20, and suitably can increase the area of each metallic support 20, conveniently by metallic support 20, each luminescence chip 10 is dispelled the heat.In addition, the convenient connection with circuit board of the distance between the leads ends 201 that also can increase each metallic support 20.In the present embodiment, this disjunctor full-color light-emitting diode 100 comprises two full-color light-emitting unit, 1, two full-color light-emitting unit 1 and arranges in row.In other embodiments, it is that row arrange full-color light-emitting unit 1 that this disjunctor full-color light-emitting diode 100 can also comprise more, as comprised three, four etc.
Ruddiness pin frame 23 is L-shaped, and form an end of the ruddiness pin frame 23 of L shape as its leads ends 231, the other end then extends to the middle part of the subregion on the encapsulating housing 4 of corresponding full-color light-emitting unit 1 correspondence.When red LED chip 11, blue-light LED chip 13 and green LED chip 12 being fixed on ruddiness pin frame 23 to facilitate, the centre position of the corresponding full-color light-emitting unit 1 in the equal position of these luminescence chips 10.
In the present embodiment, blue light pin frame 22 and copolar pin frame 24 lay respectively at the relative both sides of the other end of ruddiness pin frame 23; Blue light pin frame 22 and green glow pin frame 21 are positioned at the side of ruddiness pin frame 23 away from its leads ends.Conveniently by wire 15, blue-light LED chip 13 can be electrically connected with blue light pin frame 22 and copolar pin frame 24 like this, also facilitate and by wire 15, green LED chip 12 is electrically connected with green glow pin frame 21 and copolar pin frame 24; Reduce the length of wire 15, and then the stop to the light that luminescence chip 10 sends of wire 15 can be reduced, improve light extraction efficiency.In other embodiments, green LED chip 12 and blue-light LED chip 13 can also be flip-chip, by soldering, the two poles of the earth of green LED chip 12 are weldingly connected with green glow pin frame 21 and copolar pin frame 24 respectively, by soldering, the two poles of the earth of blue-light LED chip 13 are weldingly connected with blue light pin frame 22 and copolar pin frame 24 respectively; Improve the bonding strength of green LED chip 12 and blue-light LED chip 13.
Refer to Fig. 3 and Fig. 7, the utility model embodiment also discloses a kind of LED and shows module, the disjunctor full-color light-emitting diode 100 some as above comprising circuit board 200 and be installed on circuit board 200.This LED shows module and employs above-mentioned disjunctor full-color light-emitting diode 100, thus makes the all-colour LED density of this LED display module higher, and pixel is higher, and definition is better.Install more convenient, packaging efficiency is higher simultaneously.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201420843585.9U CN204289443U (en) | 2014-12-25 | 2014-12-25 | Disjunctor full-color light-emitting diode and LED show module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420843585.9U CN204289443U (en) | 2014-12-25 | 2014-12-25 | Disjunctor full-color light-emitting diode and LED show module |
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| CN204289443U true CN204289443U (en) | 2015-04-22 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105042405A (en) * | 2015-05-29 | 2015-11-11 | 深圳市奥拓电子股份有限公司 | LED lamp panel module |
| CN106876375A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated form RGB LED displays |
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
| CN107017329A (en) * | 2017-03-28 | 2017-08-04 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED package supports and its manufacture method |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | Side-emitting programmable control LED with IC |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105042405A (en) * | 2015-05-29 | 2015-11-11 | 深圳市奥拓电子股份有限公司 | LED lamp panel module |
| JP2020502779A (en) * | 2017-03-28 | 2020-01-23 | 山東晶泰星光電科技有限公司Ｓｈａｎｄｏｎｇ Ｐｒｏｓｐｅｒｏｕｓ Ｓｔａｒ Ｏｐｔｏｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | QFN surface mount type RGB-LED package module and method of manufacturing the same |
| CN106876543A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages and its manufacture method |
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