CN1891023A - Method for constructing emi shielding around a component embedded in a circuit board - Google Patents
Method for constructing emi shielding around a component embedded in a circuit board Download PDFInfo
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- CN1891023A CN1891023A CN 200480036607 CN200480036607A CN1891023A CN 1891023 A CN1891023 A CN 1891023A CN 200480036607 CN200480036607 CN 200480036607 CN 200480036607 A CN200480036607 A CN 200480036607A CN 1891023 A CN1891023 A CN 1891023A
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- circuit board
- parts
- groove
- ground connection
- reference planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a method for constructing EMI shielding around a component embedded in a circuit board. According to the method, a recess, which is extended to an insulating layer that represents the ground-reference plane, is formed around the embedding location of the component. The recess is filled or surfaced with an electrically conductive material, in such a way that the material is in electrical contact with the ground-reference plane and that the material essentially surrounds the component in the direction of the circuit board.
Description
The present invention relates to the method for being used for around the unit architecture electromagnetic interference (EMI) shielding of waiting to be embedded in circuit board according to the preorder of claim 1.The present invention also relates to circuit board according to the preorder of claim 15.
Patent publications US 6,388,205 B1 disclose the metallic shield of using one and partially or completely have been embedded in circuit in the circuit board, wherein said metallic shield from all gussets around circuit board, and except this circuit board is connected to the point of another circuit board imperforation.
Patent application publication US 2003/01889 A1 discloses a kind of circuit board, and wherein signal conductor is centered on by several conduction openings, described opening conductive layer plating.Therefore, compare with unified structure, described structure is more durable and more flexibly, and to make also be cheap and fast.
Patent application publication WO 03/065778 discloses a kind of semiconductor device that is embedded in the circuit board, and the insulating barrier that described circuit board is used at least one side of matrix covers, and wherein be the sidewall electric conducting material plating in the hole of described parts manufacturing.
International patent application publication WO 00/14771 and WO 00/16443 disclose a kind of method that is used for forming at circuit board EMI shielded conductor groove, wherein this conductor slot is embedded in two insulation between the conducting shell, and by the ditch transverse shielding of arranging with electrically conducting manner, thereby they form coaxial line.
Patent publications US 6,131, and 269 disclose the structure that parts wherein are embedded in module on the dielectric substrate, and wherein metal level is below dielectric substrate.Between the parts that always extend to metal level by dielectric substrate, metal isolation wall is installed.Described parts embed this dielectric substrate in described module structure.
Patent publications US 5,987, and 732 disclose the structure of the integrated microwave components of multilayer.Photoresist layer is deposited on the substrate, and removes the part of photoresist layer selectively and apply first conducting shell.Remove the second portion of photoresist layer, stay dividing wall and cavity.Electric component is placed in the cavity, and the first dielectric layers fills cavity.On described layer, apply second conducting shell, remove the part of described second conducting shell.Set up electrical connection by dielectric layer to other conducting shell from conducting shell.With fluent material, at the polyimides of 250 ℃ of curing as first dielectric layer.
Patent publications JP 2000183488 discloses a kind of circuit board, and wherein said parts are assembled to groove, and metal film is formed on the wall of groove.There is not insulating material around described parts.
Patent publications JP 2002-16-16 327 discloses the parts that are embedded in the hole that is drilled in the matrix, and wherein conductive material produces on the sidewall in hole.
The object of the invention is to produce the EMI shielding construction in circuit board, makes active parts, circuit or module to be embedded in the circuit board.
The present invention is based on following thought: in circuit board, form substantially groove around the position of built in items wherein around parts, and groove forms the surface with electric conducting material or fills with electric conducting material, make that forming the groove surface or that fill forms framework around parts, described framework to electromagnetic radiation and the parts that the major general arrives the circuit board side shield.Parts and framework insulating barrier insulated from each other is preferably formed between the embedding opening of framework and parts.
More specifically, the method according to this invention is characterised in that the method for describing in the characteristic of claim 1.
And then structure according to the present invention is characterised in that the structure of describing in the characteristic of claim 15.
Utilize the present invention to obtain considerable advantage.The present invention allows around the EMI shielding of the unit architecture that is embedding in circuit board.This structure is similar to the metallic shield housing, but in this case, the conductive frame shielding of parts by in circuit board, forming, this framework is made by a certain other material of metal, conducting polymer, electroconductive binder or block electrons radiation.Groove extends to the conducting shell of the circuit board of expression ground connection reference planes, thereby material and ground connection reference planes are electrically contacted.
In circuit board, form shielding EMI structure and allow to be embedded and do not have active or passive component, circuit or the module sensitivity of housing, because inner EMI shielding protection parts are avoided the external intervention signal and from the influence of the signal in the circuit board.
Also the fact that can during the manufacturing of structure, change of the shape by shielding construction increase the advantage of this structure.If want, shielding construction can be constructed to from each side imperforation ground or with shielding part in the mode of a certain side upper shed (yet, although it is substantially around parts) around the parts that just are being embedded in the circuit board.In certain embodiments, this structure also has following advantage: the also available flexibility of groove, translucent and/or transparent electric conducting material comes to the surface or fill.
The further advantage of this structure is, any stage that these parts can be between the tectonic epochs of circuit board or be embedded into circuit board afterwards, this has makes these parts not be exposed to the advantage for the unaccommodated environment of these parts (for example, high temperature and high pressure etc.).
Make their complementations by the material of selecting circuit board and shielding construction, thereby they provide together and have for example flexible, transparent or a certain other the circuit board of desirable attributes, can make circuit board have new attribute, thereby allow to expand their possible range of application.
The preferred embodiments of the present invention have advantage with respect to the framework of embedded hole wherein with the solution of metal deposition, because, according to embodiment, the isolation of parts and EMI shielding is better guaranteed in these embodiments, so conductive material does not need to enter the installing hole of these parts, to make the EMI shielding.In addition, on to the selection of the conductive material of EMI shielding part, there is bigger freedom.
The preferred embodiments of the present invention also have advantage with respect to disclosed solution among patent publications US 6,388,205 B1.In the solution of this patent publications, the EMI shielding part is made in the manufacturing of each layer that must the combined circuit plate, thereby in fact the conductive material of circuit board must be selected as the material of EMI shielding part.In a preferred embodiment of the invention, the EMI shielding part is configured in the circuit board that finish or half-done.
In the disclosed solution, use the transverse shielding conductor slot of the long ditch of electric conducting material plating at circuit board in patent publications WO 14771 and WO 16443, this makes circuit board have rigid structure, and has reduced its durability.
Patent application publication US 2003/018889 A1 discloses by form the considerable advantage that the EMI shielding part obtains from the conductor that forms hole of separating rather than continuous wall.The manufacturing of disclosed structure is cheap and fast in this US patent application.In addition, the conductor of separation does not reduce the mechanical robustness of circuit board, yet identical with the continuous wall flexibility that does not reduce plate.In a preferred embodiment of the invention, for example flexible material such as conducting polymer and electroconductive binder is used to replace metal to make shielding construction, thereby has kept the flexibility of circuit board, and does not sacrifice durability.Use conducting polymer and electroconductive binder, circuit board also can obtain other favourable characteristic, for example the transparency etc.Succeeding vat is also filled with polymer easily.In a preferred embodiment of the invention, with identical, do not need separately to design the position in hole according to what must finish in the solution of US patent application publication.
The present invention has many preferred embodiments.Use the method according to this invention, may be embedded in the circuit board with active or passive component or to the structural entity of EMI sensitivity.For example, the RF circuit can be embedded in by means of these embodiment.
This structure is particularly suitable for optoelectronic components is embedded into circuit board.With US 6,131, identical in 269, parts are embedded into the method that is used for constructing circuit board of insulating barrier between the tectonic epochs of circuit board therein, and these parts should be resisted the high temperature and high pressure that uses during precuring and hot compression.In the present invention, after this, these parts are embedded into multilayer circuit board, thereby these parts are not exposed to the condition that needs during the manufacturing of circuit board.There is the preferred optical material around optoelectronic components such as air for example.In patent publications US 5,987,732, using between shielding wall should be at the fluent material of 250 ℃ of curing.Most of opticses can not be resisted this temperature.
Utilization also may transfer heat to the circuit board outside according to the embodiment of preferred embodiment, particularly utilizes conductive material, for example uses metal, adhesive or the polymer of conduction heat and electricity, transfers heat to below the circuit board.
In following, utilize application example and the present invention is described in greater detail with reference to the attached drawings.Application example is anything but in order to limit the protection range that is defined by the claims.
Fig. 1 illustrates the cross section of the basic structure of plate in a circuit according to the invention.
Fig. 2 illustrates the cross section of a circuit board according to the present invention when the parts feedthrough.
Fig. 3 illustrates the cross section of creeping into the groove in the circuit board.
Fig. 4 illustrates the cross section of the filling of creeping into the groove in the circuit board.
Fig. 5 illustrates the cross section of insulating barrier of the embedded location of the parts of removal in circuit board.
Fig. 6 is illustrated in the cross section of connection of the parts of embedded location.
The parts that Fig. 7 illustrates circuit board with and the top view of shielding construction.
For the present invention, term " circuit board " is meant multilayer circuit board, wherein not only exists to form the i.e. conductor layer of 0 level of ground connection reference planes, also has at least two conductor layers that are generally the electrically conductive signal layer.Conductor layer is certain conducting metal, is generally copper.Conductor layer is isolated from each other by insulating barrier.
" parts " are semiconductor device normally, for example, and optoelectronic components or microcircuit or passive component (for example, integrating passive components etc.).Semiconductor device is generally silicon or gallium base member (carbamate additives for low phosphorus, boron or other alloy atom add to wherein), to change semi-conductive electrical properties.
Term " ground connection reference planes " is meant conducting shell, and it is grounded or is connected to another 0 electromotive force, for example is connected to 0 electromotive force that floats of circuit.
Term " ground connection reference planes top " is meant the board side that parts are connected to.Term " ground connection reference planes below " is meant the opposite side of described circuit board.
Existing between conducting shell can be the insulating material of plastics or epoxy resin or a certain similar material.Insulating material is the material that does not serve as electrical transmission paths.Insulating material can be selected for instance from following group: various resins, glass epoxy, polyimides (for example, Dupont KAPTON), polyimides-quartz, polyester, propylene, bismaleimides, glass fibre, cyanate glass, XPC (paper phenol), FR-1 (paper material) with phenol glue ramming material, FR-2 (paper material with phenol glue ramming material, UL94-V0), FR-3 (paper material) with epoxy resin, FR-4 (glass-fibrous epoxy resin lamination), CEM (composite epoxy resin material), CEM-1 (paper substrate lamination, glass fibre (7628) with one deck braiding), CEM-3 (glass epoxide), aromatic polyamide (fragrant fiber, Dupont Kevlar for example, Epoxy-Kevlar, or Nobel ' s Twaron), PTFE (special teflon), benzocyclobutene, the microfibre lamination, and analog.
Special-purpose matrix can be aluminium, LTCC (LTCC), HTCC (High Temperature Co Fired Ceramic), glass, quartz/silicon dioxide, AIN, SIC, silicon, BeO and BN usually.
The plastics that can be used as the insulating material in the circuit board comprise: polyethylene, polypropylene, polybutene, polymethylpentene, polyamide, polyimides, polysulfones, polyether-ether-ketone (for example, the PALAP that is developed by Denso company and Mitsubishi Plastics Co., Ltd), polyvinyl chloride, styrene plastic, cellulosic plastics, polymethyl methacrylate (PMMA), polyacrylonitrile, Merlon, PETG and fluoroplastics.
Conducting polymer and adhesive can be divided into thermosetting polymer and thermoplastic polymer.In order to improve conductibility, may use for example fillers such as silver, gold or nickel.
Conducting polymer comprises: polyacetylene, polythiophene, polypyrrole, p-phenylene vinylene, polyaniline, poly-2,3ethyldioxitiophene.
Electroconductive binder is formed by three kinds of main components usually: conductive fillers, polymer (for example, epoxy resin, modified epoxy resin or silicone) and the preparation of antistatic attribute is provided.According to employed adhesive, use UV light or heat to be cured/drying.Some adhesive even curing at room temperature.
The conduction isotropic adhesives of commercially available (a kind of composition or two kinds of compositions)
Comprise:
Emerson&Cuming
Ablebond 976-1, flexible conductive adhesive, filler are silver
Ablebond 84-1LMI NB, conductive epoxy resin adhesive, filler are silver
Eccobond 57C, conductive epoxy resin adhesive, filler are silver
The conductive epoxy resin adhesive of 50298, two kinds of compositions of Eccobond, filler are nickel
AMICON C-850-6 epobond epoxyn, filler are silver
AMICON CE 8500 conduction modified epoxy resin adhesives, filler is a silver
Nor?throp?Grumman?Corporation
SE-CURE 9502 electroconductive binders, filler are silver
Loctite
Product 3880 conductive epoxy resin adhesives, filler is silver (being used in particular for connecting the EMI parts)
Product 3888 epobond epoxyns, filler are silver
Product 5420 conductive silicones
Product 5421RTV silicone (the EMI/RFI shielding is provided)
Dow?Corning
DA 6524 conductive silicone adhesives
DA 6533 conductive and heat-conductive silicone adhesive agents
Panacol-Elosol?Gmbh
Elecolit 312LV (solvent-free epoxy resin adhesive, filler are silver)
Elecolit 323 (conductive epoxy adhesive, filler are silver)
Elecolit 342 (conduction acrylic ester adhesive, filler are silver)
Elecolit X-160378 (conduction epoxy adhesive, filler are silver)
The electric anisotropy adhesive of commercially available (a kind of composition or two kinds of compositions) comprising:
Loctite
Product 3441 (epobond epoxyn, the polymer of gold surfaceization)
Product 3446 (epobond epoxyn, fusing filler)
Product 3440 (filler metal/polymer)
Product 3445 (melting solder filler)
Telephus
AcpMat series (, having conductive fillers and other filler special) based on the adhesive resin cream of epoxy resin
Fig. 1 illustrates the cross section of the basic structure of a circuit board.Relevant with the manufacturing of circuit board, the conducting shell 1,3 and the insulating barrier 3 that replace are built on the circuit board.One deck of conducting shell is corresponding to ground connection reference planes 3, that is, and and 0 plane.In the example of this circuit board, there are at least three conducting shells: ground connection reference planes and the signals layer that is positioned at its above and below.Usually, there be 2-4 signals layer in ground connection reference planes above and below.
Fig. 2 illustrates the cross section of the circuit board of Fig. 1 at the embedded hole place that is used for parts.In circuit board, a plurality of conductive layers 1 and a plurality of insulating barrier 2 are alternately.One of a plurality of conductive layers are ground connection datum planes 3.Easier parts to be embedded circuit board in order making,, just not the having conductive layer and only comprise the zone of insulating material 2 of the side of embedded location, to be set at the embedded location place of parts at least one side of parts.In embodiment as shown in Figure 2, opening 4 is left in the ground connection reference planes at embedded location place.In the fabrication stage, can be left on this opening part by the continuous or discrete metal level 5 that forms of layer 3 material of for example copper.Insulating material 2 is stayed in the opening.
If wish to make the conductive layer 1 under parts and the ground connection reference planes electrically contact, then the insulating barrier 2 that passes under the ground connection reference planes 3 in the feedthrough method that preferably adopts some for example little path method that is fit to before the manufacturing metal level 5 forms feedthrough 14 to the conductive layer below being positioned at.Feedthrough 14 is electric conducting materials of metal for example.
Fig. 3 shows the cross section of the groove 6 that gets out in the circuit board of Fig. 1 and 2.Use the laser of selecting to bore or corresponding method, the groove 6 that extends to ground connection reference planes 3 is by the embedded location cutting around parts.The ground connection reference planes can be preferably placed under the whole zone of holing, and make the degree of depth of its easier keyhole.In cutting zone, preferably do not have signal to connect 1, make can be under the help of ground connection reference planes 3 controlling depth, make signal lead not to be connected to ground connection reference planes 3 by the EMI shielding.For example, the laser of selection bores not corroding metal, and only etching insulating layer makes and cuts when running into ground connection reference planes 3 and can stop.
Fig. 4 shows the cross section of filler of the groove of the circuit board that pierces Fig. 1-3.In one embodiment, after boring, groove is metallized with conducting metal.Metallize in the following manner: in the phase I, selected metal is seed layer 8 chemically grown in groove of copper for example, and after this, final metal level 9 is grown with electrochemical means.Groove can be by partially filled, and for example, only the surface is covered by metal, and groove also can be by complete filling.Alternatively, groove can be filled or be come to the surface conducting polymer or electroconductive binder.When using conducting polymer or adhesive, layer 8 and 9 can be identical or different conducting polymer or adhesive.When using conducting polymer or adhesive, there is no need in layer, to fill, but can carry out the filling of groove once or come to the surface.The groove that comes to the surface or be filled with electric conducting material forms the structure of electromagnetic radiation shielding, in this case, is referred to as framework 10.
Fig. 5 shows the cross section of removal of insulating barrier 2 at the embedded location place of the parts in the circuit board of Fig. 1-4.After making the EMI framework, in groove 6 (or framework 10), bore making hole 11, to be used for the parts to 3 layers of ground connection reference planes to be embedded by the laser of for example selecting.The framework 7 of insulating material 2 is stayed between the parts and groove that are embedded into.In the fabrication stage of circuit board, the degree of depth of continuous or discrete metal level remains to the ground connection reference planes.If by selecting laser to bore or the operation of similar approach execution brill, boring operation will stop at metal level.But the insert depth Be Controlled and the adjustment of these feasible parts that embedding.
Naturally, bore operation and can also carry out by opposite order, for example, at first bore the hole at the embedded location place that is positioned at parts, and only form groove after this around embedded location.In both cases, insulating barrier 7 is left between the embedded location of groove and parts.Yet, should be pointed out that when groove will be filled metal at first preferred fabrication and filling groove make metal not enter the hole 11 that makes into parts usually.If groove is filled with conducting polymer or electroconductive binder, groove and be used for the opening of parts can be by with random order or fill simultaneously.But because conducting polymer or adhesive sputter, so it is preferably at first made and filling groove.
Fig. 6 illustrates the cross section of the parts in the space of the circuit board that is embedded into Fig. 1-5.Use has the adhesive of enough strong conductivity or scolder or conducting polymer parts 12 for example is connected to its contact base with isotropism or anisotropy mode.In the embodiment of Fig. 6,, parts are connected to metal level 5 by means of electroconductive binder 13.Adopt aforesaid some feedthrough rule such as micro through hole method (micro through hole 14) to pass insulating barrier 2 forms from parts 12 to the electrical connection that is positioned at the conduction conductor layer 1 under it.Conductor layer 1 under the ground connection reference planes also can only be set up after forming by 2 electrical connections of the insulating barrier under the ground connection reference planes 3.Alternatively, the conducting shell under the ground connection reference planes can be finished, and realizes connecting by it.
Under the help of the conductive material of for example heat conduction and conducting metal, adhesive or polymer, heat can be delivered to outside the circuit board by parts, especially under it, or is delivered to whole shell structure.
As mentioned above, use some feedthrough method, can form and be electrically connected to the conductor layer that is positioned under the ground connection reference planes.Alternatively, for example connection or some can be connected to form the conductor layer that is positioned on the ground connection reference planes by engaging (for example using the line welding of gold or aluminum steel).
After parts 12 are embedded, can be left empty around the cavity 11 that parts keep, or optionally fill with the packing material that is fit to.
If desired, under the help of conduction sticker, from top, for example, from a parts side relative, shield member with tie point.
Fig. 7 illustrates the parts of circuit board of Fig. 1 to 6 together with the top view of its shielding construction.The groove that is filled around parts 12 forms framework 10, and this framework is that the parts shielding is at least from the electromagnetic radiation of circuit board direction.Insulating barrier 7 is retained between parts 12 and the framework 10, can see that insulating barrier 2 is between insulating barrier and parts 12 simultaneously.
Claims (22)
1. the method for the unit architecture electromagnetic interference shield in being embedded in circuit board, wherein circuit board comprises alternating conductor (1) and insulating barrier (2), and sizable part of parts (2) is embedded in the described circuit board at least, and place the structure (10) of electromagnetic radiation shielding around it, described structure shields the electromagnetic radiation from the direction of circuit board at least, it is characterized in that described parts are optoelectronic components
Groove (6) forms around the embedded location of parts (12), make insulating barrier (7) stay between the embedded location and groove (6) of parts (12), and make groove extend to the insulating barrier of for example representing ground connection reference planes (3) from the surface of described circuit board, groove (6) electric conducting material (8,9) fill or come to the surface, make described material and described ground connection reference planes (3) electrically contact, described material centers on the parts as framework (10) substantially on the direction of circuit board.
2. method according to claim 1 is characterized in that, when forming described groove (6), only removes from described circuit board and does not serve as the material of electrical transmission paths (2).
3. method according to claim 1 and 2 is characterized in that, forms therein to have ground connection reference planes (3) below the whole zone of described groove (6).
4. according to each described method in the above claim, it is characterized in that, after the plating or filling of described groove, for described parts (12) form the cavity (11) that extends to described ground connection reference planes (3) height, and described parts are embedded in the cavity that has formed.
5. according to each described method in the above claim, it is characterized in that described parts are semiconductor device or passive component such as integrating passive components for example.
6. according to each described method in the above claim, it is characterized in that the electric conducting material (8,9) that is used for forming surface or filling groove to groove is transparent, translucent and/or flexible material.
7. according to each described method in the above claim, it is characterized in that the electric conducting material (8,9) that is used for forming surface or filling groove to groove is conducting polymer or electroconductive binder.
8. according to each described method in the above claim, it is characterized in that the electric conducting material (8,9) that is used for forming surface or filling groove to groove is a metal.
9. according to each described method in the above claim, it is characterized in that described parts (12) are electrically connected to the conductor layer (1) that is positioned at below the described ground connection reference planes.
10. according to each described method in the above claim, it is characterized in that, the embedded location in described parts (12), continuous or discrete metal level (5) is stayed on the described ground connection reference planes, and described parts are electrically connected to described metal level.
11. method according to claim 10 is characterized in that, utilizes scolder or conducting polymer or electroconductive binder to form described connection.
12., it is characterized in that described metal level (5) is electrically connected to and is positioned at the following conductor layer (1) of described ground connection reference planes (3) according to claim 10 or 11 described methods.
13. method according to claim 12 is characterized in that, only forms the conductor layer (1) below the described ground connection reference planes of manufacturing (3) after electrically contacting between described metal level (5) and described conductor layer (1).
14., it is characterized in that described parts (12) are electrically connected to the conductor layer (1) that is positioned at described ground connection reference planes (3) top according to each described method in the above claim.
15. a circuit board comprises
Parts (12), its sizable at least part is embedded in the described circuit board, and
Around the structure (10) of described parts (12) structures, be used to shield at least electromagnetic radiation from the direction of described circuit board,
It is characterized in that, described parts are optoelectronic components, structure (10) comprises around the groove (6) of the embedded location of described parts, groove (6) extends to ground connection reference planes (3), insulating barrier between described groove (6) and hole (11) is arranged on the embedded location place of described parts, roughly around described parts (12), this groove (6) is filled with electric conducting material (8,9) to this groove, makes described material and described ground connection reference planes (3) electrically contact in the direction of circuit board (12).
16. circuit board according to claim 15 is characterized in that, described circuit board and the framework that is used to prevent electromagnetic radiation (10) that is set up within it are flexible.
17., it is characterized in that described groove (6) is filled with conducting polymer or electroconductive binder according to claim 15 or 16 described circuit boards.
18., it is characterized in that described parts (12) are electrically connected to conductor layer (1) according to each described circuit board in the claim 15 to 17, described conductor layer (1) is positioned under the described ground connection reference planes (3).
19. according to each described circuit board in the claim 15 to 18, it is characterized in that, at the embedded location place of described parts (12), continuous or discrete metal level (5) is arranged on the height that is positioned at the ground connection reference planes, described parts are electrically connected to described metal level.
20. circuit board according to claim 19 is characterized in that, described parts (12) are connected to described metal level (5) under the assistance of electroconductive binder or conducting polymer (13).
21., it is characterized in that described metal level (5) is electrically connected to the conductor layer (1) that is positioned under the described ground connection reference planes (3) according to each described circuit board in the claim 15 to 20.
22., it is characterized in that described parts (12) are electrically connected to the conductor layer (1) that is positioned on the described ground connection reference planes (3) according to each described circuit board in the claim 15 to 21.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20031796A FI20031796A (en) | 2003-12-09 | 2003-12-09 | A method of constructing an EMI shield around a component to be embedded in a circuit board |
| FI20031796 | 2003-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1891023A true CN1891023A (en) | 2007-01-03 |
Family
ID=29763494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480036607 Pending CN1891023A (en) | 2003-12-09 | 2004-12-09 | Method for constructing emi shielding around a component embedded in a circuit board |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1692926A1 (en) |
| JP (1) | JP2007514309A (en) |
| CN (1) | CN1891023A (en) |
| FI (1) | FI20031796A (en) |
| WO (1) | WO2005057999A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562951B (en) * | 2008-04-18 | 2011-05-11 | 欣兴电子股份有限公司 | Circuit board and manufacture method thereof |
| CN102378464A (en) * | 2010-08-12 | 2012-03-14 | 环鸿科技股份有限公司 | Circuit board module |
| CN102740608A (en) * | 2011-04-15 | 2012-10-17 | 常熟东南相互电子有限公司 | Combined-type circuit board and manufacturing method thereof |
| CN101795524B (en) * | 2009-12-31 | 2013-06-19 | 浙江阳光照明电器集团股份有限公司 | Compact bracket lamp |
| CN104066273A (en) * | 2013-03-20 | 2014-09-24 | 深南电路有限公司 | Package substrate and manufacturing method thereof, and substrate assembly |
| CN104080280A (en) * | 2013-03-26 | 2014-10-01 | 深南电路有限公司 | Packaging substrate unit, preparation method of packaging substrate unit, and substrate assembly |
| CN104080274A (en) * | 2013-03-29 | 2014-10-01 | 深南电路有限公司 | Package substrate and manufacturing method of package substrate and substrate assembly |
| CN102047777B (en) * | 2008-05-30 | 2016-05-25 | 大自达电线股份有限公司 | Electromagnetic shielding material and printed circuit board (PCB) |
| CN106716199A (en) * | 2014-09-30 | 2017-05-24 | 柏林工业大学 | Optoelectronic component |
| WO2018000916A1 (en) * | 2016-06-28 | 2018-01-04 | 广东欧珀移动通信有限公司 | Pcb assembly and mobile terminal having same pcb assembly |
| CN110246829A (en) * | 2018-03-09 | 2019-09-17 | 三星电子株式会社 | Semiconductor package part and semiconductor module |
| CN110300492A (en) * | 2019-07-25 | 2019-10-01 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
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| FI20095110A0 (en) | 2009-02-06 | 2009-02-06 | Imbera Electronics Oy | Electronic module with EMI protection |
| FR2952428B1 (en) * | 2009-11-12 | 2011-12-16 | Sagem Defense Securite | INERTIAL SENSOR |
| JP5931547B2 (en) | 2012-03-30 | 2016-06-08 | イビデン株式会社 | Wiring board and manufacturing method thereof |
| US10321569B1 (en) | 2015-04-29 | 2019-06-11 | Vpt, Inc. | Electronic module and method of making same |
| CN106535472B (en) * | 2017-01-12 | 2019-08-02 | 郑州云海信息技术有限公司 | A kind of PCB and signal transmission system |
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|---|---|---|---|---|
| US6131269A (en) * | 1998-05-18 | 2000-10-17 | Trw Inc. | Circuit isolation technique for RF and millimeter-wave modules |
| US6916122B2 (en) * | 2002-03-05 | 2005-07-12 | Jds Uniphase Corporation | Modular heat sinks |
| EP1510844A1 (en) * | 2003-08-28 | 2005-03-02 | Siemens Aktiengesellschaft | An optical fibre connector with electromagnetic shielding |
-
2003
- 2003-12-09 FI FI20031796A patent/FI20031796A/en not_active IP Right Cessation
-
2004
- 2004-12-09 EP EP04805147A patent/EP1692926A1/en not_active Withdrawn
- 2004-12-09 CN CN 200480036607 patent/CN1891023A/en active Pending
- 2004-12-09 JP JP2006543565A patent/JP2007514309A/en active Pending
- 2004-12-09 WO PCT/FI2004/000752 patent/WO2005057999A1/en not_active Application Discontinuation
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562951B (en) * | 2008-04-18 | 2011-05-11 | 欣兴电子股份有限公司 | Circuit board and manufacture method thereof |
| CN102047777B (en) * | 2008-05-30 | 2016-05-25 | 大自达电线股份有限公司 | Electromagnetic shielding material and printed circuit board (PCB) |
| CN101795524B (en) * | 2009-12-31 | 2013-06-19 | 浙江阳光照明电器集团股份有限公司 | Compact bracket lamp |
| CN102378464A (en) * | 2010-08-12 | 2012-03-14 | 环鸿科技股份有限公司 | Circuit board module |
| CN102740608A (en) * | 2011-04-15 | 2012-10-17 | 常熟东南相互电子有限公司 | Combined-type circuit board and manufacturing method thereof |
| CN104066273A (en) * | 2013-03-20 | 2014-09-24 | 深南电路有限公司 | Package substrate and manufacturing method thereof, and substrate assembly |
| CN104080280A (en) * | 2013-03-26 | 2014-10-01 | 深南电路有限公司 | Packaging substrate unit, preparation method of packaging substrate unit, and substrate assembly |
| CN104080280B (en) * | 2013-03-26 | 2017-08-08 | 深南电路有限公司 | A kind of package substrate unit and preparation method thereof and board unit |
| CN104080274A (en) * | 2013-03-29 | 2014-10-01 | 深南电路有限公司 | Package substrate and manufacturing method of package substrate and substrate assembly |
| WO2014154000A1 (en) * | 2013-03-29 | 2014-10-02 | 深南电路有限公司 | Packaging substrate and manufacturing method therefor, and substrate assembly |
| CN104080274B (en) * | 2013-03-29 | 2016-12-28 | 深南电路有限公司 | A kind of base plate for packaging and preparation method thereof and board unit |
| CN106716199A (en) * | 2014-09-30 | 2017-05-24 | 柏林工业大学 | Optoelectronic component |
| WO2018000916A1 (en) * | 2016-06-28 | 2018-01-04 | 广东欧珀移动通信有限公司 | Pcb assembly and mobile terminal having same pcb assembly |
| CN110246829A (en) * | 2018-03-09 | 2019-09-17 | 三星电子株式会社 | Semiconductor package part and semiconductor module |
| CN110246829B (en) * | 2018-03-09 | 2024-04-26 | 三星电子株式会社 | Semiconductor package and semiconductor module |
| CN110300492A (en) * | 2019-07-25 | 2019-10-01 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1692926A1 (en) | 2006-08-23 |
| FI20031796A0 (en) | 2003-12-09 |
| FI20031796A (en) | 2005-06-10 |
| JP2007514309A (en) | 2007-05-31 |
| WO2005057999A1 (en) | 2005-06-23 |
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