CN1981365A

CN1981365A - Exposure equipment, exposure method and device manufacturing method

Info

Publication number: CN1981365A
Application number: CN 200580015635
Authority: CN
Inventors: 长坂博之; 奥山猛
Original assignee: Nikon Corp; Nikon Engineering Co Ltd
Current assignee: Nikon Corp; Nikon Engineering Co Ltd
Priority date: 2004-06-10
Filing date: 2005-06-09
Publication date: 2007-06-13
Anticipated expiration: 2025-06-09
Also published as: CN100547730C; CN101639631A; CN101639631B

Abstract

Exposure apparatus exposes a substrate by irradiating the substrate with exposure light via a projection optical system and a liquid. The exposure apparatus is provided with a liquid immersion mechanism for supplying the liquid and recovering the liquid. The liquid immersion mechanism has an inclined surface, which is opposite to a surface of the substrate and is inclined with respect to the surface of the substrate, and a liquid recovering port of the liquid immersion mechanism is formed in the inclined surface. A flat portion is provided between the substrate and the projection optical system. A liquid immersion area can be maintained to be small.

Description

Exposure apparatus, exposure method, and device manufacturing method

Technical Field

The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method for exposing a substrate through a liquid.

Background

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography method in which a pattern formed on a mask is transferred onto a photosensitive substrate. The exposure apparatus used in this photolithography step includes a reticle stage that supports a reticle and a substrate stage that supports a substrate, and transfers the pattern of the reticle to the substrate through a projection optical system while sequentially moving the reticle stage and the substrate stage. In recent years, a projection optical system is expected to have higher resolution in order to cope with higher integration of element patterns. The resolution of the projection optical system is improved as the exposure wavelength used is shorter or as the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used by the exposure apparatus becomes shorter year by year, and the numerical aperture of the projection optical system gradually increases. Although the exposure wavelength of the mainstream of the laser is 248nm of KrF excimer laser, 193nm of ArF excimer laser having a shorter wavelength has been put into practical use. In addition, the depth of focus (DOF) is also important as well as the resolution when performing exposure. The resolution R and the depth of focus δ are expressed by the following formulas.

R＝k₁·λ/NA...(1)

δ＝±k₂·λ/NA²...(2)

Where λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, k₁、k₂Are the processing coefficients. As is clear from the expressions (1) and (2), when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to improve the resolution R, the depth of focus δ is narrowed.

If the depth of focus δ becomes too narrow, it becomes difficult to align the substrate surface with the image plane of the projection optical system, and the focus margin may be insufficient during the exposure operation. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in international publication No. 99/49504 has been proposed. In this liquid immersion method, a liquid immersion area is formed by filling a space between the lower surface of the projection optical system and the surface of the substrate with a liquid such as water or an organic solvent, and the resolution is improved by utilizing the fact that the substantial wavelength of exposure light in the liquid is 1/n times (n is a refractive index of the liquid, and is usually about 1.2 to 1.6) in the air, and the depth of focus can be enlarged to n times.

As disclosed in patent document 1, there is a scanning exposure apparatus that exposes a pattern formed on a mask plate to a substrate while moving the mask plate and the substrate in a scanning direction in synchronization with each other. In a scanning exposure apparatus, a higher scanning speed is required for the purpose of improving the productivity of devices. However, when the scanning speed is made higher, it may be difficult to maintain the state of the liquid immersion area in a desired state (size or the like), and the exposure accuracy and the measurement accuracy of the permeated liquid may be deteriorated. Therefore, it is required to maintain the liquid immersion area of the liquid in a desired state even when the scanning speed is increased.

For example, if the liquid immersion area cannot be maintained in a desired state and bubbles or gaps (Void) are generated in the liquid, the exposure light passing through the liquid cannot reach the substrate satisfactorily due to the bubbles or gaps, and defects such as defects occur in the pattern formed on the substrate. Further, when the liquid immersion area is partially formed on a part of the substrate while supplying and collecting the liquid, it may be difficult to sufficiently collect the liquid in the liquid immersion area due to an increase in the scanning speed. When the liquid cannot be sufficiently recovered, for example, the liquid remaining on the substrate vaporizes to form a mark (so-called water mark, and hereinafter, a case where the liquid adheres even when the liquid is not water is referred to as water mark). The water mark may affect the photoresist on the substrate and may cause deterioration of the performance of the produced element due to the effect. Further, as the scanning speed is higher, it may be difficult to maintain the liquid immersion area at a desired size. Further, the liquid in the liquid immersion area may flow out at a higher scanning speed.

Disclosure of Invention

The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure apparatus and an exposure method capable of maintaining a liquid immersion area in a desired state and performing an exposure process satisfactorily, and a device manufacturing method using the exposure apparatus.

In order to solve the above problems, the present invention employs the following configuration corresponding to fig. 1 to 33 shown in the embodiments. However, the parenthesized reference attached to each element is only an example of the element and does not limit each element.

According to the invention 1, there is provided an exposure apparatus (EX) for exposing a substrate (P) by irradiating the substrate (P) with Exposure Light (EL) through a Liquid (LQ), comprising: a projection optical system (PL); and a liquid immersion mechanism (11, 21, etc.) that supplies the Liquid (LQ) and recovers the Liquid (LQ); the liquid immersion mechanism has a slope (2) which faces the surface of the substrate (P) and is inclined relative to the surface of the substrate, and a liquid recovery port (22) of the liquid immersion mechanism is formed on the slope (2).

According to the invention 1, since the liquid recovery port of the liquid immersion mechanism is formed in the inclined surface facing the substrate surface, even when the liquid immersion area formed on the image plane side of the projection optical system and the substrate are moved relative to each other, the amount of movement of the interface (gas-liquid interface) between the liquid in the liquid immersion area and the space outside the liquid immersion area can be suppressed, and a large change in the shape of the interface can be suppressed. Therefore, the state (size, etc.) of the liquid immersion area can be maintained in a desired state. Further, the expansion of the liquid immersion area can be suppressed.

According to the invention 2, there is provided an exposure apparatus (EX) for exposing a substrate (P) by irradiating Exposure Light (EL) onto the substrate (P) through a Liquid (LQ), comprising: a projection optical system (PL); and a liquid immersion mechanism (11, 21, etc.) that supplies the Liquid (LQ) and recovers the Liquid (LQ); a liquid immersion mechanism having a flat portion (75) formed so as to face the surface of the substrate (P) and substantially parallel to the surface of the substrate (P); a flat section (75) of the liquid immersion mechanism, which is disposed between the substrate (P) and an image plane side end surface (T1) of the projection optical system (PL) so as to surround a projection area (AR1) irradiated with Exposure Light (EL); the liquid supply port (12) of the liquid immersion mechanism is disposed outside the flat portion (75) with respect to a projection area (AR1) irradiated with Exposure Light (EL).

According to the invention 2 of the present invention, since the small gap formed between the substrate surface and the flat portion can be formed in the vicinity of the projection area and formed so as to surround the projection area, not only can a sufficiently small liquid immersion area required for covering the projection area be maintained, but also since the liquid supply port is provided outside the flat portion, it is possible to prevent gas from being mixed into the liquid forming the liquid immersion area, and to continuously fill the optical path of the exposure light with the liquid.

According to the invention 3, there is provided an exposure apparatus (EX) for exposing a substrate (P) by irradiating the substrate (P) with Exposure Light (EL) through a Liquid (LQ), comprising: a projection optical system (PL); and a liquid immersion mechanism (11, 21, etc.) that supplies the Liquid (LQ) and recovers the Liquid (LQ); the liquid immersion mechanism includes: the liquid supply port (12) is provided at the 1 st position outside the optical path space of the Exposure Light (EL) and supplies the Liquid (LQ), and the guiding member (172D) guides the liquid so that the Liquid (LQ) supplied from the liquid supply port (12) flows to the 2 nd position different from the 1 st position outside the optical path space through the optical path space.

According to the invention 3 of the present invention, since the liquid supplied from the liquid supply port provided at the 1 st position outside the optical path space for exposure light flows to the 2 nd position different from the 1 st position outside the optical path space through the guide member, it is possible to suppress generation of an improper situation in which a gas portion (bubble) is formed in the liquid filled in the optical path space for exposure light, and to maintain the liquid in a desired state.

According to the 4 th aspect of the present invention, there is provided an exposure apparatus (EX) for exposing a substrate (P) by irradiating the substrate (P) with Exposure Light (EL) through a Liquid (LQ), the apparatus comprising: an optical system (PL) having an end surface (T1) that faces the substrate (P) and through which Exposure Light (EL) irradiated onto the substrate (P) passes; and a liquid immersion mechanism (11, 21, etc.) for supplying the Liquid (LQ) and recovering the liquid; the liquid immersion apparatus includes a plate member (172D) having a flat surface (75) disposed between a substrate (P) and an optical system end surface (T1) so as to face the substrate (P) in parallel and so as to surround an optical path of Exposure Light (EL); a Liquid (LQ) is supplied from a supply port (12) provided in the vicinity of an optical system end surface (T1) to a space (G2) between the optical system end surface (T1) and a plate member (172D), and the liquid is recovered from a recovery port (22), and the recovery port (22) is disposed so as to face a substrate (P) at a position that is farther from the optical path of Exposure Light (EL) than a flat surface (75) of the plate member.

According to the exposure apparatus of claim 4 of the present invention, since the minute gap formed between the flat surface of the plate member and the substrate is formed so as to surround the exposure light and the liquid recovery port is further disposed outside the flat surface, the stable liquid immersion area in a desired state can be maintained on the substrate. Further, since the liquid is supplied to the space between the plate member and the end face of the optical system, bubbles or gaps (Void) are less likely to be generated in the liquid immersion region formed in the optical path of the exposure light.

Further, according to the invention of claim 5, there is provided an exposure apparatus (EX) for exposing a substrate (P) by irradiating a substrate (P) with Exposure Light (EL) through a Liquid (LQ), comprising: an optical member (LS1) which has an end surface (T1) that comes into contact with the liquid (P) and through which Exposure Light (EL) passes; and a liquid immersion mechanism (11, 21, etc.) for supplying the Liquid (LQ) and recovering the Liquid (LQ); the liquid immersion apparatus has a flat surface (75) which is disposed in parallel to the substrate (P) and faces the substrate (P) and surrounds the optical path of the Exposure Light (EL); and inclined surfaces (2, 2') inclined with respect to the flat surface (75) outside the flat surface with respect to the optical path of the Exposure Light (EL).

According to the exposure apparatus of claim 5 of the present invention, since the minute gap formed between the flat surface of the plate member and the substrate is formed so as to surround the exposure light, a stable liquid immersion area in a desired state can be maintained on the substrate. Further, since the slope is formed outside the flat surface, the liquid can be prevented from being enlarged and leaking.

According to the 6 th aspect of the present invention, there is provided an exposure method for exposing a substrate (P) by irradiating the substrate (P) with Exposure Light (EL) through an optical member (LS1) and a Liquid (LQ), the method comprising: the substrate (P) is arranged to face the end face (T1) of the optical member (LS 1); supplying a liquid to a space (G2) between one surface of a plate member (172D) disposed between an end surface (T1) of the optical member and the substrate (P) so as to surround the optical path of the Exposure Light (EL) and the end surface (T1) of the optical member, so that the space between the end surface (T1) of the optical member and the substrate (P) and the space between the other surface of the plate member and the substrate are filled with the liquid; recovering a Liquid (LQ) from a recovery port (22) disposed so as to face the substrate (P) in parallel with the supply of the liquid to form a liquid immersion area (AR2) on a part of the substrate (P); the substrate (P) is exposed by irradiating the substrate with exposure light through a Liquid (LQ) which penetrates a part of the substrate to form a liquid immersion area (AR 2).

According to the exposure method of claim 6 of the present invention, since the minute gap formed between the flat surface of the plate member and the substrate is formed so as to surround the exposure light, a stable liquid immersion area in a desired state can be maintained on the substrate. Further, since the liquid is supplied to the space between the plate member and the end face of the optical system, bubbles or gaps are less likely to be generated in the liquid immersion area formed in the optical path of the exposure light.

According to the invention of claim 7, there is provided a device manufacturing method using the exposure apparatus (EX) of the above embodiment.

According to the invention 7, even when the scanning speed is increased, the exposure process can be favorably performed while maintaining the liquid immersion area of the liquid in a desired state, and therefore, an element having desired performance can be manufactured with high productivity.

Drawings

FIG. 1 is a schematic configuration diagram showing a1 st embodiment of an exposure apparatus according to the present invention.

Fig. 2 is a schematic perspective view showing the vicinity of the nozzle member in embodiment 1.

Fig. 3 is a perspective view of the nozzle member of embodiment 1 as viewed from the lower side.

Fig. 4 is a side sectional view showing the vicinity of the mouth member of embodiment 1.

FIG. 5 is a schematic configuration diagram showing an embodiment of the liquid recovery mechanism.

Fig. 6 is a schematic diagram for explaining the principle of the liquid recovery operation of the liquid recovery mechanism.

Fig. 7(a) and (b) are schematic diagrams for explaining the liquid recovery operation according to embodiment 1.

Fig. 8(a) and (b) are schematic diagrams showing a comparative example of the liquid recovery operation.

Fig. 9 is a schematic view showing a mouth member of embodiment 2.

Fig. 10 is a schematic view showing a mouth member of embodiment 3.

Fig. 11 is a schematic view showing a mouth member of embodiment 4.

Fig. 12 is a perspective view of the nozzle member of embodiment 5 as viewed from the lower side.

Fig. 13 is a schematic perspective view showing the vicinity of the nozzle member according to embodiment 6.

Fig. 14 is a perspective view of the nozzle member of embodiment 6 as viewed from the lower side.

Fig. 15 is a side sectional view showing the vicinity of the mouth member of embodiment 6.

Fig. 16 is a diagram for explaining the operation of the nozzle member according to embodiment 6.

Fig. 17 is a perspective view of the nozzle member of embodiment 7 as viewed from below.

Fig. 18 is a side sectional view showing the vicinity of the mouth member of embodiment 7.

Fig. 19 is a schematic perspective view showing the vicinity of the nozzle member according to embodiment 8.

Fig. 20 is a perspective view of the nozzle member of embodiment 8 as viewed from below.

Fig. 21 is a side sectional view showing the vicinity of the mouth member of embodiment 8.

Fig. 22 is a side sectional view showing the vicinity of the mouth member of the 8 th embodiment.

Fig. 23 is a plan view showing a guide member of embodiment 8.

Fig. 24 is a side sectional view showing the vicinity of the mouth member of the 8 th embodiment.

Fig. 25 is a plan view showing a guide member according to embodiment 9.

Fig. 26 is a plan view showing a guide member according to embodiment 10.

Fig. 27 is a plan view showing a guide member according to embodiment 11.

Fig. 28 is a plan view showing a guide member of embodiment 12.

Fig. 29 is a plan view showing a guide member according to embodiment 13.

Fig. 30 is a plan view showing a guide member according to embodiment 14.

Fig. 31 is a plan view showing a guide member according to embodiment 15.

Fig. 32 is a plan view showing a guide member according to embodiment 16.

FIG. 33 is a flowchart illustrating an exemplary fabrication process for the semiconductor device.

Description of the main elements

1 liquid immersion mechanism

2 inclined plane

12 liquid supply port

22 liquid recovery port

25 porous member

70, 70' mouth member

71D, 72D bottom plate part (plate-shaped component)

73 groove part

73A, 74, 74' opening

75 Flat surface (Flat part)

76 wall portion

130A exhaust port

135 suction device (suction system)

140A liquid supply port

172D bottom plate (component, guide component)

181 No. 1 guide part

181F, 182F flow path

182 nd 2 nd guide part

AR1 projection area

Liquid immersion area of AR2

AX optical axis

Light for EL exposure

EX exposure device

G2 gap (space)

LQ liquid

P substrate

PL projection optical system

End face of T1

Detailed Description

The embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto.

Embodiment 1

Fig. 1 is a schematic configuration diagram showing an exposure apparatus according to the present embodiment. In fig. 1, an exposure apparatus EX includes: the mask plate carrying platform MST can keep the mask plate M and move; a substrate stage PST capable of holding and moving a substrate P; an illumination optical system IL for illuminating a mask M held on a mask stage MST with exposure light EL; a projection optical system PL that projects a pattern image of the mask M illuminated with the exposure light EL onto the substrate P held on the substrate stage PST; and a control device CONT for controlling the overall operation of the exposure apparatus EX.

The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus to which a liquid immersion method is applied, which is for substantially shortening an exposure wavelength to improve resolution and substantially enlarging a depth of focus, and includes a liquid immersion mechanism 1 that supplies a liquid LQ and recovers the liquid LQ. The liquid immersion mechanism 1 includes a liquid supply mechanism 10 that supplies the liquid LQ to the image plane side of the projection optical system PL, and a liquid recovery mechanism 20 that recovers the liquid LQ supplied by the liquid supply mechanism 10. The exposure apparatus EX locally forms a liquid immersion area AR2 larger than the projection area AR1 and smaller than the substrate P on a part of the substrate P including the projection area AR1 (formed by the liquid LQ supplied by the liquid supply mechanism 10) of the projection optical system PL at least while the pattern image of the mask M is transferred onto the substrate P. Specifically, the exposure apparatus EX employs a partial immersion method in which a liquid LQ is filled between the optical element LS1 on the image plane side of the projection optical system PL and the surface of the substrate P disposed on the image plane side, and exposure light EL is irradiated to the substrate P through the liquid LQ and the projection optical system PL between the projection optical system PL and the substrate P and the mask M, thereby projection-exposing the pattern image of the mask M to the substrate P. The controller CONT locally forms the liquid immersion area AR2 of the liquid LQ on the substrate P by supplying a predetermined amount of the liquid LQ onto the substrate P by using the liquid supply mechanism 10 and by recovering the predetermined amount of the liquid LQ on the substrate P by using the liquid recovery mechanism 20.

The nozzle member 70 described in detail later is disposed near the image plane side of the projection optical system PL, specifically, near the optical element LS1 at the image plane side end of the projection optical system PL. The nozzle member 70 is an annular member that is disposed above the substrate P (substrate stage PST) so as to surround the projection optical element LS 1. In the present embodiment, the nozzle member 70 constitutes a part of the liquid immersion mechanism 1.

In the present embodiment, a case where a scanning type exposure apparatus (i.e., a scanning stepper) is used as the exposure apparatus EX is described as an example, in which a pattern formed on a mask M is exposed to a substrate P while synchronously moving the mask M and the substrate P in mutually different directions (opposite directions) in a scanning direction. In the following description, a direction coincident with the optical axis AX of the projection optical system PL is defined as a Z-axis direction, a direction (scanning direction) in which the mask M moves in synchronization with the substrate P in a plane perpendicular to the Z-axis direction is defined as an X-axis direction, and a direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. The rotational (tilt) directions around the X, Y, and Z axes are referred to as θ X, θ Y, and θ Z directions, respectively.

The exposure apparatus EX includes: a base BP arranged on the ground and a main column frame 9 arranged on the base BP. The main column 9 is formed with an upper step portion 7 and a lower step portion 8 protruding inward. The illumination optical system IL illuminates the mask M supported by the mask stage MST with exposure light EL, and is supported by the frame 3 fixed to the upper part of the main column 9.

The illumination optical system IL has: an exposure light source, an optical integrator for uniformizing the illuminance of the exposure light EL emitted from the exposure light source, a condenser lens for condensing the exposure light EL from the optical integrator, a relay lens system, a variable field grating for setting an illumination region on the mask M formed by the exposure light EL in a slit shape, and the like. The predetermined illumination region on the reticle M is illuminated with the exposure light EL having a uniform illumination distribution by the illumination optical system IL. MakingAs the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (DUV light) such as bright light (g-line, h-line, i-line) and KrF excimer laser (wavelength 248nm) emitted from a mercury lamp, or ArF excimer laser (wavelength 193nm) and F excimer laser are used₂Vacuum ultraviolet light (VUV light) such as laser light (wavelength 157nm), and the like. In the present embodiment, an ArF excimer laser is used.

In the present embodiment, pure water is used as the liquid. Pure water can transmit not only ArF excimer laser light but also deep ultraviolet light (DUV light) such as bright light (g-line, h-line, i-line) emitted from a mercury lamp and KrF excimer laser light (wavelength 248 nm).

And the mask plate carrying platform MST can keep the mask plate M and move. The reticle stage MST holds the reticle M by, for example, vacuum adsorption (or electrostatic adsorption). Under reticle stage MST, a plurality of air bearings (air bearing)85 which are non-contact bearings are provided. The reticle stage MST is supported on the upper surface (guide surface) of the reticle stage 4 in a non-contact manner by an air bearing 85. Openings MK1 and MK2 for passing the pattern image of reticle M are formed in the central portions of reticle stage MST and reticle stage 4, respectively. The reticle stage 4 is supported on the upper stage 7 of the main column 9 via a vibration isolator 86. That is, reticle stage MST is supported by main column 9 (upper stage 7) through vibration isolator 86 and reticle stage 4. Further, the mask stage 4 and the main column 9 are vibrationally separated by the vibration isolation device 86, and the vibration of the main column 9 is not transmitted to the mask stage 4 that supports the mask stage MST.

Mask stage MST is capable of 2-dimensional movement and slight rotation in the θ Z direction in a plane perpendicular to optical axis AX of projection optical system PL on mask stage 4, that is, in the XY plane, while holding mask M, by mask stage driving device MSTD including a linear motor or the like controlled by driving control device CONT. The reticle stage MST is movable in the X-axis direction at a predetermined scanning speed, and has a movement stroke in the X-axis direction in which the entire surface of the reticle M can at least traverse the optical axis AX of the projection optical system PL.

On mask stage MST, moving mirror 81 that moves together with mask stage MST is provided. A laser interferometer 82 is provided at a position facing the moving mirror 81. The 2-dimensional position of the mask M on the mask stage MST and the rotation angle in the θ Z direction (which may include the rotation angles in the θ X and θ Y directions depending on the case) are measured in real time by the laser interferometer 82. The measurement result of the laser interferometer 82 is output to the control device CONT. The controller CONT controls the position of the mask M held on the mask stage MST by driving the mask stage driving device MSTD based on the measurement result of the laser interferometer 82.

The projection optical system PL projects and exposes the pattern of the reticle M onto the substrate P at a predetermined projection magnification β, and is composed of a plurality of optical elements (including an optical element LS1 provided at the front end portion on the substrate P side) supported by a barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. The projection optical system PL may be any of an equal magnification system and an amplification system. The projection optical system PL may be a catadioptric system including a refractive element and a reflective element, a refractive system not including a reflective element, or a reflective system not including a refractive element. The optical element LS1 at the tip of the projection optical system PL according to the present embodiment is exposed from the barrel PK, and the liquid LQ in the liquid immersion area AR2 contacts the optical element LS 1.

A flange PF is provided on the outer periphery of the lens barrel PK holding the projection optical system PL, and the projection optical system PL is supported by the barrel table 5 through this flange PF. The barrel stand 5 is supported by the lower step portion 8 of the main column 9 through a vibration isolator 87. That is, the projection optical system PL is supported by the main column 9 (lower stage 8) through the vibration isolator 87 and the barrel stage 5. Further, the vibration isolation device 87 isolates the lens barrel table 5 from the main column 9 in terms of vibration, and the vibration of the main column 9 is not transmitted to the lens barrel table 5 that supports the projection optical system PL.

The substrate stage PST can move while supporting the substrate holder PH holding the substrate P, and holds the substrate P by, for example, a vacuum suction method. Under the substrate stage PST, a plurality of air bearings 88, which are non-contact bearings, are provided. The substrate stage PST is supported on the upper surface (guide surface) of the substrate stage 6 in a noncontact manner by an air bearing 88. The substrate stage 6 is supported on the base BP through a vibration isolator 89. Further, the vibration isolation device 89 vibrationally isolates the substrate table 6 from the main column 9 and the base BP (floor surface), and the vibration of the base BP (floor surface) or the main column 9 can be prevented from being transmitted to the substrate table 6 supporting the substrate stage PST.

The substrate stage PST is capable of 2-dimensional movement and slight rotation in the θ Z direction in the XY plane on the substrate table 6 while holding the substrate P through the substrate holder PH by the substrate stage driving device PSTD including a linear motor and the like controlled by the driving control device CONT. Further, the substrate stage PST can also move in the Z-axis direction, the θ X direction, and the θ Y direction.

The substrate stage PST is provided with a moving mirror 83 that moves together with the substrate stage PST with respect to the projection optical system PL. A laser interferometer 84 is provided at a position facing the moving mirror 83. The position and the rotation angle of the substrate P on the substrate stage PST in the 2-dimensional direction are measured in real time by the laser interferometer 84. Although not shown, exposure apparatus EX includes a focus/leveling detection system for detecting surface position information of substrate P supported on substrate stage PST. As the focus/leveling detection system, an oblique incidence system for irradiating the detection light onto the surface of the substrate P from an oblique direction, a system using a capacitance sensor, or the like can be used. The focus/leveling detection system detects position information in the Z-axis direction of the surface of the substrate P and tilt information in the θ X and θ Y directions of the substrate P in a state where the substrate P is permeable to the liquid LQ or impermeable to the liquid LQ. In the case of the focus leveling detection system that detects surface information of the surface of the substrate P in a state of not transmitting the liquid LQ, the surface information of the surface of the substrate P may be detected at a position apart from the projection optical system PL. An exposure apparatus for detecting surface information of a surface of a substrate P at a position apart from a projection optical system PL is disclosed in, for example, U.S. Pat. No. 6,674,510, and the contents of the disclosure of this document are incorporated as a part of the description of the present document within the scope permitted by the national regulations of specification or selection of the present international application.

The measurement result of the laser interferometer 84 is output to the control device CONT. The detection result of the focus/leveling detection system is also output to the control unit CONT. The control device CONT drives the substrate stage driving device PSTD based on the detection result of the focus/leveling detection system, controls the focus position and the tilt angle of the substrate P to align the surface of the substrate P with the image plane of the projection optical system PL, and controls the position of the substrate P in the X-axis direction and the Y-axis direction based on the measurement result of the laser interferometer 84.

The substrate stage PST is provided with a recess 90, and a substrate holder PH for holding the substrate P is disposed in the recess 90. The upper surface 91 of the substrate stage PST other than the concave portion 90 is a flat surface (flat portion) having substantially the same height (same surface height) as the surface of the substrate P held by the substrate holder PH. In the present embodiment, the upper surface of the movable mirror 83 is also set to be substantially flush with the upper surface 91 of the substrate stage PST.

Since the upper surface 91 substantially flush with the surface of the substrate P is provided around the substrate P, even when the edge region of the substrate P is subjected to liquid immersion exposure, since there is almost no step outside the edge portion of the substrate P, the liquid LQ can be held on the image plane side of the projection optical system PL, and the liquid immersion region AR1 can be formed satisfactorily. Further, although there is a gap of about 0.1 to 2mm between the edge portion of the substrate P and a flat surface (upper surface) 91 provided around the substrate P, the liquid LQ hardly flows into the gap due to the surface tension of the liquid LQ, and even when the vicinity of the peripheral edge of the substrate P is exposed, the liquid LQ is held under the projection optical system PL by the upper surface 91.

The liquid supply mechanism 10 of the liquid immersion mechanism 1 for supplying the liquid LQ to the image plane side of the projection optical system PL includes: a liquid supply portion 11 capable of sending out the liquid LQ, and a supply pipe 13 having one end connected to the liquid supply portion 11. The other end of the supply tube 13 is connected to the nozzle member 70. In the present embodiment, the liquid supply mechanism 10 is configured to supply pure water, and the liquid supply unit 11 includes a pure water production device, a temperature adjustment device configured to adjust the temperature of the supplied liquid (pure water) LQ, and the like. Further, as long as the predetermined water quality condition is satisfied, the pure water production apparatus may be used in a factory in which the exposure apparatus EX is disposed (a biasing device) instead of being provided in the exposure apparatus EX. Instead of providing the temperature control device for adjusting the temperature of the liquid (pure water) LQ in the exposure apparatus EX, a facility in a factory may be used. The operation of the liquid supply mechanism 10 (liquid supply unit 11) is controlled by the control unit CONT. In order to form the liquid immersion area AR2 on the substrate P, the liquid supply mechanism 10 supplies a predetermined amount of liquid LQ onto the substrate P disposed on the image plane side of the projection optical system PL under the control of the control device CONT.

A flow rate controller 16, called a mass flow controller, is provided in the middle of the supply pipe 13 to control the amount of liquid per unit time supplied from the liquid supply unit 11 to the image plane side of the projection optical system PL. The amount of liquid supplied to the flow controller 16 is controlled based on a command signal from the control unit CONT.

The liquid recovery mechanism 20 of the liquid immersion mechanism 1, which recovers the liquid LQ on the image plane side of the projection optical system PL, includes a liquid recovery unit 21 capable of recovering the liquid LQ, and a recovery tube 23 having one end connected to the liquid recovery unit 21. The other end of the recovery pipe 23 is connected to the nozzle member 70. The liquid recovery unit 21 includes, for example: a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator for separating the recovered liquid LQ from the gas, a tank for containing the recovered liquid LQ, and the like. Instead of providing all of the vacuum system, the gas-liquid separator, the tank, and the like in the exposure apparatus EX, at least a part of the facilities in the factory in which the exposure apparatus EX is disposed may be used. The operation of the liquid recovery mechanism 20 (liquid recovery unit 21) is controlled by the control unit CONT. The liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ on the substrate P supplied by the liquid supply mechanism 10 under the control of the control unit CONT so as to form the liquid immersion area AR2 on the substrate P.

The nozzle member 70 is held by a nozzle holder 92, and the nozzle holder 92 is connected to the lower step portion 8 of the main column 9. The main column 9 holding the nozzle member 70 through the nozzle holder 92 and the barrel table 5 supporting the barrel PK of the projection optical system PL through the flange PF are separated in terms of vibration through the vibration isolator 87. Accordingly, the vibration generated in the nozzle member 70 can be prevented from being transmitted to the projection optical system PL. The main column 9 supporting the nozzle member 70 via the nozzle holder 92 and the substrate stage 6 supporting the substrate stage PST are separated in terms of vibration via the vibration isolator 89. Accordingly, the vibration generated in the nozzle member 70 can be prevented from being transmitted to the substrate stage PST through the main column frame 9 and the base BP. The main column 9 supporting the nozzle member 70 via the nozzle holder 92 and the reticle stage 4 supporting the reticle stage MST are separated from each other in terms of vibration via the vibration isolation device 86. Accordingly, the vibration generated by the nozzle member 70 can be prevented from being transmitted to the reticle stage MST through the main column frame 9.

Next, the liquid immersion mechanism 1 and the nozzle member 70 constituting a part of the liquid immersion mechanism 1 will be described with reference to fig. 2, 3, and 4. Fig. 2 is a partially broken view showing a schematic perspective view of the vicinity of the nozzle member 70, fig. 3 is a perspective view of the nozzle member 70 as viewed from below, and fig. 4 is a side sectional view.

The nozzle member 70 is an annular member disposed above the substrate P (substrate stage PST) so as to surround the projection optical system PL, and is disposed near the optical element LS1 at the image plane side front end portion of the projection optical system PL. The nozzle member 70 has a hole 70H in the center thereof, in which a projection optical system PL (optical element LS1) can be disposed. A gap is provided between the inner surface of the hole 70H of the nozzle member 70 and the side surface of the optical element LS1 of the projection optical system PL. This gap is provided to vibrationally separate the optical element LS1 of the projection optical system PL from the nozzle member 70. Accordingly, the vibration generated in the nozzle member 70 can be prevented from being directly transmitted to the projection optical system PL (optical element LS 1).

The inner surface of the hole 70H of the nozzle member 70 has liquid repellency (water repellency) to the liquid LQ, and the liquid is prevented from penetrating into a gap between the side surface of the projection optical system PL and the inner surface of the nozzle member 70.

A liquid supply port 12 for supplying the liquid LQ and a liquid recovery port 22 for recovering the liquid LQ are formed below the nozzle member 70. Further, a supply channel 14 connected to the liquid supply port 12 and a recovery channel 24 connected to the liquid recovery port 22 are formed inside the nozzle member 70. The other end of the supply pipe 13 is connected to the supply channel 14, and the other end of the recovery pipe 23 is connected to the recovery channel 24. The liquid supply port 12, the supply flow path 14, and the supply pipe 13 constitute a part of the liquid supply mechanism 10, and the liquid recovery port 22, the recovery flow path 24, and the recovery pipe 23 constitute a part of the liquid recovery mechanism 20.

The liquid supply port 12 is provided above the substrate P supported by the substrate stage PST, and is opposed to the surface of the substrate P. The liquid supply port 12 is spaced apart from the surface of the substrate P by a predetermined distance. The liquid supply port 12 is disposed so as to surround a projection area AR1 of the projection optical system PL irradiated with the exposure light EL. In the present embodiment, the liquid supply port 12 is formed in an annular slit shape surrounding the projection area AR1 on the lower surface of the nozzle member 70. In the present embodiment, the projection area AR1 is a rectangle whose longitudinal direction is the Y-axis direction (non-scanning direction).

A supply flow path 14 having a buffer flow path portion 14H, a part of which is connected to the other end of the supply pipe 13; and an inclined channel section 14S having an upper end connected to the buffer channel section 14H and a lower end connected to the liquid supply port 12. The inclined flow path portion 14S has a shape corresponding to the liquid supply port 12, and its cross section along the XY plane is formed in an annular slit shape surrounding the optical element LS 1. The inclined flow path portion 14S has an inclination angle corresponding to the side surface of the optical element LS1 disposed inside thereof, and is formed so that the distance from the surface of the substrate P increases as the distance from the optical axis AX of the projection optical system PL increases in a side sectional view.

The buffer flow path portion 14H is provided outside the inclined flow path portion 14S so as to surround the upper end thereof, and is a space portion formed to expand in the XY direction (horizontal direction). The inside (optical axis AX side) of the buffer passage portion 14H is connected to the upper end of the inclined passage portion 14S, and the connection portion is a curved corner portion 17. In the vicinity of the connection portion (bend angle) 17, specifically, in the inner region (on the optical axis AX side) of the buffer flow path portion 14H, a bank portion 15 formed so as to surround the upper end portion of the inclined flow path portion 14S is provided. The bank 15 is provided so as to protrude from the bottom surface of the buffer passage 14H in the + Z direction. The bank portion 15 forms a narrow flow path portion 14N narrower than the buffer flow path portion 14H.

In the present embodiment, the nozzle member 70 is formed by combining the 1 st member 71 and the 2 nd member 72. The 1 st and 2

nd members

71 and 72 may be formed of, for example, aluminum, titanium, stainless steel, duralumin (duralumin), or an alloy containing at least two of the foregoing.

The 1 st member 71 has: the side plate portion 71A, a top plate portion 71B having an outer end connected to a predetermined position above the side plate portion 71A, an inclined plate portion 71C having an upper end connected to an inner end of the top plate portion 71B, and a bottom plate portion 71D (see fig. 3) connected to a lower end of the inclined plate portion 71C, and these plate portions are integrally joined to each other. The 2 nd member 72 has: a top plate portion 72B having an outer end portion connected to an upper end portion of the 1 st member 71, an inclined plate portion 72C having an upper end portion connected to an inner end portion of the top plate portion 72B, and a bottom plate portion 72D connected to a lower end portion of the inclined plate portion 72C, and these plate portions are integrally joined to each other. The bottom surface of the buffer flow path 14H is formed by the top plate 71B of the 1 st member 71, and the top surface of the buffer flow path 14H is formed by the bottom surface of the top plate 72B of the 2 nd member 72. The bottom surface of the inclined channel section 14S is formed by the upper surface of the inclined plate section 71C of the 1 st member 71 (the surface facing the optical element LS1), and the top surface of the inclined channel section 14S is formed by the lower surface of the inclined plate section 72C of the 2 nd member 72 (the surface opposite to the optical element 1). The inclined plate portion 71C of the 1 st member 71 and the inclined plate portion 72C of the 2 nd member 72 are formed in mortar shapes, respectively. The slit-shaped supply passage 14 is formed by combining the 1 st and 2

nd members

71 and 72. The outside of the buffer flow path section 14H is closed by the upper region of the side plate section 71A of the 1 st member 71, and the upper surface of the inclined plate section 72C of the 2 nd member 72 faces the side surface of the optical element LS 1.

The liquid recovery port 22 is provided above the substrate P supported by the substrate stage PST, and is provided so as to face the surface of the substrate P. The liquid recovery port 22 is spaced apart from the surface of the substrate P by a predetermined distance. The liquid recovery port 22 is provided outside the liquid supply port 12 so as to be spaced apart from the liquid supply port 12 with respect to the projection area AR1 of the projection optical system PL, and is formed so as to surround the liquid supply port 12 and the projection area AR 1. Specifically, side plate 71A, top plate 71B, and inclined plate 71C of member 171 form space 24 that opens downward, liquid recovery port 22 is formed by the opening of space 24, and recovery flow path 24 is formed by space 24. The other end of recovery pipe 23 is connected to a part of recovery flow path (space) 24.

A porous member 25 having a plurality of pores is disposed in the liquid recovery port 22 so as to cover the liquid recovery port 22. The porous member 25 is constituted by a mesh member having a plurality of pores. The porous member 25 may be formed of, for example, a mesh member having a honeycomb pattern (formed of a plurality of substantially hexagonal pores). The porous member 25 is formed in a thin plate shape, and has a thickness of, for example, about 100 μm.

The porous member 25 can be formed by punching a plate member of a base material (made of stainless steel (e.g., SUS 316)) constituting the porous member. Further, a plurality of thin plate-like porous members 25 may be arranged in a stacked manner in the liquid recovery port 22. The porous member 25 may be subjected to a surface treatment for suppressing dissolution of impurities into the liquid LQ or a surface treatment for improving the lyophilic property. The surface treatment may be a treatment for adhering chromium oxide to the porous member 25, for example, a "gold" treatment or a "gold WHITE" treatment by the agency of the ministry of environmental protection for steel. By applying such surface treatment, it is possible to prevent a problem that impurities of the porous member 25 dissolve in the liquid LQ. The nozzle member 70 (the 1 st and 2 nd members 71 and 72) may be subjected to the surface treatment. Further, the porous member 25 may also be formed using a material (titanium or the like) in which impurities are less soluble in the liquid LQ.

The mouth member 70 has a square shape in plan view. As shown in fig. 3, the liquid recovery port 22 is formed in a frame shape (in the shape of a "square") in plan view so as to surround the projection area A1R and the liquid supply port 12 on the lower surface of the nozzle member 70. A thin plate-like porous member 25 is disposed in the recovery port 22. Further, the bottom plate portion 71D of the member 171 is disposed between the liquid recovery port 22 (porous member 25) and the liquid supply port 12. The liquid supply port 12 is a slit formed in a ring shape in a plan view between the bottom plate portion 71D of the 1 st member 71 and the bottom plate portion 72D of the 2 nd member 72.

In the nozzle member 70, the surfaces (lower surfaces) of the

bottom plate portions

71D and 72D facing the substrate P are flat surfaces parallel to the XY plane. That is, the

bottom plate portions

71D and 72D of the nozzle member 70 have lower surfaces formed to face the surface (XY plane) of the substrate P supported by the substrate stage PST and to be substantially parallel to the surface of the substrate P. In the present embodiment, the lower surface of bottom plate portion 71D is substantially flush with the lower surface of bottom plate portion 72D, and the gap between the lower surface and the surface of substrate P arranged on substrate stage PST is minimized. Accordingly, the liquid LQ can be favorably held between the lower surfaces of the

bottom plate portions

71D and 72D and the substrate P, and the liquid immersion area AR1 can be formed. In the following description, the lower surfaces (flat portions) of the

bottom plate portions

71D and 72D formed to face the surface of the substrate P and to be substantially parallel to the surface (XY plane) of the substrate P are appropriately referred to as "flat surfaces 75".

The flat surface 75 is a surface of the nozzle member 70 which is disposed closest to the position of the substrate P supported by the substrate stage PST. In addition, in the present embodiment, since the lower surface of the bottom plate portion 71D is substantially flush with the lower surface of the bottom plate portion 72D, the lower surface of the bottom plate portion 71D and the lower surface of the bottom plate portion 72D are both referred to as the flat surface 75, but the porous member 25 may be disposed in a portion where the bottom plate portion 71D is disposed as the liquid recovery port, and in this case, only the lower surface of the bottom plate portion 72D is referred to as the flat surface 75.

The porous member 25 has a lower surface 2 facing the substrate P supported on the substrate stage PST. The porous member 25 is provided in the liquid recovery port 22 such that the lower surface 2 thereof is inclined with respect to the surface (i.e., XY plane) of the substrate P supported on the substrate stage PST. That is, the porous member 25 provided in the liquid recovery port 22 has a slope (lower surface) 2 facing the surface of the substrate P supported on the substrate stage PST. The liquid LQ passes through the inclined surface 2 of the porous member 25 disposed in the liquid recovery port 22 and is recovered. Therefore, the liquid recovery port 22 is formed in the slope 2. In other words, in the present embodiment, the entire slope functions as the liquid recovery port 22. Since the liquid recovery port 22 is formed so as to surround the projection area AR1 irradiated with the exposure light EL, the inclined surface 2 of the porous member 25 disposed in the liquid recovery port 22 is formed so as to surround the projection area AR 1.

The inclined surface 2 of the porous member 25 facing the substrate P is formed so that the distance from the surface of the substrate P increases as the distance from the optical axis AX of the projection optical system PL (optical element LS1) increases. As shown in fig. 3, in the present embodiment, the liquid recovery port 22 is formed in a "mouth" shape in plan view, and 4 porous members 25A to 25D are combined and disposed in the liquid recovery port 22. The

porous members

25A and 25C disposed on both sides of the projection area AR1 in the X-axis direction (scanning direction) are disposed such that the surface thereof is orthogonal to the XZ plane and the distance from the optical axis AX is larger as the distance from the surface of the substrate P is longer. The

porous members

25B and 25D disposed on both sides of the projection area AR1 in the Y axis direction are disposed such that the surface thereof is orthogonal to the YZ plane and the distance from the optical axis AX is larger as the distance from the surface of the substrate P is longer.

The inclination angle of the lower surface 2 of the porous member 25 with respect to the XY plane is set to 3 to 20 degrees in consideration of the viscosity of the liquid LQ or the contact angle of the liquid LQ on the surface of the substrate P. In the present embodiment, the inclination angle is set to 7 degrees.

The lower surface of the bottom plate portion 71D connected to the lower end of the inclined plate portion 71C of the 1 st member 71 is provided at substantially the same position (height) in the Z-axis direction as the lower end of the side plate portion 71A. The porous member 25 is attached to the liquid recovery port 22 of the nozzle member 70 such that the inner edge of the inclined surface 2 is substantially flush with the lower surface (flat surface 75) of the bottom plate portion 71D and the inner edge of the inclined surface 2 is continuous with the lower surface (flat surface 75) of the bottom plate portion 71D. That is, the flat surface 75 is formed continuously with the inclined surface 2 of the porous member 25. The porous member 25 is disposed so that the distance from the surface of the substrate P increases as the distance from the optical axis AX increases. Further, a wall portion 76 formed by a partial region of the lower portion of the side plate portion 71A is provided outside the outer edge portion of the slope 2 (porous member 25). The wall 76 is provided around the periphery of the porous member 25 (the inclined surface 2) so as to surround the porous member, and is provided outside the liquid recovery port 22 with respect to the projection area AR1, so as to suppress leakage of the liquid LQ.

A part of the bottom plate portion 72D forming the flat surface 75 is disposed between the substrate P and the image plane side end surface T1 of the optical element LS1 of the projection optical system PL in the Z-axis direction. That is, a part of the flat surface 75 is submerged below the lower surface (end surface) T1 of the optical element LS1 of the projection optical system PL. An opening 74 through which the exposure light EL passes is formed in the center of the bottom plate 72D on which the flat surface 75 is formed. The opening 74 has a shape corresponding to the projection area AR1, and in the present embodiment, is formed in an elliptical shape whose longitudinal direction is the Y-axis direction (non-scanning direction). The opening 74 is formed to be larger than the projection area AR1, so that the exposure light EL passing through the projection optical system PL can reach the substrate P without being blocked by the bottom plate 72D. That is, at least a part of the flat surface 75 is disposed so as to surround the optical path of the exposure light EL and to be submerged below the end surface T1 of the projection optical system PL at a position not interfering with the optical path of the exposure light EL. In other words, at least a part of the flat surface 75 is disposed between the end surface T1 on the image plane side of the projection optical system PL and the substrate P so as to surround the projection area AR 1. The bottom plate 72D is disposed so that its lower surface is a flat surface 75 facing the surface of the substrate P and is provided so as not to contact the lower surface T1 of the optical element LS1 and the substrate P. The edge 74E of the opening 74 may be formed in a right-angled shape, an acute angle, or an arc shape.

The flat surface 75 is disposed between the projection area AR1 and the inclined surface 2 of the porous member 25 disposed in the liquid recovery port 22. The liquid recovery port 22 is disposed outside the flat surface 75 with respect to the projection area AR1 and surrounds the flat surface 75. That is, the liquid recovery port 22 is disposed so as to surround the flat surface 75 at a position further away from the optical path of the exposure light. The liquid supply port 12 is also disposed outside the flat surface 75 with respect to the projection area AR 1. The liquid supply port 12 is provided between the projection area AR1 and the liquid recovery port 22 of the projection optical system PL, and the liquid LQ forming the liquid immersion area AR2 is supplied between the projection area AR1 and the liquid recovery port 22 of the projection optical system PL through the liquid supply port 12. The number, position, and shape of the liquid supply ports 12 and the liquid recovery ports 22 are not limited to those described in the present embodiment, and may be any configuration as long as the liquid immersion area AR2 can be maintained in a desired state. For example, the liquid recovery port 22 may be disposed so as not to surround the flat surface 75. In this case, the liquid recovery port 22 may be provided only in a predetermined region on both sides of the lower surface of the nozzle member 70 in the scanning direction (X direction) with respect to the projection region AR1 or only in a predetermined region on both sides of the projection region AR1 in the non-scanning direction (Y direction).

As described above, the flat surface 75 is disposed between the lower surface T1 of the optical element LS1 and the substrate P, and the distance between the surface of the substrate P and the lower surface T1 of the optical element LS1 is longer than the distance between the surface of the substrate P and the flat surface 75. That is, the lower surface T1 of the optical element LS1 is formed at a position higher than the flat surface 75 (farther from the substrate P). In the present embodiment, the distance between the lower surface T1 of the optical element LS1 and the substrate P is about 3mm, and the distance between the flat surface 75 and the substrate P is about 1 mm. The flat surface 75 is in contact with the liquid LQ in the liquid immersion area AR2, and the lower surface T1 of the optical element LS1 is also in contact with the liquid LQ in the liquid immersion area AR 2. That is, the flat surface 75 and the lower surface T1 are liquid contact surfaces that are in contact with the liquid LQ in the liquid immersion area AR 2.

The liquid contact surface T1 of the optical element LS1 of the projection optical system PL has lyophilic (hydrophilic). In the present embodiment, the lyophilic treatment is applied to the liquid contact surface T1, and the lyophilic treatment makes the liquid contact surface T1 of the optical element LS1 lyophilic. The flat surface 75 is also subjected to lyophilic treatment to have lyophilic properties. Further, a part of the flat surface 75 (for example, the lower surface of the bottom plate portion 71D) may be subjected to a liquid repellent treatment to impart liquid repellency thereto. Of course, as described above, the 1 st member 71 and the 2 nd member may be formed of a lyophilic material to make the flat surface 75 lyophilic.

The lyophilic treatment for making a predetermined member such as the liquid contact surface T1 of the optical element LS1 lyophilic includes, for example, making MgF₂、Al₂O₃、SiO₂And the like, the lyophilic material is attached. Or,since the liquid LQ of the present embodiment is water having a large polarity, a film can be formed by a hydrophilic treatment (hydrophilization treatment) using a molecular structure substance having a large polarity and having an OH group such as alcohol, for example, to impart lyophilicity (hydrophilicity). Further, by forming the optical element LS1 from fluorite or quartz, since fluorite or quartz has a high affinity for water, even if the lyophilic treatment is not performed, good lyophilic can be obtained, and the liquid LQ can be brought into substantially close contact with the liquid contact surface T1 of the optical element LS 1.

The liquid repellent treatment for imparting liquid repellency to a part of the flat surface 75 may be, for example, a treatment of adhering a liquid repellent material such as a fluorine-based resin material such as polytetrafluoroethylene (teflon (registered trademark)), an acrylic-based resin material, or a silicon-based resin material. Further, by providing the liquid repellent property to the upper surface 91 of the substrate stage PST, the liquid LQ can be prevented from flowing out of the outer side of the substrate P (the outer side of the upper surface 91) during the liquid immersion exposure, and the liquid LQ can be smoothly collected even after the liquid immersion exposure, thereby preventing a problem that the liquid LQ remains on the upper surface 91.

To supply the liquid LQ onto the substrate P, the controller CONT drives the liquid supply unit 11 to send out the liquid LQ from the liquid supply unit 11. The liquid LQ sent from the liquid supply portion 11 flows into the buffer flow path portion 14H in the supply flow path 14 of the nozzle member 70 after passing through the supply pipe 13. The buffer flow path portion 14H is a space portion that expands in the horizontal direction, and the liquid LQ flowing into the buffer flow path portion 14H flows so as to expand in the horizontal direction. Since the bank portion 15 is formed in the region on the inner side (the optical axis AX side) of the buffer flow path portion 14H on the downstream side of the flow path, the liquid LQ is once stored after being spread over the entire buffer flow path portion 14. Then, after the liquid LQ is stored in the buffer flow path portion 14H by a predetermined amount or more (after the liquid level of the liquid LQ is higher than the height of the bank portion 15), the liquid LQ flows into the inclined flow path portion 14S through the narrow flow path portion 14N. The liquid LQ flowing into the inclined channel portion 14S flows downward along the inclined channel portion 14S, and is supplied onto the substrate P disposed on the image plane side of the projection optical system PL through the liquid supply port 12. The liquid supply port 12 supplies the liquid LQ onto the substrate P from above the substrate P.

By providing the bank portion 15 in this manner, the liquid LQ flowing out of the buffer passage portion 14H is supplied substantially uniformly to the substrate P from the entire liquid supply port 12 (formed in a ring shape so as to surround the projection area AR 1). That is, if the bank portion 15 (the narrow flow path portion 14N) is not formed, the flow rate of the liquid LQ flowing through the inclined flow path portion 14S is larger in the region near the connection portion between the supply pipe 13 and the buffer flow path portion 14H than in the other regions, and therefore the supply amount of the liquid to the substrate P is not uniform at each position of the liquid supply port 12 formed in the annular shape. However, since the buffer flow path portion 14H is formed by providing the narrow flow path portion 14N and the supply of the liquid to the liquid supply port 12 is started after the buffer flow path portion 14H stores the liquid LQ in an amount equal to or larger than a predetermined amount, the liquid LQ can be supplied onto the substrate P in a state where the flow rate distribution or the flow velocity distribution at each position of the liquid supply port 12 is uniform. Here, although bubbles are likely to remain near the curved corner portion 17 of the supply channel 14, for example, at the start of supply, the flow velocity of the liquid LQ flowing through the narrow channel portion 14N can be made higher by forming the narrow channel portion 14N by narrowing the supply channel 14 near the curved corner portion 17, and bubbles can be discharged to the outside of the supply channel 14 through the liquid supply port 12 by the high-velocity flow of the liquid LQ. Next, by performing the liquid immersion exposure operation after discharging the air bubbles, the exposure process can be performed in the liquid immersion area AR2 without air bubbles. The bank 15 may be provided so as to protrude in the-Z direction from the top surface of the buffer passage portion 14H. The important point is that a narrow flow path portion 14N narrower than the buffer flow path portion 14H is provided on the flow path downstream side of the buffer flow path portion 14H.

Further, the partial bank 15 may be made lower (higher). By providing the bank 15 with regions having partially different heights, it is possible to prevent gas (bubbles) from remaining in the liquid forming the liquid immersion region AR2 when the liquid LQ starts to be supplied. The buffer flow path portion 14H may be divided into a plurality of flow paths, and different amounts of the liquid LQ may be supplied according to the position of the slit-shaped liquid supply port 12.

The controller CONT drives the liquid recovery unit 21 to recover the liquid LQ on the substrate P. By driving the liquid recovery unit 21 having a vacuum system, the liquid LQ on the substrate P flows into the recovery channel 24 through the liquid recovery port 22 in which the porous member 25 is disposed. When the liquid LQ in the liquid immersion area AR2 is collected, the liquid LQ contacts the lower surface (inclined surface) 2 of the porous member 25. Since the liquid recovery port 22 (porous member 25) is provided above the substrate P so as to face the substrate P, the liquid LQ on the substrate P is recovered from above. The liquid LQ flowing into the recovery flow path 24 is recovered to the liquid recovery unit 21 after passing through the recovery pipe 23.

Fig. 5 is a diagram showing an example of the liquid recovery unit 21. In fig. 5, the liquid recovery unit 21 includes: a recovery tank 26 connected to one end of the recovery pipe 23; a vacuum pump (vacuum system) 27 connected to the recovery tank 26 through a pipe 27K; a drain pump (drain pump) 29 connected to the recovery tank 26 through a pipe 29K; and a liquid level sensor (water level sensor) 28 provided inside the recovery tank 26. One end of the recovery pipe 23 is connected to the upper part of the recovery tank 26. One end of the recovery tank is connected to the other end of the pipe 27K of the vacuum pump 27, and is connected to the upper part of the recovery tank 26. One end of the pipe is connected to the other end of the pipe 29K of the drain pump 29, and is connected to the lower portion of the recovery tank 26. By driving the vacuum pump 27, the liquid LQ is collected and stored in the collection tank 26 through the liquid collection port 22 of the nozzle member 70. The liquid LQ stored in the recovery tank 26 is discharged to the outside through the pipe 29K by driving the drain pump 29. The operations of the vacuum pump 26 and the drain pump 29 are controlled by the control device CONT. The liquid level sensor 28 measures the liquid level (water level) of the liquid LQ contained in the recovery tank 26, and outputs the measurement result to the control unit CONT. The controller CONT adjusts the suction force (drainage force) of the drainage pump 29 to be substantially constant based on the output of the liquid sensor 28, so that the liquid level (water level) of the liquid LQ stored in the recovery tank 26 is substantially constant. The controller CONT can maintain the liquid level (water level) of the liquid LQ stored in the recovery tank 26 at a substantially constant level, and thus can stabilize the pressure in the recovery tank 26. This stabilizes the liquid LQ recovery force (suction force) that permeates through the liquid recovery port 22. In the embodiment shown in fig. 5, a drain valve may be provided instead of the drain pump 29, and the liquid level of the liquid LQ in the recovery tank 26 may be maintained substantially constant by adjusting the opening and closing of the drain valve, adjusting the diameter of the discharge port, or the like based on the output of the liquid level sensor 28.

Next, an example of a recovery method of the liquid recovery mechanism 20 of the present embodiment will be described. In the present embodiment, this recovery method is referred to as the bubble point method. The liquid recovery mechanism 20 recovers the liquid LQ only from the recovery port 22 by using the bubble point method, thereby suppressing the generation of vibration due to the recovery of the liquid.

The principle of the liquid recovery operation of the liquid recovery mechanism 20 according to the present embodiment will be described below with reference to the schematic diagram of fig. 6. A porous member 25 is disposed in the recovery port 22 of the liquid recovery mechanism 20. As the porous member, for example, a thin plate-like mesh member having a large number of holes formed therein can be used. The bubble point method is a method of recovering only the liquid LQ from the pores of the porous member 25 by controlling the pressure difference between the upper surface and the lower surface of the porous member 25 so as to satisfy a predetermined condition described later in a wet state of the porous member 25. Parameters of the conditions of the bubble point method include the pore diameter of the porous member 25, the contact angle (affinity) between the porous member 25 and the liquid LQ, the suction force of the liquid recovery unit 21 (pressure on the porous member 25), and the like.

Fig. 6 is a partially enlarged sectional view of the porous member 25, and shows a specific example of liquid collection through the porous member 25. A substrate P is disposed below the porous member 25, and a gas space and a liquid space are formed between the porous member 25 and the substrate P. More specifically, a gas space is formed between the 1 st hole 25Ha of the porous member 25 and the substrate P, and a liquid space is formed between the 2 nd hole 25Hb of the porous member 25 and the substrate P. Such a situation occurs, for example, at the end of the liquid immersion area AR 2. Alternatively, such a situation may occur when a gap of liquid is formed in the liquid LQ in the liquid immersion area AR 2. A flow path space forming a part of the recovery flow path 24 is formed in the porous member 25.

In fig. 6, Pa represents the pressure in the space between the 1 st hole 25Ha of the porous member 25 and the substrate P (the pressure below the porous member 25H), Pb represents the pressure in the flow path space above the porous member 25 (the pressure above the porous member 25), d represents the pore diameter (diameter) of the holes 25Ha and 25Hb, θ represents the contact angle between the porous member 25 (inside the hole 25H) and the liquid LQ, and γ represents the surface tension of the liquid LQ, and these results are satisfied

(4×γ×cosθ)/d≥(Pa-Pb)......(1A)

That is, as shown in fig. 6, even if a gas space is formed below the 1 st hole 25Ha of the porous member 25 (on the substrate P side), the gas permeation hole 25Ha in the space below the porous member 25 is prevented from moving (permeating) to the space above the porous member 25. That is, by optimizing the contact angle θ, the pore diameter d, the surface tension γ of the liquid LQ, and the pressures Pa and Pb so as to satisfy the condition of the above formula (1A), the interface between the liquid LQ and the gas can be maintained in the pores 25Ha of the porous member 25, and the gas can be prevented from permeating from the 1 st pores 25 Ha. On the other hand, since a liquid space is formed below the 2 nd well 25Hb (on the substrate P side) of the porous member 25, only the liquid LQ can be recovered through the 2 nd well 2 Hb.

In the condition of the above formula (1A), the hydrostatic pressure of the liquid LQ on the porous member 25 is not considered for the sake of simplicity of explanation.

In the present embodiment, the liquid recovery mechanism 20 controls the suction force of the liquid recovery unit 21 so that the pressure Pa of the space below the porous member 25, the diameter d of the pores 25H, the contact angle θ between the porous member 25 (the inner surface of the pores 25H) and the liquid LQ, and the surface tension γ of the liquid (pure water) LQ are constant, and adjusts the pressure in the flow path space above the porous member 25 so as to satisfy the above expression (1A). However, in the above formula (1A), since it is easier to control the pressure Pb so as to satisfy the above formula (1A) as (Pb — Pb) is larger, that is, (4 × γ × cos θ)/d) is larger, the diameter d of the pores 25Ha, 25Hb and the contact angle θ of the porous member 25 with the liquid LQ are preferably as small as possible.

Next, a method of exposing the pattern image of the mask M to the substrate P using the exposure apparatus EX having the above-described configuration will be described.

The controller CONT forms the liquid immersion area AR2 of the liquid LQ on the substrate P by supplying a predetermined amount of the liquid LQ onto the substrate P by the liquid immersion mechanism 1 having the liquid supply mechanism 10 and the liquid recovery mechanism 20, and by recovering the predetermined amount of the liquid LQ on the substrate P. The liquid LQ supplied by the liquid immersion mechanism 1 is such that a liquid immersion area AR2 larger than the projection area AR1 and smaller than the substrate P is partially formed on the substrate P including the projection area AR 1.

The controller CONT performs recovery of the liquid LQ on the substrate P by the liquid recovery mechanism 20 in parallel with supply of the liquid LQ on the substrate P by the liquid supply mechanism 10, and projects and exposes the pattern image of the mask M on the substrate P through the liquid LQ between the projection optical system PL and the substrate P and the projection optical system PL while moving the substrate stage PST supporting the substrate P in the X-axis direction (scanning direction).

In the exposure apparatus EX of the present embodiment, the substrate P is projection-exposed with a pattern image of the mask M while moving the mask M and the substrate P in the X-axis direction (scanning direction), and when performing the scanning exposure, a part of the pattern image of the mask M is projected in the projection area AR1 through the liquid LQ in the liquid immersion area AR2 and the projection optical system PL, and the substrate P and the mask M are moved in the + X direction (or the + X direction) at a speed β · V (β is a projection magnification) with respect to the projection area AR1 in synchronization with the movement of the substrate P and the mask M in the-X direction (or the + X direction). After exposure of one shot area is completed, the next shot area is moved to the scanning start position by the stepping movement of the substrate P, and then, the shot areas are sequentially subjected to scanning exposure processing while moving the substrate P in a step-and-scan manner.

In the present embodiment, the porous member 25 is inclined with respect to the surface of the substrate P, and the liquid LQ is recovered through the inclined surface 2 of the porous member 25 disposed in the liquid recovery port 22, and the liquid LQ is recovered through the liquid recovery port 22 including the inclined surface 2. The flat surface 75 (the lower surface of the bottom surface portion 71D) is formed continuously with the inclined surface 2. At this time, from the initial state shown in fig. 7(a) (the state where the liquid immersion area AR2 of the liquid LQ is formed between the flat surface 75 and the substrate P), the substrate P is moved by a predetermined distance in the + X direction at a predetermined speed in a scanning manner with respect to the liquid immersion area AR2, and the state shown in fig. 7(b) is obtained. In the predetermined state after the scanning movement shown in fig. 7(b), the component F1 moving obliquely upward along the inclined surface 2 and the component F2 moving in the horizontal direction are generated in the liquid LQ in the liquid immersion area AR 2. At this time, the shape of the interface (gas-liquid interface) LG between the liquid LQ and the space outside the liquid immersion area AR2 is maintained. Further, even if the substrate P moves at a high speed with respect to the liquid immersion area AR2, the shape of the interface LG can be suppressed from changing greatly.

The distance between the inclined surface 2 and the substrate P is larger than the distance between the flat surface 75 and the substrate P. That is, the space between the inclined surface 2 and the substrate P is larger than the space between the flat surface 75 and the substrate P. Accordingly, the distance L between the interface LG' in the initial state shown in fig. 7(a) and the interface LG in the predetermined state shown in fig. 7(b) after the scanning movement after the substrate P is moved can be shortened. This can suppress the expansion of the liquid immersion area AR2 and reduce the size of the liquid immersion area AR 2.

For example, as shown in fig. 8(a), when the flat surface 75 and the lower surface 2 ' of the porous member 25 disposed in the liquid recovery port 22 are continuously formed so that the lower surface 2 ' of the porous member 25 is not inclined with respect to the substrate P but is substantially parallel to the surface of the substrate P, in other words, even when the liquid recovery port 22 including the lower surface 2 ' is not inclined, the shape of the interface LG is maintained when the substrate P is moved with respect to the liquid immersion area AR 2. However, since the lower surface 2' is not inclined, only the component F2 moving in the horizontal direction is generated in the liquid LQ, and almost no component moving upward is generated (F1). At this time, since the interface LG moves by a distance substantially equal to the movement amount of the substrate P, the distance L between the interface LG' in the initial state and the interface LG in the predetermined state after the scanning movement becomes a large value, and the liquid immersion area AR2 also increases accordingly. In this way, the nozzle member 70 must be made larger to correspond to the larger liquid immersion area AR2, and the size of the substrate stage PST itself or the movement stroke of the substrate stage PST must be increased to correspond to the size of the liquid immersion area AR2, which results in an increase in the size of the exposure apparatus EX as a whole. The increase in size of the liquid immersion area AR2 becomes more significant as the scanning speed of the substrate P with respect to the liquid immersion area AR2 becomes higher.

Further, as shown in fig. 8 b, by providing a step between the flat surface 75 and the liquid recovery port 22 (the lower surface 2 'of the porous member 25), when the distance between the lower surface 2' and the substrate P is made larger than the distance between the flat surface 75 and the substrate P, in other words, when the space between the lower surface 2 'and the substrate P is made larger than the space between the flat surface 75 and the substrate P, the distance L can be made small because the component F1' moving upward is generated in the liquid LQ, and the increase in size of the liquid immersion area AR2 can be suppressed. Further, since a step is provided between the flat surface 75 and the lower surface 2 'and the flat surface 75 and the lower surface 2' are not continuously formed, the shape of the interface LG is easily broken. When the shape of the interface LG is collapsed, there is a possibility that gas enters the liquid LQ in the liquid immersion area AR2, and a problem such as bubbles may occur in the liquid LQ. Further, for example, when there is a step difference when the substrate P is scanned at a high speed in the + X direction, the shape of the interface LG is broken, and the component F1' moving upward is increased, the thickness of the liquid LQ film in the region closest to the + X side of the liquid immersion region AR2 is decreased, and when the substrate P is moved in the-X direction (reverse scanning) in this state, there is a high possibility that the liquid LQ is scattered. If the scattered liquid (see reference symbol LQ 'in fig. 8 b) remains on the substrate P, for example, a defect such as a mark (so-called water mark) formed on the substrate P due to vaporization of the liquid LQ' occurs. Further, the liquid LQ may flow out to the outside of the substrate P, and thus, there may occur a problem such as rusting of peripheral members and devices, or electric leakage. The possibility of occurrence of the above-described problem increases as the scanning speed of the substrate P with respect to the liquid immersion area AR2 increases.

In the present embodiment, since the inclined surface 2 is formed continuously with the flat surface 75 (the lower surface of the bottom plate portion 71D), and the recovery port 22 of the liquid immersion mechanism 1 (the liquid recovery mechanism 20) is formed within a range allowed by the national regulations specified or selected by the international application, and the description of the document is used as the inclined surface 2 facing a part of the surface described herein, even when the liquid immersion area AR2 formed on the image plane side of the projection optical system PL and the substrate P are moved relative to each other, the movement distance of the liquid LQ in the liquid immersion area AR2 and the interface LG in the space outside thereof can be suppressed, the shape of the liquid immersion area AR2 can be maintained (the shape change of the interface LG is reduced), and the size or the shape of the liquid immersion area AR2 can be maintained in a desired state. Accordingly, it is possible to prevent problems such as generation of bubbles in the liquid LQ, failure to completely recover the liquid, and outflow of the liquid. Accordingly, the entire exposure apparatus EX can be miniaturized.

When the substrate P is scanned at a high speed, the liquid LQ in the liquid immersion area AR2 may flow out to the outside or the liquid LQ in the liquid immersion area AR2 may scatter to the surroundings, but since the wall portion 76 is provided at the periphery of the inclined surface 2, leakage of the liquid LQ can be suppressed. That is, since the wall portion 76 is provided on the peripheral edge of the porous member 25, the buffer space can be formed inside the wall portion 76, and therefore, even when the liquid LQ reaches the inner surface of the wall portion 76, the liquid LQ forming the liquid immersion area AR2 expands inside the buffer space inside the wall portion 76, and therefore, the liquid LQ can be more reliably prevented from leaking to the outside of the wall portion 76.

Further, since a part of the flat surface 75 (the lower surface of the bottom plate 72D) is disposed below the end surface T1 of the projection optical system PL so as to surround the projection area AR1, a small gap formed between the part of the flat surface 75 (the lower surface of the bottom plate 72D) and the surface of the substrate P is formed so as to surround the projection area in the vicinity of the projection area. Accordingly, even when the substrate P is moved (scanned) at a high speed, it is possible to suppress a problem such as mixing of gas into the liquid LQ in the liquid immersion area AR2 or outflow of the liquid LQ, and to reduce the size of the entire exposure apparatus EX. Further, since the liquid supply port 12 is disposed outside a part of the flat surface 75 (the lower surface of the bottom plate portion 72D), it is possible to prevent gas (bubbles) from being mixed into the liquid LQ forming the liquid immersion area AR2, and to keep filling the optical path of the exposure light EL with the liquid even when the substrate P is moved at a high speed.

Embodiment 2

Next, embodiment 2 of the present invention will be described with reference to fig. 9. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted. In the above-described embodiment 1, the inclined surface 2 is formed by obliquely mounting the thin plate-like porous member 25 with respect to the substrate P, but as shown in fig. 9, the inclined surface 2 "may be provided on the lower surface of the nozzle member 70 so that the distance from the optical axis AX of the exposure light EL becomes longer, the distance from the surface of the substrate P becomes larger, and the liquid recovery port 22 may be formed at a predetermined position (predetermined region) in a part of the inclined surface 2". The porous member 25 may be provided in the liquid recovery port 22. At this time, the inclined surface 2 ″ of the nozzle member 70 is continuous with the lower surface 2 of the porous member 25, and the inclined surface 2 ″ is substantially flush with the lower surface 2. In this way, for example, when the interface LG of the liquid LQ is formed between the inclined surface 2 ″ and the substrate P, the shape of the interface LG can be maintained, and problems such as the generation of air bubbles in the liquid LQ in the liquid immersion area AR2 can be prevented. Further, the size of the liquid immersion area AR2 may be reduced.

Embodiment 3

FIG. 10 shows embodiment 3 of the present invention. As shown in fig. 10, the 1 st region 2A of the lower surface 2 of the porous member 25 near the optical axis AX may be formed at a larger inclination angle with respect to the substrate P than the 2 nd region 2B outside thereof.

Embodiment 4

FIG. 11 shows embodiment 4 of the present invention. As shown in fig. 11, the 1 st region 2A of the lower surface 2 of the porous member 25 near the optical axis AX may be formed at a smaller inclination angle with respect to the substrate P than the 2 nd region 2B outside thereof. That is, the lower surface 2 of the porous member 25 does not need to be a flat surface, and the lower surface 2 of the porous member 25 may be arranged so that the distance from the optical axis AX of the exposure light EL increases as the distance from the surface of the substrate P increases.

Embodiment 5

FIG. 12 shows embodiment 5 of the present invention. As shown in fig. 12, a plurality of fin members 150 may also be formed on the slope (under the porous member 25) formed under the mouth member 70. The fin member 150 is substantially triangular in side view, and is disposed in a buffer space formed inside the wall portion 76 and the lower surface 2 of the porous member 25 in the side cross-sectional view of fig. 12. The fin members 150 are radially attached to the inner surface of the wall portion 76 so as to extend outward in the longitudinal direction. Here, the plurality of fin members 150 are separated from each other, and a space portion is formed between the fin members 150. As such, by arranging the plurality of fin members 150 in this manner, since the liquid contact area at the slope (below the porous member 25) formed below the nozzle member 70 can be increased, the holding performance of the liquid LQ below the nozzle member 70 can be improved. Further, the plurality of fin members 150 may be arranged at equal intervals, or may be arranged at unequal intervals. For example, the interval between the fin members 150 disposed on both sides of the projection area AR1 in the X axis direction is set smaller than the interval between the fin members 150 disposed on both sides of the projection area AR1 in the Y axis direction. Further, the surface of the flap member 150 is preferably lyophilic to the liquid LQ. The fin member 150 may be formed by applying "gold ep" treatment or "gold ep WHITE" treatment to stainless steel (for example, SUS316), or may be formed of glass (quartz) or the like.

Embodiment 6

Next, embodiment 6 of the present invention will be described with reference to fig. 13, 14, 15, and 16. Note that the same or similar mechanisms and members as those in the above embodiments are given the same reference numerals, and the description thereof is simplified or omitted. Fig. 13 is a partial sectional view showing a schematic perspective view of the vicinity of the nozzle member 70 ', fig. 14 is a perspective view of the nozzle member 70' as viewed from the lower side, fig. 15 is a side sectional view parallel to the YZ plane, and fig. 16 is a side sectional view parallel to the XZ plane.

The nozzle member 70' of the present embodiment is formed by combining the 1 st member 171 and the 2 nd member 172, and is formed in a substantially circular shape as a whole in a plan view. The 1 st member 171 has a side plate 171A and a thick inclined plate 171C, and the upper end of the side plate 171A is connected to the upper end of the inclined plate 171C. On the other hand, the 2 nd member 172 has an inclined plate portion 172C and a bottom plate portion 172D connected to a lower end portion of the inclined plate portion 172C. The inclined plate portion 171C of the 1 st member 171 and the inclined plate portion 172C of the 2 nd member 172 are formed in a mortar shape, and the inclined plate portion 172C of the 2 nd member 172 is disposed inside the inclined plate portion 171C of the 1 st member 171. The 1 st member 171 and the 2 nd member 172 are supported by a support mechanism, not shown, in such a manner that the inner surface 171T of the inclined plate portion 171C of the 1 st member 171 and the outer surface 172S of the inclined plate portion 172C of the 2 nd member 172 are slightly separated from each other. Slit-shaped groove 73 having an annular shape in plan view is provided between inner surface 171T of inclined plate portion 171C of member 1 and outer surface 172S of inclined plate portion 172C of member 2. In the present embodiment, the slit width G1 of the groove 73 is set to be about 3 mm. In the present embodiment, the groove 73 is formed to have an inclination of about 45 degrees with respect to the XY plane (the surface of the substrate P).

The optical element LS1 is disposed inside the hole 70H formed by the inclined plate portion 172C of the 2 nd member 172, and the side surface of the optical element LS1 disposed in the hole 70H faces the inner surface 172T of the inclined plate portion 172C of the 2 nd member 172. The inner surface 172T of the inclined plate portion 172C has liquid repellency (water repellency) to the liquid LQ, and the liquid LQ is prevented from penetrating into the gap between the side surface of the projection optical system PL and the inner surface 172T of the inclined plate portion 172C (nozzle member 70').

The lower surface 171R of the inclined plate portion 171C of the 1 st member 171, which faces the substrate P, is a flat surface parallel to the XY plane. The bottom surface 172R of the bottom plate portion 172D of the 2 nd member 172 facing the substrate P is also a flat surface parallel to the XY plane. The lower surface 171R of the inclined plate portion 171C of the 1 st member 171 and the lower surface 172R of the inclined plate portion 172C of the 2 nd member 172 are substantially flush with each other, and a flat surface 75 is formed by the lower surface 171R of the inclined plate portion 171C and the lower surface 172R of the bottom plate portion 172D, and the flat surface 75 faces the surface of the substrate P (the upper surface of the substrate stage PST) supported by the substrate stage PST in the nozzle member 70' and is a surface closest to the surface of the substrate P (the upper surface of the substrate stage PST). An opening 74 through which the exposure light EL passes is formed in the center of the bottom plate 172D on which the flat surface 75 is formed. That is, the flat surface 75 is formed so as to surround the projection area AR 1.

As shown in fig. 15, a part of the bottom plate 172D forming the flat surface 75 is disposed between the lower surface T1 of the optical element LS1 of the projection optical system PL and the substrate P (substrate stage) in the Z-axis direction. The bottom plate portion 172D is provided so as not to contact the lower surface T1 of the optical element LS1 and the substrate P (substrate stage PST). The upper surface of the bottom plate 172D is disposed so as to face the lower surface T1 of the optical element LS1 and substantially parallel to the lower surface of the optical element LS1, and a predetermined gap (space) G2 is formed between the end surface T1 of the projection optical system PL and the upper surface of the bottom plate 172D.

Space portion 24 is formed in member 1 171 so as to open downward, and as in embodiment 1 described above, liquid recovery port 22 is formed in the opening of space portion 24 so that space portion 24 functions as a recovery flow path. The other end of the recovery pipe 23 is connected to a part of the recovery flow path (space) 24. A porous member 25 having a plurality of pores for covering the liquid recovery port 22 is disposed in the liquid recovery port 22. The porous member 25 has a lower surface 2 facing the substrate P supported on the substrate stage PST. As in embodiment 1, the porous member 25 is provided in the liquid recovery port 22 such that the lower surface 2 thereof is inclined with respect to the surface (i.e., XY plane) of the substrate P supported by the substrate stage PST. The inclined surface 2 of the porous member 25 is formed so that the distance from the optical axis AX of the projection optical system PL (optical element LS1) increases as the distance from the surface of the substrate P increases. As shown in fig. 15, the porous member 25 is attached to the liquid recovery port 22 of the nozzle member 70' such that the inner edge of the inclined surface 2 is substantially flush with the bottom surface 171R (flat surface 75) of the member 171 1 and the inner edge of the inclined surface 2 is continuous with the bottom surface 171R (flat surface 75).

As shown in fig. 14, the liquid recovery port 22 is formed in an annular shape in plan view so as to surround the opening 74 (projection area AR1), the groove 73, and the flat surface 75 on the lower surface of the nozzle member 70'. The flat surface 75 is disposed between the opening 74 (projection area AR1) through which the exposure light EL passes and the inclined surface 2 of the porous member 25 disposed in the liquid recovery port 22. The liquid recovery port 22 is disposed outside the flat surface 75 with respect to the opening 74 (projection area AR1) so as to surround the flat surface 75.

As described in embodiment 5, the plurality of fin members 150 are provided radially on the inclined surface (lower surface of the porous member 25) 2. The flap member 150 is substantially triangular in side view and is disposed in a buffer space formed inside the lower surface 2 and the wall portion 76 of the porous member 25. In the present embodiment, each fin member 150 has a thickness of about 0.1mm, and is circumferentially arranged in a plurality of pieces at 2-degree intervals.

As shown in fig. 13, recesses 14A are formed in the inner surface 172T of the inclined plate portion 172C of the 2 nd member 172 on both sides in the Y-axis direction of the projection area AR1 of the projection optical system PL. The concave portion 14A is formed along the inclined direction of the inclined plate portion 172C, and forms a predetermined gap G3 (see fig. 15) with the side surface of the optical element LS 1. Further, a supply flow path 14 for supplying the liquid LQ is formed on the image plane side of the projection optical system PL through a gap G3 formed between the concave portion 14A and the optical element LS 1. The upper end of the supply flow path 14 is connected to the liquid supply unit 11 via a supply pipe (supply flow path), not shown, and the lower end is connected to a gap (space) G2 between the bottom surface T1 of the projection optical system PL and the bottom plate 172D, and a liquid supply port 12 for supplying the liquid LQ to the gap G2 is formed at the lower end thereof. The liquid immersion mechanism 1 supplies the liquid LQ sent from the liquid supply unit 11 to the gap G2 between the projection optical system PL and the bottom plate 172D through the liquid supply port 12 provided at the lower end of the flow path 14. In the present embodiment, the supply channel 14 is formed to have an inclination of about 45 degrees with respect to the XY plane (the surface of the substrate P).

Further, the upper surface of the bottom plate 172D may be provided with projections and recesses to control the flow direction or flow rate of the liquid on the upper surface of the bottom plate 172D. For example, in order to determine the flow direction of the liquid LQ supplied from the liquid supply port 12 to the upper surface 172A of the bottom plate 172D, the fin-shaped member may be disposed on the liquid supply port 12, or the fin-shaped protrusion may be provided on the upper surface 172A of the bottom plate 172D. In this case, it is preferable to optimize the flow direction of the liquid LQ and the flow rate of the liquid LQ according to the results of experiments or simulations so that the optical path space on the image plane side of the projection optical system PL can be continuously filled with the liquid without leaving a gas portion. When the liquid LQ is collected from substantially the entire space on the image plane side of the projection optical system PL and is in the non-liquid-immersed state, it is preferable to optimize the flow direction of the liquid LQ and the flow rate of the liquid LQ based on the results of experiments or simulations in order to prevent the liquid LQ from remaining on the end surface T1 of the optical element LS 1. Alternatively, it is preferable to optimize the flow direction of the liquid LQ and the flow rate of the liquid LQ based on the results of experiments or simulations so as not to retain the liquid containing the substance eluted from the substrate P (photosensitive resin or the like).

Slit-shaped through holes 130 are formed in the 2 nd member 172 on both sides in the X axis direction with respect to the projection area AR1, and penetrate obliquely through the inside of the inclined plate portion 172C of the 2 nd member 172. The opening formed in the lower end portion 130A of the through hole 130 is connected to a gap (space) G2 between the bottom surface T1 and the bottom plate portion 172D of the projection optical system PL, and the upper end portion 130B is opened to the atmosphere. The liquid can be sent from the opening of the lower end 130A along the upper surface 172A of the bottom plate 172D, that is, in the direction parallel to the substrate.

The groove 73 between the 1 st member 171 and the 2 nd member 172 is disposed between the projection area AR1 irradiated with the exposure light EL and the inclined surface 2 of the liquid recovery port 22, and is formed so as to surround the opening 74 (projection area AR 1). Further, the groove 73 is also formed to surround the lower surface 172R constituting a part of the flat surface 75. In other words, the groove 73 is disposed outside the lower surface 172R constituting a part of the flat surface 75. The groove portion 73 has an opening 73A disposed to face the upper surface of the substrate stage PST (the substrate P supported by the substrate stage PST). That is, the groove 73 is open downward. The opening 73A is provided near the image plane of the projection optical system PL, and the groove 73 communicates with the gas around the image plane of the projection optical system PL through the opening 73A.

Groove 73 has opening 73B for opening to the atmosphere, in addition to opening 73A facing substrate P (substrate stage PST). In the present embodiment, the groove 73 has an opening 73B at its upper end for opening to the atmosphere. Opening 73B is formed in a circular ring shape in a plan view along the upper end of groove 73, but may be formed only in a part of the upper end of groove 73. The flow passage for allowing the inside and outside of the groove 73 to flow is not limited to the upper end of the groove 73, and may be provided at any position. For example, a flow path for allowing the middle position (predetermined position) in the Z-axis direction inside the groove 73 to flow to the outside of the groove 73 may be formed in a part of the 1 st member 171, and the groove 73 may be opened to the atmosphere through the flow path.

In this way, since the groove portion 73 having the opening 73A facing the substrate P (substrate stage PST) and the opening 73B for opening to the atmosphere is formed, a part of the liquid LQ between the nozzle member 70' and the substrate P (substrate stage PST) can be taken in and out of the groove portion 73. Accordingly, even if the size (diameter) of the nozzle member 70' is small, the liquid LQ is inhibited from flowing out to the outside of the liquid recovery port 22.

As shown in fig. 15, a flow path 131 for allowing the interior of the groove 73 to flow to the outside is formed in a part of the 1 st member 171, and a suction device 132 including a vacuum system is connected to the flow path 131. The flow path 131 and the suction device 132 are used to completely collect the liquid LQ between the nozzle member 70' and the substrate P (substrate stage PST), that is, to completely collect the liquid LQ forming the liquid immersion area AR2, and to collect the liquid LQ through the groove portion 73.

Next, the operation of the liquid immersion mechanism 1 provided with the nozzle member 70' having the above-described structure will be described. To supply the liquid LQ onto the substrate P, the control unit CONT drives the liquid supply portion 11 to send out the liquid LQ from the liquid supply portion 11. The liquid LQ sent from the liquid supply portion 11 flows into the supply tube, i.e., the upper end portion of the supply flow path 14 of the nozzle member 70'. The liquid LQ flowing into the upper end of the supply channel 14 flows downward in the direction in which the inclined plate 172C is inclined, and is supplied from the liquid supply port 12 to the space G2 between the end surface T1 of the projection optical system PL and the bottom plate 172D. Here, the gas portion existing in the space G2 before the liquid LQ is supplied to the space G2 is discharged to the outside through the through-hole 130 or the opening 74. Accordingly, it is possible to prevent a problem that gas remains in the space G2 when the liquid LQ starts to be supplied to the space G2, and to prevent a problem that a gas portion (bubble) is generated in the liquid LQ.

After the liquid LQ supplied to the space G2 fills the space G2, the liquid LQ flows into the space between the flat surface 75 and the substrate P (substrate stage PST) through the opening 74. At this time, since the liquid recovery mechanism 20 recovers the liquid LQ on the substrate P by a predetermined amount per unit time, the liquid LQ flowing into the space between the flat surface 75 and the substrate P (substrate stage PST) through the opening 74 forms the liquid immersion area AR2 of a desired size on the substrate P.

In the present embodiment, since the opening 74 through which the exposure light EL passes is reduced to increase the size of the flat surface 75, the liquid LQ can be favorably held between the substrate P (substrate stage PST) and the nozzle member 70'.

During the period of forming the liquid immersion area AR2, such as during the liquid immersion exposure of the substrate P, the flow passage 131 connected to the groove portion 73 is closed and the driving of the suction device 132 is stopped. Accordingly, even when the substrate (substrate stage PST) is moved relative to the liquid immersion area AR2 (formed so as to cover the projection area AR1), a part of the liquid LQ in the liquid immersion area AR2 can enter and exit the groove portion 73 that is open to the atmosphere, and thus, it is possible to prevent problems such as expansion of the liquid immersion area AR2 and outflow of the liquid LQ in the liquid immersion area AR 2. That is, for example, as shown in fig. 16, by moving the substrate P in the + X direction, the liquid LQ in the liquid immersion area AR2 is also moved in the + X direction in accordance with the movement of the substrate P. At this time, the liquid LQ may move in the + X direction, so that the liquid immersion area AR2 may expand in the + X direction, or the liquid LQ in the liquid immersion area AR2 may flow out of the liquid recovery port 22. However, since a part of the liquid LQ moving in the + X direction enters the groove 73 on the + X side (see arrow F3 in fig. 16), the liquid immersion area AR2 is prevented from being enlarged, the liquid LQ is prevented from flowing out, and the like.

When the liquid LQ between the nozzle member 70' and the substrate P (substrate stage PST) is completely recovered, for example, when the liquid immersion exposure of the substrate P is completed, the control device CONT opens the flow path 131 connected to the groove portion 73 at the same time as stopping the liquid supply operation of the liquid supply mechanism 10 and performing the liquid recovery operation through the liquid recovery port 22 of the liquid recovery mechanism 20, and drives the suction device 132 to make the internal space of the groove portion 73 negative pressure, thereby performing the liquid recovery operation through the opening portion 73A of the groove portion 73. In this way, by using the opening 73A closest to the substrate P (substrate stage PST), the liquid LQ between the nozzle member 70' and the substrate P (substrate stage PST) can be reliably recovered in a shorter time. At this time, since the opening 73B for opening to the atmosphere is smaller than the opening 73A functioning as a liquid LQ recovery port, the liquid LQ can be recovered by making the groove 73 sufficiently negative.

In the case where the liquid LQ is collected through the groove 73, although there is a possibility that the gas in the groove 73 flows into the flow path 131 together with the liquid LQ and causes vibration in the nozzle member 70', the collection of the liquid LQ through the groove 73 is not performed when precision such as exposure operation of the substrate P is required, and therefore, there is no problem.

In the present embodiment, the concave portion 14A forming the supply flow path 14 is provided one (two in total) on each side in the Y axis direction with respect to the projection area AR1, but may be provided at any number of locations so as to surround the projection area AR1 of the projection optical system PL irradiated with the exposure light EL. The bank portion 15 (buffer passage portion 14H) described in embodiment 1 may be provided near the upper end of the concave portion 14A.

Embodiment 7

Next, embodiment 7 of the present invention will be described with reference to fig. 17 and 18. In the present embodiment, the same or similar means and members as those in the above embodiments are given the same reference numerals, and detailed description thereof is omitted. Fig. 17 is a perspective view of the mouth member 70' as viewed from the lower side, and fig. 18 is a side sectional view. In fig. 17 and 18, a difference from embodiment 6 is that the size of bottom plate portion 172D of member 2 is small, and most of bottom plate portion 172D is not disposed between lower surface T1 of projection optical system PL and substrate P (substrate stage PST). That is, the opening 74 formed in the bottom plate 172D is formed in a substantially circular shape having substantially the same size as the lower surface T1 of the projection optical system PL (optical element LS1) and having a large number of large projection areas AR 1. Most of the lower surface T1 of the optical element LS1 is exposed so as to face the substrate P (substrate stage PST). The liquid LQ sent from the liquid supply unit 11 is supplied to a space between the lower surface T1 of the projection optical system PL and the substrate P (substrate stage PST) through a supply flow path 14 formed between the side surface of the optical element LS1 and the concave portion 14A. Although the area of the flat surface 75 is small in the present embodiment, compared to embodiment 6, since there is almost no space between the 2 nd member 172 and the optical element LS1 of the projection optical system PL, and a portion where gas is likely to accumulate is small, it is possible to more reliably prevent a problem that a gas portion (bubble) is generated in the liquid LQ forming the liquid immersion area AR2 at the start of supplying the liquid LQ.

In the above-described

embodiments

6 and 7, the mouth member 70' is constituted by a combination of the 1 st member 171 and the 2 nd member 172 for the sake of simplicity of explanation, but actually, it is constituted by combining a plurality of other members. Of course, the mouth member 70' may be constituted by one member.

In the above-described

embodiments

6 and 7, the gas in the space G2 is discharged using the through-holes 130 when the liquid LQ starts to be supplied, but the through-holes 130 may be connected to a suction device (vacuum system) to forcibly discharge the gas in the space G2 when the liquid LQ starts to be supplied.

In the above-described

embodiments

6 and 7, the opening 74 of the bottom plate 172D is not limited to the shape shown in fig. 14 or 17, and may be set so that the optical path space on the image plane side of the projection optical system PL can be continuously filled with the liquid LQ even if the substrate P (substrate stage PST) moves in a state where no gas remains.

In the above-described

embodiments

6 and 7, when the liquid LQ between the nozzle member 70' and the substrate P (substrate stage PST) (optical path space on the image plane side of the projection optical system PL) is completely recovered, an operation of blowing gas from the liquid supply port 12 may be added to the liquid recovery operation using the liquid recovery port 22 or the opening portion 73A. Since the gas blown out from the liquid supply port 12 is blown to the lower surface T1 of the optical element LS1 at the front end of the projection optical system PL, the liquid LQ adhering (remaining) to the lower surface T1 of the optical element LS1 can be removed. The gas blown out from the liquid supply port 12 can flow along the lower surface T1, and the liquid (liquid droplets) adhering to the region of the lower surface T1 of the optical element LS1 through which the exposure light EL passes (that is, the region corresponding to the projection region AR1 of the lower surface T1 of the optical element LS1) can be moved (retreated) to the outside of this region. Accordingly, the liquid LQ adhering to the region of the lower surface T1 of the optical element LS1 through which the exposure light EL passes is removed. The liquid LQ adhering to the lower surface T1 of the optical element LS1 may be removed by vaporizing (drying) the blown gas. The clean gas is blown out from the liquid supply port 12 through a filter device (not shown) including a chemical filter and a particle removal filter. As the gas, a gas substantially identical to the gas inside the chamber housing the exposure apparatus EX, for example, air (dry air) is used. Further, nitrogen (dry nitrogen) may be used as the blown gas.

When the liquid LQ is completely recovered, a vacuum system may be connected to the through hole 130 or the like for discharging the gas present in the space G2 to the outside, and the liquid LQ may be sucked and recovered from the opening formed in the lower end portion 130A of the through hole 130.

Further, a gas supply system may be connected to the through hole 130 for discharging the gas existing in the space G2 to the outside, and the gas may be blown out through the through hole 130.

In

embodiments

6 and 7, the liquid supply port 12 may be disposed on both sides in the X axis direction with respect to the projection area AR1, and the liquid LQ may be supplied from both sides in the scanning direction. In this case, the lower end 130A of the through hole 130 is provided at a position different from the liquid supply port 12, for example, on both sides of the projection area AR1 in the Y axis direction.

In addition, although the supply flow path 14 is formed by the gap G3 between the concave portion 14A of the inclined plate portion 172C and the side surface of the optical element LS1 and the lower end portion of the supply flow path 14 functions as the liquid supply port 12 in

embodiments

6 and 7, the upper end portion 130B of the through hole 130 and the liquid supply portion 11 may be connected to each other to allow the through hole 130 to function as the supply flow path and the lower end portion 130A of the through hole 130 to function as the liquid supply port. When the upper end 130B of the through hole 130 is connected to the liquid supply portion 11 and the liquid LQ is supplied through the through hole 130, the gap G3 between the concave portion 14A of the inclined plate portion 172C and the side surface of the optical element LS1 is not connected to the liquid supply portion 11 (the space G3 does not function as a supply flow path), and the upper end of the liquid LQ3 is opened to the atmosphere. Then, before the liquid LQ is supplied from the through hole 130 to the space G2, the gas existing in the space G2 is discharged to the outside through the gap G3. In this way, even when the liquid LQ is supplied through the through-hole 130, a problem that gas remains in the space G2 when the liquid LQ starts to be supplied to the space G2 can be prevented, and generation of a gas portion (bubbles) in the liquid LQ can be prevented. In this case, the upper end of the space G3 may be connected to a suction device (vacuum system) to forcibly discharge the gas in the space G2 when the liquid LQ starts to be supplied.

When the liquid LQ is supplied through the through-hole 130, the lower end portions 130A of the through-hole 130 functioning as a liquid supply port are respectively arranged on both sides in the Y-axis direction with respect to the projection area AR1, and the liquid LQ can be supplied from both sides in the non-scanning direction.

Embodiment 8

Next, embodiment 8 of the present invention will be described with reference to fig. 19, 20, 21 and 22. Fig. 19 is a partially sectional view showing a schematic perspective view of the vicinity of the nozzle member 70 ″, fig. 20 is a perspective view of the nozzle member 70 ″, as viewed from the lower side, fig. 21 is a side sectional view parallel to the YZ plane, and fig. 22 is a side sectional view parallel to the XZ plane. In the following description, the same or equivalent components as those of the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

The nozzle member 70 ″ is formed by combining the 1 st member 171, the 2 nd member 172, and the 3 rd member 173, and is formed to have a substantially circular shape as a whole in a plan view. The 1 st member 171 has a side plate 171A and a thick inclined plate 171C. The 2 nd member 172 has an inclined plate portion 172C and a bottom plate portion 172D connected to a lower end portion of the inclined plate portion 172C. The 3 rd member 173 is connected to the upper ends of the 1 st member 171 and the 2 nd member 172, and a hole 173H for disposing the optical element LS1 is formed in the center of the 3 rd member 173. The optical element LS1 is disposed inside the hole portion 70H formed by the hole portion 173H of the 3 rd member 173 and the inclined plate portion 172C of the 2 nd member 172, and the side surface of the optical element disposed inside the hole portion 70H faces the inner surface 172T of the inclined plate portion 172C of the 2 nd member 172. A slit-shaped groove 73 having an annular shape in plan view is provided between an inner surface 171T of the inclined plate portion 171C of the 1 st member 171 and an outer surface 172S of the inclined plate portion 172C of the 2 nd member 172. The groove 73 is formed to have an inclination of about 45 degrees with respect to the XY plane (the surface of the substrate P).

Further, a flat surface 75, which is a surface of the nozzle member 70 ″ that is opposed to the surface of the substrate P supported by the substrate stage PST (the upper surface of the substrate stage PST) and is closest to the surface of the substrate P (the upper surface of the substrate stage PST), is formed by the lower surface 171R of the inclined plate portion 171C of the 1 st member 171 and the lower surface 172R of the bottom plate portion 172D of the 2 nd member 172. The flat surface 75 forms a surrounding projection area AR 1.

A part of bottom plate 172D forming flat surface 75 is disposed between lower surface T1 on the image plane side of optical element LS1 of projection optical system PL and substrate P (substrate stage PST) in the Z-axis direction. The bottom plate portion 172D is provided so as not to contact the lower surface T1 of the optical element LS1 and the substrate P (substrate stage PST). The upper surface of the bottom plate 172D is disposed so as to face the lower surface T1 of the optical element LS1 and to be substantially parallel to the lower surface of the optical element LS1, and a predetermined gap (space) G2 is formed between the end surface T1 of the projection optical system PL and the upper surface of the bottom plate 172D.

Space portion 24 functioning as a recovery flow path is formed in member 1 171, and liquid recovery port 22 is formed in an opening portion of space portion 24. The liquid recovery port 22 is formed in an annular shape in plan view so as to surround the opening 74 (projection area AR1), the groove 73, and the flat surface 75. The other end of the recovery pipe 23 is connected to a part of the recovery flow path (space) 24. A porous member 25 (having a slope 2 facing the substrate P supported by the substrate stage PST) is disposed in the liquid recovery port 22. The porous member 25 is attached to the liquid recovery port 22 such that the inner edge of the inclined surface 2 is substantially flush with the lower surface 171R (flat surface 75) of the 1 st member 171 and the inner edge of the inclined surface 2 is continuous with the lower surface 171R (flat surface 75). A plurality of fin members 150 are radially provided on the inclined surface 2.

Slit-shaped through holes 130 penetrating in the oblique direction through the inside of the oblique plate portion 172C of the 2 nd member 172 are formed in the 2 nd member 172 on both sides in the Y axis direction with respect to the projection area AR 1. The upper end 140B of the through hole 140 is connected to the liquid supply unit 11 via a supply pipe (supply flow path), not shown, and the lower end 140A is connected to a gap (space) G2 between the bottom surface T1 of the projection optical system PL and the bottom plate 172D. That is, the through-hole 140 functions as a supply flow path, and the opening formed in the lower end portion 140A of the through-hole 140 functions as a liquid supply port for supplying the liquid LQ to the gap G2. The liquid supply ports 140A are provided at both sides of the projection area AR1 irradiated with the exposure light EL in the Y-axis direction, and at predetermined positions (1 st position) on both sides of the optical path space for the exposure light EL outside the optical path space for the exposure light EL.

The liquid immersion mechanism 1 supplies the liquid LQ sent from the liquid supply unit 11 to the internal space (including the gap (space) G2 between the projection optical system PL and the bottom plate 172D) from the liquid supply port (lower end) 140A through the supply flow path (through hole) 140. The supply flow path 140 is formed to have an inclination of about 45 degrees with respect to the XY plane (the surface of the substrate P). In order to determine the flow direction of the liquid LQ supplied from the liquid supply port 140A to the upper surface of the bottom plate portion 172D, a fin-shaped member may be disposed in the liquid supply port 140A, or a fin-shaped protrusion may be provided on the upper surface of the bottom plate portion 172D.

Slit-shaped through holes 130 penetrating in the oblique direction through the inside of the oblique plate portion 172C of the 2 nd member 172 are formed in the 2 nd member 172 on both sides in the X axis direction with respect to the projection area AR 1. A gap is formed between a predetermined region of the upper end 130B of the through hole 130 and the 3 rd member 173 in the upper surface of the 2 nd member 172. The upper end 130B of the through hole 130 is open to the atmosphere, and the lower end 130A of the through hole 130 is connected to a gap (space) G2 between the bottom surface T1 and the bottom plate 172D of the projection optical system PL. Accordingly, the gas in the gap G2 can be discharged (exhausted) to the external space through the upper end 130B of the through hole 130. That is, the opening formed in the lower end portion 130A of the through hole 130 functions as a gas discharge port for discharging the gas in the gap G2, and the through hole 130 functions as a gas discharge flow path. The gas in the gap G2, that is, the gas around the image plane of the projection optical system PL, is connected to the exhaust port (lower end) 130A. The exhaust ports 130A are provided at both sides of the projection area AR1 irradiated with the exposure light EL in the X-axis direction, and at predetermined positions (position 2) on both sides of the optical path space of the exposure light EL outside the optical path space of the exposure light EL.

As described above, the liquid supply port 140A is provided at a predetermined position (position 1) outside the optical path space of the exposure light EL. The bottom plate 172D also functions as a guide member for guiding the flow of the liquid LQ supplied from the liquid supply port 140A. A bottom plate portion (guide member) 172D configured to prevent gas from remaining in the liquid LQ in the optical path space of the exposure light EL. That is, the bottom plate portion 172D is disposed so that the liquid LQ supplied from the liquid supply port 140A (the 1 st position provided outside the optical path space of the exposure light EL) flows through the optical path space of the exposure light EL to the 2 nd position different from the 1 st position outside the optical path space. The bottom plate 172D has a flat surface (flat portion) 75 facing the substrate P, and also has a function of stably filling the optical path of the exposure light EL with the liquid LQ, as in the above-described embodiment.

Fig. 23 is a plan view of the bottom plate portion (guide member) 172D. In the present embodiment, the exhaust port 130A is provided at the 2 nd position outside the optical path space of the exposure light EL, and the bottom plate portion 172D is disposed so that the liquid LQ supplied from the liquid supply port 140A flows to the 2 nd position where the exhaust port 130A is provided. The guide member 172D is configured to flow the liquid LQ so as not to generate a vortex in the optical path space of the exposure light EL. That is, the bottom plate 172D has an opening 74' formed such that the liquid LQ supplied from the 1 st position (where the liquid supply port 140A is disposed) flows to the 2 nd position where the exhaust port 130A is disposed, to prevent generation of a vortex in the optical path space of the exposure light EL.

A bottom plate portion 172D having: a1 st guide 181 forming a flow direction from a1 st position where the liquid supply port 140A is provided to an optical path space (projection area AR1) for the exposure light EL; and a 2 nd guide 182 which forms a flow direction from the optical path space of the exposure light EL to the 2 nd position where the exhaust port 130A is provided. That is, the 1 st guide 181 forms a flow path 181F for flowing the liquid LQ from the liquid supply port 140A to the optical path space for the exposure light EL, and the 2 nd guide 182 forms a flow path 182F for flowing the liquid LQ from the optical path space for the exposure light EL to the 2 nd position (the exhaust port 130A).

The flow path 181F formed by the 1 st guide part 181 intersects the flow path 182F formed by the 2 nd guide part 182. The channel 181F formed by the 1 st guide part 181 allows the liquid LQ to flow substantially in the Y-axis direction, and the channel 182F formed by the 2 nd guide part 182 allows the liquid LQ to flow substantially in the X-axis direction. The 1 st guide portion 181 and the 2 nd guide portion 182 form an opening 74' having a substantially cross shape in a plan view. The opening 74 is disposed on the image plane side of the projection optical system PL, and is provided so that the exposure light EL passes through a substantially central portion of the opening 74' formed in a substantially cross shape. That is, the optical path space for the exposure light EL is set at the intersection of the flow path 181F formed by the 1 st guide 181 and the flow path 182F formed by the 2 nd guide 182.

In the present embodiment, the flow path 181F formed by the 1 st guide part 181 is substantially orthogonal to the flow path 182F formed by the 2 nd guide part 182. The width D1 of the flow path 181F formed by the 1 st guide 181 is substantially the same as the width D2 of the flow path 182F formed by the 2 nd guide 182. In the present embodiment, the connection 190 between the 1 st guide 181 and the 2 nd guide 182 is formed in a curved shape (circular arc shape).

The liquid supply port 140A supplies the liquid LQ to the internal space (including a gap (space) G2 between the bottom surface T1 and the bottom plate 172D of the projection optical system PL). The liquid LQ supplied from the liquid supply port 140A to the gap G2 flows into the optical path space for the exposure light EL while being guided by the 1 st guide 181, and after passing through the optical path space for the exposure light EL, flows outside the optical path space for the exposure light EL while being guided by the 2 nd guide 182. That is, the flow path of the liquid LQ is bent at or near the intersection of the 1 st lead part 181 and the 2 nd lead part 182. Alternatively, the flow path of the liquid LQ is curved in the optical path space or its vicinity. The liquid immersion mechanism 1 prevents the generation of eddy currents in the optical path space of the exposure light EL by guiding and flowing the liquid LQ by the 1 st and 2

nd guide portions

181 and 182 of the bottom plate portion 172D. Accordingly, even if gas (bubbles) is present in the optical path space for the exposure light EL, the gas (bubbles) can be discharged to the 2 nd position outside the optical path space for the exposure light EL by the flow of the liquid LQ, and the gas (bubbles) can be prevented from remaining in the optical path space for the exposure light EL.

As shown in fig. 19, 21, etc., the groove 73 between the 1 st member 171 and the 2 nd member 172 is formed as an opening 74' surrounding the light path space containing the exposure light EL. Further, the groove 73 is formed so as to surround the lower surface 172R constituting a part of the flat surface 75. An opening 73A disposed to face the substrate P (the upper surface of the substrate stage PST) is formed at the lower end of the groove 73. The opening 73A is formed in a substantially annular shape in plan view. On the other hand, an opening 73B having a substantially annular shape in plan view is also formed at the upper end of the groove 73. A notch 171K is formed in the upper end of the inclined plate portion 171C of the 1 st member 171 at a portion facing the 2 nd member 172, and a wide portion is formed at the upper end of the groove 73 by the notch 171K. Next, a space 73W is formed between the wide portion and the 3 rd member 173. An opening 73B at the upper end of the groove 73 is disposed inside the space 73W, and an opening 73A provided at the lower end of the groove 73 (near the image plane side of the projection optical system PL) is connected to the space 73W through the groove 73. That is, the space 73W communicates with the gas around the image plane of the projection optical system PL through the groove 73 (opening 73A).

As shown in fig. 21, a flow path 131 'connected to the space 73W is formed in a part of the 3 rd member 173, and the flow path 131' is connected to a suction device 132 including a vacuum system via a pipe 133. The flow path 131' and the suction device 132 are used to completely collect the liquid LQ between the nozzle member 70 ″ and the substrate P (substrate stage PST), and to collect the liquid LQ through the groove 73.

Further, a hole 134 for allowing the inside and the outside of the space 73W to flow is formed in the 3 rd member 173 at a position different from the flow passage 131'. Hole 134 has a diameter (size) smaller than that of flow passage 131' and is far smaller than opening 73A. In the present embodiment, the diameter of the hole 134 is about 1 mm. The hole 134 opens the space 73W to the atmosphere, and thus the gas (gap G2) around the image plane of the projection optical system PL is also opened to the atmosphere through the opening 73A, the groove 73, and the space 73W. Accordingly, a part of the liquid LQ between the nozzle member 70 ″ and the substrate P (substrate stage PST) can be put in and out of the groove portion 73. Accordingly, even if the size (diameter) of the nozzle member 70 ″ is small, the liquid LQ is suppressed from flowing out to the outside of the liquid recovery port 22.

Next, the operation of the liquid immersion mechanism 1 provided with the nozzle member 70 ″ having the above-described structure will be described. To supply the liquid LQ onto the substrate P, the control unit CONT drives the liquid supply portion 11 to send out the liquid LQ from the liquid supply portion 11. The liquid LQ sent from the liquid supply portion 11 flows into the upper end portion 140B of the supply flow path 14 of the nozzle member 70 ″ after flowing through the supply tube. The liquid LQ flowing into the upper end portion 140B of the supply channel 14 flows through the supply channel 140, and is supplied from the liquid supply port 140A to the space G2 between the end surface T1 of the projection optical system PL and the bottom plate portion 172D. Here, the gas portion existing in the space G2 before the liquid LQ is supplied to the space G2 is discharged to the outside through the through-hole 130 or the opening 74'. Accordingly, it is possible to prevent a problem that gas remains in the space G2 when the liquid LQ starts to be supplied to the space G2, and to prevent a problem that a gas portion (bubble) is generated in the liquid LQ. Since the liquid LQ sent from the liquid supply unit 11 flows inside the groove (supply flow path) 140, the liquid is supplied to the space G2 without applying a force to the side surface of the optical element LS1 or the like. Further, since the liquid LQ is not connected to the side surface of the optical element LS1, even when a predetermined functional material is applied to the side surface of the optical element LS1, for example, the functional material is prevented from being affected.

After the liquid LQ supplied to the space G2 fills the space G2, the liquid LQ flows into the space between the flat surface 75 and the substrate P (substrate stage PST) through the opening 74'. At this time, since the liquid recovery mechanism 20 recovers the liquid LQ on the substrate P by a predetermined amount per unit time, the liquid LQ flowing into the space between the flat surface 75 and the substrate P (substrate stage PST) through the opening 74' forms the liquid immersion area AR2 of a desired size on the substrate P.

Since the liquid LQ supplied from the liquid supply port 140A to the space G2 flows to the optical path space (projection area AR1) for the exposure light EL after being guided by the 1 st guide 181, that is, flows to the outside of the optical path space for the exposure light EL after being guided by the 2 nd guide 182, even if a gas portion (bubble) is generated in the liquid LQ, the bubble can be discharged to the outside of the optical path space for the exposure light EL by the flow of the liquid LQ. Further, since the bottom plate portion 172D allows the liquid LQ to flow so as not to generate a vortex in the optical path space of the exposure light EL, it is possible to prevent air bubbles from remaining in the optical path space of the exposure light EL. Further, since the bottom plate portion 172D causes the liquid LQ to flow toward the exhaust port 130A, the gas portion (bubbles) present in the liquid LQ is smoothly discharged to the outside through the exhaust port 130A. Even if a gas portion (bubbles) exists in the liquid LQ in the space between the flat surface 75 and the substrate P (substrate stage PST), the liquid LQ in the space between the flat surface 75 and the substrate P (substrate stage PST) passes through the recovery port 22 and is recovered together with the gas portion (bubbles).

During the period of forming the liquid immersion area AR2, such as during the liquid immersion exposure of the substrate P, the flow passage 131' connected to the groove portion 73 is closed and the driving of the suction device 132 is stopped. Accordingly, even when the substrate (substrate stage PST) is moved relative to the liquid immersion area AR2 (formed so as to cover the projection area AR1), a part of the liquid LQ in the liquid immersion area AR2 can enter and exit the groove portion 73 (see arrow F3 in fig. 22) which is opened to the atmosphere through the hole 134, and a problem such as the outflow of the liquid LQ in the liquid immersion area AR2 can be prevented.

When the liquid LQ between the nozzle member 70 ″ and the substrate P (substrate stage PST) is completely recovered, for example, at the end of the immersion exposure of the substrate P, the control device CONT opens the flow path 131' connected to the groove portion 73 in addition to the liquid recovery operation through the liquid recovery port 22 of the liquid recovery mechanism 20, and drives the suction device 132 to make the internal space of the groove portion 73 negative in pressure, thereby performing the liquid recovery operation through the opening portion 73A of the groove portion 73. In this way, by using the opening 73A closest to the substrate P (substrate stage PST), the liquid LQ between the nozzle member 70 ″ and the substrate P (substrate stage PST) can be reliably recovered in a shorter time. At this time, since the hole 134 for opening to the atmosphere is smaller than the opening 73A functioning as a liquid LQ recovery port, the liquid LQ can be recovered by making the groove 73 sufficiently negative pressure.

Further, when the liquid LQ between the nozzle member 70 ″ and the substrate P (substrate stage PST) is completely recovered, an operation of blowing gas from the liquid supply port 140 may be added to the liquid recovery operation using the liquid recovery port 22 or the opening portion 73A.

In addition, the suction device 132 may be driven by opening the flow passage 131' connected to the groove portion 73, as long as the state (shape, etc.) of the liquid immersion area AR2 is maintained during the formation of the liquid immersion area AR2, such as during the liquid immersion exposure of the substrate P. In this way, bubbles in the liquid LQ can be recovered through the groove portions 73.

As shown in fig. 24, the upper end 130B of the through hole 130 may be connected to a suction device (suction system) 135, and the exhaust port 130A may be connected to the suction device 135 through the through hole 130. For example, when the liquid LQ for forming the liquid immersion area AR2 starts to be supplied, the suction device 135 may be driven to make the inside of the through hole 130 negative pressure, and the gas in the space G2 may be forcibly discharged. In this way, it is possible to prevent the occurrence of a problem that gas remains in the space G2 and a problem that a gas portion (bubble) is generated in the liquid LQ. Further, the substrate P may be subjected to the liquid immersion exposure while the suction device 135 is driven, or the driving of the suction device 135 may be stopped during the liquid immersion exposure of the substrate P.

The nozzle member 70 ″ is constituted by three

members

171, 172, and 173, i.e., the 1 st, 2 nd, and 3 rd members, but may be constituted by one member or a plurality of members other than three members.

Embodiment 9

FIG. 25 shows embodiment 9. The present embodiment is characterized in that the width D2 of the flow path 182F formed by the 2 nd guide 182 is smaller than the width D1 of the flow path 181F formed by the 1 st guide 181. Accordingly, the flow rate of the liquid LQ flowing through the flow path 182F formed by the 2 nd lead part 182 can be increased with respect to the flow rate of the liquid LQ flowing through the flow path 181F formed by the 1 st lead part 181. Accordingly, the gas (bubbles) in the optical path space of the exposure light EL can be rapidly and smoothly discharged to the outside of the optical path space of the exposure light EL by the high-speed liquid LQ.

The 10 th embodiment

FIG. 26 shows the 10 th embodiment. The feature of the present embodiment is that the width D2 of the flow path 182F formed by the 2 nd guide 182 is formed so as to gradually narrow from the optical path space of the exposure light EL (the projection area AR1 or the upstream side of the 2 nd guide 182) to the 2 nd position where the exhaust port 130A is provided (or the downstream side of the 2 nd guide 182). Even with this configuration, the flow rate of the liquid LQ flowing through the flow path 182F formed by the 2 nd lead part 182 is increased with respect to the flow rate of the liquid LQ flowing through the flow path 181F formed by the 1 st lead part 181, and the gas (bubbles) can be rapidly and smoothly discharged to the outside of the optical path space for the exposure light EL.

Embodiment 11

FIG. 27 shows embodiment 11. The present embodiment is characterized in that the connection 190 between the 1 st guide 181 and the 2 nd guide 182 is formed in a straight line, and a corner is formed between the 1 st guide 181 and the 2 nd guide 182. Even with this configuration, generation of eddy current is suppressed, and gas (bubbles) is prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and can be discharged to the outside of the optical path space of the exposure light EL.

Embodiment 12

FIG. 28 shows embodiment 12. The present embodiment is characterized in that (the channel width of) a predetermined region in the vicinity of the liquid supply port 140A in the channel 181F formed by the 1 st guide 181 is formed so as to gradually narrow (from upstream to downstream) from the liquid supply port 140A toward the optical path space (projection region AR1) for the exposure light EL, and (the channel width of) a predetermined region in the vicinity of the exhaust port 130A in the channel 182F formed by the 2 nd guide 182 is formed so as to gradually narrow (from upstream to downstream) from the exhaust port 130A toward the optical path space (projection region AR1) for the exposure light EL. In the present embodiment, the 1 st guide portion 181 intersects the 2 nd guide portion 182 at substantially right angles. Even with this configuration, generation of eddy current is suppressed, and gas (bubbles) is prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and can be discharged to the outside of the optical path space of the exposure light EL.

Embodiment 13

FIG. 29 shows embodiment 13. The present embodiment is characterized in that only one liquid supply port 140A is provided. The flow path 181F formed by the 1 st guide part 181 is substantially orthogonal to the flow path 182F formed by the 2 nd guide part 182, and the opening 74' is formed in a substantially T-shape in a plan view. Even with this configuration, generation of eddy current is suppressed, and gas (bubbles) is prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and can be discharged to the outside of the optical path space of the exposure light EL.

Embodiment 14

FIG. 30 shows the 14 th embodiment. The present embodiment is characterized in that the flow path 181F formed by the 1 st guide part 181 and the flow path 182F formed by the 2 nd guide part 182 do not intersect at right angles, but intersect at a predetermined angle other than 90 degrees. The liquid supply port 140A (position 1) is provided in a region outside the optical path space (projection region AR1) for the exposure light EL, and is offset in the θ Z direction from a position aligned in the Y axis direction with the projection region AR1, and the exhaust port 130A (position 2) is also provided in a position offset in the θ Z direction from a position aligned in the X axis direction with the projection region AR 1. Even with this configuration, generation of eddy current is suppressed, and gas (bubbles) is prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and can be discharged to the outside of the optical path space of the exposure light EL.

The 15 th embodiment

FIG. 31 shows the 15 th embodiment. The characteristic feature of the present embodiment is that the liquid supply port 140A and the exhaust port 130A are provided at three predetermined positions in the region outside the optical path space of the exposure light EL. In the present embodiment, the liquid supply port 140A and the exhaust port 130A are alternately arranged at substantially equal intervals in the region outside the optical path space (projection region AR1) of the exposure light EL so as to surround the optical axis AX of the projection optical system PL. The flow paths 181F formed by the 1 st guide part 181 and the flow paths 182F formed by the 2 nd guide part 182 intersect at a predetermined angle. Even with this configuration, generation of eddy current is suppressed, and gas (bubbles) is prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and can be discharged to the outside of the optical path space of the exposure light EL.

The 16 th embodiment

FIG. 32 shows the 16 th embodiment. The present embodiment is characterized in that the liquid supply port 140A (position 1) is provided in a region outside the optical path space (projection region AR1) of the exposure light EL, and is aligned with the projection region AR1 in the Y-axis direction, and the exhaust port 130A (position 2) is provided in a position offset in the θ Z direction from the position aligned with the projection region AR1 in the Y-axis direction. In the present embodiment, the exhaust port 130A (position 2) is provided at a position separated by about 45 degrees in the θ Z direction from a position aligned in the Y axis direction with the projection area AR1 in the area outside the optical path space (projection area AR1) of the exposure light EL. The bottom plate 172D includes: a1 st guide 181 which forms a flow direction from the liquid supply port 140A to the optical path space of the exposure light EL; and a 2 nd guide 82 which forms a flow direction from the optical path space of the exposure light EL to the exhaust port 130A. The liquid LQ is caused to flow substantially in the Y-axis direction through a flow path 181F formed by the 1 st guide part 181. On the other hand, the flow path 182F formed by the 2 nd guide 182 includes a1 st region 182Fa orthogonal to the flow path 181F and configured to flow the liquid LQ substantially in the X-axis direction, and a 2 nd region 182Fb configured to flow the liquid LQ flowing through the 1 st region 182Fa toward the exhaust port 130A. The flow path 181F and the 1 st region 182Fa of the flow path 182F form an opening 74' having a substantially cross shape in a plan view. According to this configuration, even if the position where the liquid supply port 140A or the exhaust port 130A is provided is limited, generation of a vortex can be suppressed, gas (bubbles) can be prevented from remaining in the liquid LQ in the optical path space of the exposure light EL, and the gas (bubbles) can be discharged to the outside of the optical path space of the exposure light EL.

Further, if the generation of eddy current can be suppressed and the gas (bubbles) can be discharged to the outside of the optical path space of the exposure light EL, the number and arrangement of the liquid supply ports 140A and the exhaust ports 130A, the shapes of the

flow paths

181F and 182F corresponding to the liquid supply ports 140A and the exhaust ports 130A, and the like can be arbitrarily set. For example, four or more liquid supply ports 140A and exhaust ports 130A may be provided, the number of the liquid supply ports 140A and exhaust ports 130A may be different from each other, or the liquid supply ports 140A and exhaust ports 130A may be arranged at unequal intervals. It is preferable that the number and arrangement of the liquid supply ports 140A and the exhaust ports 130A, and the shapes of the

flow paths

181F and 182F corresponding to the liquid supply ports 140A and the exhaust ports 130A are optimized according to experimental or simulation results, so that the generation of vortex can be suppressed and the gas (bubbles) can be discharged to the outside of the optical path space of the exposure light EL.

In addition, in the above-described embodiments 8 to 16, although the liquid immersion mechanism 1 causes the liquid LQ supplied from the liquid supply port 140A provided at the 1 st position to flow toward the exhaust port 130A provided at the 2 nd position via the bottom plate portion (guide member) 172D, the exhaust port 130A may not be provided at the 2 nd position. Even without the gas discharge port 130A, the gas (bubbles) in the optical path space for the exposure light EL is discharged to the outside of the optical path space for the exposure light EL by the flow of the liquid LQ, and the gas is prevented from remaining in the liquid LQ in the optical path space for the exposure light EL. On the other hand, by providing the exhaust port 130A at the 2 nd position, the gas can be smoothly exhausted from the optical path space of the exposure light EL.

In the above-described embodiments 8 to 16, the liquid LQ is supplied to the projection area AR1 in the Y-axis direction by the liquid immersion mechanism 1, but the liquid LQ may be supplied to the projection area AR1 in the X-axis direction by providing the liquid supply port 140A on both sides in the X-axis direction with respect to the projection area AR1, for example.

In the embodiments 1 to 16, the slope (lower surface of the porous member) formed on the lower surface of the nozzle member 70 may be a curved surface. In the embodiments 2 to 4 described above with reference to fig. 9 to 11, the wall portion 76 may be provided on the periphery of the lower surface 2 of the porous member 25.

In the embodiments 1 to 16, the porous member 25 is disposed in the liquid recovery port 22, but the porous member 25 may not be disposed. Even in this case, for example, by providing a slope having a larger distance from the optical axis AX of the exposure light EL to the surface of the substrate P as the distance from the lower surface of the nozzle member 70 increases, and providing the liquid recovery port at a predetermined position on the slope, the shape of the interface LG can be maintained, and thus, defects such as bubbles generated in the liquid LQ in the liquid immersion area AR2 can be prevented. Further, the size of the liquid immersion area AR2 may be reduced.

In the above-described embodiments 1 to 16, the liquid recovery port is provided on the inclined surface (the lower surface of the porous member) of the lower surface of the nozzle member 70, but the liquid recovery port may be provided on a surface substantially parallel to (flush with) the flat surface 75 without forming the inclined surface on the lower surface of the nozzle member 70 as long as the liquid immersion area AR2 of the liquid LQ can be maintained in a desired state. That is, when the contact angle of the liquid LQ with respect to the substrate P is large, or when the recovery capability of recovering the liquid LQ from the liquid recovery port 22 is high, or the like, even if the moving speed of the substrate P is increased, the liquid LQ can be recovered in a state where the liquid LQ does not leak, the liquid recovery port can be provided on a surface parallel to (flush with) the flat surface 75.

In the above-described embodiments 1 to 16, the wall portion 76 is provided around the inclined surface (the lower surface of the porous member) formed on the lower surface of the nozzle member 70, but if leakage of the liquid LQ can be suppressed, the wall portion 76 may not be provided.

In the above-described embodiments 1 to 16, the groove 73 having the opening 73A facing the substrate P is provided in the nozzle member, but the groove 73 may be omitted. At this time, in order to make the space on the image plane side of the projection optical system PL a non-liquid-immersed state, the liquid LQ on the image plane side of all the projection optical systems PL can be collected using the liquid collection port 22. In this case, as in embodiments 6 to 16, when an opening connected to the space G2 between the upper surface of the bottom plate portion 72D and the optical element LS1 is formed, the liquid LQ may be recovered from the opening in parallel with the liquid recovery operation of the liquid recovery port 22.

In the nozzle tip member 70 of embodiments 1 to 16, a part of the flat surface (flat portion) 75 is formed between the projection optical system PL and the substrate P, and a slope (lower surface of the porous member) is formed outside the flat surface, but a part of the flat surface may be disposed outside (around) the end surface T1 of the projection optical system PL with respect to the optical axis of the projection optical system PL instead of being disposed below the projection optical system PL. In this case, the flat surface 75 may be substantially flush with the end surface T1 of the projection optical system PL, or the Z-axis position of the flat surface 75 may be located at a position separated in the + Z direction or the-Z direction from the end surface T1 of the projection optical system PL.

In the above-described embodiments 1 to 5, the liquid supply port 12 is formed in the annular slit shape so as to surround the projection area AR1, but a plurality of supply ports may be provided separately from each other. At this time, although the position of the supply port is not particularly limited, one supply port may be provided on each of both sides (both sides in the X-axis direction or both sides in the Y-axis direction) of the projection area AR1, or one (four in total) supply port may be provided on each of both sides in the X-axis direction and the Y-axis direction of the projection area AR 1. As long as the desired liquid immersion area AR2 can be formed, only one supply port may be provided at a position away from the projection area AR1 in a predetermined direction. When the liquid LQ is supplied from the plurality of supply ports, the amount of the liquid LQ supplied from each supply port may be adjusted to supply different amounts of the liquid from each supply port.

In addition, although the optical element LS1 of the projection optical system PL is a lens element having refractive power in the above embodiments 1 to 16, a parallel flat plate having no refractive power may be used as the optical element LS 1.

In the above-described embodiments 1 to 16, the optical path space on the image plane side (lower surface side) of the optical element LS1 of the projection optical system PL is filled with the liquid LQ, but as disclosed in international publication No. 2004/019128, a structure may be adopted in which the optical path spaces on both the upper surface side and the lower surface side of the optical element LS1 of the projection optical system PL are filled with the liquid LQ.

As described above, pure water is used for the liquid LQ of the present embodiment. Pure water has an advantage that it can be easily obtained in a large amount in a semiconductor manufacturing factory or the like, and does not adversely affect a photoresist, an optical element (lens), or the like on the substrate P. Further, pure water is expected to have a function of cleaning optical elements (provided on the surface of the substrate P and the front end surface of the projection optical system PL) because the content of impurities is extremely low, in addition to having no adverse effect on the environment. Further, when the purity of pure water supplied from a factory or the like is low, the exposure apparatus may be provided with an ultrapure water generator.

Further, the refractive index n of pure water (water) for the exposure light EL having a wavelength of about 193nm is about 1.44, and when ArF excimer laser light (having a wavelength of 193nm) is used as the light source for the exposure light EL, the wavelength on the substrate P is shortened to about 1/n, that is, about 134nm, and high resolution can be obtained. Further, since the depth of focus is about n times, that is, about 1.44 times, larger than that in air, if the depth of focus is secured to the same extent as that in air, the numerical aperture of the projection optical system PL can be increased, and the resolution can be improved.

In addition, when the liquid immersion method as described above is used, the numerical aperture NA of the projection optical system PL may be 0.9 to 1.3. As described above, when the numerical aperture NA of the projection optical system PL is increased, it is preferable to use polarized illumination because the image forming performance may be deteriorated depending on the polarization effect of any polarized light conventionally used as exposure light. In this case, it is preferable that the diffraction light having a large amount of S-polarization component (TE-polarization component), that is, a polarization direction component along the longitudinal direction of the linear pattern is emitted from the pattern of the reticle (reticle) in accordance with the linear and spatial (line and space) pattern of the reticle (reticle) by linear polarization illumination in the longitudinal direction. When the space between the projection optical system PL and the photoresist applied to the surface of the substrate P is filled with the liquid, the transmittance of the photoresist surface of the diffracted light of the S-polarization component (TE-polarization component) contributing to the improvement of the contrast becomes higher as compared with the case where the space between the projection optical system PL and the photoresist applied to the surface of the substrate P is filled with the air (gas), and therefore, even when the numerical aperture NA of the projection optical system exceeds 1.0, high image forming performance can be obtained. Further, it is more effective to appropriately combine a phase shift mask and an oblique incidence illumination method (particularly, dipole (dipole) illumination method) in the longitudinal direction of the matching line pattern as disclosed in Japanese unexamined patent publication No. 6-188169. In particular, the combination of the linearly polarized illumination method and the dipole illumination method is effective when the periodic direction of the line/space pattern is limited to a predetermined direction or when the hole patterns are densely formed in a predetermined direction. For example, when a half-tone (half-tone) type phase shift mask (pattern with a half-pitch of about 45 nm) having a transmittance of 6% is illuminated by a linearly polarized illumination method and a dipole illumination method in combination, when the illumination σ defined by the circumscribed circle of the two light fluxes forming a dipole in the pupil plane of the illumination system is set to 0.95, the respective beam radii of the pupil plane are set to 0.125 σ, and the numerical aperture of the projection optical system PL is set to NA 1.2, the depth of focus (DOF) can be increased by about 150nm as compared with the case of using an arbitrary polarized light.

When a fine line/space pattern (for example, a line/space of about 25 to 50 nm) is exposed on the substrate P using a projection optical system PL of about 1/4 reduction magnification using ArF excimer laser light as exposure light, the reticle M functions as a polarizing plate by a waveguide effect (Wave guide) depending on the structure of the reticle M (for example, the fineness of the pattern or the thickness of chromium), and the amount of diffracted light that is emitted from the reticle M as an S-polarized light component (TE-polarized light component) is larger than that of a P-polarized light component (TM-polarized light component) that decreases the contrast. In this case, although the above-described linearly polarized illumination is preferably used, high resolution performance can be obtained even when the reticle M is illuminated with arbitrary polarized light and the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3.

Further, when the ultrafine line/space pattern on the mask M is exposed on the substrate P, although it is possible to make the P-polarized light component (TM-polarized light component) larger than the S-polarized light component (TE-polarized light component) by the Wire Grid effect, when a line/space pattern larger than 25nm is exposed on the substrate P using, for example, ArF excimer laser light as the exposure light and using a projection optical system PL of a reduction magnification of about 1/4, since diffracted light of the S-polarized light component (TE-polarized light component) is emitted from the mask M more than that of the P-polarized light component (TM-polarized light component), high resolution performance can be obtained even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3.

In addition to the linearly polarized illumination (S-polarized illumination) in accordance with the longitudinal direction of the line pattern of the mask (reticle), as disclosed in japanese patent application laid-open No. 6-53120, a combination of the polarized illumination method in which linearly polarized light is applied in the circular line (circumferential) direction about the optical axis and the oblique incidence illumination method is also effective. In particular, in the case where, in addition to the line pattern in which the pattern of the reticle (reticle) extends in a predetermined direction, line patterns extending in a plurality of different directions are mixed (line/space pattern mixture in which the periodic directions are different), similarly as disclosed in japanese patent application laid-open No. 6-53120, a high imaging performance can be obtained even when the numerical aperture NA of the projection optical system PL is large by using a polarization illumination method (linearly polarizing in the line direction of a circle centered on the optical axis) and an annulus illumination method in combination. For example, when a half-transmissive phase shift mask (a pattern with a half pitch of about 63 nm) having a transmittance of 6% is illuminated by a polarization illumination method (linearly polarized light in a line direction of a circle centered on an optical axis) and an annular illumination method (an annular ratio of 3/4) in combination, when the illumination σ is set to 0.95 and the numerical aperture of the projection optical system PL is set to NA of 1.00, the depth of focus (DOF) can be increased by about 250nm compared with the case of using any polarized light, and when the half-pitch is a pattern with a half pitch of about 55nm and the numerical aperture of the projection optical system PL is set to NA of 1.2, the depth of focus can be increased by about 100 nm.

In the present embodiment, the optical element LS2 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberrations (such as spherical aberration and coma aberration) can be adjusted by this lens. Further, the optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Or a parallel plane plate which can transmit the exposure light EL.

Further, when the pressure between the substrate P and the optical element at the tip of the projection optical system PL caused by the flow of the liquid LQ is large, the optical element may be firmly fixed so as not to move by the pressure without making the optical element exchangeable.

In the present embodiment, the space between the projection optical system PL. and the substrate P is filled with the liquid LQ, but a configuration may be adopted in which the liquid LQ is filled with a cover glass made of a parallel flat plate, for example, in a state where the cover glass is attached to the surface of the substrate P.

Although the projection optical system PL of the embodiment described with reference to fig. 1 to 32 fills the optical path space on the image plane side of the optical element at the tip with the liquid, a projection optical system in which the optical path space on the mask M side of the optical element LS1 is also filled with the liquid as disclosed in international publication No. 2004/019128 may be used.

The liquid in the present embodiment is water, but may be a liquid other than water. For example, the light source for exposure light is F₂When using laser, due to this F₂The laser cannot transmit water, so that F can be used₂The laser-transmissive liquid is used as the 1 st and 2 nd liquids LQ1 and LQ2, and may be a fluorine-based fluid such as perfluoropolyether (PFPE) or fluorine-based oil. In this case, for example, the parts in contact with the 1 st and 2 nd liquids LQ1 and LQ2 are subjected to lyophilic treatment by forming a thin film of a low-polarity molecular structure substance containing fluorine. As the 1 st and 2 nd liquids LQ1 and LQ2, other liquids (e.g., cedar oil) that are transmissive to the exposure light EL, have the highest possible refractive index, and are stable against the photoresist applied to the projection optical system PL and the surface of the substrate P can be used. At this time, the surface treatment is also performed according to the polarity of the 1 st and 2 nd liquids LQ1 and LQ2 used. In addition, the air conditioner is provided with a fan,instead of pure water as the liquid LQ1, LQ2, various fluids having desired refractive indices, such as supercritical fluids or high refractive index gases, can also be used.

In the description using fig. 1, 4, 15, 16, 18, 21, 22, and 24, the space between the lower surface T1 of the optical element LS1 and the substrate P is filled with the liquid LQ in a state where the substrate P and the lower surface T1 of the optical element LS1 are opposed to each other, but even when the projection optical system PL and another member (for example, the upper surface 91 of the substrate stage or the like) are opposed to each other, the space between the projection optical system PL and the other member can be filled with the liquid.

The substrate P according to each of the above embodiments can be applied to a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, a mask plate used in an exposure apparatus, a reticle original plate (synthetic quartz, silicon wafer), or the like, in addition to a semiconductor wafer for manufacturing a semiconductor device.

In the above embodiment, the light transmissive mask (reticle) is used for forming a predetermined light shielding pattern (or phase pattern, or dimming pattern) on a light transmissive substrate, but an electronic mask disclosed in, for example, U.S. Pat. No. 6,778,257, which forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, may be used instead of the reticle.

The present invention is also applicable to an exposure apparatus (lithography system) that forms a line/space pattern on a wafer W by forming interference fringes on the wafer W as disclosed in international publication No. 2001/035168.

The exposure apparatus EX is applicable to not only a step-and-scan type exposure apparatus (scanning stepper) that performs scanning exposure of the pattern of the mask M by moving the mask M in synchronization with the substrate P, but also a step-and-repeat type projection exposure apparatus (stepper) that sequentially steps the substrate P while exposing the pattern of the mask M once in a state where the mask M and the substrate P are stationary.

As the exposure apparatus EX, the following exposure apparatuses can be applied: an exposure apparatus of a system in which a1 st pattern reduced image is exposed to a substrate P at one time by using a projection optical system (for example, a refractive projection optical system having a reduction magnification of 1/8 and not including a reflection element) in a state in which the 1 st pattern and the substrate P are substantially stationary. In this case, the present invention can be applied to a bonding type primary exposure apparatus that once exposes the substrate P by partially overlapping the reduced image of the 2 nd pattern with the 1 st pattern using the projection optical system in a state where the 2 nd pattern and the substrate P are substantially stationary. Further, as the exposure apparatus of the bonding method, an exposure apparatus of a step bonding method is also applicable, in which at least 2 pattern portions are superimposed and transferred on the substrate P, and the substrate P is sequentially moved.

The present invention is also applicable to a dual stage exposure apparatus including two substrate stages for holding substrates. The structure and exposure operation of the double stage type exposure apparatus are disclosed in, for example, Japanese patent laid-open Nos. Hei 10-163099 and Hei 10-214783 (corresponding to U.S. Pat. Nos. 6,341,007, 6,400,441, 6,549,69 and 6,590,634), Japanese patent application laid-open No. 2000-505958 (corresponding to U.S. Pat. No. 5,969,441) or U.S. Pat. No. 6,208,407, and the disclosures of the above documents are incorporated as part of the description herein within the scope permitted by the national statutes of the specification or selection of the present international application.

Further, the present invention can be applied to an exposure apparatus disclosed in JP-A-11-135400, which comprises: a substrate stage for holding the substrate P, and a measurement stage on which a reference member having a reference mark formed thereon or various types of photosensors are mounted.

The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device for exposing a semiconductor device pattern to a substrate P, but is also widely applicable to an exposure apparatus for manufacturing a liquid crystal display device or a display, an exposure apparatus for manufacturing a thin film magnetic head, a photographic device (CCD), a reticle, a mask plate, and the like.

When a linear motor is used for the substrate stage PST or the mask stage MST, either an air floating type using an air bearing or a magnetic floating type using a Lorentz (Lorentz) force or a reactance may be used. The stages PST and MST may be of a type that moves along a guide, or of a type that does not have a guide. Examples of linear motors for use in the stage are disclosed in U.S. Pat. Nos. 5,623,853 and 5,528,118, the contents of which are incorporated herein by reference to the extent permitted by the national statutes assigned or selected in the actual application.

As a driving mechanism of each of the stages PST and MST, a planar motor may be used, in which a magnet unit having a magnet arranged two-dimensionally and an armature unit having a coil arranged two-dimensionally are opposed to each other, and each of the stages PST and MST is driven by an electromagnetic force. In this case, either one of the magnet unit and the armature unit may be connected to the stage PST or the stage MST, and the other of the magnet unit and the armature unit may be provided on the moving side of the stage PST or the stage MST.

The reaction force generated by the movement of substrate stage PST may be mechanically released to the ground (grounded) using the frame member so as not to be transmitted to projection optical system PL. The details of the method of dealing with this reaction force are disclosed in U.S. Pat. No. 5,528,118 (Japanese patent application laid-open No. 8-166475), for example, and the contents of the document are incorporated herein as part of the description thereof, within the scope permitted by the national statutes specified or selected in the international application.

The reaction force generated by the movement of substrate stage MST may be mechanically released to the ground (grounded) using the frame member so as not to be transmitted to projection optical system PL. The details of the method of processing this reaction force are disclosed in, for example, U.S. Pat. No. 5,874,820 (Japanese patent application laid-open No. 8-330224), and the contents of the document are incorporated herein as part of the description thereof, insofar as they are allowed by the national statutes specified or selected in the international application.

As described above, the exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems (including the respective components recited in the claims of the present invention) so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various accuracies, before and after assembly, adjustment for achieving optical accuracy is performed on various optical systems, adjustment for achieving mechanical accuracy is performed on various mechanical systems, and adjustment for achieving electrical accuracy is performed on various electrical systems. The assembly process from various subsystems to the exposure apparatus includes mechanical connection, wiring connection of circuits, piping connection of pneumatic circuits, and the like. Of course, there is a separate assembly process for each subsystem before the assembly process from each subsystem to the exposure apparatus. When the assembling process from various subsystems to the exposure device is finished, the comprehensive adjustment is carried out to ensure various accuracies of the whole exposure device. Further, it is preferable that the exposure apparatus is manufactured in a clean room in which temperature, cleanliness, and the like are controlled.

As shown in fig. 33, the micro device of the semiconductor device is manufactured by the following steps: a step 201 of designing the functions and performances of the microdevice, a step 202 of fabricating a reticle (reticle) based on the designing step, a step 203 of manufacturing a substrate constituting a base material of the device, an exposure processing step 204 of exposing the reticle pattern to the substrate by the exposure apparatus EX of the above embodiment, a device assembling step (including a dicing step, a bonding step, and a packaging step) 205, an inspection step 206, and the like are performed.

According to the present invention, even when the scanning speed is increased, the liquid immersion area of the liquid can be maintained in a desired state, and therefore, the exposure process can be performed efficiently.

Claims

1. An exposure apparatus for exposing a substrate by irradiating the substrate with exposure light through a liquid, comprising:

a projection optical system; and

a liquid immersion mechanism that supplies the liquid and recovers the liquid;

the liquid immersion mechanism has an inclined surface which is opposite to the surface of the substrate and is inclined relative to the surface of the substrate, and a liquid recovery port of the liquid immersion mechanism is formed on the inclined surface.

2. The exposure apparatus according to claim 1, wherein the inclined surface is formed so that a distance from the substrate becomes larger as a distance from the optical axis of the exposure light becomes longer.

3. The exposure apparatus according to claim 1, wherein the inclined surface is formed so as to surround a projection area irradiated with the exposure light.

4. The exposure apparatus according to claim 3, wherein the liquid immersion mechanism has a wall portion for suppressing leakage of the liquid at a peripheral edge of the inclined surface.

5. The exposure apparatus according to claim 1, wherein the liquid recovery port is formed so as to surround a projection area irradiated with the exposure light.

6. The exposure apparatus according to claim 1, wherein a porous member is provided in the liquid recovery port.

7. The exposure apparatus according to claim 6, wherein the porous member comprises a mesh body.

8. The exposure apparatus according to claim 1, wherein the liquid immersion mechanism has a flat portion formed continuously with the inclined surface so as to be substantially parallel to the substrate surface between the projection area irradiated with the exposure light and the inclined surface, the flat portion being formed so as to surround the projection area irradiated with the exposure light.

9. The exposure apparatus according to claim 1, wherein the liquid immersion mechanism has a member having an opening through which the exposure light passes and disposed so as to form a gap with the projection optical system, and is capable of supplying the liquid between the projection optical system and the member.

10. The exposure apparatus according to claim 9, wherein the member has a flat portion formed to oppose the substrate surface.

11. The exposure apparatus according to claim 10, wherein the flat portion is formed so as to surround a projection area irradiated with the exposure light.

12. The exposure apparatus according to claim 10, wherein the liquid immersion mechanism has a groove portion disposed outside the flat portion, and an inside of the groove portion is in gas communication with a periphery of an image plane of the projection optical system.

13. The exposure apparatus according to claim 12, wherein the groove portion is formed so as to surround a projection area irradiated with the exposure light.

14. The exposure apparatus according to claim 1, wherein the liquid immersion mechanism has a groove portion disposed between a projection region irradiated with the exposure light and the inclined surface, the groove portion being disposed such that an opening portion thereof faces the substrate, an interior of the groove portion being in gas communication with a periphery of an image plane of the projection optical system.

15. The exposure apparatus according to claim 14, wherein the groove portion is formed so as to surround a projection area irradiated with the exposure light.

16. The exposure apparatus according to claim 1, wherein the inclined surface comprises a plurality of inclined surfaces inclined at different angles with respect to the surface of the substrate.

17. The exposure apparatus according to claim 1, wherein the inclined surface is inclined at an angle of 3 to 20 degrees with respect to the surface of the substrate.

18. The exposure apparatus according to claim 1, wherein the inclined surface is a liquid recovery port on the entire surface.

19. The exposure apparatus according to claim 1, wherein the inclined surface is provided with a fin.

20. The exposure apparatus according to any one of claims 1 to 19, wherein the liquid immersion mechanism continues supply and recovery of the liquid during exposure of the substrate.

21. An exposure apparatus for exposing a substrate by irradiating the substrate with exposure light through a liquid, comprising:

a projection optical system; and

a liquid immersion mechanism that supplies the liquid and recovers the liquid;

a liquid immersion mechanism having a flat portion formed to face the substrate surface and substantially parallel to the substrate surface;

a flat portion of the liquid immersion mechanism disposed between the substrate and an image plane side end surface of the projection optical system so as to surround a projection region irradiated with the exposure light;

the liquid supply port of the liquid immersion mechanism is disposed outside the flat portion with respect to the projection area irradiated with the exposure light.

22. The exposure apparatus according to claim 21, wherein the liquid recovery port of the liquid immersion mechanism is disposed outside the flat portion with respect to the projection region and surrounds the flat portion.

23. The exposure apparatus according to claim 21, wherein the liquid recovery port of the liquid immersion mechanism is disposed outside the liquid supply port with respect to the projection region and surrounds the flat portion.

24. The exposure apparatus according to claim 22, wherein the liquid immersion mechanism has a slope formed to face the substrate surface, and the liquid recovery port of the liquid immersion mechanism is formed in the slope.

25. The exposure apparatus according to claim 24, wherein the inclined surface is formed so that the distance from the optical axis of the exposure light is larger as the distance from the optical axis is longer.

26. The exposure apparatus according to claim 24, wherein the liquid immersion mechanism has a wall portion for suppressing leakage of the liquid at a peripheral edge of the inclined surface.

27. The exposure apparatus according to claim 22, wherein a porous member is provided in the liquid recovery port.

28. The exposure apparatus according to claim 21, wherein the liquid immersion mechanism includes a plate-like member having an opening through which the exposure light passes, and the plate-like member is disposed so as to face the substrate surface with one surface of the plate-like member being the flat portion.

29. The exposure apparatus according to any one of claims 21 to 28, wherein the liquid immersion mechanism continues supply and recovery of the liquid during exposure of the substrate.

30. An exposure apparatus for exposing a substrate by irradiating the substrate with exposure light through a liquid, comprising:

a projection optical system; and

a liquid immersion mechanism that supplies the liquid and recovers the liquid;

the liquid immersion mechanism includes:

a liquid supply port which is provided at the 1 st position outside the optical path space for the exposure light and supplies a liquid; and

and a guide member for guiding the liquid supplied from the liquid supply port to a 2 nd position different from the 1 st position outside the optical path space through the optical path space.

31. The exposure apparatus according to claim 30, wherein the guide member is for preventing gas from remaining in the liquid in the light path space for the exposure light.

32. The exposure apparatus according to claim 30, wherein the guide member flows the liquid so that a vortex is not generated in the light path space.

33. The exposure apparatus according to claim 30, wherein the guide member has an opening portion disposed on an image plane side of the projection optical system and allowing the exposure light to pass therethrough.

34. The exposure apparatus according to claim 33, wherein the opening portion is substantially cross-shaped.

35. The exposure apparatus according to claim 33, wherein the liquid supply port supplies liquid to an internal space including a space between the projection optical system and the guide member.

36. The exposure apparatus according to claim 30, wherein the guide member has a flat portion disposed so as to oppose to the substrate.

37. The exposure apparatus according to claim 36, wherein the flat portion is configured to surround the exposure light;

the liquid immersion apparatus includes a liquid recovery port disposed to face the substrate at a position outside the flat portion with respect to an optical path of the exposure light.

38. The exposure apparatus according to claim 30, wherein the liquid supply port comprises supply ports provided on both sides of the optical path space, respectively.

39. The exposure apparatus according to claim 30, wherein an exhaust port is provided at or near the 2 nd position.

40. The exposure apparatus according to claim 39, wherein the exhaust port is connected to a gas around an image plane of the projection optical system.

41. The exposure apparatus of claim 39, wherein the exhaust port is connected to a suction system.

42. The exposure apparatus according to claim 39, wherein the exhaust port includes supply ports provided on both sides of the optical path space, respectively.

43. The exposure apparatus according to claim 30, wherein the guide member has a1 st guide portion for forming a flow path from the 1 st position toward the optical path space, and a 2 nd guide portion for forming a flow path from the optical path space toward the 2 nd position, the flow path formed with the 1 st guide portion and the flow path formed with the 2 nd guide portion intersecting.

44. The exposure apparatus according to claim 43, wherein the 1 st guide portion and the 2 nd guide portion form a substantially cross-shaped opening portion.

45. The exposure apparatus according to claim 44, wherein the exposure light passes through a central portion of the substantially cross-shaped opening.

46. The exposure apparatus according to claim 43, wherein a width of the flow path formed by the 1 st guide part is substantially the same as a width of the flow path formed by the 2 nd guide part.

47. The exposure apparatus according to claim 43, wherein a width of the flow path formed with the 2 nd guide portion is smaller than a width of the flow path formed with the 1 st guide portion.

48. The exposure apparatus according to claim 30, wherein a liquid flow path that flows from the 1 st position to the 2 nd position through the optical path space is curved.

49. The exposure apparatus according to claim 48, wherein the liquid flow path is curved at or near the light path space.

50. An exposure apparatus for exposing a substrate by irradiating the substrate with exposure light through a liquid, comprising:

an optical system having an end surface facing the substrate and allowing exposure light irradiated to the substrate to pass therethrough; and

a liquid immersion mechanism that supplies the liquid and recovers the liquid;

the liquid immersion apparatus includes a plate member having a flat surface arranged between the substrate and the end surface of the optical system so as to face the substrate in parallel, and arranged so as to surround an optical path of exposure light;

a liquid is supplied from a supply port provided in the vicinity of the end surface of the optical system to a space between the end surface of the optical system and the plate member, and the liquid is recovered from a recovery port disposed opposite the substrate at a position spaced apart from the optical path for the exposure light than the flat surface of the plate member.

51. The exposure apparatus according to claim 50, wherein the plate member has a1 st surface opposed to the end surface of the optical system and a 2 nd surface opposed to the substrate.

52. The exposure apparatus according to claim 50, wherein the supply port is disposed on both sides of an optical path of the exposure light.

53. The exposure apparatus according to claim 50, wherein a gas can be supplied from the supply port to a space between the end face of the optical system and the plate member.

54. The exposure apparatus according to claim 50, wherein the liquid immersion device is provided with an opening, different from the supply port, connected to a space between an end surface of the optical system and the plate member.

55. The exposure apparatus according to claim 54, wherein liquid in a space between the end face of the optical system and the plate member is discharged through the opening.

56. The exposure apparatus according to claim 54, wherein the liquid in the space between the end face of the optical system and the plate member is recovered through the opening.

57. The exposure apparatus according to claim 56, wherein the liquid is collected from the opening so that an optical path space of the exposure light is in a non-liquid-immersed state.

58. The exposure apparatus of claim 54, wherein the opening is connected to a suction mechanism.

59. The exposure apparatus according to claim 54, wherein the opening is capable of supplying a gas to a space between the end face of the optical system and the plate member.

60. The exposure apparatus according to claim 50, wherein the plate member has an opening of a predetermined shape through which the exposure light passes, corresponding to a shape of an irradiation region of the exposure light.

61. The exposure apparatus according to claim 60, wherein the plate member has an opening through which the exposure light passes;

the liquid supplied to the space between one surface of the plate member and the end surface of the optical system can flow into the space between the other surface of the plate member and the substrate through the opening.

62. The exposure apparatus according to claim 61, wherein the supply port is disposed above a flat surface of the plate member.

63. The exposure apparatus according to claim 50, wherein the supply port sends out the liquid in a direction parallel to the substrate.

64. The exposure apparatus according to claim 50, wherein during exposure of the substrate, a space between the end face of the optical system and the substrate is filled with the liquid by continuing supply of the liquid from the supply port and recovery of the liquid from the recovery port.

65. The exposure apparatus according to any one of claims 50 to 64, wherein the liquid immersion mechanism has a slope inclined to the flat surface outside the flat surface of the plate member with respect to the optical path of the exposure light.

66. The exposure apparatus according to claim 65, wherein the recovery port is formed in the inclined surface.

67. The exposure apparatus according to claim 65, wherein the recovery port is formed outside the inclined surface with respect to an optical path of the exposure light.

68. The exposure apparatus according to claim 65, wherein the liquid immersion mechanism is capable of forming an interface of a liquid immersion area between the inclined surface and the substrate, the interface of the liquid immersion area being formed in a part of the substrate.

69. The exposure apparatus according to claim 65, wherein the inclined surface is inclined at an angle of 3 to 20 degrees with respect to the flat surface.

70. An exposure apparatus for exposing a substrate by irradiating the substrate with exposure light through a liquid, comprising:

an optical member having an end surface contacting the liquid and passing the exposure light; and

a liquid immersion mechanism that supplies the liquid and recovers the liquid;

the liquid immersion apparatus has a flat surface disposed in parallel to the substrate and surrounding the optical path of the exposure light, and an inclined surface inclined to the flat surface outside the flat surface with respect to the optical path of the exposure light.

71. The exposure apparatus according to claim 70, wherein the flat surface and the inclined surface are formed continuously.

72. The exposure apparatus according to claim 70, wherein the liquid immersion mechanism is capable of forming an interface of a liquid immersion area between the inclined surface and the substrate, the interface of the liquid immersion area being formed in a part of the substrate.

73. The exposure apparatus according to claim 70, wherein the inclined surface is inclined at an angle of 3 to 20 degrees with respect to the flat surface.

74. The exposure apparatus according to claim 70, wherein the liquid immersion mechanism has a recovery port disposed so as to face the substrate.

75. The exposure apparatus according to claim 74, wherein the recovery port is formed outside the inclined surface with respect to an optical path of the exposure light.

76. The exposure apparatus according to claim 50 or 74, wherein a porous member is provided in the recovery port.

77. The exposure apparatus according to claim 76, wherein the recovery port is capable of recovering only the liquid without accompanying a gas.

78. A method of manufacturing a device, comprising:

the exposure apparatus according to claim 50 or 70 is used.

79. An exposure method for exposing a substrate by irradiating the substrate with exposure light through an optical member and a liquid, comprising:

disposing a substrate so as to face an end face of the optical member;

supplying a liquid to a space between one surface of a plate member disposed between an end surface of the optical member and the substrate so as to surround an optical path of the exposure light and the end surface of the optical member, so that the space between the end surface of the optical member and the substrate and the space between the other surface of the plate member and the substrate are filled with the liquid;

recovering a liquid from a recovery port disposed opposite to the substrate in parallel with the supply of the liquid to form a liquid immersion area on a part of the substrate;

the substrate is exposed by irradiating the substrate with exposure light through a liquid that forms a liquid immersion area on a part of the substrate.

80. The exposure method of claim 79, wherein the other face of the plate member comprises a flat face substantially parallel to and opposed to the substrate surface.

81. The exposure method according to claim 80, wherein the recovery port is disposed outside the flat surface with respect to an optical path of the exposure light.

82. The exposure method according to claim 79, wherein the plate member has an opening through which the exposure light passes;

the liquid supplied to the space between the one surface of the plate member and the end surface of the optical member can flow into the space between the other surface of the plate member and the substrate through the opening.