CN1979825A - Micro-jet-flow water-cooling system for luminuous diode LED - Google Patents
Micro-jet-flow water-cooling system for luminuous diode LED Download PDFInfo
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- CN1979825A CN1979825A CNA2005101111040A CN200510111104A CN1979825A CN 1979825 A CN1979825 A CN 1979825A CN A2005101111040 A CNA2005101111040 A CN A2005101111040A CN 200510111104 A CN200510111104 A CN 200510111104A CN 1979825 A CN1979825 A CN 1979825A
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- cooling system
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- 238000001816 cooling Methods 0.000 title claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000005507 spraying Methods 0.000 claims description 31
- 239000000178 monomer Substances 0.000 claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 239000000498 cooling water Substances 0.000 claims description 11
- 238000010622 cold drawing Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 9
- 239000002826 coolant Substances 0.000 description 5
- 208000002925 dental caries Diseases 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
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- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The system includes LED chip, micro jet ejector, water tank with cooling unit, and tiny pump. Base seat of LED chip is installed on shell of the micro jet ejector. A cavity is setup inside the micro jet ejector. There is clapboard with multiple tiny nozzles inside the cavity. Through tubes, inlets and outlets setup on two sides of the clapboard are connected to tiny pump and water tank. Heat sink and fan in up part of the water tank, and micro flute channels inside the water tank form a close internal circulation cooling system. Using impaction heat exchange, the system possesses large heat transfer coefficient. Advantages are: flexible control for setting cooling direction. The invention is suitable to cool LED where condition is changed quite often.
Description
Technical field
The present invention relates to a kind of cooling system that is used for LED, particularly a kind of micro jet flow water cooling system that is used for LED.
Technical background
In recent years, the light source of novel LED has been widely used in fields such as industrial equipment, instrument and meter, traffic lights, automobile, backlight at present because it has long, advantages such as luminous efficiency is high, power is little and volume is little, sturdy and durable, rich color of life-span.
In theory, select suitable matching materials, manufacturing process and operating temperature, the electric energy major part can be transformed into luminous energy.But special needs to be pointed out is that the height of PN junction place temperature has tremendous influence to the skew of the light output color of LED and the reliability of light source work itself.For high-power LED light source, must adopt suitable design that the encapsulation of LED luminous element is remained under the specified normal working temperature, just to set a limit to junction temperature, prevent that its temperature is too high.Led chip has 90% luminous efficiency and surpasses 50,000 to 100,000 hours life-span in theory, yet at present to high-power LED illumination (surpassing 1W), when drive current at 0.35A, after moving 1,000 hours, optical property has 30% decline, and except encapsulating, the chip operating temperature is to cause the very important reasons of decreased performance, based on above-mentioned viewpoint, the cooling of LED seems and is starved of.
Existing LED cooling technology adopts highly heat-conductive material or heat sink the heat radiation mostly, and such method is simple and practical, but the effect of cooling is limited, makes the chip temperature of LED can not reduce too many.A led module released of American Bright Optoelectronics company for example, it adopts the small-sized fin that exposes to carry out Natural Heat Convection, and size is 10mm * 13mm.Because adopt heat transfer free convection, the heat of system can not fast and effeciently be discharged.For such design, the LED power density can not be too high, otherwise its operating temperature is with too high.
In recent years, along with the continuous expansion of LED range of application, high-power LED group more and more comes into one's own, and above-mentioned traditional type of cooling can not adapt to the temperature requirement of LED.In addition, for low power LED group, under the condition that cost allows, how to adopt better cooling system to make the LED working temperature lower, thereby obtain better luminous efficiency.
Summary of the invention
At the defective that exists in the prior art, the invention provides a kind of micro jet flow water cooling system that is used for LED.This system adopts water as coolant, by the Micropump pressurised driving, makes the micro jet flow cooling water directly impact the pedestal of led chip electrode, and the heat sink and fan of high-temperature water on water tank carries out heat exchange and realize cooling to the pedestal of led chip electrode.Total adopts circulating cooling system in the sealing.The present invention mainly comprises: led chip, micro spraying jet ejector, the water tank that has cooling device, Micropump, the lower surface that it is characterized in that the pedestal of described led chip is installed on the shell of micro spraying jet ejector, be provided with a cavity in the micro spraying jet ejector, be partitioned into two monomers up and down by one by the dividing plate that has a plurality of little spouts in the middle of the micro spraying jet ejector cavity, or be partitioned into to last by two dividing plates that have a plurality of little spouts, in, following three monomers, or cavity is set to by two concentric cylinder buckets, or cavity is set to coaxial polyhedron, on the surface of cylinder barrel or interior polyhedron bucket, the lower surface of the pedestal of led chip was installed on the outer wall of outside cylinder bucket or outer polyhedron bucket in spout was arranged on.Micro spraying jet ejector adopts carbon nano-tube, high-thermal conductive metal, and the highly heat-conductive material of diamond class is made, and the employing heat-conducting cream is connected between the pedestal of its outer surface and led chip.The both sides of cavity are respectively equipped with cooling water flow inlet and flow export, inlet is connected with the delivery outlet of Micropump by the scalable flexible pipe that adopts silicone rubber tube to make, outlet is connected with the inlet of water tank by the scalable flexible pipe that adopts silicone rubber tube to make, water tank upper is provided with heat sink and fan, be provided with micro-channel in the water tank, the upper end of conduit extends to the water tank upper surface, and the cold drawing that maybe will be provided with the microchannel is directly installed on the inside of water tank.The outlet of water tank is connected with the input port of Micropump by the scalable flexible pipe that adopts silicone rubber tube to make, and forms the interior circulating cooling system of sealing.
Advantage of the present invention is that system adopts impingement heat transfer, heat exchange coefficient is big, good effect of heat exchange, can effectively lower the temperature to high density LED group especially, system adopts active system, the interior circulation type of cooling of sealing, and control ratio is more flexible, any direction setting as required is useful in the frequent occasion that changes of LED operating mode and cools off.
Description of drawings
Fig. 1 systematic schematic diagram of the present invention;
LED under Fig. 2 different capacity is not having temperature chart over time under the situation of water-cooled;
LED under Fig. 3 different capacity is having temperature chart over time under the situation of water-cooled;
Fig. 4 micro spraying jet ejector cavity of the present invention is set to the structural representation of two monomers up and down;
Fig. 5 micro spraying jet ejector cavity of the present invention is set to the structural representation of three monomers in upper, middle and lower;
Fig. 6 water tank of the present invention, heat sink, fan structure schematic diagram;
Fig. 7 cisten mechanism schematic diagram that microchannel cold plates is housed of the present invention.
The pedestal of 1LED chip, 2 has cold drawing, 21 spouts that the cavity, 5 micro spraying jet ejector coolant outlets, 6 water tanks of dividing plate, 3 micro spraying jet ejector cooling water inlets, 4 micro spraying jet ejectors of a plurality of little spouts, 7 heat sink, 8 fans, 9 Micropumps, the last monomer of 10 micro spraying jet ejector cavitys, the middle monomer of 11 micro spraying jet ejector cavitys, the following monomer of 12 micro spraying jet ejector cavitys, 14 tank entries, the outlet of 15 water tanks, 16 water tank upper surfaces, 17 micro-channel, 18 are etched with the microchannel
Embodiment
Further specify embodiments of the invention below in conjunction with accompanying drawing:
The lower surface of the pedestal 1 of led chip is installed on the shell of micro spraying jet ejector, and micro spraying jet ejector adopts carbon nano-tube, high-thermal conductive metal, and highly heat-conductive materials such as diamond are made.Adopt heat-conducting cream to be connected between the lower surface of the outer surface of micro spraying jet ejector and the pedestal of led chip 1, with the increase heat-conducting effect.Be provided with a cavity 4 in the micro spraying jet ejector, be partitioned into upper and lower two monomers 10,12 by one by the dividing plate 2 that has a plurality of little spouts in the middle of the micro spraying jet ejector cavity 4, micro spraying jet ejector adopts carbon nano-tube, high-thermal conductive metal, and highly heat-conductive materials such as diamond are made.The both sides of cavity 4 are respectively equipped with cooling water flow inlet 3 and cooling water flow outlet 5, cooling water inlet 3 is connected with the delivery outlet of Micropump 9 by scalable flexible pipe, coolant outlet 5 is connected with the tank entry 14 of water tank 6 by scalable flexible pipe, water tank 6 tops are provided with heat sink 7 and fan 8, water tank 6 inside are etched with micro-channel 17, the upper end of micro-channel 17 extends to water tank upper surface 16, and water tank outlet 15 is connected with the input port of Micropump 9 by scalable flexible pipe, forms the interior circulating cooling system of sealing.Scalable flexible pipe in the system adopts silicone rubber tube to make.
Referring to Fig. 1, system adopts water as coolant, before system in package and the operation, injects certain water by connector and enters system, and each connector of good seal prevents the liquid leakage then.After Micropump 9 energising operations, water in the water tank 6 flow into the following monomer 12 of micro spraying jet ejector cavity by micro spraying jet ejector cooling water inlet 3, under certain pressure, water is formed strong jet by spout 21, jet will directly impact the top of the micro spraying jet ejector that closely links to each other with the lower surface of the pedestal 1 of led chip, produce strong heat exchange effect, the high hot-fluid that led module produces will be absorbed by water jets, its temperature sharply descends, water jets is owing to absorbed the heat of led module, and temperature will raise, under the effect of pump pressure, the water that has heated up will flow out by micro spraying jet ejector coolant outlet 5, enter into water tank 6.Referring to Fig. 4.Heat sink 7 and the effect of fan 8 under, the water that has heated up will with environment generation heat exchange, water temperature descended.Referring to Fig. 6.Water at low temperature will flow into beginning new round circulation in the Micropump 9 again.
It is 10ml/s that the present invention adopts the flow of Micropump, and led module adopts 2 * 2 arrays, and single led size of devices is that the condition of 1mm * 1mm is tested, referring to Fig. 2, and the test data when not adopting the native system cooling.The maximum surface temperature of LED group reaches 145 ° of C in operation after 3 minutes, but after this cooling system was started working, temperature dropped to 28.25 ℃.Work under such temperature, LED group luminous efficiency significantly improves, and can cool off a lot of LED simultaneously fully, and guarantees that they move at low temperatures.Referring to Fig. 3.
Claims (5)
1. micro jet flow water cooling system that is used for LED, mainly comprise: the LED chip, micro spraying jet ejector, the water tank that has cooling device, Micropump, the lower surface that it is characterized in that the pedestal of described led chip is installed on the shell of micro spraying jet ejector, be provided with a cavity in the micro spraying jet ejector, be provided with the dividing plate that has a plurality of little spouts in the cavity, the both sides of cavity are respectively equipped with cooling water flow inlet and flow export, inlet is connected with the delivery outlet of Micropump by scalable flexible pipe, outlet is connected with the inlet of water tank by scalable flexible pipe, water tank upper is provided with heat sink and fan, water tank inside is provided with micro-channel, the outlet of water tank is connected with the input port of Micropump by scalable flexible pipe, forms the interior circulating cooling system of sealing.
2. a kind of micro jet flow water cooling system that is used for LED according to claim 1, it is characterized in that described micro spraying jet ejector adopts carbon nano-tube, or high-thermal conductive metal, or the highly heat-conductive material of diamond class makes, and adopts heat-conducting cream to be connected between the pedestal of its outer surface and led chip.
3. a kind of micro jet flow water cooling system that is used for LED according to claim 1, it is characterized in that being partitioned into two monomers up and down by one by the dividing plate that has a plurality of little spouts in the middle of the described micro spraying jet ejector cavity, or be partitioned into to last by two dividing plates that have a plurality of little spouts, in, following three monomers, or cavity is set to by two concentric cylinder buckets, or cavity is set to coaxial polyhedron, on the surface of cylinder barrel or interior polyhedron bucket, the lower surface of the pedestal of led chip was installed on the outer wall of outside cylinder bucket or outer polyhedron bucket in spout was arranged on.
4. a kind of micro jet flow water cooling system that is used for LED according to claim 1, it is characterized in that described water tank inside is provided with micro-channel, the upper end of micro-channel extends to the water tank upper surface, and the cold drawing that maybe will be provided with the microchannel is directly installed on the inside of water tank.
5. a kind of micro jet flow water cooling system that is used for LED according to claim 1 is characterized in that described scalable flexible pipe adopts silicone rubber tube to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101111040A CN1979825A (en) | 2005-12-02 | 2005-12-02 | Micro-jet-flow water-cooling system for luminuous diode LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005101111040A CN1979825A (en) | 2005-12-02 | 2005-12-02 | Micro-jet-flow water-cooling system for luminuous diode LED |
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| Publication Number | Publication Date |
|---|---|
| CN1979825A true CN1979825A (en) | 2007-06-13 |
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| CNA2005101111040A Pending CN1979825A (en) | 2005-12-02 | 2005-12-02 | Micro-jet-flow water-cooling system for luminuous diode LED |
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| CN (1) | CN1979825A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN101835369A (en) * | 2010-04-29 | 2010-09-15 | 内蒙古科技大学 | Thermo-electric refrigeration liquid cooling device |
| DE102010022856A1 (en) | 2010-06-07 | 2011-12-08 | Mercury Lighting Ltd. | Lighting device has multiple lamps, where each lamp has housing and diode emitting light in environment by upper surface of housing |
| CN103514893A (en) * | 2012-06-18 | 2014-01-15 | 新科实业有限公司 | Cooling system and cooling method of semiconductor light source bar in aging test |
| CN104112725A (en) * | 2014-08-04 | 2014-10-22 | 华进半导体封装先导技术研发中心有限公司 | Heat radiation structure used for BGA (Ball Grid Array) package of high-power chip |
| CN104124218A (en) * | 2014-08-04 | 2014-10-29 | 华进半导体封装先导技术研发中心有限公司 | Heat dissipation structure for 2.5D/3DTSV high-power chip package |
| CN104296064A (en) * | 2014-10-23 | 2015-01-21 | 苏州承腾电子科技有限公司 | LED (light emitting diode) illuminating lamp |
| CN104655457A (en) * | 2015-03-03 | 2015-05-27 | 武汉大学 | Vacuum sampler for gas spectrum analysis |
| TWI507805B (en) * | 2013-04-25 | 2015-11-11 | Appotronics Corp Ltd | Wavelength conversion device |
| CN105114919A (en) * | 2015-08-11 | 2015-12-02 | 电子科技大学 | Heat dissipating device adopting paraffin and water cooling |
| CN104112725B (en) * | 2014-08-04 | 2017-01-04 | 华进半导体封装先导技术研发中心有限公司 | Radiator structure for high-power chip BGA package |
| CN107314352A (en) * | 2017-07-09 | 2017-11-03 | 冯大兰 | A kind of radiating LED lamp |
| CN107524935A (en) * | 2017-07-09 | 2017-12-29 | 冯大兰 | A kind of radiating LED lamp |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
| CN108390287A (en) * | 2018-04-04 | 2018-08-10 | 安徽施耐德成套电气有限公司 | The good high voltage power distributing cabinet of thermal diffusivity |
| WO2020181605A1 (en) * | 2019-03-12 | 2020-09-17 | 山东省科学院能源研究所 | Microchannel heat exchanger structure having nozzle and working method |
-
2005
- 2005-12-02 CN CNA2005101111040A patent/CN1979825A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101814470B (en) * | 2010-04-15 | 2011-11-30 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN101835369A (en) * | 2010-04-29 | 2010-09-15 | 内蒙古科技大学 | Thermo-electric refrigeration liquid cooling device |
| CN101835369B (en) * | 2010-04-29 | 2012-01-18 | 内蒙古科技大学 | Thermoelectric refrigeration liquid cooling device |
| DE102010022856A1 (en) | 2010-06-07 | 2011-12-08 | Mercury Lighting Ltd. | Lighting device has multiple lamps, where each lamp has housing and diode emitting light in environment by upper surface of housing |
| CN103514893A (en) * | 2012-06-18 | 2014-01-15 | 新科实业有限公司 | Cooling system and cooling method of semiconductor light source bar in aging test |
| CN103514893B (en) * | 2012-06-18 | 2017-11-10 | 新科实业有限公司 | Cooling system and cooling method for semiconductor light source bar in aging test |
| TWI507805B (en) * | 2013-04-25 | 2015-11-11 | Appotronics Corp Ltd | Wavelength conversion device |
| CN104112725A (en) * | 2014-08-04 | 2014-10-22 | 华进半导体封装先导技术研发中心有限公司 | Heat radiation structure used for BGA (Ball Grid Array) package of high-power chip |
| CN104124218A (en) * | 2014-08-04 | 2014-10-29 | 华进半导体封装先导技术研发中心有限公司 | Heat dissipation structure for 2.5D/3DTSV high-power chip package |
| CN104112725B (en) * | 2014-08-04 | 2017-01-04 | 华进半导体封装先导技术研发中心有限公司 | Radiator structure for high-power chip BGA package |
| CN104296064B (en) * | 2014-10-23 | 2015-08-05 | 苏州承腾电子科技有限公司 | A kind of LED illumination lamp |
| CN104296064A (en) * | 2014-10-23 | 2015-01-21 | 苏州承腾电子科技有限公司 | LED (light emitting diode) illuminating lamp |
| CN104655457A (en) * | 2015-03-03 | 2015-05-27 | 武汉大学 | Vacuum sampler for gas spectrum analysis |
| CN104655457B (en) * | 2015-03-03 | 2019-05-24 | 武汉大学 | A kind of spectrochemical analysis for gases vacuum core sampler |
| CN105114919A (en) * | 2015-08-11 | 2015-12-02 | 电子科技大学 | Heat dissipating device adopting paraffin and water cooling |
| CN105114919B (en) * | 2015-08-11 | 2018-02-13 | 电子科技大学 | It is a kind of using paraffin and the heat abstractor of water cooling |
| CN107524935A (en) * | 2017-07-09 | 2017-12-29 | 冯大兰 | A kind of radiating LED lamp |
| CN107314352A (en) * | 2017-07-09 | 2017-11-03 | 冯大兰 | A kind of radiating LED lamp |
| CN109882746A (en) * | 2017-07-09 | 2019-06-14 | 曹建新 | A kind of radiating LED lamp |
| CN107314352B (en) * | 2017-07-09 | 2019-09-10 | 曹建新 | A kind of radiating LED lamp |
| CN110454758A (en) * | 2017-07-09 | 2019-11-15 | 曹建新 | A kind of radiating LED lamp |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
| CN108390287A (en) * | 2018-04-04 | 2018-08-10 | 安徽施耐德成套电气有限公司 | The good high voltage power distributing cabinet of thermal diffusivity |
| WO2020181605A1 (en) * | 2019-03-12 | 2020-09-17 | 山东省科学院能源研究所 | Microchannel heat exchanger structure having nozzle and working method |
| US11549758B2 (en) | 2019-03-12 | 2023-01-10 | Energy Research Institute Of Shandong Academy Of Sciences | Microchannel heat exchanger structure with nozzle and working method thereof |
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Open date: 20070613 |