CN1956604A - Bone-conduction microphone and method of manufacturing the same - Google Patents
Bone-conduction microphone and method of manufacturing the same Download PDFInfo
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- CN1956604A CN1956604A CN 200610135551 CN200610135551A CN1956604A CN 1956604 A CN1956604 A CN 1956604A CN 200610135551 CN200610135551 CN 200610135551 CN 200610135551 A CN200610135551 A CN 200610135551A CN 1956604 A CN1956604 A CN 1956604A
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Abstract
A bone-conduction microphone of the invention has a cantilevered structure. A piezoelectric element composing the detecting part of a bone-conduction microphone is mechanically pressed into an element mounting opening open to a supporting member provided to a microphone case while temporarily bonded to a connecting member including a signal communication spacer , a copper-made spacer, a tapered ground spacer, and an insulating spacer, and optionally reinforced and fixed by use of an adhesive. Thus, a bone-conduction microphone with a simple structure including a vibration detecting part assemblable without use of a solder, and a method of manufacturing the same can be provided.
Description
Technical field
The present invention relates to be used for the bone-conduction microphone and the manufacture method thereof of mobile phone or mobile device, the acoustic information transmitter that relates in particular to the ear-wearing type of osteoacusis vibration annex, that utilize sound that is fit to be used as mobile phone or mobile device uses or is fit to be used as the bone-conduction microphone and the manufacture method thereof of the pickoff sensor of the osteoacusis sound that detects the acoustic information transmitter.
And, the present invention relates to utilize piezoelectric element to detect the bone-conduction microphone that the osteoacusis vibration converts thereof into the signal of telecommunication, relate in particular to the osteoacusis vibration that utilizes bimorph or single piezo crystals chip piezoelectric element to detect in human body head, to transmit and convert thereof into the bone-conduction microphone that the signal of telecommunication is used for communication.
Background technology
In recent years, along with popularizing of mobile phone and mobile device etc., the use variation of these equipment develops significantly.As an example wherein, in the use of mobile phone or mobile device, need not labor be tired of that the acoustic information transmitter of the small-sized ear-wearing type that user's hand just can be conversed is widely used.In use, use because the user is installed in cavity of concha portion with the microphone portion of tut data transmission machine and earphone portion, therefore having the user only needs microphone portion and earphone portion are installed in the advantage that cavity of concha portion just can converse.And because the often bigger uses such as place of noise around such as mobile phone, the acoustic information transmitter employing that therefore is used for the ear-wearing type of mobile phone etc. is subjected to ambient noise to influence the microphone of little osteoacusis mode.
Above-mentioned acoustic information transmitter is the structure with bone-conduction microphone and earphone portion, and during use, bone-conduction microphone and earphone portion are installed in cavity of concha portion and use.At first, bone-conduction microphone is installed in cavity of concha portion, detects the osteoacusis sound in the cavity of concha portion, and its sound as mobile phone that is connected or mobile device is sent.In addition, earphone portion and bone-conduction microphone are installed in cavity of concha portion simultaneously, convert received signal to sound, as receiving the external auditory meatus output of sound to the user.By these two actions, this acoustic information transmitter can realize need not hand held mobile phone etc. equipment with regard to operable function.
Usually, bone-conduction microphone is installed in user's the cavity of concha, the vocal cords by the user are sent, detect in the vibration of propagation such as head and the sound (osteoacusis sound=vibration) that arrives cavity of concha portion as cavity of concha portion.That is to say that this bone-conduction microphone is the structure that is constituted, can critically be detected the vibration of the contact-making surface in the cavity of concha portion by vibrating sensor, in order to improve the detection performance, must make small-sizedly it and lightweight.
About acoustic information transmitter a lot of known examples are arranged, the disclosed example of Japanese kokai publication hei 9-331591 communique is for example arranged with this bone-conduction microphone and earphone portion.
And,, have the conductive adhesive of use, folder to establish the one-sided method that is bearing on the substrate of metal spacer, or utilize conductive adhesive to replace the method for scolding tin as Japanese kokai publication hei 8-330887 communique, the publicity of TOHKEMY 2005-55305 communique institute.In this case, the conducting means of double as single-sided electrode can make wiring oversimplify.
In the maintenance method of using conductive adhesive, there is not resonance point for guaranteeing sensitivity and making in the sound frequency bandwidth, need the connection of high rigidity to keep.Because this point, present situation are the conductive adhesives that must use sclerosis about 150 ℃.
Above-mentioned pass through the part that soft soldering carries out and fix, owing to be accompanied by scolding tin heat to the damage of parts and the deterioration of characteristic, existing problems aspect stable performance and quality assurance.
Summary of the invention
Under this situation, problem of the present invention is, provides simple in structure, has bone-conduction microphone and the manufacture method thereof of not using the vibration detecting part that scolding tin just can assemble.
And, use the assembling operation of above-mentioned adhesive all piezoelectric element to be fixed on desired location until the adhesive sclerosis, the operation of bonding assembling need be divided into a plurality of operations, and in each operation, utilize anchor clamps to fix, in high temperature furnace, place certain hour.Therefore, also need a large amount of anchor clamps during owing to a large amount of production, cause operation not carry out simultaneously, therefore have the long shortcoming of overall operation activity time.In addition,, therefore be easy to generate rigidity and undercapacity, cause resonance frequency to reduce easily because supporting rigidity only depends on conductive adhesive.In addition owing to use the big liquid of freedom shape, so have that being offset appears in the operation of bonding bearing area easily, a problem that deviation also appears in sensitivity and characteristic easily.
Therefore, problem of the present invention is, the structure of the bone-conduction microphone that the one-sided supporting that can obtain single piezo crystals chip or bimorph formula piezoelectric element is connected with electrode is provided, though use conductive adhesive in this structure, but with its main means as maintenance and electrode connection, also do not need to be arranged on to insert the high temperature groove on the anchor clamps, operating efficiency is higher, and can guarantee required maintenance rigidity, also can guarantee the reliability that is electrically connected.Briefly, the objective of the invention is to, provide and use the grafting material be beneficial to environmental protection and the maintenance of the piezoelectric element of one-sided supporting type is connected the bone-conduction microphone that operation is oversimplified.
In order to solve above-mentioned problem, in the microphone of the present invention, the piezoelectric element of one or more formations constitutes the vibration detecting part that the osteoacusis vibration that is passed to microphone case is detected, described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit
To constitute near the end of piezoelectric element of above-mentioned vibration detecting part and fixing above-mentioned piezoelectric element, the link that carries out signal of telecommunication transmission insert the element mounting opening that is formed at above-mentioned support unit.
In addition, in this bone-conduction microphone, with near the end of above-mentioned piezoelectric element and above-mentioned link mechanically be pressed into the said elements mounting opening.
In addition, in this bone-conduction microphone, further reinforce fixing with adhesive to the connecting portion that is fixed by insertion.
In addition, in this bone-conduction microphone, above-mentioned piezoelectric element is the piezoceramic material of square bar shape or square plate shape, and the said elements mounting opening is a rectangle.
In addition, this bone-conduction microphone has vibration detection device, this vibration detection device is with the maintenance frame accessory unilateral component pressure-bearing electric device of square cylindrical portion with rectangular opening, described piezoelectric element is made of the bimorph formula or the one or more of single piezo crystals chip that are formed with first electrode surface and second electrode surface, become the rectangular plate shape of outer electrode
In above-mentioned rectangular opening, insert the insulating spacer of the コ font of electrical insulating material formation,
One end of first electrode surface of above-mentioned piezoelectric element and side is inserted above-mentioned rectangular opening in the mode that the inner peripheral surface of the コ font by above-mentioned insulating spacer surrounds,
To have being pressed between the end of first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, making the one side crimping of the end of second electrode surface of above-mentioned piezoelectric element and above-mentioned rectangular opening and conducting of wedge-shaped part.
In addition, in this bone-conduction microphone, with the piezoelectric element of above-mentioned bimorph formula or single piezo crystals chip a plurality of with the one end across the mode of the conducting partition of the metal piezoelectric element portion that overlaps and in series be electrically connected to form, and an end that will be exposed at above-mentioned first electrode surface of outside of above-mentioned piezoelectric element portion and side inserts above-mentioned rectangular opening in the mode that the inner peripheral surface of the コ font by above-mentioned insulating spacer surrounds, to have being pressed between first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element portion of wedge-shaped part, or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, make the one side crimping of above-mentioned second electrode surface of the other outside that is exposed at above-mentioned piezoelectric element portion and above-mentioned rectangular opening and conducting.
In addition, in this bone-conduction microphone, a plurality of inboards at above-mentioned insulating spacer of the piezoelectric element of above-mentioned bimorph formula or single piezo crystals chip are arranged side by side above-mentioned piezoelectric element,
One end of first electrode surface of above-mentioned piezoelectric element portion is inserted above-mentioned rectangular opening in the mode that contacts with the inner peripheral surface of the コ font of above-mentioned insulating spacer,
To have being pressed between first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element portion or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, making the one side crimping of the end of second electrode surface of above-mentioned piezoelectric element portion and above-mentioned rectangular opening and conducting of wedge-shaped part.
In addition, in this bone-conduction microphone, make the above-mentioned partition that is pressed into, between first electrode surface and above-mentioned insulating spacer that are pressed into above-mentioned piezoelectric element portion, make it become electrode with the first electrode surface conducting of above-mentioned piezoelectric element portion with metal.
In addition, in this bone-conduction microphone, will with the maintenance frame accessory of the second electrode surface conducting of above-mentioned piezoelectric element portion as the ground connection lateral electrode, be connected to the grounding pattern of the circuit board that constitutes amplifying circuit and fix maintenance, be bearing on the foregoing circuit plate piezoelectric element portion is one-sided.
In addition, in this bone-conduction microphone, will with the maintenance frame accessory of the second electrode surface conducting of above-mentioned piezoelectric element portion as the ground connection lateral electrode, be connected to the grounding pattern of the circuit board that constitutes impedance inverter circuit, and by above-mentioned maintenance frame accessory is fixedly remained on the foregoing circuit plate, be bearing on the foregoing circuit plate piezoelectric element portion is one-sided, and, will directly be connected with the electrode of the first electrode surface conducting of above-mentioned piezoelectric element portion with the data side pattern of foregoing circuit plate.
In addition, in this bone-conduction microphone, more than half part at the back side of the side that the part surface with loading piezoelectric element of circuit board that loads above-mentioned piezoelectric element portion is opposite forms grounding pattern, form to cover the housing of the piezoelectric element portion and the impedance conversion portion that are loaded into the foregoing circuit plate with the conducting body or at the material that medial surface has a conducting tunicle, make the grounding pattern conducting of itself and foregoing circuit plate and have electric shielding effect.
In addition, in this bone-conduction microphone, with the human body contact site of above-mentioned housing as the acoustical vibration that is used to obtain osteoacusis.
And, the manufacture method of bone-conduction microphone of the present invention, it is the manufacture method that the piezoelectric element of one or more formations forms the bone-conduction microphone of vibration detecting part, described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit, and this manufacture method has following operation: near the link of using with the fixedly usefulness or the electrical signal transfer of above-mentioned piezoelectric element the end of the piezoelectric element that constitutes above-mentioned vibration detecting part is carried out semifixed operation under by the interim bonding state of conductive adhesive; Be pressed into the operation of the element mounting opening that is formed at above-mentioned support unit near the end of the interim binding that a last operation is formed; The operation that above-mentioned conductive adhesive is hardened fully.
And, the manufacture method of bone-conduction microphone of the present invention, it is the manufacture method that the piezoelectric element of one or more formations forms the bone-conduction microphone of vibration detecting part, described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit, this manufacture method has following operation: will constitute near the end of piezoelectric element of above-mentioned vibration detecting part and the fixedly usefulness of above-mentioned piezoelectric element or link that electrical signal transfer is used insert and be formed at after the element mounting opening of above-mentioned support unit, by the insertion section being processed to taper, the ground connection partition of an electrode grounding of above-mentioned piezoelectric element is pressed into the said elements mounting opening, and is fixed on the operation on the above-mentioned support unit near the end with above-mentioned piezoelectric element.
In addition, and, the manufacture method of bone-conduction microphone of the present invention, have following operation: by the element mounting opening that above-mentioned ground connection partition is pressed into above-mentioned support unit with after fixing near the end of above-mentioned piezoelectric element, the operation of further using adhesive that this fixed part is reinforced.
As mentioned above, by adopting the present invention, can not carry out support fixing that weld job just carries out piezoelectric element with simple structure, and can improve the operation qualification rate, can make, provide stable performance, cheap and stay-in-grade bone-conduction microphone.That is, can provide have simple in structure, do not use bone-conduction microphone and the manufacture method thereof of scolding tin with regard to assemblnig vibration detecting part.
And, as mentioned above, the present invention does not use leaded scolding tin in the connection of the one-sided supporting of the bimorph formula piezoelectric element of prior art example and electrode thereof, and use conductive adhesive, need not be fixed on and put into the high temperature groove on the anchor clamps and assemble, the bone-conduction microphone of the reliability that can guarantee that required maintenance rigidity is connected with electrode can be provided.Therefore, can use the material that is beneficial to environmental protection and reducing production costs.
Description of drawings
Fig. 1 is the stereogram of the bone-conduction microphone in expression an embodiment of the invention.
Fig. 2 is the right side view of the bone-conduction microphone in expression an embodiment of the invention.
Fig. 3 is the exploded perspective view of the bone-conduction microphone in expression an embodiment of the invention.
Fig. 4 is the exploded perspective view of the bone-conduction microphone in expression another embodiment of the present invention.
Fig. 5 is the stereoscopic figure of the bone-conduction microphone in an embodiment of the invention.
Fig. 6 is the end view of the bone-conduction microphone of Fig. 5.
Fig. 7 is the cutaway view of G-G position shown in Figure 6.
Fig. 8 is the exploded perspective view of constituent part of the bone-conduction microphone of presentation graphs 5.
Fig. 9 is the stereogram of each one in the assembling procedure.
Figure 10 is the stereogram at the main position of the bone-conduction microphone in expression an embodiment of the invention.
Figure 11 is the stereogram at the main position of the bone-conduction microphone in expression an embodiment of the invention.
Embodiment
The bone-conduction microphone of ear-wearing type acoustic information transmitter of the present invention has the sound pickup sensor structure of the osteoacusis sound that can detect from the low frequency frequency to the high frequency frequency.Therefore, the structure of bone-conduction microphone does not preferably apply the structure and the assemble method of useless compressing or power to the piezoelectric element as the significant points of vibration detection, and its structure etc. is related to the steady quality of finished product.Below, will implement optimal embodiment of the present invention and be illustrated among Fig. 1 to Figure 11, and describe.
Fig. 1 is the stereogram of the bone-conduction microphone in expression an embodiment of the invention, and Fig. 2 is its right side view.Fig. 3 is the exploded perspective view of the bone-conduction microphone in an embodiment of the invention, and Fig. 4 is the exploded perspective view of the bone-conduction microphone in the another embodiment of the invention.
At first the bone-conduction microphone to an embodiment of the invention describes.As Fig. 1～shown in Figure 3, the bone-conduction microphone of present embodiment is that square bar shape or side are tabular, is formed with electrode in its surface, and itself is by constituting with lower member etc.: the first piezoelectric element 1a, the second piezoelectric element 1b that detect vibration; FET (electric field effect formula transistor) 4 with functions such as impedance conversion and amplifications; Link, it is made of the signal connection partition 11 that connects these elements, copper connection partition 12, ground connection partition 13; Device substrate 2, the insulating spacer 10 that it will have the support unit 40 that is provided with element mounting opening 20, fixing whole microphone case 30, be used to guarantee to insulate, FET4 etc. are fixing.
In case this bone-conduction microphone is subjected to the vibration force from the outside, this vibration force propagates into the first piezoelectric element 1a, the second piezoelectric element 1b that inserts the element mounting opening 20 that is fixed in microphone case 30 by microphone case 30.As mentioned above since piezoelectric element 1a, 1b are ends be fixed and the other end open can free movable structure, so its with the stiff end be the big or small corresponding amount of the suffered vibration force of basic point and free vibration.In other words, piezoelectric element 1a, 1b vibrate as the vibrating body with free end and stiff end.Simultaneously, piezoelectric element 1a, 1b produce on its electrode and the corresponding signal of telecommunication of magnitude of vibrations that is subjected to, the signal that passes through to be connected connects partition 11, to the input part transmission that is formed on the circuit on the device substrate 2, perhaps, from the electrode of the first piezoelectric element 1a by the ground connection transmission of ground connection partition 13, by the FET4 of device substrate 2, as the output of bone-conduction microphone electronic equipment to the mobile phone that connects with lead-out terminal 3 etc. to device substrate 2.
By this bone-conduction microphone being installed in user's cavity of concha portion, bone-conduction microphone obtain by vocal cords pronunciations, modulated at oral cavity and throat and nasal cavity etc., in the bone of maxilla or head or cartilage, biological tissue etc., propagate and the audiogenic vibration (osteoacusis sound) of arrival cavity of concha portion, convert thereof into the signal of telecommunication, and to the machine transmission that is connected.
Below, the fixed structure and the method for the mechanical aspects of the piezoelectric element of bone-conduction microphone described.As shown in Figure 3, the test section of bone-conduction microphone is overlapping successively with ground connection partition 13, the first piezoelectric element 1a, copper ground connection partition 12, the second piezoelectric element 1b, signal connection partition 11 and insulating spacer 10 these each parts, and with for example conductive adhesive that each parts are bonding temporarily.This interim bonding good test section is pressed into the element mounting opening 20 of being located at the support unit 40 on the microphone case 30 shown in Figure 3, makes the adhesive sclerosis, thereby finish the fixing of bone-conduction microphone portion by the predetermined process operation.Though said interim bonding expression here is that adhesive keeps parts but the unhardened state of adhesive itself with its viscosity or adhesiveness.
Then, piezoelectric element and the electrical connection thereof to bone-conduction microphone describes.Above-mentioned ground connection partition 13, copper ground connection partition 12, signal connect partition 11 and are made of conductive material, and insulating spacer 10 is made of insulator.Therefore, the electrode of the first piezoelectric element 1a is connected with ground connection partition 13, another electrode of the first piezoelectric element 1a is connected with the electrode of the second piezoelectric element 1b by the copper ground connection partition 12 of conductivity, and another electrode of the second piezoelectric element 1b is connected with the input part of the FET4 of device substrate 2 by the signal connection partition 11 of electric conductor.This input connecting portion is connected effectively by conductive adhesive or scolding tin, and the detected signal of piezoelectric element is transferred to device substrate 2.
At this moment, if insulating spacer 10 can not play one's part to the full, then piezoelectric element 1a, 1b can connect with the periphery of the element mounting opening 20 of the microphone case 30 that is made of electric conductor, and piezoelectric element 1a, 1b become the electrical short state, detect the output signal variation.
Below, other execution modes of the present invention that adopt second fixing means different with the fixing means of the piezoelectric element of above-mentioned bone-conduction microphone etc. are described.If the fixing means to above-mentioned piezoelectric element etc. further specifies, then be to smear conductive adhesive and successively under lamination, the state that each parts are interim bonding, be pressed into the fixing means of the element mounting opening 20 of microphone case 30 at each part that ground connection partition shown in Figure 3 13, the first piezoelectric element 1a, copper ground connection partition 12, the second piezoelectric element 1b, the signal that constitutes test section is connected partition 11 and insulating spacer 10.This method is owing to be that parts with interim bonding test section are pressed into element mounting opening 20, therefore has the advantage that to carry out push operation swimmingly, but then, this method exists the problem of the conductive adhesive of smearing liquid state (or gluey) between each parts.
Therefore, below introduce second fixing means that assembling procedure was omitted, reduced in the operation that will smear conductive adhesive between each parts.Promptly, second fixing means is the element mounting opening 20 to microphone case shown in Figure 4 30, with dry status insulating spacer 10, signal connection partition 11, the second piezoelectric element 1b, copper ground connection partition 12, the first piezoelectric element 1a are inserted assigned position successively, at last, the ground connection partition 14 that the insertion section is processed to taper mechanically is pressed into the direction shown in the arrow X, utilizes high rigidity with each parts mechanical fixation.And, carry out the reinforcing of fixed part after fixing as required with adhesive etc.The second above-mentioned fixing means has the advantage of assembling operation that constitutes each parts of test section with dry status.
Yet there is the angle of 45 degree on one side of element mounting opening 20 shown in Figure 2 with respect to the mask of microphone case 30.But the fixing means of this bone-conduction microphone also can be irrelevant with microphone case 30 angulations with one side of element mounting opening 20.
In addition, with the opposition side of microphone case 30, cover the shell of protection vibration detecting part and circuit, can obtain osteoacusis sound with this part.
In the above embodiment, the situation of utilizing first and second piezoelectric elements (1a, 1b) to form vibration detecting part is illustrated, if use a plurality of this piezoelectric elements, the sensitivity that then can improve vibration detection also can only constitute vibration detecting part with a piezoelectric element on the contrary.
Fig. 5 is the stereogram of the outward appearance of bone-conduction microphone, and Fig. 6 is its end view, and Fig. 7 is the cutaway view of G-G position shown in Figure 6.Fig. 8 is decomposed into the stereogram that constituent part is represented with it.Fig. 9 be respectively with the state representation of the shell 31 of dismantling in the assembling procedure in the state representation of C, the circuit board 5 of dismantling in D, the state representation that keeps frame accessory 21 of will further dismantling in the state representation of E, the insulating spacer 10 of will dismantling in the stereogram of F.
Identical with the piezoelectric element 1a of bimorph formula, 1b descends thereon on the two sides and has arranged silver-colored tunicle as electrode.The conducting partition 15 of copper alloy system has and forms at interval and the effect of conducting, is configured between the electrode surface of one-sided supporting end of piezoelectric element 1a and 1b.The electrode terminal 16 of Fig. 7, Fig. 8 (partition that is pressed into wedge portion) has more to the planar portions of the top taper that then thickness is thin more, and it is configured on first electrode surface A (Fig. 9) position contacting of the following side that makes its planar portions and piezoelectric element 1b.Dispose the insulating spacer 10 of コ font, the configuration portion of its one-sided supporting end with piezoelectric element 1a, 1b, conducting partition 15, electrode terminal 16 surrounds, and forms the structure that further keeps the rectangle ring portion of frame accessory 21 that these parts are surrounded with high conductive metallic.
State shown in the D of Fig. 9 is the initial collected state of assembling procedure.Assembling sequence is the annular distance (rectangular opening 35 of square cylindrical portion) that at first insulating spacer 10 is inserted the rectangle that keeps frame accessory 21, then, insert with the order of piezoelectric element 1b, conducting partition 15, piezoelectric element 1a insulating spacer 10 the コ font inner space and make it overlapping after, the planar portions of the taper of electrode terminal 16 is pressed into the space that face and the first electrode surface A of the following side of piezoelectric element 1b of the inboard of insulating spacer 10 face mutually as chock.
Very little the setting for of linear foot of the rectangular opening 35 of frame accessory will be kept, thickness summation less than the dependent part of inserting five parts ( piezoelectric element 1a, 1b, conducting partition 15, insulating spacer 10 and electrode terminal 16) wherein, by electrode terminal 16 is pressed into as chock, mutually crimping and strain, piezoelectric element 1a, 1b are kept on the frame accessory 21 by one-sided being bearing in abreast with the interval of the thickness that is equivalent to conducting partition 15.In addition, the peak response direction of piezoelectric element 1a, 1b detection vibration is the arrow Z direction shown in Fig. 7.
The cleaning of the reliability of the conducting that this is mutual by guaranteeing each contact-making surface, adopt the suitable crimp force that counter-force produced that is difficult for the material of oxidation and keeps strain to realize, but for the stability that improves the endurance of environmental condition and guarantee to keep, the mobile high insulating properties adhesive in the gap about permeable 10 μ m can also be spread upon the side of piezoelectric element 1a, 1b and insulating spacer 10 the gap, and further spread upon the gap between insulating spacer 10 and the maintenance frame accessory 21 and the outside of maintaining part etc.
In addition, after the push operation of electrode terminal 16, auxiliary as what connect, on the part of the contact-making surface peripheral part of each electrode part that is connected, smear the low and normal temperature hardened conductive adhesive of good conductivity of mechanical strength, this way also is of value to and improves the reliability that is electrically connected.The end of conducting partition 15 is provided with the otch 15a of V-arrangement, and this is in order to make the electrode surface that should connect expose required area with for connection.That is, smear the conductive adhesive that is used for auxiliary conducting, can obtain certain conducting by the V slot part that after combination, forms.Other connecting portion is exposed owing to maneuverable part, thereby shape is not set especially for this reason.
In any case, in operational sequence hereto, not only do not need to be arranged on the cure operations of putting into the high temperature groove on the positioning fixture and carrying out conductive adhesive, and, because the maintenance of piezoelectric element does not directly depend on adhesive, thereby its reliability height, also guarantee rigidity easily.
The module that assembling obtains in above operational sequence, further, interfix being loaded into by FET4, capacitor 6 etc. on the circuit board 5 that constitutes impedance inverter circuit on the single face as the maintenance frame accessory 21 of two gate terminal of series voltage element 1a, 1b and the form that electrode terminal 16 is connected required pattern.The rear side opposite with the part loading surface of circuit board 5 constitutes grounding pattern and scolding tin bonding land and is the scolding tin bonding land (omitting diagram) of signal output.In addition, also can 1～2 grade enlarging section be set, constitute elementary amplifying circuit as impedance conversion portion in the back level of FET4.
For interfixing of the module of circuit board 5 and piezoelectric element portion, also can with keep frame accessory 21 and electrode terminal 16 separately need the connecting portion soft soldering on the pattern of circuit board.At this, even use the high Pb-free solder of fusing point, also can be by promptly carrying out the processing that heating operation realizes not reaching the temperature that diminishes the piezoelectric element performance.
In addition, under the situation of the rapid operation that is difficult to carry out soft soldering,, do not need the anchor clamps of locating with replacing yet, can only arrange and just put into the high temperature groove even use conductive adhesive to carry out conducting and to being maintained fixed of substrate.In addition, can use normal temperature hardened conductive adhesive to connect, use other the high adhesive of normal temperature hardened rigidity to keep, also not need to put into this operational sequence of high temperature groove in this case.
After the piezoelectric element module is loaded into substrate, to install in the mode that covers circuit part with the conducting body or at the material shell 31 that form, that have electric shielding effect that medial surface has a conducting tunicle, by being connected, guarantee not the piezoelectric element of anti-external noise and the shield effectiveness of impedance inverter circuit with high impedance with the ground connection side pattern of circuit board 5.And support projection portion 5a (seeing Fig. 8 etc.) about circuit board 5 is the structure that is used to support bone-conduction microphone.
The top and bottom of shell 31 by keeping frame accessory 21 with circuit board 5 clampings, can further improve as the externally mounted part of the bone-conduction microphone of assembling finished product and the rigidity that is connected as the maintenance frame accessory 21 of the one-sided support of piezoelectric element 1a, 1b, this externally mounted part is being crimped on human body, when obtaining acoustical vibration, can detracting and import it into piezoelectric element quiveringly.
Figure 10 has represented main position with the bone-conduction microphone of two piezoelectric element horizontal modes with stereogram.That is, two piezoelectric elements are arranged side by side on its interarea bone-conduction microphone in parallel face as piezoelectric element portion.Same as described above, piezoelectric element 11a, 11b and insulating spacer parts, conducting partition parts, chock parts, electrod assembly together, to be pressed in the rectangular opening that state is maintained at the annulus with rectangular opening 22 that keeps frame accessory 21.Same as described above, be not need to be arranged on the structure of on the anchor clamps, in the high temperature groove, carrying out cure operations.And formation impedance inverter circuit or this feature of amplifying circuit are also same as described above on circuit board 15.
Figure 11 is the stereogram at the main position of expression bone-conduction microphone.It is to form rising portions 23b, and be processed to form the structure of the ring portion 23a with rectangular opening herein by the punching press pull and stretch by bending ram on as the metallic plate system substrate element 23 of the structure substrate of entire product, circuit board 25 is loaded into the primary flat portion of substrate element 23, and its grounding pattern is connected with the projection 23c of the substrate element 23 of an electrode that becomes piezoelectric element.In addition, the electrod assembly 26 that be pressed between piezoelectric element 21b and the insulating trip parts, becomes another electrode part of piezoelectric element be connected with the signal pattern of circuit board 25 (omitting diagram).Among this embodiment, same as described above equally, be not need to be arranged on the structure of on the anchor clamps, in the high temperature groove, carrying out cure operations.
In above embodiment, situation to the piezoelectric element that uses two bimorph formulas is illustrated, even single piezo crystals chip, because it is identical with the bimorph formula that first electrode surface and second electrode surface are formed at the structure of both sides of plate, therefore, single piezo crystals chip piezoelectric element can be used in the present invention, both can be one also can be more than three to amount of piezoelectric element in addition.
Claims (15)
1. bone-conduction microphone, the piezoelectric element of one or more formations constitutes the vibration detecting part that the osteoacusis vibration that is passed to microphone case is detected, and described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit
To constitute near the end of piezoelectric element of above-mentioned vibration detecting part and fixing above-mentioned piezoelectric element, the link that carries out signal of telecommunication transmission insert the element mounting opening that is formed at above-mentioned support unit.
2. bone-conduction microphone as claimed in claim 1 is characterized in that, with near the end of above-mentioned piezoelectric element and above-mentioned link mechanically be pressed into the said elements mounting opening.
3. bone-conduction microphone as claimed in claim 1 is further reinforced fixing to the connecting portion that is fixed by above-mentioned insertion with adhesive.
4. bone-conduction microphone as claimed in claim 3, above-mentioned piezoelectric element are the piezoceramic materials of square bar shape or square plate shape, and the said elements mounting opening is a rectangle.
5. bone-conduction microphone, has vibration detection device, this vibration detection device is with the maintenance frame accessory unilateral component pressure-bearing electric device of square cylindrical portion with rectangular opening, described piezoelectric element is made of the bimorph formula or the one or more of single piezo crystals chip that are formed with first electrode surface and second electrode surface, become the rectangular plate shape of outer electrode
In above-mentioned rectangular opening, insert the insulating spacer of the コ font of electrical insulating material formation,
One end of first electrode surface of above-mentioned piezoelectric element and side is inserted above-mentioned rectangular opening in the mode that the inner peripheral surface of the コ font by above-mentioned insulating spacer surrounds,
To have being pressed between the end of first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, making the one side crimping of the end of second electrode surface of above-mentioned piezoelectric element and above-mentioned rectangular opening and conducting of wedge-shaped part.
6. bone-conduction microphone as claimed in claim 5, it is characterized in that, with the piezoelectric element of a plurality of above-mentioned bimorph formulas or single piezo crystals chip with the one end across the mode of the conducting partition of the metal piezoelectric element portion that overlaps and in series be electrically connected to form, and an end that will be exposed at above-mentioned first electrode surface of outside of above-mentioned piezoelectric element portion and side inserts above-mentioned rectangular opening in the mode that the inner peripheral surface of the コ font by above-mentioned insulating spacer surrounds, to have being pressed between first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element portion of wedge-shaped part, or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, make the one side crimping of above-mentioned second electrode surface of other outsides that are exposed at above-mentioned piezoelectric element portion and above-mentioned rectangular opening and conducting.
7. bone-conduction microphone as claimed in claim 5 is characterized in that, the piezoelectric element of a plurality of above-mentioned bimorph formulas or single piezo crystals chip is arranged side by side above-mentioned piezoelectric element in the inboard of above-mentioned insulating spacer,
One end of first electrode surface of above-mentioned piezoelectric element portion is inserted above-mentioned rectangular opening in the mode that contacts with the inner peripheral surface of the コ font of above-mentioned insulating spacer,
To have being pressed between first electrode surface that partition is pressed into above-mentioned insulating spacer and above-mentioned piezoelectric element portion or between the face of the face in the outside of above-mentioned insulating spacer and above-mentioned rectangular opening, making the one side crimping of the end of second electrode surface of above-mentioned piezoelectric element portion and above-mentioned rectangular opening and conducting of wedge-shaped part.
8. bone-conduction microphone as claimed in claim 5, it is characterized in that, the above-mentioned partition that is pressed into is a metallic, between first electrode surface and above-mentioned insulating spacer that are pressed into above-mentioned piezoelectric element portion, makes it become electrode with the first electrode surface conducting of above-mentioned piezoelectric element portion.
9. as claim 5 or 8 described bone-conduction microphones, it is characterized in that, will with the maintenance frame accessory of the second electrode surface conducting of above-mentioned piezoelectric element portion as the ground connection lateral electrode, be connected to the grounding pattern of the circuit board that constitutes amplifying circuit and fix maintenance, be bearing on the foregoing circuit plate piezoelectric element portion is one-sided.
10. as claim 5 or 8 described bone-conduction microphones, it is characterized in that, will with the maintenance frame accessory of the second electrode surface conducting of above-mentioned piezoelectric element portion as the ground connection lateral electrode, be connected to the grounding pattern of the circuit board that constitutes impedance inverter circuit, and by above-mentioned maintenance frame accessory is fixedly remained on the foregoing circuit plate, with one-sided being bearing on the foregoing circuit plate of above-mentioned piezoelectric element portion, and, will directly be connected with the electrode of the first electrode surface conducting of above-mentioned piezoelectric element portion with the data side pattern of foregoing circuit plate.
11. as claim 5 or 8 described bone-conduction microphones, it is characterized in that, more than half part at the back side of the side that the part surface with loading piezoelectric element of circuit board that loads above-mentioned piezoelectric element portion is opposite forms grounding pattern, form to cover the housing of the piezoelectric element portion and the impedance conversion portion that are loaded into the foregoing circuit plate with the conducting body or at the material that medial surface has a conducting tunicle, make the grounding pattern conducting of itself and foregoing circuit plate and have electric shielding effect.
12. bone-conduction microphone as claimed in claim 11 is characterized in that, with the human body contact site of above-mentioned housing as the acoustical vibration that is used to obtain osteoacusis.
13. the manufacture method of a bone-conduction microphone, it is the manufacture method that the piezoelectric element of one or more formations forms the bone-conduction microphone of vibration detecting part, described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit, and this manufacture method has following operation: near the link of using with the fixedly usefulness or the electrical signal transfer of above-mentioned piezoelectric element the end of the piezoelectric element that constitutes above-mentioned vibration detecting part is carried out semifixed operation under by the interim bonding state of conductive adhesive; Be pressed into the operation of the element mounting opening that is formed at above-mentioned support unit near the end of the interim binding that a last operation is formed; The operation that above-mentioned conductive adhesive is hardened fully.
14. the manufacture method of a bone-conduction microphone, it is the manufacture method that the piezoelectric element of one or more formations forms the bone-conduction microphone of vibration detecting part, described piezoelectric element forms electrode, with an end as free end, the other end is fixed on the microphone case by support unit, this manufacture method has following operation: will constitute near the end of piezoelectric element of above-mentioned vibration detecting part and the fixedly usefulness of above-mentioned piezoelectric element or link that electrical signal transfer is used insert and be formed at after the element mounting opening of above-mentioned support unit, by the insertion section being processed to taper, the ground connection partition of an electrode grounding of above-mentioned piezoelectric element is pressed into the said elements mounting opening, and is fixed on the operation on the above-mentioned support unit near the end with above-mentioned piezoelectric element.
15. the manufacture method of bone-conduction microphone as claimed in claim 14, it is characterized in that, have following operation: by the element mounting opening that above-mentioned ground connection partition is pressed into above-mentioned support unit with after fixing near the end of above-mentioned piezoelectric element, the operation of further using adhesive that this fixed part is reinforced.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP302975/2005 | 2005-10-18 | ||
| JP2005302975A JP2007116248A (en) | 2005-10-18 | 2005-10-18 | Bone-conduction microphone and method of manufacturing same |
| JP080012/2006 | 2006-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1956604A true CN1956604A (en) | 2007-05-02 |
Family
ID=38063630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610135551 Pending CN1956604A (en) | 2005-10-18 | 2006-10-18 | Bone-conduction microphone and method of manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007116248A (en) |
| CN (1) | CN1956604A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010057401A1 (en) * | 2008-11-21 | 2010-05-27 | 新兴盛科技股份有限公司 | Low background sound bone skin vibrating microphone and a pair of glasses including the microphone |
| CN103873997A (en) * | 2012-12-11 | 2014-06-18 | 联想(北京)有限公司 | Electronic device and sound collection method |
| CN104581584A (en) * | 2013-10-11 | 2015-04-29 | 岳凡恩 | Radio device and method for manufacturing the same |
| CN112637738A (en) * | 2018-04-26 | 2021-04-09 | 深圳市韶音科技有限公司 | Earphone system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3796670A4 (en) * | 2018-06-15 | 2021-06-02 | Shenzhen Voxtech Co., Ltd. | Bone conduction speaker and earphone |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727746Y2 (en) * | 1990-02-16 | 1995-06-21 | 株式会社オーディオテクニカ | Touch microphone |
-
2005
- 2005-10-18 JP JP2005302975A patent/JP2007116248A/en active Pending
-
2006
- 2006-10-18 CN CN 200610135551 patent/CN1956604A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010057401A1 (en) * | 2008-11-21 | 2010-05-27 | 新兴盛科技股份有限公司 | Low background sound bone skin vibrating microphone and a pair of glasses including the microphone |
| CN103873997A (en) * | 2012-12-11 | 2014-06-18 | 联想(北京)有限公司 | Electronic device and sound collection method |
| US9578423B2 (en) | 2012-12-11 | 2017-02-21 | Beijing Lenovo Software Ltd. | Electronic device and sound capturing method |
| CN104581584A (en) * | 2013-10-11 | 2015-04-29 | 岳凡恩 | Radio device and method for manufacturing the same |
| CN112637738A (en) * | 2018-04-26 | 2021-04-09 | 深圳市韶音科技有限公司 | Earphone system |
| CN112637737A (en) * | 2018-04-26 | 2021-04-09 | 深圳市韶音科技有限公司 | Earphone system |
| CN112637737B (en) * | 2018-04-26 | 2021-11-30 | 深圳市韶音科技有限公司 | Earphone system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007116248A (en) | 2007-05-10 |
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Open date: 20070502 |