CN1702531A - Liquid crystal display device and fabricating method thereof - Google Patents
Liquid crystal display device and fabricating method thereof Download PDFInfo
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- CN1702531A CN1702531A CNA2005100722831A CN200510072283A CN1702531A CN 1702531 A CN1702531 A CN 1702531A CN A2005100722831 A CNA2005100722831 A CN A2005100722831A CN 200510072283 A CN200510072283 A CN 200510072283A CN 1702531 A CN1702531 A CN 1702531A
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- 239000010408 film Substances 0.000 claims abstract description 135
- 239000010409 thin film Substances 0.000 claims abstract description 65
- 238000003860 storage Methods 0.000 claims abstract description 47
- 230000008569 process Effects 0.000 claims abstract description 44
- 239000003990 capacitor Substances 0.000 claims abstract description 22
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
A thin film transistor substrate and a fabricating method simplify a process and enlarge a capacitance value of a storage capacitor without any reduction of aperture ratio. A transparent first conductive layer and an opaque second conductive layer of a double-layer structured gate line are formed having a step coverage. A pixel electrode is provided on the gate insulating film within a pixel hole of said pixel area passing through the passivation film to be connected to the thin film transistor. A storage capacitor overlaps with the pixel electrode with having the gate insulating film therebetween and has a lower storage electrode protruded from the first conductive layer.
Description
The application requires the right of priority of the Korean Patent Application No. P2004-37771 that submits in Korea S on May 27th, 2004, and in conjunction with as a reference, all purposes are considered as in this formal proposition this application at this.
Technical field
The present invention relates to a kind of liquid crystal display device, more specifically, relate to a kind of for the thin film transistor base plate of thin film transistor (TFT) and the manufacture method of simplification thereof.
Background technology
Usually, liquid crystal display (LCD) thus device is controlled the light transmission display image of liquid crystal by regulating electric field.For this purpose, LCD comprises LCD panel with liquid crystal cells of arranging with matrix type and the driving circuit that is used to drive LCD panel.
LCD panel comprises thin film transistor base plate respect to one another and colour filtering chip basic board, is infused in the liquid crystal between the two substrates and keeps the wadding in the box gap between the two substrates.
Thin film transistor base plate comprises: grid line, data line, be formed on the thin film transistor (TFT) as switching device of each infall of grid line and data line, formed and be connected to the pixel electrode of thin film transistor (TFT) and oriented film for each liquid crystal cells.Grid line and data line are by the signal of each pad portion reception from driving circuit.The picture element signal that the sweep signal that thin film transistor (TFT) response offers grid line will offer data line is applied to pixel electrode.
Colour filtering chip basic board is included as color filter that each liquid crystal cells forms, be used to divide color filter and reflect exterior light black matrix, be generally used for reference voltage is applied to the public electrode of liquid crystal cells and the oriented film that forms.
By preparing membrane array substrate and colour filtering chip basic board respectively, they are connected, between them, inject liquid crystal then and seal this plate and finish LCD panel.
In this liquid crystal display device, because thin film transistor base plate comprises repeatedly mask process of semiconductor machining operation and needs, so thin film transistor base plate has the manufacturing process of the complexity that increases the LCD panel manufacturing cost.In order to address this problem, developed a kind of thin film transistor base plate that can reduce the quantity of mask process.This is because a mask process can comprise a plurality of sub-operations such as thin film deposition, cleaning, photoetching, etching, photoresist lift off and inspection process etc.Recently, the most outstanding is a kind ofly to have eliminated a four-wheel (four-round) of taking turns mask process the mask process from already present the wheel as five of thin film transistor (TFT) standard mask operation.
Fig. 1 is the planimetric map of the thin film transistor base plate that adopts the four-wheel mask process, and Fig. 2 is the sectional view of the thin film transistor base plate that obtains along I-I ' line among the figure.
With reference to figure 1 and Fig. 2, thin film transistor base plate comprises: the grid line 2 and the data line 4 that are arranged on the infrabasal plate 42 and intersect each other have gate insulating film 44 therebetween; Be arranged on the thin film transistor (TFT) 6 of each infall and be arranged on the pixel electrode 18 at unit area place with decussate texture.In addition, thin film transistor base plate comprises the holding capacitor 20 that is arranged on the lap place between pixel electrode 18 and prime (pre-stage) grid line 2, is connected to the grid pad 26 of grid line 2 and is connected to the data pads 34 of data line 4.
The sweep signal that thin film transistor (TFT) 6 responses are applied to grid line 2 makes the picture element signal that is applied to data line 4 charge in the pixel electrode 18 and maintenance.For this reason, thin film transistor (TFT) 6 comprises the grid 8 that is connected to grid line 2, is connected to the source electrode 10 of data line 4, is connected to the drain electrode 12 of pixel electrode 18, and and grid 8 is overlapping and limit the active layer 14 of the source electrode 10 and the raceway groove between 12 that drains.
And source electrode 10 and drain 12 overlapping and at source electrode 10 and drain have channel part between 12 active layer 14 also with data line 4, down data pads electrode 36 and last storage electrode 22 are overlapping.On active layer 14, further be provided with the ohmic contact layer 48 that forms Ohmic contact with data line 4, source electrode 10, drain electrode 12, following data pads electrode 36 and last storage electrode 22.
Data line 4 is connected to the data driver (not shown) by data pads 34.Data pads 34 is made of following element: from data line 4 extended data pads electrode 36 and last data pads electrodes 40 down, it is connected to down data pads electrode 36 by the 4th contact hole 38 that runs through passivating film 50.
Below, will describe in detail and adopt the manufacturing of four-wheel mask process to have the method for the thin film transistor base plate of said structure with reference to figure 3A to 3D.
With reference to figure 3A,, the gate metallic pattern that comprises grid line 2, grid 8 and following grid pad electrode 28 is set on infrabasal plate 42 by first mask process.
More particularly, by deposition technique, on infrabasal plate 42, form gate metal layer such as sputter.Then, photoetching and etching procedure by utilizing first mask carry out composition to gate metal layer, form the gate metallic pattern that comprises grid line 2, grid 8 and following grid pad electrode 28 thus.Gate metal layer has individual layer or the double-decker that is made of chromium (Cr), molybdenum (Mo) or aluminum metal etc.
With reference to figure 3B, coating gate insulating film 44 on infrabasal plate 42 with gate metallic pattern.In addition, by second mask process, order setting comprises the semiconductor pattern and the source/drain metal pattern that comprises data line 4, source electrode 10, drain electrode 12, following data pads electrode 36 and last storage electrode 22 of active layer 14 and ohmic contact layer 48 on gate insulating film 44.
More particularly, by as deposition techniques such as plasma enhanced chemical vapor deposition (PECVD) and sputters, gate insulating film 44, amorphous silicon layer, n are set in proper order on the infrabasal plate 42 with gate metallic pattern
+Amorphous silicon layer and source/drain metal layer.Here, gate insulating film 44 is by inorganic insulating material such as silicon nitride (SiO
x) or monox (SiO
x) constitute.Source/drain metal is selected from molybdenum (Mo) or molybdenum alloy etc.
Then, utilize second mask, on the source/drain metal layer, form the photoresist pattern by photoetching.In this case, the diffraction exposed mask with diffraction exposed portion of the groove office that is positioned at thin film transistor (TFT) is used as second mask, allows the photoresist pattern of channel part to have the height lower than other source/drain pattern parts thus.
Subsequently, utilize the photoresist pattern, the source/drain metal layer is carried out composition, the drain electrode 12 that comprises data line 4, source electrode 10, fuse with source electrode 10 and the source/drain metal pattern of last storage electrode 22 are provided thus by the wet operation of carving.
Then, utilize identical photoresist pattern, carve operation to n by doing
+Amorphous silicon layer and amorphous silicon layer carry out composition simultaneously, and ohmic contact layer 48 and active layer 14 are provided thus.
By the ashing operation, remove photoresist pattern from channel part with low relatively height, thereby by doing the ohmic contact layer 48 of carving operation etching source/drain metal pattern and channel part.Thereby, expose the active layer 14 of channel part so that source electrode 10 disconnects with drain electrode 12 is connected.
Then, by stripping process, remove remaining photoresist pattern on the source/drain metal pattern groups.
With reference to figure 3C, on gate insulating film 44, form the passivating film 50 that comprises first to the 4th contact hole 16,24,30 and 38 with source/drain metal pattern.
More particularly, by deposition technique whole formation passivating film 50 on gate insulating film 44 with source/drain metal pattern as plasma enhanced chemical vapor deposition (PECVD).Then, utilize the 3rd mask, passivating film 50 is carried out composition, thereby limit first to the 4th contact hole 16,24,30 and 38 by photoetching and etching procedure.Form first contact hole 16 to run through passivating film 50 and to expose drain electrode 12 mode, and form second contact hole 24 in the mode that runs through passivating film 50 and expose storage electrode 22.The mode of grid pad electrode 28 forms the 3rd contact hole 30 to run through passivating film 50 and gate insulating film 44 and to expose down.Form the 4th contact hole 38 in the mode that runs through passivating film 50 and expose data pads electrode 36.
Passivating film 50 is made of the inorganic insulating material identical with gate insulating film 44, or by acrylic acid organic compound, BCB (benzocyclobutene) or the PFCB formations such as (Freon C318s) of organic insulation as having little specific inductive capacity.
With reference to figure 3D, by the 4th mask process, be provided with on the passivating film 50 comprise pixel electrode 18, on the electrically conducting transparent film figure of grid pad electrode 32 and last data pads electrode 40.
By such as deposition techniques such as sputter deposition of transparent conductive film on whole passivating film 50.Then, utilize the 4th mask, nesa coating is carried out composition, thereby the electrically conducting transparent film figure that comprises pixel electrode 18, goes up grid pad electrode 32 and last data pads electrode 40 is provided by photoetching and etching procedure.Pixel electrode 18 is electrically connected to drain electrode 12 by first contact hole 16, is electrically connected to the last storage electrode 22 overlapping with preceding wire grid lines 2 by second contact hole 24 simultaneously.Last grid pad electrode 32 is electrically connected to down grid pad electrode 28 by the 3rd contact hole 30.Last data pads electrode 40 is electrically connected to down data pads electrode 36 by the 4th contact hole 38.Here, nesa coating is by tin indium oxide formations such as (ITO).
As mentioned above, the thin film transistor base plate of prior art and manufacture method thereof adopt the four-wheel mask process, have reduced the quantity of operation thus, have therefore reduced and the proportional manufacturing cost of the minimizing of operation quantity.Yet because the four-wheel mask process still has complicated manufacturing process, it has limited any minimizing on the cost, therefore needs manufacture method and the thin film transistor base plate that therefore further reduces manufacturing cost and its manufacture method that can further simplify.
In addition, in the prior art thin film transistor base plate,,, therefore comprise that the semiconductor layer of active layer 14 and ohmic contact layer 48 is arranged on the below of storage electrode 22 because last storage electrode 22 is made of source/drain metal for second mask process.Because this semiconductor layer, last storage electrode 22 is relative far away with grid line 2 mutual distances as storage electrode down, thereby reduces the electric capacity of holding capacitor 20, its with apart from being inversely proportional to.For this reason, holding capacitor 20 can not stably keep charging into the picture element signal in the pixel electrode 18.
In addition, in the prior art thin film transistor base plate, the upper and lower electrode of holding capacitor 20 is made of opaque source/drain metal and gate metal respectively.Thereby this problem that causes is when enlarging the overlapping region of going up between storage electrode 22 and the grid line 2 so that increasing the electric capacity of holding capacitor 20, and the aperture of pixel electrode 18 is than also reducing respective degrees.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of thin film transistor base plate and its manufacture method, it is suitable for the electric capacity of simplifying working process and enlarging holding capacitor, and does not need to reduce the aperture ratio.
In order to realize these and other purposes of the present invention, comprise according to the liquid crystal display device of embodiment of the present invention: double-deck grid line, described bilayer have first transparency conducting layer and second opaque conductive layer and have the step coating; Intersect to limit the data line of pixel region with grid line; Gate insulating film between grid line and data line; Be connected to the thin film transistor (TFT) of grid line and data line; Limit the raceway groove of thin film transistor (TFT) and the semiconductor layer overlapping with data line; The passivating film of cover data line and thin film transistor (TFT); Pixel electrode on the gate insulating film in running through the pixel region pixel aperture of passivating film; Holding capacitor with overlapping with pixel electrode has gate insulating film therebetween, and described holding capacitor has from the extended storage electrode down of first transparency conducting layer.
This display device further comprises: the grid pad, it comprise have double-decker and be connected to the following grid pad electrode of grid line and in the contact hole that runs through gate insulating film and passivating film on the grid pad electrode.
This display device further comprises: data pads, it comprise the following data pads electrode that is connected to data line and in running through the contact hole of passivating film on the data pads electrode, wherein semiconductor layer is overlapping with following data pads electrode.
Pixel electrode laterally is connected to drain electrode basically by pixel aperture.
Last data pads electrode by the contact hole substantial lateral be connected to down the data pads electrode.
Grid is connected to grid line.
Manufacture method according to a kind of liquid crystal display device of embodiment of the present invention comprises: utilize first mask to form grid line and grid that comprises the bilayer with transparency conducting layer and the gate pattern that comprises the following storage electrode with transparency conducting layer on substrate; Form the gate insulating film of cover gate pattern, and utilize second mask on gate insulating film, to form semiconductor layer and source; With utilize the 3rd mask to form to have form on the passivating film of pixel aperture and the gate insulating film in pixel aperture be connected to drain electrode and with the overlapping pixel electrode of following storage electrode.
First mask comprises first shadow tone (half-tone) mask.
Second mask comprises the diffraction exposed mask.
The 3rd mask comprises second half-tone mask.
The step that forms grid line and grid comprises: form first conductive layer and second conductive layer as transparency conducting layer on substrate; Utilize first mask, on second conductive layer, form the first photoresist pattern and the second photoresist pattern by photoetching with different-thickness; Form grid line, grid and following storage electrode by adopting the first photoresist pattern and the second photoresist pattern first conductive layer and second conductive layer to be carried out composition by etching; Utilize the first photoresist pattern, second conductive layer under removing by etching on the storage electrode; With the removal first photoresist pattern.
Utilize etching, second conductive layer is retained in down on the storage electrode.
This method further comprises: after forming grid line, grid and following storage electrode, utilize ashing to make the first photoresist pattern attenuation and remove the second photoresist pattern.
Data line and semiconductor layer are overlapping.
Following storage electrode extends from first conductive layer of grid line.
The step that forms grid line and grid comprises that further formation is connected to the following grid pad electrode of grid line, and the step that forms passivating film further comprises: the grid pad electrode forms the contact hole that runs through passivating film and gate insulating film by exposing down, and in contact hole, form be connected to grid pad electrode down on the grid pad electrode.
Following grid pad electrode comprises bilayer.
The step that forms gate insulating film further comprises: form the following data pads electrode that is connected to data line, and the step that forms passivating film comprises further: form run through second contact hole of passivating film and in second contact hole, be connected to data pads electrode down on the data pads electrode.
The step that forms passivating film comprises: form passivating film in source electrode and drain electrode; Utilize second mask, on passivating film, form the first photoresist pattern and the second photoresist pattern by photoetching with different-thickness; Utilize the first photoresist pattern and the second photoresist pattern, form first contact hole by etching; Utilize the first photoresist pattern, form the pixel aperture and second contact hole by etching; On the first photoresist pattern, form transparency conducting layer; Peel off (lift-off) with utilization by removing first photoresist pattern and the transparency conducting layer, form the transparent conductive patterns that has pixel electrode, goes up grid pad electrode and last data pads electrode.
This method further comprises by ashing to be made the first photoresist pattern attenuation and remove the second photoresist pattern after forming first contact hole.
The step that forms the pixel aperture and second contact hole comprises the expose portion that forms drain electrode and following data pads electrode.
Pixel electrode laterally is connected to drain electrode basically.
Last data pads electrode laterally is connected to down the data pads electrode basically.
The step that forms the pixel aperture and second contact hole comprises that etching is positioned at the semiconductor layer of below of the expose portion of drain electrode and following data pads electrode.
The step that forms the pixel aperture and second contact hole comprises that over etching (over-etching) passivating film makes the edge of the photoresist pattern of winning more outstanding than the edge of passivating film.
First conductive layer and second conductive layer have successively the step coating of (constant).
Description of drawings
These and other purposes of the present invention will be from the appended accompanying drawing of hereinafter with reference to apparent the detailed description of embodiment of the present invention, wherein:
Figure 1 shows that the planimetric map of the part of prior art thin film transistor base plate;
Figure 2 shows that in Fig. 1 the sectional view of the thin film transistor base plate that obtains along I-I ' line;
Fig. 3 A to 3D is depicted as the sectional view of manufacturing method of film transistor base plate shown in Figure 2;
Figure 4 shows that planimetric map according to the part thin film transistor base plate of embodiment of the present invention;
Figure 5 shows that in Fig. 4 the sectional view of the thin film transistor base plate that obtains along II-II ', III-III ' and IV-IV ' line;
Fig. 6 A and 6B are depicted as planimetric map and the sectional view according to first mask process of the thin film transistor base plate of embodiment of the present invention;
Fig. 7 A to 7E is depicted as the sectional view that is used for explaining in detail first mask process;
Fig. 8 A and 8B are depicted as planimetric map and the sectional view according to second mask process of the thin film transistor base plate of embodiment of the present invention;
Fig. 9 A to 9E is depicted as the sectional view that is used for explaining in detail second mask process;
Figure 10 A and 10B are depicted as planimetric map and the sectional view according to the 3rd mask process of the thin film transistor base plate of embodiment of the present invention;
Figure 11 A to 11E is depicted as the sectional view that is used for explaining in detail the 3rd mask process;
Figure 12 shows that planimetric map according to the part thin film transistor base plate of second embodiment of the invention; And
Figure 13 shows that in Figure 12 the sectional view of the thin film transistor base plate that obtains along II-II ', III-III ' and IV-IV ' line.
Embodiment
To describe embodiments of the present invention in detail now, these embodiment illustrate in appended accompanying drawing.
Below, will describe illustrated embodiment of the present invention in detail with reference to figure 4 to 13.
Fig. 4 is the planimetric map according to the part thin film transistor base plate of embodiment of the present invention, and Fig. 5 is the sectional view of the thin film transistor base plate that obtains along II-II ', III-III ' and IV-IV ' line in Fig. 4.
With reference to figure 4 and Fig. 5, thin film transistor base plate comprises: be arranged on grid line 102 and data line 104 on the infrabasal plate 142 in mode intersected with each other, have gate insulating film 144 therebetween; The thin film transistor (TFT) 106 of contiguous each infall; With the pixel electrode 118 that is arranged on the pixel region place that is limited by intersection.In addition, thin film transistor base plate comprises: be arranged on pixel electrode 118 and the following storage electrode 122 that stretches out from grid line 102 between the holding capacitor 120 of lap, be connected to the grid pad of grid line 102 and be connected to the data pads 134 of data line 104.
Thin film transistor (TFT) 106 responses are applied to the sweep signal of grid line 102, make the picture element signal that is applied to data line 104 charge in the pixel electrode 118 and maintenance.For this reason, thin film transistor (TFT) 106 comprises: the grid 108 that is connected to grid line 102; Be connected to the source electrode 110 of data line 104; Be oppositely arranged, be connected to the drain electrode 112 of pixel electrode 118 with source electrode 110; The active layer 116 overlapping with grid 108 has gate insulating film 144 therebetween, to limit source electrode 110 and the raceway groove between 112 of draining; With the ohmic contact layer 146 on the active layer 116 that is formed on except channel part, make source electrode 110 and drain electrode 112 Ohmic contact.
Here, grid line 102 and grid 108 have double-decker, wherein are provided with first conductive layer 101 that is made of transparency conducting layer and second conductive layer 103 that is made of metal level thereon.
In addition, comprise that the semiconductor pattern 148 of active layer 116 and ohmic contact layer 146 is also overlapping with data line 104.
Be provided with the pixel aperture 170 that runs through passivating film 150 by the pixel region that intersection limited between grid line 102 and the data line 104.Pixel electrode 118 is formed on the gate insulating film 144 in the pixel aperture 170 and with passivating film 150 has surface of contact.In addition, pixel electrode 118 is connected to the drain electrode 112 by being exposed by pixel aperture 170.The picture element signal that is provided by thin film transistor (TFT) 106 is provided this pixel electrode 118, thereby produces the electric potential difference with respect to the public electrode that is arranged on colour filtering chip basic board (not shown) place.Because dielectric anisotropy, this electric potential difference is rotatably provided in the liquid crystal between thin film transistor base plate and the colour filtering chip basic board, and control is from the amount of light source (not shown) by the light of pixel electrode 118 inputs, thus with described light transmission in colour filtering chip basic board.
It is feasible overlapping with pixel electrode 118 to the following storage electrode 122 that pixel region stretches out from first conductive layer 101 to form holding capacitor 120, has gate insulating film 144 therebetween.Therefore following storage electrode 122 is that transparency conducting layer constitutes by first conductive layer 101, can enlarge the overlapping region between it and the pixel region, and can not reduce the aperture ratio.Therefore, may increase the electric capacity of holding capacitor 120 and not reduce the aperture ratio.In addition, pixel electrode 118 and following storage electrode 122 overlap each other, and only have gate insulating film 144 therebetween, to reduce the distance between two electrodes 118 and 122, further increase the electric capacity of holding capacitor 120 thus.As a result, can more stably keep filling into signal in the pixel electrode 118.
As mentioned above, form following storage electrode 122 overlapping and that constitute by transparency conducting layer according to the thin film transistor base plate of embodiment of the present invention, so it can increase the electric capacity of holding capacitor 120 and can not reduce the aperture ratio with pixel electrode 118.Therefore, the live width of grid line 102 can reduce, and and the overlapping region between grid line 102 and the pixel electrode 118 irrelevant, the advantage that has thus is to realize high definition.
By the thin film transistor base plate with said structure of following three-wheel mask process formation according to embodiment of the present invention.
Fig. 6 A and 6B are respectively the planimetric map and the sectional view of explanation first mask process in according to the manufacturing method of film transistor base plate of embodiment of the present invention, and Fig. 7 A to Fig. 7 E is the sectional view that is used for explaining in detail first mask process.
By first mask process, on infrabasal plate 142, form the gate metallic pattern of the grid 108 that comprises grid line 102, is connected to grid 102, following grid pad electrode 128 and following storage electrode 122.Grid line 102, grid 108 and following grid pad electrode 128 adopt double-decker, first conductive layer 101 and second conductive layer 103 in this double-decker, have been constructed, and storage electrode 122 adopts single layer structure down, and first conductive layer 101 of grid line 102 extends in this single layer structure.Utilize half-tone mask 160, form gate pattern by the single mask operation with above-mentioned bilayer and single layer structure.
More particularly, shown in Fig. 7 A, by deposition technique such as sputter, structure first conductive layer 101 and second conductive layer 103 on infrabasal plate 142, and be formed with photoresist 167 on it.First conductive layer is by transparent conductive material such as tin indium oxide (ITO), tin oxide (TO), indium zinc oxide formations such as (IZO).Second conductive layer 103 is made of metal material such as Mo, Cu, Al, Ti, Cr, MoW or AlNd etc.
Further, on second conductive layer 103, the 3rd conductive layer can be set.In this case, first conductive layer is made of transparency conducting layer such as ITO, IZO, TO etc.; Second conductive layer is by formations such as metal level such as Mo, Ti, Cu, Al (Nd) groups; And the 3rd conductive layer is by formations such as metal level such as Cu, Al, Ti, Mo, Al (Nd) groups.In addition, the second and the 3rd conductive layer can be by above-mentioned group constitute.For example, they are by Mo/ITO, Al (Nd)/ITO, Cu/ITO, Cu/Ti/ITO, Cu/Mo/ITO, Cu/Mo/ITO, Cu/Mo+Ti/ITO, Al (Nd)/formations such as Mo/ITO.This means, for example when describing the Mo/ITO that exceeds bilayer, should at first form ITO, form Mo afterwards.
Next, shown in Fig. 7 B, utilize half-tone mask 160, by photoetching, photoresist 167 exposes under light and develops, thereby forms the photoresist pattern with step coating.
Half-tone mask 160 comprises suprasil (SiO
2) substrate 166 and the barrier bed 162 and the part photic zone 164 that form thereon.Here, barrier bed 162 is arranged on the location that will have a gate pattern cutting off ultraviolet ray (UV), thereby stays the first photoresist pattern 168A after development.Part transmission layer 164 be arranged on will have following storage electrode location with local transmission UV, thereby stay the second photoresist pattern 168B thinner than the first photoresist pattern.For this reason, barrier bed is by metal such as Cr, CrO
xEtc. formation, and part transmission layer 164 is by MoSi
xConstitute.
Subsequently, shown in Fig. 7 C, utilize photoresist pattern, by etching procedure first conductive layer 101 and second conductive layer 103 are carried out composition, thereby double-deck gate pattern is provided with step coating.
Then, shown in Fig. 7 D, utilize oxygen (O
2) plasma, by the ashing operation photoresist pattern 168 is carried out ashing, thereby make the thickness attenuation of the first photoresist pattern and remove the second photoresist pattern.In addition, utilize the first photoresist pattern 168 of ashing, second conductive layer 103 under removing by etching procedure on the storage electrode 122.Thereby following storage electrode 122 can only be made of first conductive layer 101, and not can with second conductive layer, 103 mis-alignments that are included in the grid line 102.At this moment, more etchings are carried out on edge every side of second conductive layer 103 of the ashing first photoresist pattern 168A composition once more, thereby make first conductive layer 101 of gate pattern and certain step coating that second conductive layer 103 has stepwise.Therefore, when the side of first conductive layer 101 and second conductive layer 103 has high steep slope, can prevent the damage state based of the source/drain metal layer that produces thereon.
Simultaneously, the etching procedure of first conductive layer 101 and second conductive layer 103 optionally uses wet the quarter or dried the quarter.For example, if the first and second all conductive layers 101 and 103 are etched, so, first conductive layer 101 shown in Fig. 7 C and the etching procedure of second conductive layer 103, the etching procedure of the ashing operation of photoresist pattern and second conductive layer 103 that has exposed carries out in identical chamber in succession, and therefore available advantage is that operation is simplified.
The etching procedure of second conductive layer 103 that has exposed in addition, can use wet the quarter.Another example for example, shown in Fig. 7 C, first conductive layer 101 and second conductive layer 103 can use wet the quarter, shown in Fig. 7 D, the ashing operation of second conductive layer 103 that has exposed and etching procedure can use to do and carve, and the etching procedure of second conductive layer 103 that has perhaps only exposed can use wet the quarter.In addition, second conductive layer 103 wets quarter, and first conductive layer 101 is done quarter, and perhaps second conductive layer 103 is done quarter, and first conductive layer 101 wets quarter; And the ashing operation of second conductive layer 103 that has exposed in view of the above and etching procedure use to do and carve, and the etching procedure of second conductive layer 103 that has perhaps only exposed uses wet the quarter.
Therefore, do when adopting high-definition mode that to carve be favourable, and when adopting high size pattern wet quarter be favourable.In addition, do when second conductive layer 103 is made of Mo that to carve be favourable, and when second conductive layer 103 is made of Cu or Al wet quarter be favourable.
Therefore, shown in Fig. 7 E, remove the photoresist pattern 168A that stays on the gate pattern by stripping process.
Fig. 8 A and 8B are respectively the planimetric map and the sectional view of explanation second mask process in the method for making thin film transistor base plate according to embodiment of the present invention, and Fig. 9 A to Fig. 9 D is the sectional view that is used for explaining in detail second mask process.
At first, on infrabasal plate 142, form gate insulating film 144 with gate pattern.In addition, form the active layer 116 that the source/drain pattern comprise data line 104, source electrode 110, drain electrode 112 and following data pads electrode 136 and comprising overlaps each other along the back side of source/drain pattern and the semiconductor pattern 148 of ohmic contact layer 146 thereon.Utilize the diffraction exposed mask, form semiconductor pattern 148 and source/drain pattern by the single mask operation.
More particularly, order forms gate insulating film 144 on the infrabasal plate 142 with gate pattern, amorphous silicon layer 115, and n has mixed
+Or p
+The amorphous silicon layer 145 of impurity and source/drain metal layer 105.For example, gate insulating film 144, the amorphous silicon of the amorphous silicon layer 115 and the impurity that mixed forms by PECVD, and source/drain metal layer 105 forms by sputter.Gate insulating film 144 is by inorganic insulating material such as silicon nitride (SiN
x) or monox (SiO
x) constitute, and source/drain metal layer 105 is formed by Cr, MoW, Cr/Al, Cu, Al (Nd), Mo/Al, Mo/Al (Nd) or Cr/Al (Nd) etc.For example, double-deck Al/Cr means should at first form Cr, forms Al afterwards.
Further, shown in Fig. 9 B, on source/drain metal layer 105, form photoresist 219, utilize diffraction exposed mask 210 then, expose and development photoresist 219 under light by photoetching, thereby the photoresist pattern 220 with step coating is provided.
Diffraction exposed mask 210 comprises transparent quartz substrate 212, by metal level such as Cr, CrO
xDeng the barrier bed and the diffraction exposure slit 216 that form.Barrier bed 214 is arranged on location with semiconductor pattern and source/drain pattern cutting off ultraviolet ray (UV), thereby stays the first photoresist pattern 220A after development.Diffraction exposure slit 216 is arranged on the location of the raceway groove with thin film transistor (TFT) with diffraction UV, stays the second photoresist pattern 220B thinner than the first photoresist pattern 220A thus.
Subsequently, shown in Fig. 9 C, utilize photoresist pattern 220, by etching procedure source/drain metal layer 105 is carried out composition, thereby source/drain pattern and semiconductor pattern 148 are provided below it with step coating.In this case, the source electrode 110 of source/drain pattern and drain electrode 112 have the structure of one.
Then, shown in Fig. 9 D, utilize oxygen (O
2) plasma, by the ashing operation, photoresist pattern 220 is carried out ashing, thereby make the thickness attenuation of the first photoresist pattern 220A and remove the second photoresist pattern 220B.In addition, utilize the first photoresist pattern 220A of ashing, remove by removing source/the leakages pattern that the second photoresist pattern exposed and the ohmic contact layer of its below, thereby make source electrode 110 112 separate and expose active layer 116 with draining by etching.Thereby, at source electrode 110 with drain between 112 the raceway groove that comprises active layer 116 is set.At this moment, etching is more carried out on every side edge of source/drain pattern first photoresist pattern 220A of ashing once more, thereby the source/drain pattern and the semiconductor pattern 148 of the step coating with stepwise are provided.
Therefore, shown in Fig. 9 E, remove the photoresist pattern 220A that stays on the source/drain pattern by stripping process.
Figure 10 A and 10B are respectively planimetric map and the sectional view of explanation according to the 3rd mask process of the thin film transistor base plate of embodiment of the present invention, and Figure 11 A to Figure 11 E is the sectional view that is used for explaining in detail the 3rd mask process.
More particularly, shown in Figure 11 A, by on gate insulating film 144, forming passivating film 150, and form photoresist 239 thereon with source/drain pattern such as technology such as PECVD and spin coateds.Passivating film 150 is made of the inorganic insulating material identical with gate insulating film 144, perhaps is made of as acrylic acid organic compound, BCB (benzocyclobutene) or the PFCB (Freon C318) with little specific inductive capacity organic insulation.
Next, shown in Figure 11 B, utilize half-tone mask 230, photoresist 239 is exposed under light and develop, form photoresist pattern 240 thus with step coating by photoetching.
Half-tone mask 230 comprises suprasil (SiO
2) substrate 232 and the barrier bed 234 and the part transmission layer 236 that form on it.Here, barrier bed 234 is arranged on location that passivating film must exist cutting off ultraviolet ray (UV), thereby stays the first photoresist pattern 240A after development.Part transmission layer 236 be arranged on have the pixel aperture 170 that runs through passivating film 150 and second contact hole 138 location with local transmission UV, thereby after development, stay the second photoresist pattern 240B thinner than the first photoresist pattern 240A.For this, barrier bed 234 is by metal such as Cr, CrO
xEtc. formation, and part transmission layer 236 is by MoSi
xConstitute.In addition, quartz base plate 232 be arranged on have first contact hole 130 that runs through passivating film 150 and gate insulating film 144 location with complete transmission UV, thereby prevent the existence of photoresist pattern 240.
Subsequently, shown in Figure 11 C, utilize photoresist pattern 240 with step coating, pass through etching procedure, passivating film 150 and gate insulating film 144 are carried out composition, thereby first contact hole 130 that runs through passivating film 150 and gate insulating film 144 is provided, to expose grid pad electrode 128 down.
Then, shown in Figure 11 C, utilize oxygen (O
2) plasma, by the ashing operation, photoresist pattern 240 is carried out ashing, thereby make the thickness attenuation of the first photoresist pattern 240A and remove the second photoresist pattern 240B.In addition, utilizing the first photoresist pattern 240A of ashing, removing the passivating film 150 that exposes by do carving operation, so that pixel aperture 170 that exposes drain electrode 112 and gate insulating film 144 and second contact hole 138 that exposes data pads electrode 136 to be provided.Here, the overetch by passivating film 150 is had the shape more outstanding more than the edge of passivating film 150 by the edge of the first photoresist pattern 240A of ashing.This ashing is carried out in identical chamber in succession with the dried operation of carving.
Next, shown in Figure 11 D,, on thin film transistor base plate, integrally form nesa coating 117 with first photoresist pattern 240A by such as deposition techniques such as sputters.Nesa coating 117 is made of ITO, IO or IZO etc.In this case, the deposition back has linear nesa coating 117 and has opening in the edge of passivating film 150 near the edge of the first photoresist pattern 240A, so that the remover infiltration lane to be provided.
Then, shown in Figure 11 E, remove the first photoresist pattern 240 and the nesa coating 117 on it simultaneously, thereby the transparent conductive patterns that comprises pixel electrode 118, goes up grid pad electrode 132 and last data pads electrode 140 is provided by stripping process.At this moment, the infiltration lane that remover forms via the opening of nesa coating 117 easily infiltrates from the edge of passivating film 150, therefore can improve charge stripping efficiency.Pixel electrode 118 has surface of contact with passivating film 150 in pixel aperture 170, and is arranged on the gate insulating film 144 to be connected to drain electrode 112.Last grid pad electrode 132 has surface of contact with passivating film 150 in first contact hole 130, and is connected to down grid pad electrode 128.Last data pads electrode 132 has surface of contact with passivating film 150 in second contact hole 138, and is connected to down data pads electrode 136.
As mentioned above, utilize half-tone mask to form the following storage electrode 122 that has double-deck gate pattern and have single layer structure according to the manufacturing method of film transistor base plate of embodiment of the present invention.In addition, it utilizes another half-tone mask formation to run through pixel aperture 170 and second contact hole 138 and first contact hole 130 that runs through passivating film 150 and gate insulating film 144 of passivating film 150.In addition, according to the stripping process of the manufacturing method of film transistor base plate of the embodiment of the present invention photoresist pattern by being used for composition passivating film 150 nesa coating is carried out composition, so that transparent conductive patterns to be provided.As a result, can simplify working process by the three-wheel mask process.
And, method manufacturing according to the thin film transistor base plate of the embodiment of the invention, when tending to relative unfertile land and limit thickness corresponding to the photoresist pattern of following storage electrode 122 in relatively large zone and pixel aperture 170, use half-tone mask, and limit corresponding to relatively than the thickness of the photoresist pattern of the raceway groove of zonule such as thin film transistor (TFT) 106 time when tending to relative unfertile land, this method is used diffraction exposed mask.Thereby, can improve process efficiency.
Figure 12 is the planimetric map according to the part thin film transistor base plate of second embodiment of the invention, and Figure 13 is the sectional view of the thin film transistor base plate that obtains along II-II ', III-III ' and IV-IV ' line in Figure 12.
Figure 12 and thin film transistor base plate shown in Figure 13 are connected to the drain electrode 112 that is exposed by pixel aperture 170 except pixel electrode 118 in the side; And upward data pads electrode 140 is connected to outside the following data pads electrode 136 that is exposed by second contact hole 138 in the side, has and Fig. 4 and thin film transistor base plate components identical shown in Figure 5.Therefore, with the description of omitting to similar elements.
When the source/drain pattern that comprises data line 104, source electrode 110, drain electrode 112 and following data pads electrode 136 is formed by the Mo that can be suitable for dried quarter, after the formation of the pixel aperture 170 that runs through passivating film 150 and second contact hole 138, the part that exposes of drain electrode 112 and following data pads electrode 136 is etched.In this case, the semiconductor pattern that is arranged on below the drain electrode 112 and the part that exposes of following data pads electrode 136 also is etched.Thereby, be arranged on the side that pixel aperture 170 interior pixel electrodes 118 are connected to drain electrode 112, and contact with active layer 116 that stays or gate insulating film 144.In addition, be arranged on the side that second contact hole, 138 interior last data pads electrodes 140 are connected to down data pads electrode 136, and contact with active layer 116 that stays or gate insulating film 144.
As mentioned above, according to the present invention, the upper and lower electrode of holding capacitor is formed by transparency conducting layer, does not need to reduce the aperture ratio to enlarge the overlapping region between described two electrodes, thereby increases the electric capacity of holding capacitor.In addition, following storage electrode and last storage electrode are that pixel electrode is overlapping, only have gate insulating film therebetween, thereby because the distance between the two poles of the earth reduces, have increased the electric capacity of holding capacitor biglyyer.
Especially, according to the present invention,, formed the following storage electrode 122 that has double-deck gate pattern and have single layer structure by means of half-tone mask.In addition, by means of another half-tone mask, form the pixel aperture 170 and second contact hole 138 that runs through passivating film 150 and first contact hole 130 that runs through passivating film 150 and gate insulating film 144.In addition, the stripping process of the photoresist pattern by being used for composition passivating film 150 carries out composition with nesa coating, so that transparent conductive patterns to be provided.As a result, can simplify working process by the three-wheel mask process.
In addition, according to the present invention, therefore by the half-tone mask operation, first conductive layer of gate pattern and second conductive layer have the constant step coating of stepwise, and the rapid inclination by first conductive layer and second conductive layer can prevent the breakage of the source/drain pattern that causes.
In addition, according to the present invention, when tending to use half-tone mask when relative unfertile land limits wide photoresist pattern, and when tending to relative unfertile land and limit narrow photoresist pattern use diffraction exposed mask.Thereby, can improve process efficiency.
Although the present invention is described by the embodiment shown in the above-mentioned accompanying drawing, it will be understood by those of skill in the art that to the invention is not restricted to these embodiments that it can have various deformation or improvement in the case of without departing from the spirit of the present invention.Therefore, scope of the present invention only limits by claims and its equivalent.
Claims (26)
1. liquid crystal display device comprises:
Double-deck grid line, described bilayer have first transparency conducting layer and second opaque conductive layer and have the step coating;
Intersect to limit the data line of pixel region with described grid line;
Gate insulating film between described grid line and data line;
Be connected to the thin film transistor (TFT) of described grid line and data line;
Limit the raceway groove of described thin film transistor (TFT) and the semiconductor layer overlapping with described data line;
Cover the passivating film of described data line and thin film transistor (TFT);
Pixel electrode on the gate insulating film in the pixel aperture of the pixel region that runs through described passivating film; And
The holding capacitor overlapping with described pixel electrode has described gate insulating film therebetween, and described holding capacitor has from the extended storage electrode down of described first transparency conducting layer.
2. display device according to claim 1 is characterized in that, further comprises:
The grid pad, it comprise have double-decker and be connected to the following grid pad electrode of described grid line and in the contact hole that runs through described gate insulating film and passivating film on the grid pad electrode.
3. display device according to claim 1 is characterized in that, further comprises:
Data pads, it comprise the following data pads electrode that is connected to described data line and in running through the contact hole of described passivating film on the data pads electrode,
Wherein said semiconductor layer is overlapping with following data pads electrode.
4. display device according to claim 1 is characterized in that, described pixel electrode laterally is connected to described drain electrode basically by pixel aperture.
5. display device according to claim 3 is characterized in that, the described data pads electrode of going up laterally is connected to described data pads electrode down basically by contact hole.
6. display device according to claim 1 is characterized in that described grid is connected to grid line.
7. the manufacture method of a liquid crystal display device comprises:
Utilize first mask, formation comprises double-deck grid line and grid with transparency conducting layer and the gate pattern that comprises the following storage electrode with transparency conducting layer on substrate;
Form the gate insulating film of cover gate pattern, and utilize second mask on gate insulating film, to form semiconductor layer and source; And
Utilize the 3rd mask to form to have form on the passivating film of pixel aperture and the gate insulating film in pixel aperture be connected to drain electrode and with the overlapping pixel electrode of following storage electrode.
8. method according to claim 7 is characterized in that, described first mask comprises first half-tone mask.
9. method according to claim 7 is characterized in that, described second mask comprises the diffraction exposed mask.
10. method according to claim 8 is characterized in that, described the 3rd mask comprises second half-tone mask.
11. method according to claim 7 is characterized in that, the step of described formation grid line and grid comprises:
On substrate, form first conductive layer and second conductive layer of transparency conducting layer;
Utilize first mask, on described second conductive layer, form the first photoresist pattern and the second photoresist pattern by photoetching with different-thickness;
Form grid line, grid and following storage electrode by adopting the first and second photoresist patterns to utilize etching that first and second conductive layers are carried out composition;
Utilize the first photoresist pattern, second conductive layer under removing by etching on the storage electrode; And
Remove the described first photoresist pattern.
12. method according to claim 11 is characterized in that, utilizes etching, described second conductive layer is retained in down on the storage electrode.
13. method according to claim 11 is characterized in that, further be included in form grid line, grid and following storage electrode after, utilize ashing to make the first photoresist pattern attenuation and remove the second photoresist pattern.
14. method according to claim 7 is characterized in that, described data line and semiconductor layer are overlapping.
15. method according to claim 7 is characterized in that, described storage electrode down extends from first conductive layer of grid line.
16. method according to claim 7 is characterized in that,
The step of described formation grid line and grid comprises that further formation is connected to the following grid pad electrode of grid line; And
The step of wherein said formation passivating film comprises that further the grid pad electrode forms the contact hole that runs through passivating film and gate insulating film by exposing down, in contact hole, form be connected to grid pad electrode down on the grid pad electrode.
17. method according to claim 16 is characterized in that, described grid pad electrode down comprises bilayer.
18. method according to claim 16 is characterized in that, the step of described formation gate insulating film comprises that further formation is connected to the following data pads electrode of data line, and
Form passivating film further comprise formation by second contact hole of passivating film and in second contact hole, be connected to data pads electrode down on the data pads electrode.
19. method according to claim 18 is characterized in that, the step of described formation passivating film comprises:
In source electrode and drain electrode, form passivating film;
Utilize second mask, on passivating film, form the first photoresist pattern and the second photoresist pattern by photoetching with different-thickness;
Utilize the first photoresist pattern and the second photoresist pattern, form first contact hole by etching;
Utilize the first photoresist pattern, form the pixel aperture and second contact hole by etching;
On the described first photoresist pattern, form transparency conducting layer; And
Form the transparent conductive patterns that has pixel electrode, goes up grid pad electrode and last data pads electrode by utilizing stripping process to remove the first photoresist pattern and transparency conducting layer.
20. method according to claim 19 is characterized in that, further comprises by ashing making the first photoresist pattern attenuation and remove the second photoresist pattern after forming first contact hole.
21. method according to claim 19 is characterized in that, the step of the described formation pixel aperture and second contact hole comprises the expose portion that forms drain electrode and following data pads electrode.
22. method according to claim 21 is characterized in that, described pixel electrode laterally is connected to drain electrode basically.
23. method according to claim 21 is characterized in that, the described data pads electrode of going up laterally is connected to down the data pads electrode basically.
24. method according to claim 21 is characterized in that, the step of the described formation pixel aperture and second contact hole comprises that etching is positioned at the lower semiconductor layer of the expose portion of drain electrode and following data pads electrode.
25. method according to claim 21 is characterized in that, the step of the described formation pixel aperture and second contact hole comprises that the overetch passivating film makes the edge of the photoresist pattern of winning more outstanding than the edge of passivating film.
26. method according to claim 7 is characterized in that, described first conductive layer and second conductive layer have constant step coating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-0037771 | 2004-05-27 | ||
| KR1020040037771A KR101086478B1 (en) | 2004-05-27 | 2004-05-27 | Thin Film Transistor Substrate for Display Device And Method For Fabricating The Same |
| KR1020040037771 | 2004-05-27 |
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| Publication Number | Publication Date |
|---|---|
| CN1702531A true CN1702531A (en) | 2005-11-30 |
| CN100421020C CN100421020C (en) | 2008-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100722831A Expired - Fee Related CN100421020C (en) | 2004-05-27 | 2005-05-27 | Liquid crystal display device and fabricating method thereof |
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| Country | Link |
|---|---|
| US (2) | US7468527B2 (en) |
| JP (1) | JP4335845B2 (en) |
| KR (1) | KR101086478B1 (en) |
| CN (1) | CN100421020C (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20050112645A (en) | 2005-12-01 |
| US20090085040A1 (en) | 2009-04-02 |
| JP4335845B2 (en) | 2009-09-30 |
| KR101086478B1 (en) | 2011-11-25 |
| JP2005338856A (en) | 2005-12-08 |
| US20050263768A1 (en) | 2005-12-01 |
| US7468527B2 (en) | 2008-12-23 |
| CN100421020C (en) | 2008-09-24 |
| US8017462B2 (en) | 2011-09-13 |
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