CN204167361U - A kind of surface attaching type LED - Google Patents
A kind of surface attaching type LED Download PDFInfo
- Publication number
- CN204167361U CN204167361U CN201420538849.XU CN201420538849U CN204167361U CN 204167361 U CN204167361 U CN 204167361U CN 201420538849 U CN201420538849 U CN 201420538849U CN 204167361 U CN204167361 U CN 204167361U
- Authority
- CN
- China
- Prior art keywords
- substrate
- type led
- attaching type
- surface attaching
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 5
- 229920006335 epoxy glue Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of surface attaching type LED, comprising: substrate; Chip is on the substrate set; Connect the bonding line of described substrate and described chip; Cover the packing colloid of described substrate and described chip; It is characterized in that, in the conductive hole of described substrate, be filled with metal object.The utility model is by being filled in conductive hole by metal object, and be packaged in colloid inside, when cutting into single product, can not be cut inside the built-in colloid of conductive hole, but exclusively enjoy use as single product, so not only can improve definition and the production efficiency of LED, and can increase the service life.
Description
Technical field
The utility model relates to LED manufacture technology field, relates to a kind of surface attaching type LED in particular.
Background technology
In the prior art, for the microminiature surface attaching type LED of Small Distance display screen, be adopt plug ink or epoxy fill the mode of LED-baseplate conductive hole and then encapsulate cutting, very high to equipment requirement precision.Because existing equipment and substrate manufacture precision can not reach cutting accuracy, product is easily cut when cutting partially, and divide conductive hole equally through 1/4 and easily conductive hole is cut away and cause product failure, also to reduce the cutting speed of the inadequate equipment of precision simultaneously, thus affect production efficiency.
How therefore a kind of surface attaching type LED be provided, not only can improve definition and the production efficiency of LED, and can to increase the service life be the problem that those skilled in the art need solution badly.
Utility model content
In view of this, the utility model provides a kind of surface attaching type LED.
For achieving the above object, the utility model provides following technical scheme:
A kind of surface attaching type LED, comprising: substrate; Chip is on the substrate set; Connect the bonding line of described substrate and described chip; Cover the packing colloid of described substrate and described chip; It is characterized in that, in the conductive hole of described substrate, be filled with metal object.
Preferably, in above-mentioned a kind of surface attaching type LED, the thickness of described substrate is 0.1mm-1mm, and material is BT substrate, FR4 substrate, aluminium base, copper base or ceramic substrate.
Preferably, in above-mentioned a kind of surface attaching type LED, described substrate conducting hole is realized by machinery or chemical mode, and on individual devices, conductive hole has four.
Preferably, in above-mentioned a kind of surface attaching type LED, described chip adopts die bond primer to be fixed on described base plate line surface, and then is connected to the described base plate line other end by described bonding line and carries out conducting.
Preferably, in above-mentioned a kind of surface attaching type LED, the arrangement mode of described chip position adopts the arrangement mode of yi word pattern or mosaic shape.
Preferably, in above-mentioned a kind of surface attaching type LED, described packing colloid uses epoxy glue or silicones.
The utility model is by adopting metal object filled conductive hole and being packaged in colloid inside, when cutting into single product, can not be cut inside the built-in colloid of conductive hole, but exclusively enjoy use as single product, so not only can improve definition and the production efficiency of LED, and extend useful life.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 accompanying drawing is structural representation of the present utility model.
Fig. 2 accompanying drawing is the structural representation of the utility model chips encapsulation.
In FIG:
2 be chip, 3 be bonding line, 5 for metal object
In fig. 2:
1 is that substrate, 4 is for packing colloid.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of surface attaching type LED.
Refer to accompanying drawing 1, the structural representation of a kind of surface attaching type LED disclosed in the utility model, specifically comprises: substrate 1; Be arranged on the chip 2 on substrate; The bonding line 3 of connection substrate 1 and chip 2; The packing colloid 4 of covered substrate 1 and chip 2; It is characterized in that, in the conductive hole of substrate 1, be filled with metal object 5.
The utility model improves the surface attaching type LED in traditional employing plug ink or epoxy glue filling substrate conducting hole, change into and use metal object filled conductive hole and be packaged in colloid inside, when cutting into single product, can not be cut inside the built-in colloid of conductive hole, but exclusively enjoy use as single product, thus improve the material of filling in conductive hole that to be divided equally by conductive hole 1/4 when cutting and cause and come off and reduce the problem in useful life, so not only can improve definition and the production efficiency of LED, and can increase the service life.
In order to optimize technique scheme further, the thickness of substrate 1 is 0.1mm-1mm, and material is BT substrate, FR4 substrate, aluminium base, copper base or ceramic substrate, and these materials all have good thermal endurance and thermal conductivity, is conducive to the safe handling of LED.
In order to optimize technique scheme further, the conductive hole of substrate 1 is realized by machinery or chemical mode, and on individual devices, conductive hole has four, can be evenly distributed on substrate 1, and the specification of each conductive hole is consistent.
In order to optimize technique scheme further, chip 2 adopts die bond primer to be fixed on substrate 1 circuit surface, and then is connected to the substrate 1 circuit other end by bonding line 3 and carries out conducting.This ensure that the stability of the clear of circuit and circuit turn-on.
In order to optimize technique scheme further, the arrangement mode of chip 2 position adopts the arrangement mode of yi word pattern or mosaic shape, adds facility for producing.
In order to optimize technique scheme further, packing colloid 4 uses epoxy glue or silicones, has the advantages such as high temperature resistant, good toughness.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.For device disclosed in embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates see method part.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a surface attaching type LED, comprising: substrate (1); Chip (2) is on the substrate set; Connect the bonding line (3) of described substrate (1) and described chip (2); Cover the packing colloid (4) of described substrate (1) and described chip (2); It is characterized in that, in the conductive hole of described substrate (1), be filled with metal object (5).
2. a kind of surface attaching type LED according to claim 1, is characterized in that, the thickness of described substrate (1) is 0.1mm-1mm, and material is BT substrate, FR4 substrate, aluminium base, copper base or ceramic substrate.
3. a kind of surface attaching type LED according to claim 1 and 2, is characterized in that, described substrate (1) conductive hole is realized by machinery or chemical mode, and on individual devices, conductive hole has four.
4. a kind of surface attaching type LED according to claim 1, it is characterized in that, described chip (2) adopts die bond primer to be fixed on described substrate (1) circuit surface, and then is connected to described substrate (1) the circuit other end by described bonding line (3) and carries out conducting.
5. a kind of surface attaching type LED according to claim 1 or 4, is characterized in that, the arrangement mode of described chip (2) position adopts the arrangement mode of yi word pattern or mosaic shape.
6. a kind of surface attaching type LED according to claim 1, is characterized in that, described packing colloid (4) uses epoxy glue or silicones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420538849.XU CN204167361U (en) | 2014-09-19 | 2014-09-19 | A kind of surface attaching type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420538849.XU CN204167361U (en) | 2014-09-19 | 2014-09-19 | A kind of surface attaching type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204167361U true CN204167361U (en) | 2015-02-18 |
Family
ID=52541017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420538849.XU Expired - Lifetime CN204167361U (en) | 2014-09-19 | 2014-09-19 | A kind of surface attaching type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204167361U (en) |
-
2014
- 2014-09-19 CN CN201420538849.XU patent/CN204167361U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150218 |
|
| CX01 | Expiry of patent term |