CN1869724A - Method of inspecting electronic circuit - Google Patents
Method of inspecting electronic circuit Download PDFInfo
- Publication number
- CN1869724A CN1869724A CNA2006100899183A CN200610089918A CN1869724A CN 1869724 A CN1869724 A CN 1869724A CN A2006100899183 A CNA2006100899183 A CN A2006100899183A CN 200610089918 A CN200610089918 A CN 200610089918A CN 1869724 A CN1869724 A CN 1869724A
- Authority
- CN
- China
- Prior art keywords
- signal
- circuit
- test signal
- output
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000012360 testing method Methods 0.000 claims abstract description 201
- 238000007689 inspection Methods 0.000 claims description 8
- 230000000052 comparative effect Effects 0.000 claims description 2
- 238000012550 audit Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000003111 delayed effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. by varying supply voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. by varying supply voltage
- G01R31/3004—Current or voltage test
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A method of inspecting an electronic circuit that includes a first integrated circuit and a second integrated circuit formed on a circuit board. The first integrated circuit has a first power source, an input circuit and a signal output section, and the second integrated circuit has a second power source, an output circuit and a signal input section. The method is comprised of steps of: changing voltage level of the first power source; applying a test signal to the signal input section; detecting an output signal of the signal output section; examining whether there is a sufficient margin in the electronic circuit by comparing the test signal and the output signal.
Description
The present invention relates to a kind of method that is used to check the electronic circuit that comprises integrated circuit.
All comprise integrated circuit in most of Electrical and Electronic circuit.Usually, described integrated circuit is encapsulated in the resin enclosure, and wherein a plurality of conductive pins stretch out from described shell.The size of described integrated circuit and the interval between the pin have been made into and have been suitable for carrying out quality check not difficultly.
Yet along with the needs that strengthen performance of integrated circuits are become more and more stronger, the size of integrated circuit and the interval between the pin are reduced.
In quality check, there is so-called surplus test (margin test).The test of described surplus is in the on-off operation of examining integrated circuit when checking that probe is applied to one or more described pin to a certain voltage.Along with the interval between the pin becomes more and more nearer, described inspection probe contacts difficult more with pin.
In order to address the above problem, the inspection area that JP-A-5-72280 has proposed to form on circuit board is so that carry out the surplus test to integrated circuit after being installed on the circuit board.Yet because except that installing space, this inspection area also needs the extra test space in the circuit board, so it can not help to reduce the size of electronic circuit.
Therefore, an object of the present invention is: can under the situation that the extra test space is not provided, realize the surplus test.
According to principal character of the present invention, a kind of method that is used to check electronic circuit is provided, described electronic circuit is included in first integrated circuit and second integrated circuit that forms on the circuit board, wherein first integrated circuit has first power supply, an input circuit and a signal output component, and second integrated circuit has second source, an output circuit and a signal input part, and described method comprises the steps: to change the described first power source voltage level; Test signal is applied to described signal input part; Detect the output signal of described signal output component; And examine in described electronic circuit, whether there are enough surpluses by more described test signal and described output signal.
Adopt said method, to can carrying out under the situation of the extra test space not having in the surplus test of the electronic circuit of installing on the circuit board.
Preferably, described method also comprises the step that is used for changing the voltage level of second source before test signal is applied to signal input part.This makes it possible to examine the operation of first integrated circuit when second source changes its voltage level.
In above-mentioned inspection method, preferably, described voltage level changes in maximum guarantees voltage (assurance voltage) and the minimum scope that guarantees between the voltage.As long as the first and second power source voltage level are set in the minimum scope that guarantees between voltage and the maximum assurance voltage, the comparative result of test event signal and output signal so just can determine that described surplus is enough in the scope of prevalue.
According to another feature of the present invention, a kind of method that is used to check electronic circuit is provided, described electronic circuit is included in first integrated circuit and second integrated circuit that forms on the circuit board, wherein first integrated circuit has first power supply, an input circuit and a signal output component, and second integrated circuit has second source, an output circuit and a signal input part, and described method comprises the steps: to connect described first and described second source; Described first and the voltage level of described second source be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with maximum
2HTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; And if described test signal and described output signal are inequality, determine not exist enough surpluses so.
Said method can also comprise the steps: described first and the voltage level of described second source be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with minimum
2LTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; And test event signal is identical with output signal, then determines to exist enough surpluses.
According to another feature of the present invention, a kind of method that is used to check electronic circuit is provided, described electronic circuit is included in first integrated circuit and second integrated circuit that forms on the circuit board, wherein first integrated circuit has first power supply, a plurality of input circuit and signal output component thereof, and second integrated circuit has second source, a plurality of output circuit and signal input part thereof, and described method comprises the steps: to connect described first and described second source; Described first and the voltage level of described second source be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with minimum
2LTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; If described test signal and described output signal are inequality, determine not exist enough surpluses so; Described first and the voltage level of described second source be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with maximum
2HTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; And if described test signal and described output signal are inequality, determine not exist enough surpluses so; Described first and the voltage level of described second source be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with minimum
2LTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; And if described test signal and described output signal are inequality, determine not exist enough surpluses so; Described first and the voltage level of described second source be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with maximum
2HTest signal is applied to described signal input part; Detect the output signal of described signal output component; Whether examine described test signal identical with described output signal; And if described test signal and described output signal are inequality, determine so not have enough surpluses, if perhaps described test signal is identical with described output signal, be defined as existing enough surpluses so.
By to following detailed description, the research of appended claims and accompanying drawing, it is clearer that the function of other objects, features and characteristic of the present invention and relevant portion of the present invention will become.In the accompanying drawings:
Fig. 1 is the schematic electronic circuit that forms on circuit board according to of the present invention;
Fig. 2 is the electronic circuit that forms on circuit board according to first embodiment of the invention;
Fig. 3 is the process flow diagram that is used to check the method for the electronic circuit that forms according to first embodiment on circuit board;
Fig. 4 shows the chart of the surplus test zone of the electronic circuit that forms according to first embodiment on circuit board;
Fig. 5 shows the chart of the surplus test zone of the electronic circuit that forms according to first embodiment on circuit board;
Fig. 6 is the electronic circuit that forms on circuit board according to second embodiment of the invention;
Fig. 7 is the electronic circuit that forms on circuit board according to third embodiment of the invention;
Fig. 8 is the electronic circuit that forms on circuit board according to fourth embodiment of the invention;
Fig. 9 is the process flow diagram that is used to check the method for the electronic circuit that forms according to the 4th embodiment on circuit board;
Figure 10 is the electronic circuit that forms on circuit board according to fifth embodiment of the invention;
Figure 11 is the process flow diagram that is used to check the method for the electronic circuit that forms according to the 6th embodiment on circuit board;
Figure 12 shows the chart of the surplus test zone of the electronic circuit that forms according to the 6th embodiment on circuit board;
Figure 13 shows the chart of the surplus test zone of the electronic circuit that forms according to the 6th embodiment on circuit board;
Figure 14 shows the chart that is formed on the limit testing zone of the electronic circuit on the circuit board according to the 6th embodiment;
Figure 15 shows the chart of the surplus test zone of the electronic circuit that forms according to the 6th embodiment on circuit board;
Figure 16 is the electronic circuit that forms on circuit board according to seventh embodiment of the invention; With
Figure 17 is the process flow diagram that is used to check the method for the electronic circuit that forms according to the 7th embodiment on circuit board.
At first, will be described with reference to Figure 1 notion of the present invention.As shown in Figure 1, first integrated circuit (hereinafter referred to as IC-1) 11 and second integrated circuit (hereinafter referred to as IC-2) 12 are installed on the circuit board 10.Described IC-1 11 comprises first power supply 13, first input circuit 14 and second output circuit 16, and described IC-2 12 comprises second source 18, first output circuit 15 and second input circuit 17.The voltage of the voltage of first power supply 13 and second source 18 can be controlled independently of one another.First input circuit 14 of IC-1 11 and first output circuit 15 of IC-2 12 are connected with each other by first wiring 19 that forms on circuit board 10, and second input circuit 17 of second output circuit 16 of IC-1 11 and IC-2 12 is connected with each other by second wiring 20 that forms on circuit board 10.
The test signal that sends from external signal generator (not shown) is applied to each output circuit 15,16 and surplus test cell (not shown).The output signal of each input circuit 14,17 also is input to described surplus test cell.More described test signal of described surplus test cell and described output signal, and when their surpluses that is defined as interface when being equal to each other that becomes be enough.
Herein, described surplus is that the difference between threshold value and the described output signal defines during by the electronic circuit normal running.If the difference between threshold value and the output signal drops in the prescribed level, can think that then described surplus is enough.Described electronic circuit can comprise the digital circuit that comprises cmos circuit, and the mimic channel that comprises operational amplifier.
If mains fluctuations, the voltage of the output signal of electronic circuit can change so.Change the output voltage of first output circuit 15 by the voltage that changes second source 18.Variation in the output voltage of first output circuit 15 changes the input voltage of first input circuit 14 via first wiring 19.Thus, the test of the operated surplus on first input circuit 14 can be undertaken by the voltage that changes second source 18.
Thus, the test of the operated surplus on second input circuit 17 also can be undertaken by the voltage that changes first power supply 13 according to above-mentioned identical mode.
To the electronic circuit of installing according to first embodiment be described with reference to figure 2-5 on circuit board.Incidentally, after this identical reference marker shows identical or substantially the same part, parts or assembly.
Following the surplus test that circuit according to first embodiment is carried out described with reference to figure 3.
At first, at (step) S401, connect first and second power supplys 13,18.Then, at S402, the voltage of first and second power supplys 13,18 is set to the minimum assurance voltage V of IC-1 11 respectively
1LGuarantee voltage V with the maximum of IC-2 12
2HAfter this, at S403, the test signal that comprises Lo signal and follow-up Hi signal is applied to the first test signal input block 32 of first output circuit 15.Incidentally, can be applied to the first test signal input block 32 to Hi signal and follow-up Lo signal as test signal.This test signal is exported from the first test signal output block 31 as diagnostic signal, this test signal is sent to the first test signal input block 25 via first wiring 19.After this, at S404, whether the output signal of examining the first test signal output block 24 is identical with the test signal that is applied to the first test signal input block 32, to carry out branch's examination.As shown in Figure 4, the examination of described branch is used for: though when the input threshold value 51 of CMOS because of the low voltage level of first power supply 13 for low be when hanging down, whether the level of the Lo signal of audit test signal is lower than the input threshold value 51 of CMOS, even and when the Lo of test signal signal when being high because of the higher voltage level of second source 18, whether the level of the Hi signal of audit test signal is higher than the input threshold value.If the examination result at S404 is YES (perhaps Y), step advances to S405 so, and wherein the voltage of first power supply 13 is set to the maximum assurance voltage V of IC-1 11
1H, and the voltage of second source 18 is set to the minimum assurance voltage V of IC-2 12
2LAt next step S406, described test signal is applied to the first test signal input block 32.At next step S407, whether the output signal of examining the first test signal output block 24 is identical with described test signal, to carry out branch's examination.As shown in Figure 5, in the examination of described branch, when the input threshold value 51 of CMOS when being high because of the high-voltage level of first power supply 13, even perhaps when the Hi of test signal signal when being low because of the lower voltage level of second source 18, whether the level whether level of the Hi signal of audit test signal is higher than the Lo signal of the input threshold value 51 of CMOS and test signal is lower than input threshold value 51.
If the examination result at S407 is Y, step advances to S408 so, determines that wherein the surplus of the interface between IC-1 11 and the IC-2 12 is enough.
On the other hand, if be N in the result of S404 or S407, step advances to S409 so, determines that wherein the surplus of the interface between IC-1 11 and the IC-2 12 is inadequate.
Incidentally, step S402 and step S405 can exchange each other.By monitoring the output signal of the first test signal output block 24, can guarantee that voltage replaces with the threshold value that other variable voltage detects cmos circuit 21 minimum and maximum.
With the electronic circuit of on circuit board, installing that is described with reference to Figure 6 according to second embodiment.
Except first input circuit 14 comprise comparer 71 and the bleeder circuit formed by resistor 72 and resistor 73, according to the circuit of second embodiment structurally with identical according to the circuit of first embodiment.
The reference voltage of comparer 71 is parts of the voltage of first power supply 13 that provided by described bleeder circuit.Can carry out according to aforesaid way the surplus test that this embodiment carries out.
With the electronic circuit of on circuit board, installing that is described with reference to Figure 7 according to the 3rd embodiment.
Except first output circuit 15 comprise comparer 71 and the bleeder circuit formed by resistor 72 and resistor 73, according to the circuit of the 3rd embodiment structurally with identical according to the circuit of first embodiment.
The reference voltage of comparer 71 is parts of the voltage of the second source 18 that provided by described bleeder circuit.Can carry out according to aforesaid way the surplus test that this embodiment carries out.
To the electronic circuit of installing according to the 4th embodiment be described with reference to figure 8 and 9 on circuit board.
Except the bleeder circuit of being made up of resistor 72 and resistor 73 is set at the outside of IC-1 11 and IC-2 12, according to the circuit of the 4th embodiment structurally with according to second
The circuit of embodiment is identical.
Following the surplus test that circuit according to the 4th embodiment is carried out described with reference to figure 9.
At first, at S1001, connect first and second power supplys 13,18.Then, at S1002, the voltage of first and second power supplys 13,18 is set to voltage V1 (considering the voltage of the comparer 71 that is in same phase) and the minimum voltage V that guarantees respectively
2LAfter this, at S1003, the test signal that comprises Hi signal and follow-up Lo signal is applied to the first test signal input block 32 of first output circuit 15.After this, at S1004, whether the output signal of examining the first test signal output block 24 is identical with the test signal that is applied to the first test signal input block 32, to carry out branch's examination.If the examination result at S1004 is Y, step advances to S1005 so, and wherein the voltage of second source 18 is set to the maximum assurance voltage V of IC-2 12
2HAt next step S1006, test signal is applied to the first test signal input block 32.At next step S1007, whether the output signal of examining the first test signal output block 24 is identical with described test signal, to carry out branch's examination.If the examination result at S1007 is Y, step advances to S1008 so, and wherein the surplus of the interface between first output circuit 15 of first input circuit 14 of definite IC-1 11 and IC-2 12 is enough.On the other hand, if the result is N, step advances to S1009 so, and wherein the surplus of the interface between first output circuit 15 of first input circuit 14 of definite IC-1 11 and IC-2 12 is inadequate.
Incidentally, step S1002 and step S1005 can exchange each other.By monitoring the output signal of the first test signal output block 24, can guarantee that voltage replaces with the threshold value that other variable voltage detects cmos circuit 21 minimum and maximum.
With the electronic circuit of on circuit board, installing that is described with reference to Figure 10 according to the 5th embodiment.
Except first output circuit 15 of IC-2 12 has the analogue amplifier 111, be identical structurally with circuit according to the 3rd embodiment according to the circuit of the 5th embodiment.
Can carry out according to aforesaid way the surplus test that this embodiment carries out.
To the electronic circuit of installing according to the 6th embodiment be described with reference to figure 11-15 on circuit board.
Except the cmos circuit 21 of first input circuit 14 of IC-1 11 has the delayed action, according to the circuit of the 5th embodiment is identical with circuit according to first embodiment structurally, threshold level 151 that wherein said delayed action is used to provide lower and higher threshold level 152.
It is following that what describe with reference to Figure 11 is the surplus test that the circuit according to the 6th embodiment is carried out.
At first, at S1201, connect first and second power supplys 13,18.Then, at S1202, the minimum that the voltage of first and second power supplys 13,18 is set to IC-1 11 respectively guarantees voltage V
1LGuarantee voltage V with the maximum of IC-2 12
2HAfter this, at S1203, the test signal that comprises Lo signal and follow-up Hi signal is applied to the first test signal input block 32 of first output circuit 15.This test signal is exported from the first test signal output block 31 as diagnostic signal, it is sent to the first test signal input block 25 via first wiring 19.After this, at S1204, whether the output signal of examining the first test signal output block 24 is identical with the test signal that is applied to the first test signal input block 32, to carry out branch's examination.As shown in figure 12, the examination of described branch is used for: though when the input threshold value 151 of CMOS be when hanging down because of the low voltage level of first power supply 13 and the Lo signal of test signal when being high because of the higher voltage level of second source 18, whether the level whether level of the Lo signal of audit test signal is lower than the Hi signal of the lower input threshold value 151 of CMOS and test signal is higher than higher input threshold value 152.If the examination result at S1204 is Y, step advances to S1205 so, and wherein the voltage of first power supply 13 is set to the minimum assurance voltage V of IC-1 11
1L, and the voltage of second source 18 is set to the minimum assurance voltage V of IC-2 12
2LAt next step S1206, test signal is applied to the first test signal input block 32.At next step S1207, whether the output signal of examining the first test signal output block 24 is identical with described test signal, to carry out branch's examination.As shown in figure 13, wherein carry out the examination of following branch: though when lower input threshold value 151 be when hanging down because of the lower voltage level of first power supply 13, whether the level of the Lo signal of audit test signal is lower than lower input threshold value 151, even and when the Hi of test signal signal when being low because of the lower voltage level of second source 18, whether the level of the Hi signal of audit test signal is higher than higher input threshold value 152.
If the examination result at S1207 is Y, step advances to S1208 so, and wherein the voltage of first and second power supplys 13,18 is set to the maximum assurance voltage V of IC-1 11 respectively
1HGuarantee voltage V with the minimum of IC-2
2LAfter this, at S1209, test signal is applied to the first test signal input block 32 of first output circuit 15.After this, at S1210, whether the output signal of examining the first test signal output block 24 is identical with described test signal, to carry out branch's examination.As shown in figure 14, the examination of described branch is used for: though when the higher input threshold value 152 of CMOS when being high because of the higher voltage level of first power supply 13 and the Hi signal of test signal be when hanging down because of the lower voltage level of second source 18, whether the level whether level of the Lo signal of audit test signal is lower than the Hi signal of the lower input threshold value 151 of CMOS and test signal is higher than higher input threshold value 152.
If the examination result at S1210 is Y, step advances to S1211 so, and wherein the voltage of first power supply 13 is set to the minimum assurance voltage V of IC-1 11
1H, and the voltage of second source 18 is set to the maximum assurance voltage V of IC-2 12
2HAt next step S1212, test signal is applied to the first test signal input block 32.At next step S1213, whether the output signal of examining the first test signal output block 24 is identical with described test signal, to carry out branch's examination.As shown in figure 15, the examination of described branch is used for: even when the higher input threshold value 152 of CMOS when being high because of the higher voltage level of first power supply 13 and the Lo signal of test signal when being high because of the higher voltage level of second source 18, whether the level of the Lo signal of audit test signal is lower than the lower input threshold value 151 of CMOS and whether the Hi signal of test signal is higher than higher input threshold value 152.If examination result is Y, step advances to S1214 so, determines that wherein the surplus of the interface between IC-1 11 and the IC-2 12 is enough.If the result at S1202, S1204, S1207, S1210 and S1213 is N, step advances to S1215 so, determines that wherein the surplus of the interface between IC-1 11 and the IC-2 12 is inadequate.
Incidentally, the order that voltage is set in step S1202, S1205, S1208, S1211 can change each other, and by the voltage of the monitoring first test signal output block 24, can be guaranteeing that voltage replaces with variable voltage level, to detect the threshold value of cmos circuit 21.
Will be referring to figs. 16 and 17 the electronic circuit of describing according to the 7th embodiment of on circuit board, installing.
Except that first power supply 13, first input circuit and second output circuit 16, IC circuit-1 11 according to the 7th embodiment also comprises the 3rd input circuit 121 and the 4th input circuit 123, and except first output circuit 15, second input circuit 17 and second source 18, IC-2 12 also comprises the 3rd output circuit 122 and the 4th output circuit 124.First input circuit 14 is connected by first wiring with first output circuit 15, second output circuit 16 is connected by second wiring with second input circuit 17, the 3rd input circuit 121 is connected by the 3rd wiring 137 with the 3rd output circuit 122, and the 4th input circuit 123 is connected by the 4th wiring 138 with the 4th output circuit 124.
As mentioned above, be connected to first wiring, 19 first input circuit 14 and comprise the first test signal output block 24 and the first test signal input block 25.First output circuit 15 that is connected to first wiring 19 comprises the first test signal output block 31 and the first test signal input block 32.In addition, second input circuit 16 comprises test signal input block 125 and test signal output block 126.Second output circuit 17 comprises test signal output block 128 and test signal input block 127.The 3rd input circuit 121 comprises test signal output block 129 and test signal input block 130.The 3rd output circuit 122 comprises test signal output block 132 and test signal input block 131.The 4th input circuit 123 comprises test signal output block 133 and test signal input block 134.The 4th output circuit 124 comprises test signal output block 136 and test signal input block 135.The test signal input block 25 of first input circuit 14 links to each other with the test signal input block 32 of first output circuit 15 by wiring 19.The test signal output block 126 of second output circuit 16 links to each other with the test signal input block 127 of second input circuit by wiring 20.The test signal input block 130 of the 3rd input circuit 121 links to each other with the test signal output block 131 of the 3rd output circuit by wiring 137.The test signal input block 134 of the 4th input circuit links to each other with test signal output block 135 by wiring 138.
Following the surplus test that circuit according to the 7th embodiment is carried out described with reference to Figure 17.
At first, at S 1801, connect first and second power supplys 13,18.Then, at S1802, the minimum that the voltage of first and second power supplys 13,18 is set to IC-1 11 respectively guarantees voltage V
1LGuarantee voltage V with the minimum of IC-2
2LAfter this, at S1803, the test signal that comprises Lo signal and follow-up Hi signal is applied to the test signal input block 31 of first output circuit 15, the test signal input block 125 of second output circuit 16, the test signal input block 132 of the 3rd output circuit 122 and the test signal input block 136 of the 4th output circuit 124.Then, at S1804, locate the control and measuring signal at the test signal output block 24 of first input circuit 14, the test signal output block 128 of second input circuit 17, the test signal output block 129 of the 3rd input circuit 121 and 133 of the test signal efferents of the 4th input circuit 123.That is to say whether all output signals of audit test signal output component 24,128,129,133 are identical with the test signal that is applied to test signal input block 31,125,132,136.
If the examination result at S1804 is Y, step advances to S1805 so, and wherein the voltage of first power supply 13 is set to the minimum assurance voltage V of IC-1 11
1L, and the voltage of second source 18 is set to the maximum assurance voltage V of IC-2 12
2HAt next step S1806, test signal is applied to four test signal input blocks 31,125,132,136.At next step S1807, whether the output signal of examining four test signal output blocks 24,125,132,136 is identical with described test signal, to carry out branch's examination.
If the examination result at S1807 is Y, step advances to S1808 so, and wherein the voltage of first and second power supplys 13,18 is set to the maximum assurance voltage V of IC-1 11 respectively
1HGuarantee voltage V with the minimum of IC-2
2LAfter this, at S1809, test signal is applied to four test signal input blocks 24,128,129,133.After this, at S1810, whether the output signal of examining four test signal output blocks 31,125,132,136 is identical with described test signal, to carry out branch's examination.
If the examination result at S1810 is Y, step advances to S1811 so, and wherein the voltage of first power supply 13 is set to the maximum assurance voltage V of IC-1 11
1H, and the voltage of second source 18 is set to the maximum assurance voltage V of IC-2 12
2HAt next step S1812, test signal is applied to four test signal input blocks 24,123,129,133.At next step S1813, whether the output signal of examining four test signal output blocks 24,128,129,133 is identical with described test signal, to carry out branch's examination.
If examination result is Y, step advances to S1814 so, determines that wherein the surplus of the interface between 14,17,121,123 and four output circuits 15,16,122,124 of four input circuits is enough.If the result at S1804, S1807, S1810 and S1813 is N, step advances to S1815 so, determines that wherein the surplus of the interface between IC-1 11 and the IC-2 12 is inadequate.
Incidentally, the order that voltage is set in step S1802, S1805, S1808, S1811 can change each other, and by the voltage of the monitoring first test signal output block 24, can be guaranteeing that voltage replaces with variable voltage level, to detect the threshold value of cmos circuit 21.
Can come the output signal of test signal output block examine identical whether according to different modes with test signal.For example, can incorporate negative circuit into one of them of input and output circuit, when being the Lo signal with convenient test signal, the output signal of test event signal output block is the Hi signal, determines that so described surplus is enough.
Always do not need to change both voltage of first power supply 13 and second source 18.For example, if the voltage of first power supply 13 of the electronic circuit shown in Fig. 2 is changed, can examine poor in the threshold value of first input circuit 14 so.
Signal output component or signal input part can form by pad or terminal.
If is N (inequality) at step S404 to the examination result according to the electronic circuit of first embodiment, can determine so to be set to the minimum voltage V that guarantees when the voltage of first power supply 13
1LAnd the voltage of second source is set to the minimum voltage V that guarantees
2LThe time interface surplus be inadequate.
In previous description of the present invention, with reference to its certain embodiments the present invention is disclosed.Yet, without departing from the present invention, obviously can make various modifications and change to specific embodiment of the present invention, scope of the present invention is limited by appended claims.
Claims (7)
1, a kind of method that is used to check electronic circuit, described electronic circuit is included in circuit board (10) and goes up first integrated circuit (11) and second integrated circuit (12) that forms, described first integrated circuit has first power supply (13), an input circuit (14) and a signal output component (24), and described second integrated circuit has second source (18), an output circuit (15) and a signal input part (32), and described method comprises the steps:
Change the voltage level of described first power supply (13);
Test signal is applied to described signal input part (32);
Detect the output signal of described signal output component (24); And
Examine in described electronic circuit, whether there are enough surpluses by more described test signal and described output signal.
2, inspection method as claimed in claim 1 also is included in described test signal is applied to the step that described signal input part (32) changes the voltage level of described second source (18) before.
3, inspection method as claimed in claim 1 or 2, wherein, described voltage level changes in maximum guarantees voltage and the minimum scope that guarantees between the voltage.
4, inspection method as claimed in claim 3, if described first and the voltage level of described second source be set at described minimum the assurance in voltage and the described maximum scope that guarantees between the voltage, if the comparative result of described test signal and described output signal in the scope of prevalue, so just can determine that described surplus is enough.
5, a kind of method that is used to check electronic circuit, described electronic circuit is included in circuit board (10) and goes up first integrated circuit (11) and second integrated circuit (12) that forms, described first integrated circuit has first power supply (13), an input circuit (14) and a signal output component (24), and described second integrated circuit has second source (18), an output circuit (15) and a signal input part (32), and described method comprises the steps:
Connect described first and described second source (13,18);
Described first and the voltage level of described second source (13,18) be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with maximum
2H
Test signal is applied to described signal input part (32);
Detect the output signal of described signal output component (24);
Whether examine described test signal identical with described output signal; And
If described test signal and described output signal are inequality, determine not exist enough surpluses so.
6, inspection method as claimed in claim 5 also comprises the steps: after review step
Described first and the voltage level of described second source (13) be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with minimum
2L
Test signal is applied to described signal input part (32);
Detect the output signal of described signal output component (24);
Whether examine described test signal identical with described output signal; And
If described test signal is identical with described output signal, determine to exist enough surpluses so.
7, a kind of method that is used to check electronic circuit, described electronic circuit is included in circuit board (10) and goes up first integrated circuit (11) and second integrated circuit (12) that forms, described first integrated circuit has first power supply (13), a plurality of input circuit (14,121,123) and signal output component (24,129,133), and described second integrated circuit has second source (18), a plurality of output circuit (15,122,124) and signal input part (32,131,135), described method comprises the steps:
Connect described first and described second source (13,18);
Described first and the voltage level of described second source (13,18) be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with minimum
2L
Test signal is applied to described signal input part (32,131,135);
Detect the output signal of described signal output component (24,129,133);
Whether examine described test signal identical with described output signal;
If described test signal and described output signal are inequality, determine not exist enough surpluses so;
Described first and the voltage level of described second source (13,18) be set to the minimum voltage V that guarantees respectively
1LGuarantee voltage V with maximum
2H
Test signal is applied to described signal input part (32,131,135);
Detect the output signal of described signal output component (24,129,133);
Whether examine described test signal identical with described output signal; And
If described test signal and described output signal are inequality, determine not exist enough surpluses so;
Described first and the voltage level of described second source (13,18) be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with minimum
2L
Test signal is applied to described signal input part (32,131,135);
Detect the output signal of described signal output component (24,129,133);
Whether examine described test signal identical with described output signal; And
If described test signal and described output signal are inequality, determine not exist enough surpluses so;
Described first and the voltage level of described second source (13,18) be set to the maximum voltage V that guarantees respectively
1HGuarantee voltage V with maximum
2H
Test signal is applied to described signal input part (32,131,135);
Detect the output signal of described signal output component (24,129,133);
Whether examine described test signal identical with described output signal; And
If described test signal and described output signal are inequality, determine so not have enough surpluses, if perhaps described test signal is identical with described output signal, determine to exist enough surpluses so.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP153838/2005 | 2005-05-26 | ||
| JP2005153838A JP2006329814A (en) | 2005-05-26 | 2005-05-26 | Method for inspecting circuit mounted onto board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1869724A true CN1869724A (en) | 2006-11-29 |
| CN100526899C CN100526899C (en) | 2009-08-12 |
Family
ID=37387916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100899183A Expired - Fee Related CN100526899C (en) | 2005-05-26 | 2006-05-26 | Method of inspecting electronic circuit |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7728601B2 (en) |
| JP (1) | JP2006329814A (en) |
| CN (1) | CN100526899C (en) |
| DE (1) | DE102006024721A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957428A (en) * | 2010-08-25 | 2011-01-26 | 京信通信系统（中国）有限公司 | Automatic test method and tool of monitoring circuit board |
| CN102759700A (en) * | 2011-04-27 | 2012-10-31 | 海力士半导体有限公司 | Test circuit and method of semiconductor integrated circuit |
| CN105067988A (en) * | 2015-07-02 | 2015-11-18 | 开曼群岛威睿电通股份有限公司 | Integrated circuit and integrated circuit testing device and method |
| US9322868B2 (en) | 2011-04-27 | 2016-04-26 | SK Hynix Inc. | Test circuit and method of semiconductor integrated circuit |
| CN106163133A (en) * | 2016-08-23 | 2016-11-23 | 黄河科技学院 | There is the multifunctional comprehensive circuit debugging system of circuit welding function |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012026950A (en) * | 2010-07-27 | 2012-02-09 | Sony Corp | Integrated semiconductor device |
| US9841457B1 (en) * | 2016-11-01 | 2017-12-12 | Nhk Spring Co., Ltd. | Pseudo flexure for disk drive and method of testing electronic circuit for disk drive |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853775A (en) * | 1981-09-26 | 1983-03-30 | Fujitsu Ltd | Testing of ic memory |
| US5283762A (en) * | 1990-05-09 | 1994-02-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device containing voltage converting circuit and operating method thereof |
| JPH0572280A (en) | 1991-09-13 | 1993-03-23 | Fujitsu Ltd | Testing method for chip onboard unit |
| JPH0572260A (en) | 1991-09-17 | 1993-03-23 | Fuji Xerox Co Ltd | Measuring method of static current consumption for semiconductor integrated circuit |
| JP2769653B2 (en) * | 1991-11-06 | 1998-06-25 | 三菱電機株式会社 | Inverting circuit |
| US5457695A (en) * | 1992-02-27 | 1995-10-10 | Texas Instruments Incorporated | Method and system for screening logic circuits |
| US5764580A (en) * | 1995-08-18 | 1998-06-09 | Hitachi, Ltd. | Semiconductor integrated circuit |
| JPH11328238A (en) * | 1998-05-12 | 1999-11-30 | Toshiba Corp | Evaluation device and method for multi-power integrated circuit |
| KR100295055B1 (en) * | 1998-09-25 | 2001-07-12 | 윤종용 | Semiconductor memory device having internal voltage converter whose voltage is variable |
| JP2003207543A (en) * | 2002-01-10 | 2003-07-25 | Hitachi Ltd | Semiconductor device and test method |
| JP3759069B2 (en) * | 2002-05-14 | 2006-03-22 | Ｎｅｃマイクロシステム株式会社 | Internal voltage control circuit |
| JP2003345845A (en) * | 2002-05-22 | 2003-12-05 | Mitsubishi Electric Corp | Automatic arranging and wiring apparatus |
| US7047471B2 (en) * | 2003-03-03 | 2006-05-16 | Hewlett-Packard Development Company, L.P. | Voltage margin testing of bladed servers |
| TWI258768B (en) * | 2004-03-10 | 2006-07-21 | Samsung Electronics Co Ltd | Sense amplifier and method for generating variable reference level |
-
2005
- 2005-05-26 JP JP2005153838A patent/JP2006329814A/en active Pending
-
2006
- 2006-05-25 US US11/439,970 patent/US7728601B2/en not_active Expired - Fee Related
- 2006-05-26 CN CNB2006100899183A patent/CN100526899C/en not_active Expired - Fee Related
- 2006-05-26 DE DE102006024721A patent/DE102006024721A1/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957428A (en) * | 2010-08-25 | 2011-01-26 | 京信通信系统（中国）有限公司 | Automatic test method and tool of monitoring circuit board |
| CN102759700A (en) * | 2011-04-27 | 2012-10-31 | 海力士半导体有限公司 | Test circuit and method of semiconductor integrated circuit |
| US9322868B2 (en) | 2011-04-27 | 2016-04-26 | SK Hynix Inc. | Test circuit and method of semiconductor integrated circuit |
| CN102759700B (en) * | 2011-04-27 | 2016-09-21 | 海力士半导体有限公司 | The test circuit of semiconductor integrated circuit and method of testing |
| CN105067988A (en) * | 2015-07-02 | 2015-11-18 | 开曼群岛威睿电通股份有限公司 | Integrated circuit and integrated circuit testing device and method |
| CN105067988B (en) * | 2015-07-02 | 2018-03-30 | 英特尔公司 | Integrated circuit, arrangement for testing integrated circuit and method |
| CN106163133A (en) * | 2016-08-23 | 2016-11-23 | 黄河科技学院 | There is the multifunctional comprehensive circuit debugging system of circuit welding function |
| CN106163133B (en) * | 2016-08-23 | 2018-09-04 | 黄河科技学院 | Multifunctional comprehensive circuit debugging system with circuit welding function |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006329814A (en) | 2006-12-07 |
| US7728601B2 (en) | 2010-06-01 |
| CN100526899C (en) | 2009-08-12 |
| DE102006024721A1 (en) | 2006-11-30 |
| US20060270069A1 (en) | 2006-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1869724A (en) | Method of inspecting electronic circuit | |
| CN101038325A (en) | Method and device for testing chip | |
| CN101303708B (en) | Method and apparatus for encoding code for multiplexing chip pins | |
| CN101065681A (en) | Interface apparatus for semiconductor device tester | |
| CN100337212C (en) | Logic verification system and method | |
| CN1248001C (en) | Low-cost configuration for monitoring and controlling parametric measurement units in automatic test equipment | |
| CN1471640A (en) | Method for testing a testable electronic device | |
| CN1632605A (en) | Chip pin open circuit and short circuit tester and method therefor | |
| CN1243307C (en) | Method and equipment for detecting single plate by JTAG | |
| CN1588104A (en) | MOS device hot carrier injection effect measuring method | |
| CN1523672A (en) | Semiconductor integrated circuit device | |
| CN1222909C (en) | Loading method of Flash chip and JTAG controller | |
| CN118349401A (en) | Test equipment, test method and test system | |
| CN1248002C (en) | Automatic test equipment using sigma delta modulation to create reference levels | |
| CN1191370A (en) | Semiconductor memory | |
| CN113434346B (en) | Automatic detection method and system for differential signal polarity connection | |
| CN1110095C (en) | Semiconductor device and internal function identification method of semiconductor device | |
| KR100974669B1 (en) | A built off self test circuit system or a pattern generating system that have look up table and a method for outputting test data for device under test using the system | |
| CN1559086A (en) | Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system | |
| CN1649129A (en) | Automatic placement and routing device, method for placement and routing of semiconductor device, semiconductor device and manufacturing method of the same | |
| CN1118006C (en) | Voltage Measuring circuit | |
| US20010003209A1 (en) | Efficient generation of optimum test data | |
| CN112098802B (en) | Welding spot intermittent fault diagnosis method based on wavelet time-frequency entropy energy sequence | |
| CN100340864C (en) | Apparatus and method for testing circuit board | |
| CN1548974A (en) | Super large scale integrated circuit testing channel compression method and circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20110526 |