CN204062613U - Lamp - Google Patents
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- CN204062613U CN204062613U CN201420535417.3U CN201420535417U CN204062613U CN 204062613 U CN204062613 U CN 204062613U CN 201420535417 U CN201420535417 U CN 201420535417U CN 204062613 U CN204062613 U CN 204062613U
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- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims 6
- 238000004020 luminiscence type Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
本实用新型提供一种能够降低点灯电路的温度的灯。实施方式所涉及的灯具备:一端侧开口且中空的框体(1);具有向一端侧突出的保持部(26),并且至少一部分容纳于框体(1)内的绝缘外壳(2);具有电连接部(43)的基板(41);具有安装于基板(41)上的半导体发光元件(42),并且配置于绝缘外壳(2)的一端侧的发光模块(4);配置于绝缘外壳(2)内的点灯电路(6);在一端连接于点灯电路(6)且另一端保持于绝缘外壳(2)的保持部(26)的状态下,与基板(41)的电连接部(43)软钎焊连接的电线(61)。
The utility model provides a lamp capable of reducing the temperature of a lighting circuit. The lamp according to the embodiment includes: a hollow frame body (1) with one end side open; an insulating casing (2) having a holding portion (26) protruding toward one end side and at least partly accommodated in the frame body (1); A substrate (41) having an electrical connection portion (43); a light-emitting module (4) having a semiconductor light-emitting element (42) mounted on the substrate (41) and disposed on one end side of an insulating casing (2); disposed on an insulating The lighting circuit (6) in the casing (2); the electrical connection part with the substrate (41) under the condition that one end is connected to the lighting circuit (6) and the other end is held in the holding part (26) of the insulating casing (2). (43) Wires (61) for soldering connection.
Description
技术领域technical field
本实用新型的实施方式涉及一种灯。The embodiment of the utility model relates to a lamp.
背景技术Background technique
例如,为了照明或显示的用途,使用有利用发光二极管等半导体的发光的灯。该灯包括:在基板上安装有LED等半导体发光元件的模块、经由电线与模块连接并且向半导体发光元件供给电力的点灯电路、容纳半导体发光元件和点灯电路等的部件。For example, lamps utilizing light emission of semiconductors such as light emitting diodes are used for lighting and display purposes. This lamp includes a module in which semiconductor light emitting elements such as LEDs are mounted on a substrate, a lighting circuit connected to the module via wires to supply power to the semiconductor light emitting elements, and components that house the semiconductor light emitting elements and the lighting circuit.
以往,将模块和从点灯电路延伸的电线进行连接时,采用了利用焊锡等将电线直接连接于模块的基板上的电连接部的方式(以下,称作直接软钎焊方式)。但是,直接软钎焊方式存在如下问题:电线与电连接部的软钎焊连接的操作性较差。针对这个问题,可以考虑另行设置使电线固定的部件,但这样会导致配件数量的增加。Conventionally, when connecting a module to an electric wire extending from a lighting circuit, a method of directly connecting the electric wire to an electrical connection portion on a substrate of the module with solder or the like (hereinafter referred to as a direct soldering method) has been employed. However, the direct soldering method has a problem in that the operability of the soldered connection between the electric wire and the electrical connection part is poor. In order to solve this problem, it is conceivable to separately provide parts for fixing the electric wires, but this will lead to an increase in the number of accessories.
专利文献1:日本特开2012-59636号公报Patent Document 1: Japanese Patent Laid-Open No. 2012-59636
发明内容Contents of the invention
本实用新型要解决的问题是提供一种结构简单且能够改善直接软钎焊的操作性的灯。The problem to be solved by the utility model is to provide a lamp with simple structure and capable of improving the operability of direct soldering.
为了解决上述问题,实施方式的灯具备:一端侧开口且中空的框体;具有向一端侧突出的保持部,并且至少一部分容纳于所述框体内的绝缘外壳;具有电连接部的基板;具有安装于所述基板上的半导体发光元件,并且配置于所述绝缘外壳的一端侧的发光模块;配置于所述绝缘外壳内的点灯电路;在一端连接于所述点灯电路,另一端保持于所述绝缘外壳的所述保持部的状态下,与所述基板的所述电连接部软钎焊连接的电线。In order to solve the above-mentioned problems, the lamp of the embodiment includes: a hollow frame with one end open; A semiconductor light-emitting element mounted on the substrate and a light-emitting module disposed on one end side of the insulating case; a lighting circuit disposed in the insulating case; one end is connected to the lighting circuit, and the other end is held in the insulating case. In the state of the holding portion of the insulating case, the electric wires connected to the electrical connection portion of the substrate are soldered.
根据本实用新型,能够使结构变得简单,并且改善直接软钎焊的操作性。According to the present invention, the structure can be simplified, and the operability of direct soldering can be improved.
附图说明Description of drawings
图1是用于说明第1实施方式的灯的图。FIG. 1 is a diagram for explaining a lamp according to a first embodiment.
图2是第1实施方式的灯的俯视图。Fig. 2 is a plan view of the lamp of the first embodiment.
图3是第1实施方式的灯的卸下框体后的绝缘外壳的侧视图。Fig. 3 is a side view of the insulating case with the housing removed of the lamp according to the first embodiment.
图4是第1实施方式的灯的保持部附近的放大图。4 is an enlarged view of the vicinity of a lamp holding portion of the first embodiment.
图中:1-框体,2-绝缘外壳,26-保持部,3-散热板,4-发光模块,41-基板,5-灯罩,6-点灯电路,61-电线,7-灯头,8-绝缘环。In the figure: 1-frame body, 2-insulating shell, 26-holding part, 3-radiating plate, 4-light-emitting module, 41-substrate, 5-lampshade, 6-lighting circuit, 61-wire, 7-lamp holder, 8 - insulating ring.
具体实施方式Detailed ways
(第1实施方式)(first embodiment)
参照图1~图4,对第1实施方式进行说明。图1是用于说明第1实施方式的灯的图,图2是第1实施方式的灯的俯视图,图3是第1实施方式的灯的卸下框体后的绝缘外壳的侧视图,图4是第1实施方式的灯的保持部附近的放大图。A first embodiment will be described with reference to FIGS. 1 to 4 . 1 is a diagram for explaining the lamp of the first embodiment, FIG. 2 is a plan view of the lamp of the first embodiment, and FIG. 4 is an enlarged view of the vicinity of the lamp holding portion of the first embodiment.
本实施方式的灯是用于照明或显示用途的LED灯,该灯包括:框体1、绝缘外壳2、散热板3、发光模块4、灯罩5、点灯电路6、灯头7和绝缘环8。另外,在本实施方式中,灯中心轴上的从灯头7侧观察时灯罩5所在位置的方向称为一端侧,从灯罩5侧观察时灯头7所在位置的方向称为另一端侧而进行说明。The lamp in this embodiment is an LED lamp for lighting or display purposes, and the lamp includes: a frame body 1 , an insulating case 2 , a heat sink 3 , a light emitting module 4 , a lampshade 5 , a lighting circuit 6 , a lamp cap 7 and an insulating ring 8 . In addition, in this embodiment, the direction in which the lamp cover 5 is located when viewed from the base 7 side on the central axis of the lamp is referred to as one end side, and the direction in which the lamp base 7 is located when viewed from the lamp cover 5 side is referred to as the other end side. .
框体1是由热传导性较好的材料,例如铝或陶瓷,和具有高散热性的树脂等制成的圆筒形的外壳。框体1在一端侧和另一端侧具有开口,这些开口是连通的。框体1呈内径及外径从一端侧向另一端侧变小的缩径形状。即,一端侧的开口的直径大于另一端侧的开口的直径。并且,厚度在所有部分基本相同,为0.2mm~1.0mm左右。可以通过冲压加工形成这种框体1。The frame body 1 is a cylindrical casing made of a material with good thermal conductivity, such as aluminum or ceramics, and resin with high heat dissipation. The frame body 1 has openings on one end side and the other end side, and these openings are connected. The frame body 1 has a reduced-diameter shape in which the inner diameter and the outer diameter become smaller from one end side to the other end side. That is, the diameter of the opening on one end side is larger than the diameter of the opening on the other end side. In addition, the thickness is basically the same in all parts, and is about 0.2 mm to 1.0 mm. Such a frame body 1 can be formed by press working.
绝缘外壳2是例如由聚对苯二甲酸乙二酯等电绝缘性较好且热传导性比金属低的材料制成并且至少一部分配置于框体1的内部的外壳。绝缘外壳2具有圆筒形的主体部21。与框体1相同,主体部21在一端侧和另一端侧具有开口,这些开口是连通的。并且,内径从一端侧向另一端侧变小。绝缘外壳2的外表面顺应框体1的内表面的形状而形成为直径从一端侧向另一端侧变小的缩径形状,并在其另一端侧形成有螺旋状的突起。另外,在绝缘外壳2容纳于框体1内部的状态下,螺旋状的突起的附近从框体1的另一端侧的开口向外部突出。The insulating case 2 is, for example, made of a material such as polyethylene terephthalate with good electrical insulation and lower thermal conductivity than metal, and at least a part of it is disposed inside the housing 1 . The insulating case 2 has a cylindrical main body portion 21 . Like the frame body 1 , the main body portion 21 has openings on one end side and the other end side, and these openings communicate. Also, the inner diameter becomes smaller from one end side to the other end side. The outer surface of the insulating case 2 is formed in a reduced-diameter shape whose diameter decreases from one end side to the other end side in conformity with the shape of the inner surface of the frame body 1 , and a spiral protrusion is formed on the other end side. In addition, in a state where the insulating case 2 is accommodated inside the housing 1 , the vicinity of the spiral protrusion protrudes to the outside from the opening on the other end side of the housing 1 .
在绝缘外壳2的内部设置有圆筒部22、电路保持部23、突出部24以及卡合部25。圆筒部22是具有螺纹孔的筒,该螺纹孔设置成位于绝缘外壳2的一端侧的开口附近的位置。电路保持部23是具有卡止片的有底开口的长尺寸箱体。突出部24是从绝缘外壳2的一端侧的开口进一步向一端侧突出的多角形状的柱体。卡合部25是从绝缘外壳2的一端侧的开口进一步向一端侧突出的钩爪。在本实施方式中,圆筒部22和电路保持部23各设置有一对,突出部24和卡合部25各设置有3个。A cylindrical portion 22 , a circuit holding portion 23 , a protruding portion 24 , and an engaging portion 25 are provided inside the insulating case 2 . The cylindrical portion 22 is a cylinder having a screw hole provided at a position near an opening on one end side of the insulating case 2 . The circuit holding part 23 is a bottom-opened elongated box having locking pieces. The protruding portion 24 is a polygonal pillar protruding further toward one end side from an opening on one end side of the insulating case 2 . The engaging portion 25 is a claw protruding from an opening on the one end side of the insulating case 2 to the one end side. In the present embodiment, a pair of cylindrical parts 22 and a pair of circuit holding parts 23 are provided, and three protrusion parts 24 and three engaging parts 25 are provided.
在绝缘外壳2的一端侧的开口附近,从其开口进一步向一端侧方向突出形成有保持部26。如图2~图4所示,保持部26具有第1保持部261和第2保持部262。第1保持部261是沿与后述的发光模块4的基板41的安装面大致平行的方向(Y方向)延伸的槽状的凹部。其底部2611的表面的高度设定成与基板41的安装面的高度几乎相同。第2保持部262是与基板41的安装面大致平行(Y方向)地形成的狭缝。并且,在保持部26附近,尤其在保持部26的另一端侧的绝缘外壳2的侧面上,形成有电线插通部27。Near the opening on the one end side of the insulating case 2 , a holding portion 26 is formed protruding from the opening in the direction of the one end side. As shown in FIGS. 2 to 4 , the holding portion 26 has a first holding portion 261 and a second holding portion 262 . The first holding portion 261 is a groove-shaped recess extending in a direction (Y direction) substantially parallel to the mounting surface of the substrate 41 of the light emitting module 4 described later. The height of the surface of the bottom 2611 is set to be substantially the same as the height of the mounting surface of the substrate 41 . The second holding portion 262 is a slit formed substantially parallel to the mounting surface of the substrate 41 (in the Y direction). In addition, a wire insertion portion 27 is formed in the vicinity of the holding portion 26 , particularly on the side surface of the insulating case 2 on the other end side of the holding portion 26 .
散热板3是由热传导性好的材料,例如铝等金属,制成的薄板,其配置成覆盖绝缘外壳2的一端侧的开口。散热板3具有螺纹孔31、位于边缘部的第1切口32、第2切口33及插通部34,在将散热板3配置于绝缘外壳2的情况下,螺纹孔31对准圆筒部22的螺纹孔,并且突出部24从第1切口32向散热板3的一端侧突出,卡合部25从第2切口33向散热板3的一端侧突出,保持部26从插通部34向散热板3的一端侧突出。由此,散热板3得以定位,并且通过将螺丝91拧进螺纹孔31,使散热板3固定于绝缘外壳2。The heat sink 3 is a thin plate made of a material having good thermal conductivity, for example, metal such as aluminum, and is disposed so as to cover an opening on one end side of the insulating case 2 . The heat sink 3 has a threaded hole 31 , a first notch 32 at the edge, a second notch 33 , and an insertion portion 34 . and the protruding part 24 protrudes from the first notch 32 to one end side of the heat dissipation plate 3, the engaging part 25 protrudes from the second notch 33 to one end side of the heat dissipation plate 3, and the holding part 26 extends from the insertion part 34 to the heat dissipation One end side of the plate 3 protrudes. Thus, the heat dissipation plate 3 is positioned, and the heat dissipation plate 3 is fixed to the insulating case 2 by screwing the screw 91 into the threaded hole 31 .
发光模块4具有基板41、LED42和电连接部43,并且配置成与散热板3的一端侧面接触。基板41是由热传导性好的材料,例如铝或陶瓷,制成的薄板。基板41呈切掉四角的大致矩形形状,在该切除部分的边上形成有螺丝用切口(未图示),通过拧进螺丝92将散热板3与基板41机械连接、热连接。LED42是被称作发光二极管的半导体发光元件,与形成在基板41上的配线图案(未图示)电连接。具体而言,发光二极管为在树脂等组件上安装放射蓝色光的发光芯片,并以覆盖该发光芯片的方式被黄色的荧光体层覆盖的发光二极管,在本实施方式中配置有5个发光二极管。电连接部43是用于向各LED42供电的输入端子,与配线图案电连接。The light emitting module 4 has a substrate 41 , LEDs 42 , and an electrical connection portion 43 , and is disposed so as to be in contact with one end side of the heat sink 3 . The substrate 41 is a thin plate made of a material with good thermal conductivity, such as aluminum or ceramics. The substrate 41 has a substantially rectangular shape with four corners cut off, and notches for screws (not shown) are formed on the side of the cut-off portion, and the heat sink 3 is mechanically and thermally connected to the substrate 41 by screwing in the screws 92 . The LED 42 is a semiconductor light emitting element called a light emitting diode, and is electrically connected to a wiring pattern (not shown) formed on the substrate 41 . Specifically, the light-emitting diode is a light-emitting diode that emits blue light on a component such as resin, and is covered with a yellow phosphor layer so as to cover the light-emitting chip. In this embodiment, five light-emitting diodes are arranged. . The electric connection part 43 is an input terminal for feeding power to each LED42, and is electrically connected to a wiring pattern.
灯罩5是以聚碳酸酯为主要成分的透明或乳白色的透光性罩。灯罩5呈半球状,在其开口侧形成有被卡合部51和突起52。在被卡合部51上形成有开口。突起52设置于其与被卡合部51之间配置有绝缘外壳2的突出部24的位置。因此,就灯罩5而言,通过使绝缘外壳2的卡合部25与灯罩5的被卡合部51卡合,可以使灯罩5保持在绝缘外壳2上,能够将灯罩5以覆盖发光模块4的方式配置在框体1上。The lampshade 5 is a transparent or milky white translucent cover with polycarbonate as the main component. The globe 5 has a hemispherical shape, and an engaged portion 51 and a protrusion 52 are formed on the opening side thereof. An opening is formed in the engaged portion 51 . The protrusion 52 is provided at a position where the protruding portion 24 of the insulating case 2 is disposed between the engaged portion 51 and the protrusion 52 . Therefore, as far as the lampshade 5 is concerned, by engaging the engaging portion 25 of the insulating housing 2 with the engaged portion 51 of the lampshade 5, the lampshade 5 can be held on the insulating housing 2, and the lampshade 5 can be used to cover the light-emitting module 4. The way is configured on the frame 1.
点灯电路6是用来向发光模块4供给所希望的电力的电路,其容纳于绝缘外壳2的内部。点灯电路6具有:电路基板,在环氧树脂等具有电绝缘性的基板上设有预定的金属配线;安装在电路基板上的电路元件;电线61。电路元件由变压器、FET(场效应晶体管)、电容器等电子元件构成。通过使电路基板容纳于绝缘外壳2的电路保持部23的槽内,并且通过卡止片卡止电路基板的一端侧,从而使点灯电路6容纳并固定于绝缘外壳2的内部。The lighting circuit 6 is a circuit for supplying desired electric power to the light emitting module 4 and is housed in the insulating case 2 . The lighting circuit 6 includes: a circuit board on which predetermined metal wiring is provided on an electrically insulating board such as epoxy resin; circuit elements mounted on the circuit board; and electric wires 61 . Circuit elements are composed of electronic components such as transformers, FETs (field effect transistors), and capacitors. The lighting circuit 6 is accommodated and fixed inside the insulating case 2 by accommodating the circuit board in the groove of the circuit holding portion 23 of the insulating case 2 and locking one end side of the circuit board by the locking piece.
灯头7是用于安装于器具的灯座的供电部,其安装于绝缘外壳2的另一端的螺旋状的突起上,与点灯电路6电连接。灯头7具有:螺旋状部,即形成于侧面的螺旋状的金属部分;孔眼,即形成于底面的金属部分;绝缘部(未图示),即设置在螺旋状部和孔眼之间,使螺旋状部和孔眼彼此电绝缘的部分。The base 7 is a power supply unit for being attached to a lamp socket of a device, is attached to a spiral protrusion at the other end of the insulating case 2 , and is electrically connected to the lighting circuit 6 . The lamp cap 7 has: a helical part, which is a helical metal part formed on the side; an eyelet, which is a metal part formed on the bottom surface; an insulating part (not shown), which is arranged between the helical part and the hole, so that the helical The portion where the shape and the eyelet are electrically insulated from each other.
绝缘环8是由具有绝缘性的部件构成的环状部件,设置于从框体1突出的绝缘外壳2的部分的外周部,以使绝缘环8位于框体1和灯头7之间。The insulating ring 8 is an annular member made of an insulating member, and is provided on the outer periphery of the portion of the insulating case 2 protruding from the frame body 1 so that the insulating ring 8 is located between the frame body 1 and the base 7 .
以下,对本实施方式的灯的组装进行说明。Hereinafter, assembly of the lamp of this embodiment will be described.
将点灯电路6固定于电路保持部23后,将绝缘外壳2容纳于框体1的内部。此时,使一端连接于点灯电路6的电线61的另一端通过电线插通部27引出至绝缘外壳2的一端侧。然后,将绝缘环8安装于从框体1的另一端侧的开口突出的绝缘外壳2的外周部,接着将灯头7与点灯电路6电连接之后,将灯头7螺合于螺旋状的突起。After fixing the lighting circuit 6 to the circuit holding portion 23 , the insulating case 2 is accommodated in the housing 1 . At this time, the other end of the electric wire 61 connected to the lighting circuit 6 at one end is led out to the one end side of the insulating case 2 through the electric wire insertion portion 27 . Then, the insulating ring 8 is attached to the outer peripheral portion of the insulating case 2 protruding from the opening on the other end side of the frame body 1, and the cap 7 is electrically connected to the lighting circuit 6, and then the cap 7 is screwed to the spiral protrusion.
接着,将散热板3配置于绝缘外壳2的一端侧以使散热板3的第1切口32、第2切口33、插通部34分别对准绝缘外壳2的突出部24、卡合部25、保持部26,并用螺丝91螺纹固定。此时,如果预先通过螺丝92将发光模块4连接于散热板3,则操作会比较顺利。然后,将通过电线插通部27引出至绝缘外壳2的一端侧的电线61保持于保持部26的第2保持部262,接着将电线61大致弯曲90度后保持于第1保持部261,将前端部配置于电连接部43。由此,电线61的沿基板41的安装面方向(尤其是X方向)的移动被限制,容易对电线61的另一端部和电连接部43进行定位。接着,对电连接部43和电线61进行软钎焊连接,形成钎焊连接部44,从而完成电连接部43和电线61之间的电连接、机械连接。最后,将灯罩5安装在绝缘外壳2上,以使卡合部25卡合于被卡合部51的孔,从而将灯罩5配置在框体1的一端侧。Next, dispose the heat sink 3 on one end side of the insulating case 2 so that the first cutout 32, the second cutout 33, and the insertion portion 34 of the heat sink 3 are respectively aligned with the protruding portion 24, the engaging portion 25, The holding part 26 is screwed and fixed with a screw 91 . At this time, if the light emitting module 4 is connected to the heat dissipation plate 3 through the screw 92 in advance, the operation will be relatively smooth. Then, the electric wire 61 drawn out to one end side of the insulating case 2 through the electric wire insertion portion 27 is held in the second holding portion 262 of the holding portion 26, and then the electric wire 61 is held in the first holding portion 261 after being bent approximately 90 degrees, and the The front end portion is disposed on the electrical connection portion 43 . Accordingly, the movement of the electric wire 61 in the direction of the mounting surface of the substrate 41 (especially in the X direction) is restricted, and the other end of the electric wire 61 and the electrical connection portion 43 are easily positioned. Next, the electrical connection part 43 and the electric wire 61 are connected by soldering to form the solder connection part 44 , thereby completing the electrical and mechanical connection between the electrical connection part 43 and the electric wire 61 . Finally, the globe 5 is mounted on the insulating case 2 so that the engaging portion 25 is engaged with the hole of the engaged portion 51 , and the globe 5 is disposed on one end side of the housing 1 .
在第1实施方式中,通过将从点灯电路6延伸过来的电线61保持于向绝缘外壳2的一端侧突出的保持部26,能够容易地将电线61配置于发光模块4的电连接部43,因此,能够容易进行电连接部43和电线61的软钎焊连接。并且,通过使保持部26通过散热板3的插通部34而向散热板3的一端侧突出,能够利用散热板3将发光模块4所产生的热进行散热,并且能够容易地使电线61保持于保持部26,甚至能够容易进行电连接部43和电线61的软钎焊连接。In the first embodiment, by holding the electric wire 61 extending from the lighting circuit 6 in the holding portion 26 protruding toward one end side of the insulating case 2, the electric wire 61 can be easily arranged in the electrical connection portion 43 of the light emitting module 4, Therefore, the solder connection between the electrical connection portion 43 and the electric wire 61 can be easily performed. In addition, by making the holding portion 26 protrude toward one end side of the heat sink 3 through the insertion portion 34 of the heat sink 3, the heat generated by the light emitting module 4 can be dissipated by the heat sink 3, and the electric wire 61 can be easily held. In the holding part 26, even the solder connection of the electrical connection part 43 and the electric wire 61 can be performed easily.
而且,通过在保持部26的第1保持部261上保持沿与基板41的LED42的安装面大致平行的方向延伸的电线61,能够在沿安装面的方向上、尤其是在X方向上对电连接部43和电线61进行定位,能够更加容易地进行电连接部43和电线61的软钎焊连接。而且,由于第1保持部261为凹部,且凹部的底面2611的高度与基板41的安装面高度相同,因此,能够在与安装面垂直方向上,即在Z方向上对电连接部43和电线61进行定位,能够更加容易地进行电连接部43和电线61的软钎焊连接。而且,通过在保持部26的第2保持部262上保持沿与基板41的安装面大致垂直的方向延伸的电线61,从而能够将电线61稳定地保持在第1保持部261上,能够抑制电线61从第1保持部261脱落。Moreover, by holding the electric wire 61 extending in a direction substantially parallel to the mounting surface of the LED 42 of the substrate 41 on the first holding portion 261 of the holding portion 26, it is possible to connect the electric wires in the direction along the mounting surface, particularly in the X direction. The connection part 43 and the electric wire 61 are positioned, and the solder connection between the electric connection part 43 and the electric wire 61 can be performed more easily. Moreover, since the first holding portion 261 is a recess, and the height of the bottom surface 2611 of the recess is the same as the height of the mounting surface of the substrate 41, it is possible to align the electrical connection portion 43 and the electric wire in the direction perpendicular to the mounting surface, that is, in the Z direction. 61 is positioned, and the soldering connection between the electrical connection part 43 and the electric wire 61 can be performed more easily. Moreover, by holding the electric wire 61 extending in a direction substantially perpendicular to the mounting surface of the board 41 on the second holding portion 262 of the holding portion 26, the electric wire 61 can be stably held on the first holding portion 261, and the electric wire 61 can be restrained from 61 falls off from the first holding portion 261 .
此外,通过使电线61穿过绝缘外壳2的电线插通部27而保持于第2保持部262,并在第1保持部261和第2保持部262之间进行弯曲后保持于第1保持部261,从而能够将从容纳于绝缘外壳2内部的点灯电路6延伸过来的电线61有效且精确地引导至发光模块4的电连接部43。In addition, the electric wire 61 is held by the second holding portion 262 by passing through the electric wire insertion portion 27 of the insulating case 2, and is held by the first holding portion after being bent between the first holding portion 261 and the second holding portion 262. 261 , so that the wire 61 extending from the lighting circuit 6 accommodated inside the insulating case 2 can be effectively and accurately guided to the electrical connection portion 43 of the light emitting module 4 .
本实用新型并不限定于上述实施方式,可以进行各种变形。The present invention is not limited to the above-mentioned embodiment, and various modifications are possible.
例如,可以按照需求自由改变LED42的个数。并且,也可以用激光二极管,或用含有荧光体的树脂对多个LED芯片进行封装的COB(ChipOn Board,板上芯片)方式的光源,从而替换LED42。For example, the number of LEDs 42 can be freely changed according to requirements. In addition, the LED 42 may be replaced with a laser diode or a COB (Chip On Board) light source in which a plurality of LED chips are packaged with a phosphor-containing resin.
圆筒部22、电路保持部23、突出部24及卡合部25等的数量也不限定于实施方式中的数量,可以进行改变。The number of the cylindrical part 22, the circuit holding part 23, the protrusion part 24, the engaging part 25, etc. is not limited to the number in embodiment, and can be changed.
以上,对本实用新型的几个实施方式进行了说明。本实用新型的上述实施方式只是举例说明,并没有限定实用新型范围的意图。这些新的实施方式能够以其它各种方式实施,在不脱离本实用新型宗旨的范围内,可进行各种省略、置换、变更。这些实施方式或其变形均属于本实用新型的范围或宗旨内,并且也包含在技术方案中记载的发明及其等同的范围内。Several embodiments of the present invention have been described above. The above-mentioned embodiments of the utility model are just examples, and are not intended to limit the scope of the utility model. These new embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the present invention. These embodiments and modifications thereof all belong to the scope or gist of the present invention, and are also included in the invention described in the claims and the equivalent scope thereof.
Claims (7)
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JP2014-054400 | 2014-03-18 | ||
JP2014054400A JP2015176843A (en) | 2014-03-18 | 2014-03-18 | lamp |
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CN204062613U true CN204062613U (en) | 2014-12-31 |
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