CN204130519U - Based on the fixing of plug-in type MOSFET pipe and radiator structure - Google Patents
Based on the fixing of plug-in type MOSFET pipe and radiator structure Download PDFInfo
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- CN204130519U CN204130519U CN201420596064.8U CN201420596064U CN204130519U CN 204130519 U CN204130519 U CN 204130519U CN 201420596064 U CN201420596064 U CN 201420596064U CN 204130519 U CN204130519 U CN 204130519U
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- 239000000758 substrate Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 53
- 239000011324 bead Substances 0.000 abstract description 31
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种基于插件式MOSFET管的固定及散热结构，包括一个散热基板，散热基板的一侧设置有至少一个导热压条，任意一个导热压条的两端均各自通过一个螺钉与散热基板固定连接，任意一个导热压条的中部与散热基板平行，任意一个导热压条在其与散热基板相向的侧面中间隔并列设置有两个以上数目的凹槽。凹槽的形状与插件式MOSFET管的形状配合。将多个MOSFET管各自嵌入一个凹槽，然后将导热压条的两端用螺钉与散热基板固定。螺钉锁紧后，导热压条压紧MOSFET管，使其紧贴在散热基板上。本实用新型使MOSFET管与散热基座接触良好、散热均匀，增加了散热面积，减少了安装所需螺钉，且可保证MOSFET管的固定效果。
A fixing and heat dissipation structure based on a plug-in MOSFET tube, including a heat dissipation substrate, at least one heat conduction bead is provided on one side of the heat dissipation substrate, and the two ends of any heat conduction bead are fixedly connected to the heat dissipation substrate by a screw, and any one The middle part of the heat-conducting bead is parallel to the heat-dissipating substrate, and any one of the heat-conducting bead is provided with more than two grooves juxtaposed at intervals on the side facing the heat-dissipating substrate. The shape of the groove matches the shape of the plug-in MOSFET tube. Insert a plurality of MOSFET tubes into a groove respectively, and then fix the two ends of the heat-conducting bead to the heat-dissipating substrate with screws. After the screws are locked, the heat conduction bead compresses the MOSFET tube so that it is tightly attached to the heat dissipation substrate. The utility model makes good contact between the MOSFET tube and the heat dissipation base, uniform heat dissipation, increases the heat dissipation area, reduces screws required for installation, and can ensure the fixing effect of the MOSFET tube.
Description
技术领域: Technical field:
本实用新型涉及电学领域，尤其涉及电机控制器，特别涉及电机控制器中的插件式MOSFET管元件，具体的是一种基于插件式MOSFET管的固定及散热结构。 The utility model relates to the field of electricity, in particular to a motor controller, in particular to a plug-in MOSFET tube element in the motor controller, in particular to a fixing and heat dissipation structure based on the plug-in MOSFET tube.
背景技术: Background technique:
现有技术中，电机控制器广泛采用插件式MOSFET管（即金属-氧化层半导体场效晶体管）作为功率元件。MOSFET管自身带一个通孔，利用螺钉穿过该通孔后与散热基座固定。因为只有一个螺钉固定，且螺钉位置不在MOSFET管的中心，致使MOSFET管内部的半导体芯片只有单端固定；在MOSFET管内部远离通孔的散热片不能良好接触到散热基板，从而造成了一定的热阻增加。电机控制器经常采用多个插件式MOSFET管，因此需要多个螺钉来固定，安装效率较低。 In the prior art, plug-in MOSFETs (ie metal-oxide semiconductor field effect transistors) are widely used as power components in motor controllers. The MOSFET tube itself has a through hole, and the screw is passed through the through hole and fixed to the heat dissipation base. Because there is only one screw fixed, and the screw position is not in the center of the MOSFET tube, the semiconductor chip inside the MOSFET tube is only fixed at one end; the heat sink inside the MOSFET tube away from the through hole cannot be in good contact with the heat dissipation substrate, resulting in a certain amount of heat resistance increases. Motor controllers often use multiple plug-in MOSFET tubes, so multiple screws are required for fixing, and the installation efficiency is low.
发明内容： Invention content:
本实用新型的目的在于提供一种基于插件式MOSFET管的固定及散热结构，所述的这种基于插件式MOSFET管的固定及散热结构要解决现有技术中电机控制器中插件式MOSFET管固定和散热情况不理想的技术问题。 The purpose of this utility model is to provide a fixing and heat dissipation structure based on a plug-in MOSFET tube. The fixing and heat dissipation structure based on a plug-in MOSFET tube should solve the problem of fixing the plug-in MOSFET tube in the motor controller in the prior art. And technical problems with unsatisfactory heat dissipation.
本实用新型的这种基于插件式MOSFET管的固定及散热结构，包括一个散热基板，其中，所述的散热基板的一侧设置有至少一个导热压条，任意一个所述的导热压条的两端均各自通过一个螺钉与散热基板固定连接，任意一个导热压条的中部与散热基板平行，任意一个导热压条在其与散热基板相向的侧面中间隔并列设置有两个以上数目的凹槽。 The fixing and heat dissipation structure based on the plug-in MOSFET tube of the present utility model includes a heat dissipation substrate, wherein at least one heat conduction bead is arranged on one side of the heat dissipation substrate, and the two ends of any one of the heat conduction bead are Each is fixedly connected to the heat dissipation substrate by a screw, the middle part of any heat conduction bead is parallel to the heat dissipation substrate, and any one heat conduction bead is provided with more than two grooves juxtaposed at intervals in the middle of its side facing the heat dissipation substrate.
进一步的，散热基板上设置有两个以上数目的导热压条。 Further, more than two heat-conducting pressure strips are arranged on the heat dissipation substrate.
进一步的，两个以上数目的导热压条在散热基板上平行间隔分布。 Further, more than two heat-conducting pressure strips are distributed in parallel and at intervals on the heat-dissipating substrate.
进一步的，凹槽的形状与插件式MOSFET管的形状配合。 Further, the shape of the groove matches the shape of the plug-in MOSFET tube.
进一步的，凹槽呈扁平长方体。 Further, the groove is in the shape of a flat cuboid.
进一步的，任意一个导热压条的两端均向散热基板方向延伸设置有一个固定脚，所述的固定脚与散热基板直接接触。 Further, both ends of any heat-conducting bead are provided with a fixing foot extending toward the heat dissipation substrate, and the fixing foot is in direct contact with the heat dissipation substrate.
进一步的，任意一个导热压条均由铜型材、或者铝型材构成。 Further, any heat-conducting bead is made of copper profile or aluminum profile.
本实用新型的工作原理是: 将多个MOSFET管各自嵌入一个凹槽，然后将导热压条的两端用螺钉与散热基板固定。螺钉锁紧后，导热压条压紧MOSFET管，使其紧贴在散热基板上，避免了通过MOSFET管中单个通孔固定时周边需要散热的部位翘起脱离散热基板的情况，MOSFET管与散热基座接触良好、散热均匀，在多管并联的情况下各管之间可实现均热效果。减少了安装MOSFET管所需的螺钉，螺钉且可选用较大螺钉，使得压紧力更大。MOSFET管产生的热量还可通过导热压条进行散热，增大了散热面积。螺钉导热锁紧压条后，可保证MOSFET管被固定在凹槽内，在工作过程中不会发生位移变动，获得理想的固定效果。 The working principle of the utility model is: a plurality of MOSFET tubes are respectively embedded in a groove, and then the two ends of the heat-conducting bead are fixed with the heat-dissipating substrate with screws. After the screw is locked, the heat-conducting bead presses the MOSFET tube tightly to make it cling to the heat dissipation substrate, avoiding the situation that the surrounding parts that need heat dissipation are lifted off the heat dissipation substrate when it is fixed through a single through hole in the MOSFET tube. The seat is in good contact and the heat dissipation is uniform. In the case of parallel connection of multiple tubes, the heat equalization effect can be achieved between the tubes. The number of screws required to install the MOSFET tube is reduced, and larger screws can be used to increase the pressing force. The heat generated by the MOSFET tube can also be dissipated through the heat conduction bead, which increases the heat dissipation area. After the screw conducts heat and locks the pressure strip, it can ensure that the MOSFET tube is fixed in the groove, and there will be no displacement changes during the working process, and an ideal fixing effect can be obtained.
本实用新型和已有技术相比较，其效果是积极和明显的。本实用新型利用包括有多个凹槽的金属导热压条将多个MOSFET管固定在散热基板上，MOSFET管与散热基座接触良好、散热均匀，导热压条增加了散热面积，减少了安装所需螺钉的数目，且可保证MOSFET管被固定在凹槽内，在工作过程中不会发生位移变动，获得理想的固定效果。 Compared with the prior art, the utility model has positive and obvious effects. The utility model utilizes the metal heat-conducting bead with multiple grooves to fix multiple MOSFET tubes on the heat dissipation substrate, the MOSFET tubes are in good contact with the heat-dissipating base, and the heat dissipation is uniform. The heat-conducting bead increases the heat dissipation area and reduces the screws required for installation. The number can ensure that the MOSFET tube is fixed in the groove, and there will be no displacement changes during the working process, and an ideal fixing effect can be obtained.
附图说明： Description of drawings:
图1是本实用新型的基于插件式MOSFET管的固定及散热结构的剖面结构示意图。 Fig. 1 is a schematic cross-sectional structure diagram of the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图2是本实用新型的基于插件式MOSFET管的固定及散热结构的结构示意图。 Fig. 2 is a structural schematic diagram of the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图3是本实用新型的基于插件式MOSFET管的固定及散热结构的俯视结构示意图。 Fig. 3 is a top view structural diagram of the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图4是本实用新型的基于插件式MOSFET管的固定及散热结构中的导热压条的仰视图。 Fig. 4 is a bottom view of the heat conduction bead in the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图5是本实用新型的基于插件式MOSFET管的固定及散热结构中的导热压条的主视图。 Fig. 5 is a front view of the heat conduction bead in the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图6是本实用新型的基于插件式MOSFET管的固定及散热结构中的导热压条的俯视图。 Fig. 6 is a top view of the heat conduction bead in the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present invention.
图7是本实用新型的基于插件式MOSFET管的固定及散热结构的一个实施例中的MOSFET管的主视图。 Fig. 7 is a front view of the MOSFET tube in an embodiment of the plug-in MOSFET tube-based fixing and heat dissipation structure of the present invention.
图8是本实用新型的基于插件式MOSFET管的固定及散热结构的一个实施例中的MOSFET管的侧视图。 Fig. 8 is a side view of the MOSFET tube in an embodiment of the plug-in MOSFET tube-based fixing and heat dissipation structure of the present invention.
具体实施方式： Detailed ways:
实施例1: Example 1:
如图1、图2、图3、图4、图5和图6所示，本实用新型的基于插件式MOSFET管的固定及散热结构，包括一个散热基板1，其中，所述的散热基板1的一侧设置有至少一个导热压条2，任意一个所述的导热压条2的两端均各自通过一个螺钉3与散热基板1固定连接，任意一个导热压条2的中部与散热基板1平行，任意一个导热压条2在其与散热基板1相向的侧面中间隔并列设置有两个以上数目的凹槽4。 As shown in Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6, the fixing and heat dissipation structure based on the plug-in MOSFET tube of the present utility model includes a heat dissipation substrate 1, wherein the heat dissipation substrate 1 At least one heat-conducting bead 2 is provided on one side of the heat-conducting bead 2, and the two ends of any one of the heat-conducting bead 2 are respectively fixedly connected to the heat-dissipating substrate 1 by a screw 3, and the middle part of any one of the heat-conducting bead 2 is parallel to the heat-dissipating substrate 1. The thermally conductive bead 2 is provided with more than two grooves 4 juxtaposed at intervals on its side facing the heat dissipation substrate 1 .
进一步的，散热基板1上设置有两个以上数目的导热压条2。 Further, more than two heat-conducting pressure strips 2 are arranged on the heat dissipation substrate 1 .
进一步的，两个以上数目的导热压条2在散热基板1上平行间隔分布。 Further, more than two heat-conducting pressure strips 2 are distributed in parallel and at intervals on the heat-dissipating substrate 1 .
如图7和图8所示，凹槽4的形状与插件式MOSFET管5的形状配合。 As shown in FIG. 7 and FIG. 8 , the shape of the groove 4 matches the shape of the plug-in MOSFET tube 5 .
进一步的，凹槽4呈扁平长方体。 Further, the groove 4 is in the shape of a flat cuboid.
进一步的，任意一个导热压条2的两端均向散热基板1方向延伸设置有一个固定脚，所述的固定脚与散热基板1直接接触。 Further, both ends of any heat-conducting bead 2 are provided with a fixing foot extending toward the heat dissipation substrate 1 , and the fixing foot is in direct contact with the heat dissipation substrate 1 .
进一步的，任意一个导热压条2均由铜型材、或者铝型材构成。 Further, any heat-conducting bead 2 is made of copper profile or aluminum profile.
本实施例的工作原理是: 将多个MOSFET管5各自嵌入一个凹槽4，然后将导热压条2的两端用螺钉3与散热基板1固定。螺钉3锁紧后，导热压条2压紧MOSFET管5，使其紧贴在散热基板1上，避免了通过MOSFET管5中单个通孔固定时周边需要散热的部位翘起脱离散热基板1的情况，MOSFET管5与散热基座接触良好、散热均匀，在多管并联的情况下各管之间可实现均热效果。减少了安装MOSFET管5所需的螺钉3，螺钉3且可选用较大螺钉3，使得压紧力更大。MOSFET管5产生的热量还可通过导热压条2进行散热，增大了散热面积。螺钉3导热锁紧压条后，可保证MOSFET管5被固定在凹槽4内，在工作过程中不会发生位移变动，获得理想的固定效果。 The working principle of this embodiment is as follows: a plurality of MOSFET tubes 5 are respectively embedded in a groove 4, and then both ends of the heat-conducting bead 2 are fixed to the heat dissipation substrate 1 with screws 3. After the screw 3 is locked, the thermally conductive bead 2 presses the MOSFET tube 5 so that it is closely attached to the heat dissipation substrate 1, which avoids the situation that the surrounding parts that need heat dissipation are lifted off the heat dissipation substrate 1 when fixed through a single through hole in the MOSFET tube 5 , the MOSFET tube 5 is in good contact with the heat dissipation base, and the heat dissipation is uniform. In the case of parallel connection of multiple tubes, the heat equalization effect can be realized among the tubes. The screws 3 required for installing the MOSFET tube 5 are reduced, and the screws 3 can be selected to be larger, so that the pressing force is greater. The heat generated by the MOSFET tube 5 can also be dissipated through the heat-conducting bead 2, which increases the heat dissipation area. After the screw 3 conducts heat and locks the bead, it can ensure that the MOSFET tube 5 is fixed in the groove 4, and there will be no displacement change during the working process, and an ideal fixing effect can be obtained.
Claims (7)
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| CN201420596064.8U CN204130519U (en) | 2014-10-15 | 2014-10-15 | Based on the fixing of plug-in type MOSFET pipe and radiator structure |
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| CN201420596064.8U CN204130519U (en) | 2014-10-15 | 2014-10-15 | Based on the fixing of plug-in type MOSFET pipe and radiator structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105899049A (en) * | 2016-06-06 | 2016-08-24 | 上海宝星意迈杰企业发展有限公司 | Radiator structure |
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- 2014-10-15 CN CN201420596064.8U patent/CN204130519U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105899049A (en) * | 2016-06-06 | 2016-08-24 | 上海宝星意迈杰企业发展有限公司 | Radiator structure |
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Granted publication date: 20150128 |