CN1743495B - Organic matter vaporization plating device - Google Patents
Organic matter vaporization plating device Download PDFInfo
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- CN1743495B CN1743495B CN200510096608XA CN200510096608A CN1743495B CN 1743495 B CN1743495 B CN 1743495B CN 200510096608X A CN200510096608X A CN 200510096608XA CN 200510096608 A CN200510096608 A CN 200510096608A CN 1743495 B CN1743495 B CN 1743495B
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- 239000005416 organic matter Substances 0.000 title claims abstract description 211
- 238000007747 plating Methods 0.000 title claims description 199
- 238000009834 vaporization Methods 0.000 title claims description 197
- 230000008016 vaporization Effects 0.000 title claims description 197
- 238000003860 storage Methods 0.000 claims abstract description 138
- 239000000758 substrate Substances 0.000 claims abstract description 130
- 238000007740 vapor deposition Methods 0.000 claims abstract description 20
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 238000001704 evaporation Methods 0.000 claims description 139
- 230000008020 evaporation Effects 0.000 claims description 138
- 239000007921 spray Substances 0.000 claims description 96
- 239000002245 particle Substances 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims description 3
- 239000007858 starting material Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000005755 formation reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
To provide an organic matter vapor deposition system by which, in a state where a substrate is almost vertically stood, organic matter is vapor-deposited, so as to form an organic thin film, and which is applicable to a large-sized substrate, and can form an organic thin film with a uniform thickness as well. The organic matter vapor deposition system is equipped with: a chamber forming a barrel body and allowing a substrate to retain an angle from 70 to 110[deg.] to the ground; an organic matter storage section composed of at least one organic matter storage part receiving the organic matter to be vapor-deposited on the substrate; an organic matter injection nozzle section of injecting the organic matter to be vapor-deposited on the substrate; a connection line of connecting the organic matter injection nozzle section and the organic matter storage section; and a transfer device capable of moving at least the organic matter injection nozzle section among the organic matter storage section, the organic matter injection nozzle section and the connection line to a vertical direction.
Description
Technical field
The present invention relates to be used to form the organic matter vaporization plating device of organic films such as organic semiconductor element, in more detail, relate to the generally perpendicularly axial state evaporation of substrate organism, form organic film, applicable to large-sized substrate, can form the organic matter vaporization plating device of the organic film of uniform thickness.
Background technology
Usually, the organic film that contains the organic semiconductor element of organic electric-field light-emitting element (OLED, Organic light Emitting Device) etc. has a great difference in following method, promptly, low molecular organic material is evaporated in vacuum and form the method for organic film, after macromolecule organic matter is dissolved in solvent, use spin coating (spin coating), immersion plating (dip coating), little resistance plating (ダ ケ タ one Block レ one テ ィ Application グ), ink jet printing etc. to form the method for organic film.
When under vacuum, making the film that constitutes by low molecular organic material by aforesaid method, the baffle pattern (shadow mask pattern) that will have the shaped aperture portion that will form is arranged in before the substrate, by evaporation organic substance on above-mentioned substrate, on above-mentioned substrate, make organic film.
As the manufacture method of the organic film that constitutes by above-mentioned low molecular organic material, have the method in use point type organic matter vaporization plating source and the method in use line style organic matter vaporization plating source etc.
But, when stating such some type or the organic source of line style thing vapor deposition source in the use and on large-sized substrate, forming organic film, distance between above-mentioned substrate and the evaporation source increases simultaneously, and the increase of the distance between above-mentioned substrate and the evaporation source becomes the reason of the homogeneity reduction that is formed at the organic film on the above-mentioned substrate.
In addition, when the distance between above-mentioned substrate and the evaporation source increased, evaporation from the vacuum chamber of organism outside above-mentioned substrate of above-mentioned evaporation source evaporation increased organic loss, consider that above-mentioned organism is high price, the problem that then exists manufacturing cost to increase.
In addition, for guaranteeing the homogeneity of organic film, above-mentioned baffle pattern and evaporation source constitute the angle of regulation, can form organic film.At this moment, constitute under the situation of predetermined angular at above-mentioned baffle pattern and evaporation source, there are the following problems,, produces the shadow effect that is caused by above-mentioned baffle pattern that is, is difficult to obtain the organic film of desirable shape.
Evaporation source and nozzle is integrated, and then there are the following problems, that is, because heat and the distortion that the heat by substrate and mask pattern causes can take place.
In addition, under the situation of large-sized substrate, exist because the phenomenon that hangs down of substrate, thereby make the different problem of homogeneity of the film of the central part of substrate and edge part.
Existing organic matter vaporization plating device is for carrying out organic even evaporation, and adopts the mode of mobile substrate, but when this substrate moves, and has the size that the makes the chamber very large problem that becomes.
Under the situation of existing organic matter vaporization plating device, when stating organic matter vaporization plating device in the use, in the gap of each integrant, enter the organism particle, produce organic leakage.If owing to above-mentioned well heater is polluted in so organic leakage, the problem that then exists above-mentioned well heater to be short-circuited.
Be short-circuited and when switching above-mentioned well heater,,, in addition, also have the problem of blocked operation time length at above-mentioned well heater so there is the difficulty of switching because above-mentioned well heater constitutes one with above-mentioned organic matter vaporization plating source.
Summary of the invention
The present invention researches and develops for solving above-mentioned prior art problems, its purpose is to provide a kind of organic matter vaporization plating device, and it is the evaporation organism under the state that the substrate approximate vertical is holded up, and forms organic film, applicable to large-sized substrate, and can form the organic film of uniform thickness.
Another purpose of the present invention is to provide a kind of organic matter vaporization plating device, it is the evaporation organism under the state that the substrate approximate vertical is holded up, form organic film, applicable to large-sized substrate, and can form the organic film of uniform thickness, the organism storage part is separated with the organism nozzle, make the minimizing deformation of substrate and mask pattern.
Other purposes of the present invention are to provide a kind of organic matter vaporization plating device, but its have independent separate well heater and with the incorporate spray nozzle part of splasher.
For achieving the above object, organic matter vaporization plating device of the present invention has: the chamber, and it constitutes housing, substrate is maintained become 70 °～110 ° angle with respect to ground; The organic matter vaporization plating source, it is made of organism storage part, organism guiding road, well heater, internal heat reflector, exterior cooling plate and organism nozzle, is used for evaporation organism on described substrate and forms organic film; Organic matter vaporization plating source transporter, it can make described organic matter vaporization plating source move in the vertical direction.
It is desirable to, described organism storage part is divided into a plurality of unit.
It is desirable to, described organism guiding road is the mobile route from the organism particle of described organism storage part evaporation.
It is desirable to, described organism guiding road keeps the final travel direction of organism particle to become-20 °～20 ° angle with respect to ground.
It is desirable to, described well heater is located at the outside on organism storage part and organism guiding road, heats described organism storage part and organism guiding road.
It is desirable to, described internal heat reflector is than outer setting of described well heater.
It is desirable to, described exterior cooling plate is positioned at the outside of described internal heat reflector, prevents the heat passage to outside of inside, described organism evaporation part, and described exterior cooling plate preferably uses refrigerant cools external heat reflector.
It is desirable to, described organic matter vaporization plating source also has the front end of the organism injection direction that is positioned at described organism spray nozzle part, is determined at the organic evaporation rate and the evaporation Determination of thickness transmitter of evaporation on the described substrate.
It is desirable to, also have the device that is used at described organism impurity.
In addition, organic matter vaporization plating device of the present invention has: the chamber, and it constitutes housing, substrate is maintained become 70 °～110 ° angle with respect to ground; A plurality of organic matter vaporization platings source, its evaporation material on described substrate forms film, by the well heater on evaporation material storage part, evaporation material guiding road, the described evaporation material storage part of heating and evaporation material guiding road, be formed at the outside of described evaporation material storage part and evaporation material guiding road and be used for the internal heat reflector of reverberation, exterior cooling plate and the evaporation material spray nozzle part of being located at the outside of described internal heat reflector and cooling off described internal heat reflector constitutes; Organic matter vaporization plating source transporter, it can make above-mentioned vapor deposition source move in the vertical direction.
Comprise identical organism mutually in described a plurality of vapor deposition source, can particularly on large-sized substrate, form uniform organic film at substrate.
In addition, described a plurality of vapor deposition source preferably is made of first vapor deposition source and second vapor deposition source, it is desirable to more, described first vapor deposition source is the starting material vapor deposition source of the film on the substrate, and described second vapor deposition source is the impurity vapor deposition source that is used for containing at described film the impurity that the characteristic of improving described film uses.
Described a plurality of different organic matter vaporization plating source preferred tunable joint spray angle.
In addition, organic matter vaporization plating device of the present invention comprises: the chamber, and it constitutes housing and support substrate; At least one organic matter vaporization plating source, it has the organism storage part of storage organism and local opening, be connected with the part of described organism storage part opening and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell.
Can also have the organic matter vaporization plating source transporter that described organic matter vaporization plating source is moved in the vertical direction.
It is desirable to, at least one in described organism storage part and the described spray nozzle part is made of graphite (graphite).
Described spray nozzle part has: the organism nozzle, and it sprays the organism particle on described substrate; The splashproof film, its organism that prevents described organism storage part splashes.
It is desirable to, described well heater portion has the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down.
Described organic matter vaporization plating source also can have the internal heat reflector that is installed on described outer casing inner wall.
Described organic matter vaporization plating source also can have the hot cut-off of the substrate direction exterior face that is installed on described spray nozzle part.
Described organic matter vaporization plating source also can have the refrigerating unit of being located at described outer shell outer wall.
In addition, organic matter vaporization plating device of the present invention comprises: the chamber, it constitutes housing and support substrate organic matter vaporization plating source, and it has the organism storage part of storage organism and local opening, be connected with the opening portion of described organism storage part and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell; Organic matter vaporization plating source transporter, it can make described organic matter vaporization plating source move in the vertical direction.
It is desirable to, described well heater portion has the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down, and is made of the structure of the well heater passage (heater tumle1) of the form that covers described organism storage part.
As mentioned above, according to the present invention, a kind of organic matter vaporization plating device can be provided, it is the evaporation organism under the state that the substrate approximate vertical is holded up, form organic film,, and can form the organic film of uniform thickness applicable to large-sized substrate, the organism storage part is separated with the organism nozzle, make the minimizing deformation of substrate and mask pattern.
The present invention can provide a kind of organic matter vaporization plating device, but its have independent separate well heater portion and with the incorporate spray nozzle part of splasher.
As mentioned above, be illustrated, but so long as the skilled practitioner of this technical field then can be carried out various corrections and change to the present invention in the scope that does not break away from inventive concept and field with reference to ideal embodiment of the present invention.
Description of drawings
Fig. 1 is the sketch chart that is used to illustrate the organic matter vaporization plating device of an embodiment of the present invention:
Fig. 2 a～Fig. 2 b is the sketch chart that is used to illustrate the organic matter vaporization plating device of an embodiment of the present invention
Fig. 3 is the sketch chart that is used to illustrate the organic matter vaporization plating device of another embodiment of the present invention:
Fig. 4 is the sketch chart that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention;
Fig. 5 a～Fig. 5 b is the figure that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention;
Fig. 6 is the sketch chart that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention:
Fig. 7 a is the longitudinal diagram in organic matter vaporization plating source that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention;
Fig. 7 b is the diagram of the organism storage part that is defined in organic matter vaporization plating device, spray nozzle part and the well heater portion of other embodiments of the present invention;
Fig. 7 c is the diagram of the shell that is defined in organic matter vaporization plating device of other embodiments of the present invention;
Fig. 7 d is the diagram of the refrigerating unit that is defined in organic matter vaporization plating device of other embodiments of the present invention.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
Same reference marks is represented identical integrant among the figure.
Fig. 1 is the sketch chart that is used to illustrate the organic matter vaporization plating device of an embodiment of the present invention.
With reference to Fig. 1, the organic matter vaporization plating device 100 of embodiment of the present invention comprises: chamber 110, and it constitutes the housing of above-mentioned organic matter vaporization plating device 100; Organic matter vaporization plating source 120, it is used for spraying the organism particle on the organic substrate S of evaporation; Organic matter vaporization plating source transporter 130, it can make above-mentioned organic matter vaporization plating source 120 move in the vertical direction.
Above-mentioned chamber 110 makes wants the organic substrate S approximate vertical of evaporation, it is desirable to maintain the angle that becomes 70 °～11O ° with ground.In addition, preferred above-mentioned chamber 110 is a vacuum chamber.
Above-mentioned organic matter vaporization plating source 120 comprises: organism storage part 121, and it receives the organism of evaporation on above-mentioned substrate 110; Organism spray nozzle part 122, it will spray to above-mentioned substrate S from the organism of above-mentioned organism storage part 121 evaporations; Connection line 123, it connects above-mentioned organism storage part 121 and organism spray nozzle part 122, constitutes the organic mobile route of above-mentioned evaporation; Determinator 124, it is determined at the organic evaporation rate and the organic thickness of evaporation on the above-mentioned substrate S.
Above-mentioned organic matter vaporization plating source transporter 130 can make the structure of the running gear that the above-mentioned at least organism spray nozzle part 122 in the above-mentioned organic matter vaporization plating source 120 moves in the vertical direction constitute by having.At this moment, above-mentioned organic matter vaporization plating source transporter 130 is the vertical conveying apparatus that are suitable for use in maintaining the above-mentioned chamber 110 of vacuum, it also has travelling speed regulating mechanism (not shown), can regulate the translational speed of the above-mentioned at least organism spray nozzle part 122 in the above-mentioned organic matter vaporization plating source 120.
Reference marks M among the figure is the mask pattern of decision organism shape of evaporation on above-mentioned substrate S.
Fig. 2 a and Fig. 2 b are the sketch chart that is used to illustrate the organic matter vaporization plating device of an embodiment of the present invention, are the diagrams that is defined in organic substrate of evaporation and organic matter vaporization plating source.
With reference to Fig. 2 a and Fig. 2 b, the organic matter vaporization plating source 120 of the organic matter vaporization plating device 110 of an embodiment of the present invention comprises: organism storage part 121, and organic at least one organism storage location 121a of evaporation constitutes on substrate S by accepting for it; Organism spray nozzle part 122, it sprays the organism of evaporation on substrate S; Connection line 123, it is connected above-mentioned organism spray nozzle part 122 with organism storage part 121; Determinator 124, it measures organic evaporation rate and the organic thickness of evaporation on substrate S.
Above-mentioned organism storage part 121 is made of storage organic at least one organism storage location 121a of evaporation on above-mentioned substrate S.Above-mentioned organism storage part 121 is parts that heating organism storage location 121a makes the evaporation of organism particle, above-mentioned organism storage part 121 is usually located at the inside in above-mentioned chamber 110, but organism storage part 121 of the present invention also can be positioned at the outside of above-mentioned chamber 11O.That is, the position of above-mentioned organism storage part 121 constitutes in the mode of the inside that can be positioned at chamber 110 or outside whole positions.
Above-mentioned organism spray nozzle part 122 is will be from the organism particle spraying of the above-mentioned organism storage part 121 evaporations part on the above-mentioned substrate S, do not illustrate, it is by having the well heater that prevents above-mentioned organism particle condensation and being used to make the uniform structure of nozzle of injection of organism particle to constitute.In addition, above-mentioned organism spray nozzle part 122 can also be following next door (baffle) structure, promptly, become particle state in incomplete evaporation from the organism of above-mentioned organism storage part 121 evaporations, but the organism that further will keep by bunchy (cluster) form of a plurality of organism particles aggregate is broken into the organism particle state, and the size that makes the organism particle that sprays on above-mentioned substrate S evenly.
Above-mentioned connection line 123 is that above-mentioned organism storage part 121 is connected with above-mentioned organism spray nozzle part 122, will be transported to the part of above-mentioned organism spray nozzle part 122 from the organism particle of organism storage part 121 evaporations.Above-mentioned connection line 123 is for preventing from the organism particle condensation temperature controllable of above-mentioned organism storage part 121 evaporations.In addition, minimize, can have indivedual controls more than or equal to two zone for making condensing of above-mentioned organism particle.In addition, when above-mentioned organism storage part 121 was positioned at above-mentioned chamber 110 outside, the connection line 123 that above-mentioned organism storage part 121 is connected with organism spray nozzle part 122 was connected with the outside in above-mentioned chamber 110.In addition, above-mentioned connection line 123 is owing to making above-mentioned organism spray nozzle part 122 move in the vertical direction, so by this morphosis of pleated tube.
Said determination device 124 is measured organic evaporation rate and the organic thickness of evaporations on above-mentioned substrate S, and it is positioned at the leading section of the organism injection direction of above-mentioned organism spray nozzle part 122, and is integrated with above-mentioned organism spray nozzle part 122.Said determination device 124 forms organic film and when above-mentioned organism spray nozzle part 122 is moved on for above-mentioned substrate S, move with above-mentioned organism spray nozzle part 122, measure the organic evaporation rate of evaporation on above-mentioned substrate S, control the organism steam output in the above-mentioned organism storage part 121.
Use the formation method of organic film of above-mentioned this organic matter vaporization plating device 100 as follows.
At first, substrate S is installed in the chamber 110 of above-mentioned organic matter vaporization plating device 100, makes itself and ground approximate vertical, preferably maintain the angle that becomes 70 °～11O ° with ground.
Secondly, heating is positioned at the inside in above-mentioned chamber 110 or outside and by receiving the organism storage part 121 that organic at least one above-mentioned organism storage location constitutes, and evaporates above-mentioned organism with the organism particle state.
The above-mentioned organism particle that has evaporated moves to above-mentioned organism spray nozzle part 122 via the connection line 123 of above-mentioned organism storage part 121 and organism spray nozzle part 122, is ejected on the above-mentioned substrate S via above-mentioned organism spray nozzle part 122.
At this moment, become particle state in incomplete evaporation from the organism of above-mentioned organism storage part 121 evaporations, collide but make to keep by the organism of the bunchy form of a plurality of organism particles aggregate and the next door of organism spray nozzle part 122, further be broken into the organism particle state, thus, make the size of the organism particle that sprays on above-mentioned substrate S even.
In addition, the connection line 123 of above-mentioned organism storage part 121 and organism spray nozzle part 122 and organism spray nozzle part 122 are by the auxiliary heater heating, so that the above-mentioned organism particle that has evaporated is noncondensing.
In addition, can above-mentioned organism spray nozzle part 122 be moved by above-mentioned organic matter vaporization plating source transporter 130, above-mentioned organism particle is ejected on the above-mentioned substrate S equably, on above-mentioned substrate S, forms uniform organic film.
On the other hand, Fig. 3 is the sketch chart that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention, is the diagram that is defined in organic substrate of evaporation and organic matter vaporization plating source.
With reference to Fig. 3, the organic matter vaporization plating device shown in the organic matter vaporization plating device of other embodiments of the present invention and Fig. 1, Fig. 2 a and Fig. 2 b is similar.Only in the organic matter vaporization plating source 200 of above-mentioned organic matter vaporization plating device by different on a plurality of organism storage parts 210 and the structure that a plurality of organism spray nozzle parts 220 constitute.
Promptly, the organic matter vaporization plating source 200 of the organic matter vaporization plating device of other embodiments of the present invention has following structure: a plurality of organism storage parts 210, organic at least one organism storage location of evaporation constitutes on substrate S by receiving for it, and the chamber that is positioned at above-mentioned organic matter vaporization plating device is inner or outside; A plurality of organism spray nozzle parts 220, it is corresponding above-mentioned organism storage part 210 respectively; A plurality of connection lines 230, it is connected above-mentioned each organism spray nozzle part 220 with organism storage part 210; Determinator 240, it is located at the front end of the organism injection direction of above-mentioned each organism spray nozzle part 220, measures the organic evaporation rate of evaporation on above-mentioned substrate S.
The organic matter vaporization plating source 200 of above-mentioned this organic matter vaporization plating device is owing to have a plurality of organism storage part 21O and a plurality of organism spray nozzle part 220, even be not used to running gear that above-mentioned organism spray nozzle part 220 is moved so do not have, also can be on the large-sized substrate that approximate vertical is holded up the evaporation organism, have under the situation of above-mentioned running gear evaporation organism more equably.
Fig. 4 is the sketch chart that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention, is the diagram that is defined in organic substrate of evaporation and organic matter vaporization plating source.
With reference to Fig. 4, the organic matter vaporization plating device shown in the organic matter vaporization plating device of other embodiments of the present invention and Fig. 1, Fig. 2 a and Fig. 2 b is similar.Only the organic matter vaporization plating source 300 of above-mentioned organic matter vaporization plating device by at least one organism storage part 310 with above-mentioned organism storage part 310 in different on the structure that constitutes of any corresponding a plurality of organism spray nozzle part 320.
Promptly, the organic matter vaporization plating source 300 of the organic matter vaporization plating device of other embodiments of the present invention has following structure: the organism storage part, it is made of to organic at least one organism storage location of substrate S evaporation acceptance, is positioned at the inside or the outside of above-mentioned organic matter vaporization plating device; A plurality of organism spray nozzle parts, it sprays the organism particle on above-mentioned substrate; A plurality of connection lines, it is connected above-mentioned each organism spray nozzle part with the organism storage part; Determinator, it is located at the front end of the organism injection direction of above-mentioned each organism spray nozzle part, measures the organic evaporation rate of evaporation on substrate.
Above-mentioned this organic matter vaporization plating device is at the organism nozzle of an organism storage location correspondence more than or equal to two.
That is, corresponding a plurality of organism nozzles an organism storage location, evaporation organism on the substrate that above-mentioned approximate vertical is holded up forms organic film.
As mentioned above, the organic matter vaporization plating device of the embodiment of the present invention that Fig. 1～shown in Figure 4 is such sprays the organism particle with the state of vertically holding up, and forms organic film, thus, under the situation of using large-sized substrate, prevent the sagging shape of substrate, therefore, applicable to large-sized substrate.
In addition, can with organism storage part and organism nozzle segment from, prevent the distortion that the heat of above-mentioned substrate and mask pattern causes, it is equal to form organic particle distribution on above-mentioned substrate: even organic film.
Use is stored in the different material of organism of above-mentioned a plurality of organism storage parts, can be used to improve the injection of the impurity of above-mentioned organic film characteristic.
As the mask that is used to form above-mentioned organic film, in the current trends of using existing precision metallic mask (finemetal mask), because organism and above-mentioned substrate S are generally perpendicularly sprayed, can guarantee that uniform staged covers the advantage of (ス テ ッ プ カ バ リ ッ ジ) so have.
Owing to move above-mentioned organic matter vaporization plating source 120,200,300 by above-mentioned organic matter vaporization plating source transporter 130, evaporation organism on above-mentioned substrate S, so do not have an organic matter vaporization plating source transporter with existing, and the organic situation of organic matter vaporization plating device 100 evaporations that substrate S is moved is compared, and the size reduction of chamber 11O can be arrived in about 75%.
On the other hand, Fig. 5 a and Fig. 5 b are the figure that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention, Fig. 5 a is the longitudinal diagram in organic matter vaporization plating source of the organic matter vaporization plating device of other embodiments of the present invention, and Fig. 5 b is the drawing in side sectional elevation in organic matter vaporization plating source of the organic matter vaporization plating device of other embodiments of the present invention.
With reference to Fig. 5 a and Fig. 5 b, the organic matter vaporization plating source 400 of the organic matter vaporization plating device of other embodiments of the present invention is made of organism storage part 410, organism guiding road 420, well heater 430, internal heat reflector 440, exterior cooling plate 450, organism spray nozzle part 460 and determinator 470.
Above-mentioned organism storage part 410 is organic parts that storage is formed at the material of the organic film on the above-mentioned substrate S, preferably is made of the crucible that is divided into a unit 410a at least.
Above-mentioned organism guiding road 420 is used for the organism particle from above-mentioned organism storage part 410 evaporations is transported to above-mentioned organism spray nozzle part 460, and is used to determine the mobile route of above-mentioned organism particle.Explanation in further detail, for upwards evaporating above-mentioned organism particle from above-mentioned organism storage part 410, evaporation organism on the substrate S that above-mentioned approximate vertical is holded up, and the final mobile route that must make above-mentioned organism particle is a general horizontal direction, therefore, must make the end on above-mentioned organism guiding road 420 maintain with ground-20 °～20 ° angle.That is, guide the final mobile route of above-mentioned organism particle, make it maintain with ground-20 °～20 ° angle.In addition, the middle portion on above-mentioned organism guiding road 420 is formed obliquely with the angle of regulation, the organism of a part of bunchy (cluster) form from the organism of above-mentioned organism storage part 410 evaporations collides with the inwall on guiding road, be broken into the organism particle state, thus, the organism of above-mentioned bunchy form mixes equably in above-mentioned organism guiding 420 inside, road swimmingly, prevents that organism from solidifying on above-mentioned substrate S and carry out evaporation.
Above-mentioned well heater 430 is located at the outside on above-mentioned organism storage part 41O and organism guiding road 420, is used to heat above-mentioned organism storage part 410 and organism guiding road 420.That is, heat above-mentioned organism storage part 41O, evaporate above-mentioned organism, the organism particle that evaporated is condensed in the inside on above-mentioned organism guiding road 420 and heat with organic particle state.
Above-mentioned internal heat reflector 440 is located at the outside of above-mentioned well heater 430, is used to increase the thermo-efficiency in above-mentioned organic matter vaporization plating source 400, and its multistage ground constitutes, can absorb the thermal capacity of 400 inside, above-mentioned organic matter vaporization plating source.
Said external cooling plate 450 is positioned at the outside of above-mentioned internal heat reflector 440, prevents the heat passage to outside of 400 inside, above-mentioned organic matter vaporization plating source.Said external cooling plate 450 uses refrigerant cools internal heat reflector 440.
Above-mentioned organism spray nozzle part 460 has following effect, promptly, to spray from the substrate S that above-mentioned organism storage part 410 evaporates and the organism particle of inflow is holded up to approximate vertical via above-mentioned organism guiding road 420, determine the evaporation of above-mentioned organic filler on above-mentioned substrate S, the form of distribution.In addition, above-mentioned organism spray nozzle part 460 is preferably the form that can regulate spray angle when spraying the organism particle.The organism in the above-mentioned organism of the may command storage location 410 is used for and regulates the state that sprays the organism particle by the form of the above-mentioned organism spray nozzle part 460 of opening, so can evaporate equably.
On the other hand, shown in Fig. 5 b, above-mentioned organism storage part 410 is divided at least one unit 410a, stores organism in each unit 410a, and in addition, well heater 430 is distributed in the periphery of above-mentioned organism storage part 410 equably.
It when above-mentioned organism storage part 410 is made of a unit, produces the poor of the organism rate of evaporation that causes the position because above-mentioned organism storage part 4lO temperature inside distributes to differ under the situation of the above-mentioned organism evaporation that makes organism storage part 410.The even injection of the official post impurity of the rate of evaporation that cause such position and the homogeneity of organic film reduce, but can make the organism rate of evaporation in the above-mentioned organism storage part 410 even by above-mentioned organism storage part 410 is divided into a plurality of unit 410a.
The formation method of organic film of organic matter vaporization plating device in organic matter vaporization plating source that use has above-mentioned other embodiments of the present invention is as follows.
At first, in the chamber of above-mentioned organic matter vaporization plating device 100, substrate S is installed, makes itself and ground keep approximate vertical, it is desirable to keep the angle that becomes 70 °～11O ° with ground.
Secondly, accept the organic above-mentioned organism storage part 41O in above-mentioned organic matter vaporization plating source 400 by above-mentioned well heater 430 heating.
At this moment, each unitary organism that will be accommodated in the crucible of above-mentioned organism storage part 41O by above-mentioned well heater 430 flashes to the organism particle state.
The above-mentioned organism particle that has evaporated flows into above-mentioned organism spray nozzle part 460 via above-mentioned organism guiding road 420.At this moment, the mobile route of above-mentioned organism particle determines by the shape on above-mentioned organism guiding road 420.Because the end on above-mentioned organism guiding road 420 keeps with ground-20 °～20 ° angle, so the final mobile route of the above-mentioned organism particle in the above-mentioned organic matter vaporization plating source 400 maintains with ground-20 °～20 ° angle.In addition, above-mentioned organism guiding road 420 makes from the organism of above-mentioned organism storage part 410 evaporations, incomplete evaporation becomes particle state, collide but make to keep by the organism of the bunchy form of a plurality of organism particles aggregate and the inwall on above-mentioned organism guiding road 420, be broken into the organism particle state, thus, make the size of the organism particle that is ejected on the above-mentioned substrate S even.In addition, above-mentioned organism guiding road 420 external heated devices 430 noncondensing above-mentioned organism particle that has evaporated in above-mentioned organism guiding road 420.
The organism particle that flows into above-mentioned organism spray nozzle part 460 forms organic film via above-mentioned organism spray nozzle part 460 evaporation on above-mentioned substrate S.At this moment, above-mentioned organic matter vaporization plating source 400 is moved in the vertical direction, keeping evaporation organism particle on the substrate S that becomes 70 °～100 ° of angles with above-mentioned ground, form organic film by above-mentioned organic matter vaporization plating source transporter 130.In addition, above-mentioned organism particle is because its final mobile route maintains with ground-20 °～20 ° angle, so when above-mentioned organism particle was ejected on the above-mentioned substrate S via above-mentioned organism spray nozzle part 460, above-mentioned organism particle sprayed to become-20 °～20 ° angle with ground.In addition, at above-mentioned organism particle on above-mentioned substrate S during evaporation, the form of regulating the organism particle of evaporation on above-mentioned substrate S by the form of the above-mentioned organism spray nozzle part 460 of opening.
On the other hand, during the above-mentioned organism of evaporation on the above-mentioned substrate S, measure organic evaporation rate and the organic evaporation thickness of evaporation on above-mentioned substrate S at the said determination device 470 of being located at leading section on the organism injection direction of above-mentioned organism spray nozzle part 460.Therefore, by the evaporation rate and the organic evaporation thickness of the organism particle during the use said determination device 470 controls formation organic films, can realize the reproducibility of organic film uniform thickness.
Fig. 6 is the sketch chart that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention.
With reference to Fig. 6, the organic matter vaporization plating device of other embodiments of the present invention has following structure: as shown in Figure 1, have a plurality of organic matter vaporization platings source 120, and have the organic matter vaporization plating source transporter that is used to make above-mentioned each organic matter vaporization plating source vertical shifting.
As an example, above-mentioned different a plurality of vapor deposition source can be made of the first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B, the identical organism of bag in the above-mentioned first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B, move at the interval that is separated from each other regulation, can be on substrate the uniform organic film of evaporation.When using large-sized substrate evaporation organic film, be favourable particularly.
Perhaps, above-mentioned different a plurality of organic matter vaporization platings source is made of the first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B, any organic matter vaporization plating source among the above-mentioned first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B, for example the first organic matter vaporization plating source 400A sprays on above-mentioned substrate S as the raw-material organic organic matter vaporization plating of organic film source, and the second organic matter vaporization plating source 400B contains the organic matter vaporization plating source that is useful on the impurity that improves above-mentioned organic film characteristic in above-mentioned organic film.
At this moment, the above-mentioned first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B be in order to contain organism in organic film, and can regulate spray angle, with before evaporation material on the above-mentioned substrate S, and mixing in certain zone.
In addition, can measure each organic evaporation rate and evaporation Determination of thickness device by injection direction front end setting at the nozzle of the above-mentioned first organic matter vaporization plating source 400A and the second organic matter vaporization plating source 400B, can be during formation on the above-mentioned substrate S contains the organic film of impurity, control evaporation rate and organic thickness can carry out the control of the foreign matter content that contains in the organic film.
As mentioned above, as Fig. 5 a and Fig. 5 b and shown in Figure 6, the organic matter vaporization plating device 100 of other embodiments of the present invention prevents from via above-mentioned internal heat reflector 400 and exterior cooling plate 450 heat release to the outside except that above-mentioned organism spray nozzle part 460 heat affecting to above-mentioned substrate S and mask pattern M to be minimized.That is, can prevent above-mentioned substrate S that heat causes and the distortion of mask pattern M.
Fig. 7 a～Fig. 7 d is the figure in organic matter vaporization plating source that is used to illustrate the organic matter vaporization plating device of other embodiments of the present invention, Fig. 7 a is the longitudinal diagram in organic matter vaporization plating source of the organic matter vaporization plating device of other embodiments of the present invention, Fig. 7 b is the diagram of the organism storage part, spray nozzle part and the well heater portion that are defined in the organic matter vaporization plating device of other embodiments of the present invention, Fig. 7 c is the diagram of shell that is defined in the organic matter vaporization plating device of other embodiments of the present invention, and Fig. 7 d is the diagram of refrigerating unit that is defined in the organic matter vaporization plating device of other embodiments of the present invention.
With reference to Fig. 7 a～Fig. 7 d, the above-mentioned organic matter vaporization plating source 500 of the organic matter vaporization plating device lO0 of an embodiment of the present invention has following structure: organism storage part 510, and it stores organism, and local opening; Spray nozzle part 520, its part with the opening of above-mentioned organism storage part 510 is connected, and sprays organism; Shell 530, it is for covering the form of above-mentioned organism storage part 5lO; Well heater portion 540, it is between above-mentioned organism storage part 510 and above-mentioned shell 530.
Above-mentioned organism storage part 510 be storage will be on above-mentioned substrate S the raw-material organic part of the organic film of evaporation, constitute by crucible usually.In addition, above-mentioned organism storage part 510 can be made of the good graphite of heat conductivity (graphite) or its Equivalent, but is not limited to this material in the present invention.
Said nozzle portion 520 has following effect, that is, spray on the substrate S that approximate vertical is holded up from the organism particle of above-mentioned organism storage part 310 evaporations, determines the evaporation of above-mentioned organism particle on above-mentioned substrate S, the form of distribution.At this moment, said nozzle portion 520 constitutes organism nozzle 521 and splashproof film 525 incorporate forms, wherein, organism nozzle 521 will be from the organism particle spraying of above-mentioned organism storage part 51O evaporation on above-mentioned substrate S, and splashproof film 525 prevents that organism from not flashing to the organism particle but the situation of splashing with bunchy (cluster) form from above-mentioned organism storage part 510.In addition, said nozzle portion 520 can be made of the good graphite of heat conductivity (graphite) or its Equivalent, but in the present invention, is not limited to this material.In addition, owing to can regulate the spray regime of organism particle by the form of opening said nozzle portion 520, the organism in the above-mentioned organism storage part of the may command 51O evaporates equably.
Above-mentioned shell (housing) 530 constitutes the form that covers above-mentioned organism storage part 510, and above-mentioned organism storage part 510 and outside atmosphere are isolated.
Above-mentioned well heater portion 540 is used for evaporatively heating the organism of above-mentioned organism storage part 510 between above-mentioned organism storage part 510 and above-mentioned shell 530.At this moment, above-mentioned well heater portion 540 comprises the hot line 541 that can evaporate above-mentioned organic thermal source and described hot line 541 from hanging down and the hot line supporting mass 545 that supports by preventing of constituting of a kind of stiffening web (Rib).In other words, above-mentioned well heater portion 540 forms the structure of a kind of well heater passage (heaterrunne1) that is made of hot line 541 and hot line supporting mass 545, and above-mentioned well heater passage (heater runne1) covers above-mentioned organism storage part 51O.Therefore, above-mentioned well heater portion 540 since in above-mentioned organic matter vaporization plating source 500 not with other integrants, particularly above-mentioned organism storage part 510 is integrated, or is installed on other integrants, so can separate independently and change.
In addition, above-mentioned organic matter vaporization plating source 500 can also have the internal heat reflector 550 that is installed on above-mentioned shell 530 inwalls.550 reflections of above-mentioned internal heat reflector are from the heat that above-mentioned well heater portion 540 produces, and increase the heat exchange of above-mentioned well heater portion 540.
Above-mentioned organic matter vaporization plating source 500 can also have along the substrate S direction of said nozzle portion 520 and is installed on hot cut-off 560 on the exterior face.Above-mentioned hot cut-off 560 prevents that heat from emitting heat via said nozzle portion 520 and influencing the situation of above-mentioned substrate S.
Above-mentioned organic matter vaporization plating source 500 can also have the refrigerating unit 570 of being located at above-mentioned shell 530 outer walls.Above-mentioned refrigerating unit 570 prevents to be discharged to outside situation from the heat that above-mentioned well heater portion 540 produces via above-mentioned shell 530.
On the other hand, above-mentioned organic matter vaporization plating source 500 can also have not shown, be used to measure organic evaporation rate and the organic evaporation Determination of thickness device of evaporation on above-mentioned substrate S.
As mentioned above, the organic matter vaporization plating source 500 of the above-mentioned organic matter vaporization plating device shown in Fig. 7 a～Fig. 7 d, with the above-mentioned well heater portion 540 of above-mentioned organism storage part 510 by well heater passage (heater runne1) structure, opening portion at above-mentioned organism storage part 5lO inserts spray nozzle part 520, and in the above-mentioned shell 530 of above-mentioned well heater portion's 540 insertions, constitute the structures that above-mentioned organism storage part 510, spray nozzle part 520 and well heater portion 540 decompose assembling easily.
On the other hand, use the formation method of organic film of organic matter vaporization plating device 100 as follows with above-mentioned this organic matter vaporization plating source 500.
At first, substrate is installed in the chamber 110 of above-mentioned organic matter vaporization plating device 100, is made itself and ground approximate vertical, it is desirable to maintain angle with 70 °～110 ° of ground formations.
Secondly, by 540 heating of above-mentioned well heater portion accept will be on the above-mentioned substrate S in above-mentioned organic matter vaporization plating source 500 the organic organism storage part 510 of evaporation.At this moment, be stored in organism in the above-mentioned organism storage part 5 10, evaporate with the organism particle state by 540 heating of above-mentioned well heater portion.
The above-mentioned organism particle that has evaporated flows in the said nozzle 520, sprays via said nozzle portion 520, and evaporation is on above-mentioned substrate S.At this moment, the organism particle of evaporation on above-mentioned substrate S determines its evaporation shape by aforementioned mask pattern M.
At this moment, can transport above-mentioned organic matter vaporization plating source 500 by above-mentioned transporter 130, evaporation organism on above-mentioned substrate S can be implemented more uniform organic evaporation.
On the other hand, said nozzle portion 520 is because integrated with organism nozzle 52l and splasher 525, so do not flash to the organism particle from above-mentioned organism storage part 51O, the organism of the bunchy form that can prevent to splash.
Said nozzle portion 520 is made of the good material of the such thermal conductivity of graphite (graphite), even other heating unit is not set, also can prevent condensing of the organism particle that sprays via said nozzle portion 520.
In addition, above-mentioned organism particle on above-mentioned substrate S during evaporation, the form that the form of the organism nozzle 321 by the above-mentioned organism spray nozzle part 520 of opening is regulated the organism particle of evaporation on above-mentioned substrate S.
On the other hand, because the organic matter vaporization plating source also has determinator (not shown), thereby can during the above-mentioned organism of evaporation on the above-mentioned substrate S, measure organic evaporation rate and the organic evaporation thickness of evaporation on above-mentioned substrate S.Therefore, when stating determinator 580 formation organic films in the use,, can realize the reproducibility of organic film uniform thickness by the evaporation rate and the organic matter vaporization plating thickness of control organism particle.
Claims (23)
1. organic matter vaporization plating device is characterized in that having: constitute the chamber of housing, it makes substrate keep 70 °～110 ° angle with respect to ground; The organic matter vaporization plating source, it is made of organism storage part, organism guiding road, well heater, internal heat reflector, exterior cooling plate and organism nozzle, is used for evaporation organism on described substrate and forms organic film; Organic matter vaporization plating source transporter, it moves in the vertical direction described organic matter vaporization plating source,
Wherein, described organism guiding road is the mobile route from the organism particle of described organism storage part evaporation, described well heater is located at the outside on organism storage part and organism guiding road, heat described organism storage part and organism guiding road, described internal heat reflector is than outer setting of described well heater, described exterior cooling plate is positioned at the outside of described internal heat reflector, prevents the heat passage to outside of inside, described organic matter vaporization plating source.
2. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described organism storage part is divided into a plurality of unit.
3. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described organism guiding road makes the final travel direction of organism particle keep-20 °～+ 20 ° angle with respect to ground.
4. organic matter vaporization plating device as claimed in claim 1 is characterized in that, described exterior cooling plate uses refrigerant cools internal heat reflector.
5. organic matter vaporization plating device as claimed in claim 1, it is characterized in that, described organic matter vaporization plating source also has determination sensor, and it is positioned at the front end of the organism injection direction of described organism spray nozzle part, measures organic evaporation rate and the evaporation thickness of evaporation on described substrate.
6. organic matter vaporization plating device as claimed in claim 1 is characterized in that, also has the device that is used at described organism impurity.
7. organic matter vaporization plating device is characterized in that having: the chamber, and it constitutes housing, makes substrate keep 70 °～110 ° angle with respect to ground; A plurality of organic matter vaporization platings source, its evaporation material and form film on described substrate, by the well heater on evaporation material storage part, evaporation material guiding road, the described evaporation material storage part of heating and evaporation material guiding road, be formed at the outside of described evaporation material storage part and evaporation material guiding road and be used for the internal heat reflector of reverberation, exterior cooling plate and the evaporation material spray nozzle part of being located at the outside of described internal heat reflector and cooling off described internal heat reflector constitutes; Organic matter vaporization plating source running gear, it moves in the vertical direction described vapor deposition source, and wherein, described evaporation material guiding road is the mobile route from the evaporation material particle of described evaporation material storage part evaporation.
8. organic matter vaporization plating device as claimed in claim 7 is characterized in that, described a plurality of vapor deposition source evaporations are identical organism mutually.
9. organic matter vaporization plating device as claimed in claim 7 is characterized in that, described a plurality of vapor deposition source are made of the first organic vapor deposition source and the second organic vapor deposition source.
10. organic matter vaporization plating device as claimed in claim 9, it is characterized in that, the described first organic matter vaporization plating source is the starting material vapor deposition source of film on substrate, and the described second organic matter vaporization plating source is to contain the impurity vapor deposition source that is useful on the impurity that improves described film characteristics in described film.
11. organic matter vaporization plating device as claimed in claim 7 is characterized in that, spray angle can be regulated in described a plurality of different organic matter vaporization plating sources.
12. organic matter vaporization plating device as claimed in claim 7, it is characterized in that, described organic matter vaporization plating source also has determination sensor, and it is positioned at the organism injection direction front end of described organism spray nozzle part, measures organic evaporation rate and the evaporation thickness of evaporation on described substrate.
13. an organic matter vaporization plating device is characterized in that, comprising: the chamber, it constitutes housing and support substrate; At least one organic matter vaporization plating source, it has the organism storage part of storage organism and a part of opening, be connected with the part of described organism storage part opening and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell, compare described well heater portion, locate to be provided with the internal heat reflector for more outer.
14. organic matter vaporization plating device as claimed in claim 13 is characterized in that, also has the organic matter vaporization plating source transporter that described organic matter vaporization plating source is moved in the vertical direction.
15. organic matter vaporization plating device as claimed in claim 13 is characterized in that, at least one in described organism storage part and the described spray nozzle part is made of graphite.
16. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described spray nozzle part has: the organism nozzle, and it sprays the organism particle on described substrate; The splashproof film, its organism that prevents described organism storage part splashes.
17. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described well heater portion has the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down.
18. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the internal heat reflector that is installed on described outer casing inner wall.
19. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the hot cut-off of the substrate direction exterior face that is installed on described spray nozzle part.
20. organic matter vaporization plating device as claimed in claim 13 is characterized in that, described organic matter vaporization plating source also has the refrigerating unit of being located at described outer shell outer wall.
21. an organic matter vaporization plating device is characterized in that it comprises: the chamber, it constitutes housing and support substrate; The organic matter vaporization plating source, it has the organism storage part of storage organism and local opening, be connected with the opening portion of described organism storage part and spray the shell of the form of organic spray nozzle part, the described organism storage part of covering, the well heater portion between described organism storage part and shell; Organic matter vaporization plating source transporter, it can make described organic matter vaporization plating source move in the vertical direction, and compares described well heater portion, locates to be provided with the internal heat reflector for more outer.
22. organic matter vaporization plating device as claimed in claim 21 is characterized in that, described spray nozzle part has: the organism nozzle, and it sprays the organism particle on described substrate; The splashproof film, its organism that prevents described organism storage part splashes.
23. organic matter vaporization plating device as claimed in claim 21 is characterized in that, described well heater portion comprises the hot line of thermal source and prevents the hot line supporting mass that described hot line hangs down, constitutes the structure of the well heater passage of the form that covers described organism storage part.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040067259A KR100579406B1 (en) | 2004-08-25 | 2004-08-25 | Vertical Moving Type Apparatus for Depositing Organic Material |
| KR67259/04 | 2004-08-25 | ||
| KR84884/04 | 2004-10-22 | ||
| KR1020040084884A KR100646514B1 (en) | 2004-10-22 | 2004-10-22 | Apparatus for Depositing Organic Material |
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| CN1743495A CN1743495A (en) | 2006-03-08 |
| CN1743495B true CN1743495B (en) | 2011-09-14 |
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| CN200510096608XA Active CN1743495B (en) | 2004-08-25 | 2005-08-25 | Organic matter vaporization plating device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1743495A (en) | 2006-03-08 |
| KR20060018745A (en) | 2006-03-02 |
| KR100579406B1 (en) | 2006-05-12 |
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