CN1889816A - Electronic equipment with foaming structure and producing method thereof - Google Patents
Electronic equipment with foaming structure and producing method thereof Download PDFInfo
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- CN1889816A CN1889816A CN 200510082275 CN200510082275A CN1889816A CN 1889816 A CN1889816 A CN 1889816A CN 200510082275 CN200510082275 CN 200510082275 CN 200510082275 A CN200510082275 A CN 200510082275A CN 1889816 A CN1889816 A CN 1889816A
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- shell
- foaming structure
- foaming
- electronic equipment
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Abstract
A method for preparing electronic device with foamed structure includes providing a shell and an electronic element set in said shell, filling a foaming liquid into said shell and utilizing chemical foaming mode to foam said foaming liquid to be foamed structure, using foamed structure in said shell to cover or clad said electronic element for intensifying mechanical strength of shell and for absorbing impact of outside force in order to protect electronic element effectively.
Description
Technical field
The relevant a kind of electronic equipment of the present invention with foaming structure, and particularly relevant a kind of reinforcement rib that need not add can be possessed the electronic equipment of sufficient mechanical strength characteristic.
Background technology
Increasingly competitive along with electronic product, the life cycle of various electronic products is shorter and shorter, and the variation of electronic product casing also becomes more important.In the tradition, electronic product shell is made in modes such as plastic cement ejaculation, die cast metal or metal stampings, in order to allow electronic product not only have necessary intensity and reliability, also has diverse appearance and modeling.In recent years, along with making rapid progress of science and technology and information, the manufacturing technology of electronic product is also day by day progressive.Pursue under the considering of portability and practicality present people, electronic product all pursues gently, thin, short, little characteristic.
Therefore, existing electronic product reduces the thickness of shell under the considering of loss of weight mostly.Yet the shell that thickness reduces will cause the intensity of electronic product and reliability to die down, and and then make the element of electronic product inside be subjected to the chance that external force injures to increase.So the electronic product casing inboard is equipped with the reinforcement rib mostly in the tradition, the stress that electronic product casing is born reduces, and and then increases the intensity and the reliability of electronic product.
Yet, strengthen rib in the electronic product casing installed inside inner space will be dwindled.And strengthen that the rib conventional method is to use that thermosol connects, riveted joint, ultrasonic waves weld, deadlocked or lock screw etc. adds operation and fixes in electronic product casing.In addition, electronic product often needs to be embedded special pattern or literal at housing, for example be embedded the trade name font of unlike material on the shell of notebook computer, this is in the mechanical strength that all can reduce the whole casing body, thereby needs extra shell structure design so that electronic product can be by testing.In view of the above, adding operation will increase extra cost, and, the installation site of outer ribbed with make feasibility, and even fixed form all need complicated design and arrangement, and then the degree of difficulty of manufacturing is increased, and then the time-histories of product development is prolonged.In view of this, relevant manufacturer there's no one who doesn't or isn't actively improves above-mentioned shortcoming.
Summary of the invention
Therefore the purpose of this invention is to provide a kind of electronic equipment and manufacture method thereof, make electronic product not only have diversified outward appearance, and have necessary intensity and reliability with foaming structure.
Another object of the present invention provides a kind of electronic equipment and manufacture method thereof with foaming structure, makes electronic product can strengthen the mechanical strength of this electronic product by foaming structure, and needn't add the reinforcement rib.
Another purpose of the present invention provides a kind of electronic equipment and manufacture method thereof with foaming structure, needn't strengthen the mechanical strength of this electronic product by strengthening rib, and make the weight saving of electronic product.
A further object of the present invention provides a kind of electronic equipment and manufacture method thereof with foaming structure, and its manufacture process is simple and easy and and then reduce production costs and shorten the time-histories of product development.
Another purpose of the present invention is that a kind of strong method that adds of partial structurtes is being provided, make electronic product can strengthen the mechanical strength of this electronic product by the foaming structure part, and do not need extra shell structure design, and then process cost is reduced, and the time-histories that shortens product development.
According to above-mentioned purpose of the present invention, a kind of electronic equipment and manufacture method thereof of tool foaming structure proposed.This electronic equipment comprises shell, is installed on the interior electronic component of shell and the foaming structure of covering or coated electric components.Wherein, foaming structure is in order to the mechanical strength of strengthening shell or as the usefulness of the supporting construction of shell, and can protect electronic component not damaged by external force.
A kind of manufacture method according to an aspect of the present invention with electronic equipment of foaming structure, this method comprises at least: a shell is provided; One electronic component is installed in this shell; After this electronic component of installation is in this shell, pour into an expanding foam solution to this shell; And after this expanding foam solution of perfusion was to this shell, this expanding foam solution that foams made this expanding foam solution form a foaming structure so that this shell is provided support.
A kind of according to a further aspect of the invention electronic equipment with foaming structure comprises at least: a shell;
One electronic component is installed in this shell; One foaming structure is positioned at this shell, in order to support this shell.
Wherein, foaming structure is to cover or coated electric components, and by foaming structure with the mechanical strength of strengthening shell or as the usefulness of the supporting construction of shell, and can protect electronic component not damaged by external force.
According to a preferred embodiment of the present invention, above-mentioned shell can be soft or the hard material manufacturing.Therefore, inject in the shell contain electronic component in expanding foam solution before, provide a mould earlier, and the shell that will include electronic component is inserted in this mould.And after expanding foam solution forms foaming structure, in mould, take out the shell that includes electronic component and foaming structure.Because the support of foaming structure can make shell form a rigid structure, and and then make shell be enough to bear pressure and impact.
From the above, because the foaming structure that another preferred embodiment of the present invention provided has characteristic yielding and that restoring force is good, so when the external impacts electronic equipment, this foaming structure deformability is to absorb stress, and then avoid electronic component is produced injury, when the external force disappearance, foaming structure can be returned to original shape.And because foaming structure has the characteristic of light weight, so therefore electronic product can reduce its weight, and and then electronic product competitiveness on market is increased.Moreover, because it is simple and easy to form the operation of foaming structure armature, thus the production cost of electronic product not only can so and reduce, and can own diversified outward appearance easily.
Be suitable in the present invention expanding foam solution can comprise soft or hard foam, for example foamed plastics or metal foam.In addition, above-mentioned expanding foam solution also can comprise the antistatic foam body, for example add antistatic agent or directly use foaming aluminium alloy or antistatic plastic cement as foaming body.
Description of drawings
For above-mentioned and other purposes of the present invention, characteristics and advantage can be become apparent, preferred embodiment of the present invention is elaborated below in conjunction with accompanying drawing:
Fig. 1-the 6th is according to a kind of manufacturing process profile of the manufacture method of the electronic equipment with foaming structure of a preferred embodiment of the present invention; And
Fig. 7 is a kind of exploded perspective view of using the electronic equipment of a preferred embodiment of the present invention.
Embodiment
Preferred embodiment of the present invention discloses a kind of method that forms the foaming structure armature, and this kind method is applicable to the manufacturing electronic equipment.Utilize foaming structure to cover or coated electric components, make electronic component avoid the damage that external impacts causes.In addition, because foaming structure has the characteristic of light weight, so electronic product still can keep light, thin, short, little characteristic.Moreover, because it is simple and easy to form the method for foaming structure armature, so use the characteristic that electronic product of the present invention can have inexpensive and diversified outward appearance.Embodiments of the invention can be used for various fields, and can not limit claim of the present invention.
With reference to figure 1-6, it is a kind of manufacturing process profile according to the method for the formation foaming structure armature of a preferred embodiment of the present invention.The method of formation foaming structure armature of the present invention can be used for making any product that contains the element that needs protection, in a particular embodiment, is applicable to the manufacture method of electronic equipment.With reference to figure 1, at first an electronic component 200 is installed on the drain pan 110 of electronic equipment.Wherein, electronic component 200 can comprise circuit board or electronic building brick.
Continuation is with reference to figure 1, a metal foil paster 240 parts is installed is adjacent to electronic component 200 on the drain pan 110, and an insulating barrier 220 parts are installed are positioned on the metal foil paster 240.Wherein, metal foil paster 240 is in order to reduce electromagnetic interference effect (Electromagnetic Interference).In addition, be coated with layer protective layer (not shown) with insulating barrier 220, not influenced by the expanding foam solution of follow-up perfusion with insulating barrier 200 in order to protect above-mentioned electronic component 200, metal foil paster 240 in electronic component 200, metal foil paster 240.
With reference to figure 7, Fig. 7 is a kind of exploded perspective view of using the electronic equipment of a preferred embodiment of the present invention.After metal foil paster 240 and insulating barrier 220 are installed, a top shell 120 are installed on drain pan 110, and and then are formed a shell.Wherein, top shell 120 is equipped with a shell inlet 140, and the both side edges of drain pan 110 respectively is equipped with a shell exhaust outlet 160.Shell inlet 140 be in order to the perfusion expanding foam solution to shell, and shell exhaust outlet 160 is to be used to pour into expanding foam solution to shell the time, gets rid of original gas in the shell.In addition, shell inlet 140 and shell exhaust outlet 160 also can be installed on the optional position on the shell.With reference to figure 2,, be installed in the mould 300 so will include the shell of electronic component 200 because the shell of present embodiment is to make with soft or hard material.Wherein, mould 300 is equipped with a mould inlet 320, and the both side edges of mould 300 respectively is equipped with a die venting mouth 340.In addition, mould inlet 320 is to be installed on the shell inlet 140 and shell exhaust outlet 160 outsides respectively with die venting mouth 340.By mould inlet 320 with the perfusion expanding foam solution, and via shell inlet 140 to shell.And die venting mouth 340 is to be used to pour into expanding foam solution to shell the time, and original gas in the shell is discharged.
With reference to Fig. 3, after the shell that includes electronic component 200 is installed on 300 li on mould, expanding foam solution 500 is poured into to shell by an expanding foam solution nozzle 400.In the present embodiment, expanding foam solution 500 comprises hard foam, for example hard polyurethane, foamed polystyrene body (Polystyrene), cellulose acetate foaming body (Cellular Cellulose Acetate), thermosetting foamed plastics, differential mode foaming body or metal foam (as the aluminium alloy foaming body).Have higher mechanical strength by the formed foaming structure of hard foam, can be in order to the shell of support electronic equipment.In another embodiment of the present invention, expanding foam solution 500 also can comprise soft foamed material, for example Polyurethane foaming body, vinyl foaming body (Vinyl Foam), foam polyethylene and silica resin foaming body (Silicone Foam) are if expanding foam solution 500 comprises the Polyurethane foaming body or foam polyethylene is then better.Have yielding characteristic by the formed foaming structure of soft foamed material, can avoid the damage of external force in order to protection electronic component 200.Employed expanding foam solution also can comprise the particulate of conductor, for example metal particle.The foaming structure that expanding foam solution foamed out that adds the conductor particulate can have conductivity, and then avoids interference and the injury of static to electronic component.In addition, expanding foam solution 500 also can be avoided the influence of static to electronic component, for example antistatic foamed plastics or aluminium alloy foaming body etc. by the antistatic foam body.
Perfusion expanding foam solution to the number in the shell is to depend on the needed engineering properties of foaming structure.For instance,, then make the degree of follow-up foamed process foaming bigger, and then make the foaming structure comparatively soft (in other words, young's modulus is lower) after the foaming if the foaming liquid measure of pouring into to the shell is less.Otherwise, if the foaming liquid measure of pouring into to the shell is more, the foaming structure then harder (in other words, young's modulus is higher) after the foaming then.In addition, in an embodiment more of the present invention, expanding foam solution also can pour into the regional area to the shell, makes the foaming structure after the foaming be strengthened this regional area.
With reference to Fig. 4, after expanding foam solution 500 pours into to shell, make expanding foam solution 500 foaming by a foamed process, use so that expanding foam solution 500 forms foaming structures 600.The chemical foaming agent (Chemical Blowing Agent) that this foamed process can utilize expanding foam solution 500 to include, perhaps directly gas is added in the expanding foam solution, these both all with so that gas is distributed in the soft foamed material equably, and then make soft foamed material reach the foaming purpose.
With reference to Fig. 5, after foamed process is finished, mould 300 is opened, and taken out the shell that includes foaming structure 600 and electronic component 200.It should be noted that shell inlet 140 and generally all contain the foaming structure 620 that behind foamed process, overflows around the shell exhaust outlet 160.
With reference to Fig. 6, after including the shell taking-up of foaming structure 600 and electronic component 200, finishing shell inlet 140 and shell exhaust outlet 160 foaming structure 620 on every side.The producer also can install sheet to hide the ugly 700 in shell inlet 140 and shell exhaust outlet 160, and is attractive in appearance in order to increase shell.
According to the above, the electronic equipment of using preferred embodiment of the present invention can support by the reinforcement of foaming structure, and makes the shell of electronic equipment have necessary mechanical strength, and then avoids external force that electronic component 200 is caused damage.In addition, because the foaming structure that another preferred embodiment of the present invention provided has characteristic yielding and that restoring force is good, so when the external impacts electronic equipment, this foaming structure deformability is to absorb stress, and then avoid electronic component is produced injury, when the external force disappearance, foaming structure can be returned to original shape.In addition, the partial foaming structure that an embodiment more according to the present invention is provided makes electronic equipment can strengthen the part and whole mechanical strength of this electronic equipment by the partial foaming structure.
By the invention described above preferred embodiment as can be known, apply the present invention to and have following advantage less:
(1) because foaming structure can have enough mechanical strengths, so can strengthen the mechanical strength of shell or as the usefulness of the supporting construction of shell;
(2),, and then avoid electronic component produced and injure so when the external impacts electronic equipment, this foaming structure deformability to be absorbing stress because foaming structure has yielding characteristic;
(3) because foaming structure has the characteristic of light weight, so electronic equipment still can keep light, thin, short, little characteristic when considering its necessary mechanical strength and reliability;
(4) simple and easy because form the method for foaming structure armature, can reduce its design and the cost of making so use electronic product of the present invention; And
(5) because shell can be made by soft material, thus changeable appearance and modeling can be provided, and and then the lifting market competitiveness.
Though the present invention discloses as above with a preferred embodiment; yet it is not in order to limit the present invention; any person skilled in the art person; without departing from the spirit and scope of the present invention; when the change that can do various equivalences or replacement, so protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (12)
1. manufacture method with electronic equipment of foaming structure, this method comprises at least:
One shell is provided;
One electronic component is installed in this shell;
After this electronic component of installation is in this shell, pour into an expanding foam solution to this shell; And
After this expanding foam solution of perfusion was to this shell, this expanding foam solution that foams made this expanding foam solution form a foaming structure so that this shell is provided support.
2. the manufacture method with electronic equipment of foaming structure as claimed in claim 1 is characterized in that also comprising:
Before in this expanding foam solution of perfusion to this shell, also comprise with a rete covering this electronic component.
3. the manufacture method with electronic equipment of foaming structure as claimed in claim 1 is characterized in that this shell comprises:
One shell inlet is installed on this shell, in order to pour into this expanding foam solution to this shell; And
At least one shell exhaust outlet is installed on this shell, is used to pour into this expanding foam solution to this shell the time, gets rid of original gas in this shell.
4. the manufacture method with electronic equipment of foaming structure as claimed in claim 3 is characterized in that also comprising:
Before this expanding foam solution of perfusion is to this shell, a mould is provided, this mould comprises a hollow chamber, and this shell that this electronic component will be installed is inserted this hollow chamber; And
After this expanding foam solution of foaming, open this mould, and take out this shell that includes this foaming structure and this electronic component;
Wherein, this mould comprises:
One mould inlet is installed on this mould, and is positioned at this shell inlet outside, in order to pour into this expanding foam solution to this shell; And
At least one die venting mouth is installed on this mould, and is positioned at corresponding this shell exhaust outlet outside, is used to pour into this expanding foam solution to this shell the time, gets rid of original gas in this shell.
5. the manufacture method with electronic equipment of foaming structure as claimed in claim 4 is characterized in that also comprising:
After taking-up includes this shell of this foaming structure and this electronic component, repair this shell inlet and this shell exhaust outlet of this shell.
6. the manufacture method with electronic equipment of foaming structure as claimed in claim 5 is characterized in that also comprising:
After this shell inlet and this shell exhaust outlet of this shell of finishing, stick at least one sheet to hide the ugly in this shell inlet and this exhaust outlet.
7. electronic equipment with foaming structure comprises at least:
One shell;
One electronic component is installed in this shell;
One foaming structure is positioned at this shell, in order to support this shell.
8. the electronic equipment with foaming structure as claimed in claim 7 is characterized in that also comprising:
One rete covers this electronic component.
9. the electronic equipment with foaming structure as claimed in claim 7 is characterized in that this foaming structure covers this electronic component to protect this electronic component.
10. the electronic equipment with foaming structure as claimed in claim 7 is characterized in that this foaming structure comprises a soft foamed material, a hard foam and makes up one of them.
11. the electronic equipment with foaming structure as claimed in claim 10 is characterized in that this soft foamed material is selected from a group that is made up of Polyurethane foaming body, vinyl foaming body, foam polyethylene and silica resin foaming body.
12. the electronic equipment with foaming structure as claimed in claim 10 is characterized in that this hard foam is selected from a group that is made up of hard polyurethane foaming body, foamed polystyrene body, cellulose acetate foaming body, thermosetting foamed plastics, differential mode foaming body and metal foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510082275 CN1889816A (en) | 2005-06-29 | 2005-06-29 | Electronic equipment with foaming structure and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510082275 CN1889816A (en) | 2005-06-29 | 2005-06-29 | Electronic equipment with foaming structure and producing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1889816A true CN1889816A (en) | 2007-01-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510082275 Pending CN1889816A (en) | 2005-06-29 | 2005-06-29 | Electronic equipment with foaming structure and producing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1889816A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108475554A (en) * | 2015-12-21 | 2018-08-31 | 恩德斯+豪斯流量技术股份有限公司 | The field device and its manufacturing method of automatic technology |
| CN110193908A (en) * | 2019-07-05 | 2019-09-03 | 重庆丰裕聚氨酯有限公司 | Foam device |
-
2005
- 2005-06-29 CN CN 200510082275 patent/CN1889816A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108475554A (en) * | 2015-12-21 | 2018-08-31 | 恩德斯+豪斯流量技术股份有限公司 | The field device and its manufacturing method of automatic technology |
| CN108475554B (en) * | 2015-12-21 | 2020-07-07 | 恩德斯+豪斯流量技术股份有限公司 | Automation field device and method for the production thereof |
| CN110193908A (en) * | 2019-07-05 | 2019-09-03 | 重庆丰裕聚氨酯有限公司 | Foam device |
| CN110193908B (en) * | 2019-07-05 | 2023-09-12 | 重庆丰裕宇科技有限公司 | Foaming device |
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