CN204231845U - Heat radiation module and electronic equipment - Google Patents
Heat radiation module and electronic equipment Download PDFInfo
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- CN204231845U CN204231845U CN201420709186.3U CN201420709186U CN204231845U CN 204231845 U CN204231845 U CN 204231845U CN 201420709186 U CN201420709186 U CN 201420709186U CN 204231845 U CN204231845 U CN 204231845U
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- 230000005855 radiation Effects 0.000 title abstract 6
- 239000000428 dust Substances 0.000 claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims description 184
- 238000001816 cooling Methods 0.000 claims description 10
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 abstract description 11
- 230000009467 reduction Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
The utility model provides a kind of heat radiation module and electronic equipment, and relate to electronic device field, the object reached is reduction of dust adsorbance on a heat sink, effectively reduces dust accumulation.The technical scheme of main employing is: heat radiation module comprises heat-transfer device, heat radiation pack and fan.Wherein, one end of heat-transfer device is connected with the electronic component in external electronic device.Heat radiation pack is connected with the other end of heat-transfer device, heat radiation pack has the gas channel that air inlet size is greater than air outlet size, fan is arranged on the side of radiating subassembly, the dust that fan is rotated in the air-flow produced flows into gas channel from air inlet, then flows out to the outside of external electronic device from air outlet.The utility model embodiment is mainly used in the process of electronic equipment dissipating heat.
Description
Technical Field
The utility model relates to an electronic equipment field especially relates to a heat dissipation module and electronic equipment.
Background
Electronic elements inside the electronic equipment generate a large amount of heat in the use process of the electronic equipment, and the electronic elements are burnt out due to too much heat collection inside the electronic equipment, so that the normal work of the electronic equipment is influenced. In order to dissipate heat inside the electronic device, a heat dissipation module is required to be disposed inside the electronic device, and the heat dissipation module includes a fan and at least one heat sink. In order to improve the heat dissipation efficiency of the heat dissipation module, a large number of heat dissipation fins are used, which are densely arranged on one side of the fan in a mutually parallel manner, and generate air flow through the rotation of the fan, and the air flow flows out through the heat dissipation fins to accelerate the heat dissipation. However, since the airflow generated by the rotation of the fan usually carries dust and/or fiber and the like, and the surface of the heat sink is rough, when the airflow passes through the heat sink and flows out, the dust is adsorbed on the heat sink, and a large amount of dust is accumulated on the heat sink for a long time, so that the airflow cannot pass through the heat sink, thereby reducing the heat dissipation function of the heat sink, and the accumulation of the dust can also disable the heat dissipation function of the heat sink, thereby causing the heat dissipation module to be scrapped.
In order to reduce the adsorption amount of dust on the heat sink, the surface of the heat sink is coated with a film, so as to reduce the adsorption capacity of the heat sink to the dust by improving the smoothness of the surface of the heat sink. However, if the time is long, dust with small particles such as dust still accumulates on the heat dissipation fins, and since the number of the heat dissipation fins is large and the heat dissipation fins are arranged in parallel and densely, dust such as large fibers can still be absorbed by the heat dissipation fins, so the effect of reducing dust accumulation in the above manner is poor.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a heat dissipation module and an electronic device having a novel structure, wherein the adsorption amount of dust on the heat dissipation plate is reduced, and the dust is effectively reduced.
The utility model discloses an aim at and solve its technical problem and adopt following technical scheme to realize:
in one aspect, the utility model provides a heat dissipation module, this heat dissipation module includes:
one end of the heat conduction device is connected with an electronic element in external electronic equipment;
the heat dissipation assembly piece is connected with the other end of the heat conduction device; the heat dissipation assembly piece is provided with an airflow channel with the size of an air inlet larger than that of an air outlet;
the fan is arranged on one side of the heat dissipation assembly, so that dust in airflow generated by rotation of the fan can flow into the airflow channel from the air inlet and then flow out of the external electronic equipment from the air outlet.
Optionally, in the heat dissipation module, the heat dissipation fins include a first connection plate, a plurality of first heat dissipation fins, and a plurality of second heat dissipation fins;
the first end face of the first connecting plate is connected with the other end of the heat conducting device;
the plurality of first cooling fins are arranged in parallel on a second end face, opposite to the first end face, of the first connecting plate;
at least one second radiating fin is arranged between every two adjacent first radiating fins, and each second radiating fin is connected with one radiating fin of every two adjacent first radiating fins; wherein,
the second radiating fin and the first radiating fin connected with the second radiating fin form a preset angle, so that the first connecting plate, the first radiating fin and the second radiating fin enclose an airflow channel with the size of the air inlet larger than that of the air outlet.
Optionally, in the heat dissipation module, the second heat dissipation plate is smoothly connected to one heat dissipation plate of every two adjacent first heat dissipation plates.
Optionally, in the heat dissipation module, the preset angle is an acute angle.
Optionally, in the heat dissipation module, the heat dissipation fins include a second connection plate, a plurality of third heat dissipation fins and a plurality of fourth heat dissipation fins, where the size of the fourth heat dissipation fins is smaller than that of the third heat dissipation fins;
the first end face of the second connecting plate is connected with the other end of the heat conducting device;
the plurality of third heat dissipation fins are arranged in parallel on a second end face, opposite to the first end face, of the second connecting plate;
at least one fourth heat dissipation fin is arranged between every two adjacent third heat dissipation fins, the fourth heat dissipation fins are arranged in parallel with the third heat dissipation fins, and one end of each fourth heat dissipation fin is connected with the second end face of the second connecting plate, so that the second connecting plate, the third heat dissipation fins and the fourth heat dissipation fins enclose an airflow channel with the size of the air inlet larger than that of the air outlet.
Optionally, the heat dissipation module includes:
and the grounding device is connected with the heat dissipation assembly piece.
Optionally, in the foregoing heat dissipation module, the grounding device includes:
one end of the electric connection wire is connected with the radiating fin, and the other end of the electric connection wire is connected with a grounding part in the external electronic equipment; or,
and the grounding circuit is connected with the heat dissipation assembly sheet.
Optionally, the heat dissipation module further includes:
the dust storage device is arranged on the side end face of the radiating fins and forms an accommodating space with an opening together with the radiating fins, and the opening corresponds to the airflow outlet of the fan.
Optionally, in the heat dissipation module, a depth of the accommodating space is consistent with a depth of the airflow channel.
In another aspect, the present invention provides an electronic device, including:
the air conditioner comprises a shell, wherein a vent is arranged on the shell;
m electronic components which are fixedly arranged in the shell, wherein M is a positive integer more than or equal to 1;
the heat dissipation module is fixedly arranged in the shell; wherein,
the heat conducting device of the heat dissipation module is connected with the M electronic elements, and the air outlet of the heat dissipation assembly sheet of the heat dissipation module corresponds to the ventilation opening.
Borrow by above-mentioned technical scheme, the utility model discloses the structure has following advantage at least:
the utility model provides a technical scheme is through being equipped with the airflow channel that the air intake size is greater than the air outlet size with the cooling block piece for dust in the rotatory air current that produces of fan is difficult for adsorbing in the air intake department of cooling block piece, can follow air intake inflow airflow channel, flows to the electronic equipment outside from the air outlet again, thereby reduces the adsorption capacity of dust on the fin. Compared with the prior art the utility model provides an effectual reduction dust accumulation of technical scheme, the practicality is high.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
The present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an implementation of a heat dissipation module according to an embodiment of the present invention;
fig. 2 is a schematic view of a first implementation structure of a heat dissipation assembly in accordance with an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2;
fig. 4 is a plan view of a first implementation structure of a heat dissipation assembly in accordance with an embodiment of the present invention;
fig. 5 is a plan view of a second implementation structure of an electrical heat dissipation assembly according to an embodiment of the present invention;
fig. 6 is a plan view of a third implementation structure of a heat dissipation assembly in accordance with an embodiment of the present invention;
fig. 7 is a schematic view of an implementation structure of a dust storage device disposed on a heat dissipation assembly in accordance with an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an implementation of the electronic device according to an embodiment of the present invention.
Detailed Description
The embodiment of the utility model provides a for solve among the prior art radiating module piece and go up the absorbent problem of dust, provided a radiating module and electronic equipment of novel structure.
The utility model discloses technical scheme for solving above-mentioned technical problem, the general thinking is as follows:
the embodiment of the utility model provides an among the technical scheme, electronic equipment includes:
one end of the heat conduction device is connected with an electronic element in external electronic equipment;
the heat dissipation assembly piece is connected with the other end of the heat conduction device; the heat dissipation assembly piece is provided with an airflow channel with the size of an air inlet larger than that of an air outlet;
the fan is arranged on one side of the heat dissipation assembly, so that dust in airflow generated by rotation of the fan can flow into the airflow channel from the air inlet and then flow out of the external electronic equipment from the air outlet.
Based on same utility model think, the utility model provides an electronic equipment, electronic equipment includes:
the air conditioner comprises a shell, wherein a vent is arranged on the shell;
m electronic components which are fixedly arranged in the shell, wherein M is a positive integer more than or equal to 1;
the heat dissipation module is fixedly arranged in the shell; wherein,
the heat conducting device of the heat dissipation module is connected with the M electronic elements, and the air outlet of the heat dissipation assembly sheet of the heat dissipation module corresponds to the ventilation opening; wherein,
the heat dissipation module includes:
one end of the heat conduction device is connected with an electronic element in external electronic equipment;
the heat dissipation assembly piece is connected with the other end of the heat conduction device; the heat dissipation assembly piece is provided with an airflow channel with the size of an air inlet larger than that of an air outlet;
the fan is arranged on one side of the heat dissipation assembly, so that dust in airflow generated by rotation of the fan can flow into the airflow channel from the air inlet and then flow out of the external electronic equipment from the air outlet.
The utility model provides a technical scheme is through being equipped with the airflow channel that the air intake size is greater than the air outlet size with the cooling block piece for dust in the rotatory air current that produces of fan is difficult for adsorbing in the air intake department of cooling block piece, can follow air intake inflow airflow channel, flows to the electronic equipment outside from the air outlet again, thereby reduces the adsorption capacity of dust on the fin. Compared with the prior art the utility model provides an effectual reduction dust accumulation of technical scheme, the practicality is high.
To further illustrate the technical means and effects of the present invention for achieving the intended purpose of the present invention, the following detailed description of the embodiments, structures, features and effects of the test stand according to the present invention will be made with reference to the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "an embodiment" refers to not necessarily the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As shown in fig. 1, an embodiment of the present invention provides a schematic structural diagram of a heat dissipation module. This embodiment a thermal module include: a heat conducting device 10, a heat dissipating fin 20, and a fan 30. As shown in fig. 1, one end of the heat conducting device 10 is connected to an electronic component in an external electronic device. The heat dissipation fins 20 are connected to the other end of the heat conducting device 10, and the heat dissipation fins 20 have airflow channels with sizes of the air inlets 21 and the air outlets 22, that is, the heat dissipation fins in the heat dissipation fins 20 may be arranged according to a certain arrangement manner, so that the heat dissipation fins 20 formed by arranging the plurality of heat dissipation fins 20 according to a certain arrangement manner have airflow channels with sizes of the air inlets 21 and the air outlets 22. The certain arrangement is any arrangement that enables the heat dissipation fins 20 to have airflow channels with the size of the air inlet 21 larger than that of the air outlet 22, and is not limited herein. The fan 30 is disposed at one side of the heat dissipation assembly, so that dust in an airflow generated by rotation of the fan 30 can flow into the airflow channel from the air inlet 21 and flow out of the external electronic device from the air outlet 22.
In practical application, the air intake size is generally for being greater than 1mm, the air outlet size can be 1mm or 0.9mm or the arbitrary value between 1mm ~ 0.9mm, and the selection of specific air intake size and air outlet size is decided according to customer's demand, the embodiment of the utility model provides a do not do specifically and restrict.
The embodiment of the utility model provides a through being equipped with the air current passageway that the air intake size is greater than the air outlet size with the cooling block piece for dust in the rotatory air current that produces of fan is difficult for adsorbing in the air intake department of cooling block piece, can follow air intake inflow air current passageway, flows to the electronic equipment outside from the air outlet again, thereby reduces the adsorption capacity of dust on the fin. Compared with the prior art the embodiment of the utility model provides an effectual reduction dust accumulation, the practicality is high.
Further, the heat dissipation fins 20 of the airflow channel in the above embodiment, in which the size of the air inlet 21 is larger than that of the air outlet 22, may be implemented by using the following structure:
first, as shown in fig. 2 and 3, the heat dissipation fins 20 may be composed of a first connection plate 23a, a plurality of first heat dissipation fins 24a, and a plurality of second heat dissipation fins 25 a. A first end surface of the first connection plate 23a is connected to the other end of the heat conduction device 10. The plurality of first fins 24a are arranged in parallel with each other on a second end face of the first connection plate 23a opposite to the first end face. At least one second heat dissipation fin 25a is arranged between every two adjacent first heat dissipation fins 24a, and each second heat dissipation fin 25a is connected with one heat dissipation fin of every two adjacent first heat dissipation fins 24a, and it should be noted here that each second heat dissipation fin 25a may be connected at any position on one heat dissipation fin of every two adjacent first heat dissipation fins 24 a. The second heat sink 25a and the first heat sink 24a connected thereto form a preset angle a, so that the first connecting plate 23a, the first heat sink 24a and the second heat sink 25a enclose an airflow channel in which the size of the air inlet 21 is larger than that of the air outlet 22. Wherein the preset angle a may be an acute angle. That is, the second heat sink 25a is disposed along the flow direction of the airflow flowing through the heat dissipation fins 20, so that the airflow generated by the rotation of the fan 30 and the dust carried in the airflow can flow out of the electronic device through the heat dissipation fins 20, thereby reducing the amount of dust adsorbed on the heat sink, reducing the accumulation of dust, and ensuring the heat dissipation performance of the heat dissipation module.
In the present embodiment, the number of the second heat dissipation fins 25a provided between each adjacent two of the first heat dissipation fins 24a may be one, two, or more. In practical implementation, if one second heat sink 25a is disposed between every two adjacent first heat sinks 24a, as shown in fig. 4, the second heat sink 25a and the first heat sink 24a connected thereto form a predetermined angle a, so that the airflow generated by the rotation of the fan 30 can flow out of the electronic device along the second heat sink 25a, thereby effectively reducing the amount of dust adsorbed on the heat sinks; if two second heat dissipation fins 25a are disposed between every two adjacent first heat dissipation fins 24a, as shown in fig. 5, one end of the second heat dissipation fin 25a1 is connected to the first heat dissipation fin 24a1, and the second heat dissipation fin 25a1 and the first heat dissipation fin 24a1 form the predetermined angle a. One end of the second heat sink 25a2 is connected to the first heat sink 24a2, and the second heat sink 25a2 and the first heat sink 24a2 form the predetermined angle a, so that the air inlet 21 and the air outlet 22 of the airflow channel defined by the first connecting plate 23a, the first heat sink 24a and the second heat sink 25a are on the same center line, thereby equalizing air pressure at various positions in the airflow channel, facilitating the airflow generated by the rotation of the fan 30 and the dust carried in the airflow to flow out of the electronic device along the second heat sink 25a, and further effectively reducing the amount of dust adsorbed on the heat sinks. Certainly, a plurality of second radiating fins can be arranged between every two adjacent first radiating fins, and the design of the plurality of second radiating fins can reduce the adsorption capacity of dust on the radiating fins and enhance the radiating capacity of the radiating module.
In this embodiment, in order to avoid the phenomenon of dust accumulation at the joint of the second heat dissipation fin and the first heat dissipation fin, the second heat dissipation fin and one heat dissipation fin of every two adjacent first heat dissipation fins need to be connected smoothly, so that the second heat dissipation fin and the first heat dissipation fin are in smooth transition, and the adsorption capacity of dust on the heat dissipation fins is effectively reduced.
Secondly, as shown in fig. 6, the heat dissipating fins 20 may further comprise a second connecting plate 23b, a plurality of third heat dissipating fins 24b and a plurality of fourth heat dissipating fins 25b, wherein the size of the fourth heat dissipating fins 25b is smaller than that of the third heat dissipating fins 24 b. A first end surface of the second connecting plate 23b is connected to the other end of the heat conducting device 10. The plurality of third fins 24b are arranged in parallel with each other on a second end face of the second connecting plate 23b opposite to the first end face. At least one fourth heat dissipation fin 25b is arranged between every two adjacent third heat dissipation fins 24b, the fourth heat dissipation fins 25b are arranged in parallel with the third heat dissipation fins 24b, and one end of each fourth heat dissipation fin 25b is connected with the second end face of the second connection plate 23b, so that the second connection plate 23b, the third heat dissipation fins 24b and the fourth heat dissipation fins 25b enclose an airflow channel in which the size of the air inlet 21 is larger than that of the air outlet 22, and therefore airflow generated by rotation of the fan 30 and dust carried in the airflow can flow out of the electronic equipment through the heat dissipation assembly fins 20, the adsorption amount of the dust on the heat dissipation fins can be reduced, the accumulation of the dust can be reduced, and the heat dissipation performance of the heat dissipation module can be guaranteed.
In this embodiment, the number of the fourth heat dissipation fins provided between each adjacent two of the third heat dissipation fins may be one or more. The specific amount can be determined according to actual requirements. In a specific implementation, as shown in fig. 6, one fourth heat dissipation plate 25b may be disposed between every two adjacent third heat dissipation plates 24b, the fourth heat dissipation plate 25b and the third heat dissipation plate 24b are disposed in parallel on the second end surface of the second connection plate 23b, and the fourth heat dissipation plate may be located at any position between the two adjacent third heat dissipation plates and located at a middle position between the two adjacent third heat dissipation plates, so that a channel formed by the two adjacent third heat dissipation plates is divided into two airflow outflow channels by the fourth heat dissipation plate, so that the second connection plate, the third heat dissipation plate, and the fourth heat dissipation plate enclose an airflow channel having an air inlet size larger than an air outlet size, thereby effectively reducing dust accumulation and having high practicability.
Further, in order to prevent the static electricity on the heat dissipation assembly from making the dust particles adhere to the heat dissipation assembly, the heat dissipation module in the above embodiment may include: and a grounding device. The grounding device is connected with the heat dissipation assembly piece. Static electricity on the radiating fins is guided to the ground through the grounding device, so that voltage on the radiating fins is zero, and the phenomenon that the static electricity adsorbs dust is effectively avoided. In particular implementation, the grounding device may include: one end of the electric connection wire is connected with the radiating fin, and the other end of the electric connection wire is connected with a grounding part in the external electronic equipment; alternatively, the grounding means may comprise a grounding circuit, the grounding circuit being connected to the heat sink fins. Wherein, ground circuit among the prior art can be adopted to ground circuit, the embodiment of the utility model provides a do not specifically limit.
Further, in order to prevent dust from accumulating on the side of the heat dissipation plate, the heat dissipation module in the above embodiment may further include: a dust storage means 40. As shown in fig. 7, the dust storage device 40 is disposed on a side end surface of the heat dissipating fins 20, and forms an accommodating space with an opening corresponding to the airflow outlet of the fan with the heat dissipating fins 20. The depth of the accommodating space is consistent with that of the airflow channel, so that the integrity of the heat dissipation module is high.
As shown in fig. 8, the electronic device according to the second embodiment of the present invention is schematically illustrated. As shown in fig. 5, the electronic apparatus includes: a housing 200, M electronic components 300, and a heat dissipation module 100. Wherein, the heat dissipation module 100 includes: a heat conducting device 10, a heat dissipating fin 20, and a fan 30. As shown in fig. 1, one end of the heat conducting device 10 is connected to an electronic component in an external electronic device. The heat dissipation assembly 20 is connected to the other end of the heat conducting device 10, and the heat dissipation assembly 20 has an airflow channel with an air inlet 21 larger than an air outlet 22. The fan 30 is disposed at one side of the heat dissipation assembly, so that dust in an airflow generated by rotation of the fan 30 can flow into the airflow channel from the air inlet 21 and flow out of the external electronic device from the air outlet 22. As shown in FIG. 8, the housing 200 is provided with a vent 210, the M electronic components 300 are fixedly disposed in the housing 200, and M is a positive integer greater than or equal to 1. The heat dissipation module 100 is fixedly disposed in the housing 200. The heat conducting device 10 of the heat dissipation module 100 is connected to the M electronic components 300, and the air outlet of the heat dissipation assembly of the heat dissipation module 100 corresponds to the vent 210.
Specifically, the heat dissipation module in the second embodiment may directly adopt the heat dissipation module provided in the first embodiment, and the specific implementation structure may refer to the related contents described in the first embodiment, which is not described herein again.
The electronic device in the above embodiments may be a notebook computer or a desktop all-in-one machine.
The utility model provides a technical scheme is through being equipped with the airflow channel that the air intake size is greater than the air outlet size with the cooling block piece for dust in the rotatory air current that produces of fan is difficult for adsorbing in the air intake department of cooling block piece, can follow air intake inflow airflow channel, flows to the electronic equipment outside from the air outlet again, thereby reduces the adsorption capacity of dust on the fin. Compared with the prior art the utility model provides an effectual reduction dust accumulation of technical scheme, the practicality is high.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A heat dissipation module, comprising:
one end of the heat conduction device is connected with an electronic element in external electronic equipment;
the heat dissipation assembly piece is connected with the other end of the heat conduction device; the heat dissipation assembly piece is provided with an airflow channel with the size of an air inlet larger than that of an air outlet;
the fan is arranged on one side of the heat dissipation assembly, so that dust in airflow generated by rotation of the fan can flow into the airflow channel from the air inlet and then flow out of the external electronic equipment from the air outlet.
2. The heat dissipation module of claim 1, wherein the heat dissipation fins are comprised of a first connection plate, a plurality of first heat dissipation fins, and a plurality of second heat dissipation fins;
the first end face of the first connecting plate is connected with the other end of the heat conducting device;
the plurality of first cooling fins are arranged in parallel on a second end face, opposite to the first end face, of the first connecting plate;
at least one second radiating fin is arranged between every two adjacent first radiating fins, and each second radiating fin is connected with one radiating fin of every two adjacent first radiating fins; wherein,
the second radiating fin and the first radiating fin connected with the second radiating fin form a preset angle, so that the first connecting plate, the first radiating fin and the second radiating fin enclose an airflow channel with the size of the air inlet larger than that of the air outlet.
3. The heat dissipation module of claim 2, wherein the second heat sink is smoothly connected to one heat sink of every two adjacent first heat sinks.
4. The heat dissipation module of claim 2, wherein the predetermined angle is an acute angle.
5. The heat dissipation module of claim 1, wherein the heat sink assembly is comprised of a second connection plate, a plurality of third fins, and a plurality of fourth fins, wherein the fourth fins have a size smaller than the third fins;
the first end face of the second connecting plate is connected with the other end of the heat conducting device;
the plurality of third heat dissipation fins are arranged in parallel on a second end face, opposite to the first end face, of the second connecting plate;
at least one fourth heat dissipation fin is arranged between every two adjacent third heat dissipation fins, the fourth heat dissipation fins are arranged in parallel with the third heat dissipation fins, and one end of each fourth heat dissipation fin is connected with the second end face of the second connecting plate, so that the second connecting plate, the third heat dissipation fins and the fourth heat dissipation fins enclose an airflow channel with the size of the air inlet larger than that of the air outlet.
6. The heat dissipation module of claim 1, comprising:
and the grounding device is connected with the heat dissipation assembly piece.
7. The heat dissipation module of claim 6, wherein the grounding means comprises:
one end of the electric connection wire is connected with the radiating fin, and the other end of the electric connection wire is connected with a grounding part in the external electronic equipment; or,
and the grounding circuit is connected with the heat dissipation assembly sheet.
8. The heat dissipation module of any one of claims 1 to 7, further comprising:
the dust storage device is arranged on the side end face of the radiating fins and forms an accommodating space with an opening together with the radiating fins, and the opening corresponds to the airflow outlet of the fan.
9. The heat dissipation module of claim 8, wherein the depth of the receiving space is substantially equal to the depth of the airflow channel.
10. An electronic device, comprising:
the air conditioner comprises a shell, wherein a vent is arranged on the shell;
m electronic components which are fixedly arranged in the shell, wherein M is a positive integer more than or equal to 1;
the heat sink module as claimed in any one of claims 1 to 9, wherein the heat sink module is fixedly disposed in the housing; wherein,
the heat conducting device of the heat dissipation module is connected with the M electronic elements, and the air outlet of the heat dissipation assembly sheet of the heat dissipation module corresponds to the ventilation opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420709186.3U CN204231845U (en) | 2014-11-21 | 2014-11-21 | Heat radiation module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420709186.3U CN204231845U (en) | 2014-11-21 | 2014-11-21 | Heat radiation module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN204231845U true CN204231845U (en) | 2015-03-25 |
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ID=52929884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420709186.3U Active CN204231845U (en) | 2014-11-21 | 2014-11-21 | Heat radiation module and electronic equipment |
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| Country | Link |
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| CN (1) | CN204231845U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN109786344A (en) * | 2019-02-28 | 2019-05-21 | 苏州浪潮智能科技有限公司 | A kind of adding pressure type cooling fin and radiating module |
| CN111815809A (en) * | 2020-06-17 | 2020-10-23 | 安徽超清科技股份有限公司 | Intelligent traffic signal machine |
-
2014
- 2014-11-21 CN CN201420709186.3U patent/CN204231845U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106774751A (en) * | 2017-01-03 | 2017-05-31 | 北京飞讯数码科技有限公司 | A kind of outer surface heat abstractor |
| CN106774751B (en) * | 2017-01-03 | 2023-05-05 | 北京飞讯数码科技有限公司 | External surface heat abstractor |
| CN108255276A (en) * | 2018-04-26 | 2018-07-06 | 刘康 | Heat dissipation performance is not easy the air-cooled laptop decayed |
| CN109786344A (en) * | 2019-02-28 | 2019-05-21 | 苏州浪潮智能科技有限公司 | A kind of adding pressure type cooling fin and radiating module |
| CN111815809A (en) * | 2020-06-17 | 2020-10-23 | 安徽超清科技股份有限公司 | Intelligent traffic signal machine |
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