CN1678138A - Organic electroluminescence display assembly structure and package method - Google Patents
Organic electroluminescence display assembly structure and package method Download PDFInfo
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- CN1678138A CN1678138A CN 200410017412 CN200410017412A CN1678138A CN 1678138 A CN1678138 A CN 1678138A CN 200410017412 CN200410017412 CN 200410017412 CN 200410017412 A CN200410017412 A CN 200410017412A CN 1678138 A CN1678138 A CN 1678138A
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- transparent cover
- organic electroluminescence
- display
- cover plate
- assembly according
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Abstract
The method seals transparent base plate with an organic luminescence chip to a transparent cover board through glue on frame. The transparent cover board possesses an accommodation flute and annular flute around. Glue is coated on periphery of flute of the transparent cover board. Thus, the transparent base plate and the transparent cover board are sealed. An enclosed space is formed on the accommodation flute in order to seal organic luminescence chip. There is at least one protection film on circumferential surface of the transparent cover board, and there is at least a moisture absorption material adhibited on inner surface of the accommodation flute in the transparent cover board. The invention improves connectivity between glue and glass, increases coherence of glue and reduces water permeability so as to raise service life of assembly.
Description
Technical field
The present invention relates to the technology of a kind of display of organic electroluminescence (OLED) assembly, particularly a kind of structure and method for packing thereof of promoting the display of organic electroluminescence assembly of assembly life-span.
Background technology
Fig. 1 is the structure of common display of organic electroluminescence assembly 10; it is equipped with one earlier on a glass substrate 12 have exciting light chip 14; and under inert gas environment; go up to form a frame glue 16 around this glass substrate 12 with syringe coating ultraviolet sclerotic type glue or heating stiffening type glue; and by this glass cover-plate 18 is sticked thereon, not attacked by aqueous vapor with protection assembly 10 inside.
Yet because above-mentioned glass cover-plate 18 is generally alkali glass, can diffuse out metal cation, influence frame glue 16 irradiating ultraviolet light or when hot polymerization incomplete, so that with the then property variation of glass, therefore can't block the external environment aqueous vapor fully and penetrate into, so that 10 life-spans of assembly can't reach demand for commodity.
The patent that prior art had been applied at the problems referred to above is as follows, see also " Organnic electroluminescent device and method for packing thereof (the Method of encapsulating organic electroluminescence deviceand organic electroluminescence device) " of United States Patent (USP) case numbers 5962962, it proposes a kind of method for packing, in encapsulation process, inertia, the grease that dewaters are poured into component internal, and in grease, sneak into hygroscopic material; In addition in " organic illuminating element (the Organic EL element) " of United States Patent (USP) case numbers 5882761, proposition is in encapsulation process, use has the metal cover board of groove, and at cover plate groove stickup hygroscopic material, enter the aqueous vapor of component internal by the hygroscopic material adsorption and permeation, to increase the life-span of assembly; Yet above-mentioned two patents though can effectively increase assembly life-span, often because of frame glue polymerization sclerosis is incomplete, cause permeability rate very high, and the phenomenon that cover plate comes off take place.
Problem for the gas solved water infiltration; propose in " passivation of Organnic electroluminescent device (the Passivation of electroluminescent organic devices) " of United States Patent (USP) case numbers 5811177 on modular construction, to plate one to several floor inert metal; the diaphragm of inorganic protective film and resin capping; penetrate into component internal in order to the aqueous vapor that blocks external environment fully; yet add this passivation layer of plating at the organic electroluminescence assembly superstructure; its treatment temperature injures the damage assembly most probably; and required time is longer, is not suitable for producing in batches.
In view of this, the present invention proposes a kind of structure and method for packing thereof of display of organic electroluminescence assembly at above-mentioned technical problem, to improve above-mentioned defective.
Summary of the invention
Main purpose of the present invention is to provide a kind of structure and method for packing thereof that improves the display of organic electroluminescence assembly of assembly life-span, and it can effectively avoid aqueous vapor infringement intraware, with lifting subassembly life-span significantly.
Another object of the present invention is to provide a kind of structure and its method for packing that reduces the display of organic electroluminescence assembly of frame glue seepage rate, it can improve the problem that the prior art seepage rate is too high and cover plate comes off.
A further object of the present invention is to provide a kind of polymerization of frame the glue structure and method for packing thereof of display of organic electroluminescence assembly completely promoted, and it can promote the adhesion between frame glue and glass.
For achieving the above object, the present invention proposes a kind of structure of organic electroluminescence assembly, comprises that one is provided with the transparency carrier of an organic light emission chip; One transparent cover plate tool, one containing groove and at least one groove that is located on around the containing groove, and the transparent cover plate circumferential surface covers at least one diaphragm; And the top of the groove around transparent cover plate coating one frame glue, transparency carrier and transparent cover plate are sealed and make containing groove form the confined space of a salable described organic light emission chip; And at the containing groove inner surface of transparent cover plate at least one hygroscopic material that has been sticked.
Another embodiment of the present invention is a kind of method for packing of display of organic electroluminescence assembly, and it comprises the steps: to provide one to have the transparent cover plate that containing groove and ring are established groove; Plate layer protecting film at least earlier in the transparent cover plate circumferential surface; The containing groove inner surface of at least one hygroscopic material at transparent cover plate is sticked; And be coated with the groove top of a frame glue around transparent cover plate, to have the transparency carrier of organic light emission chip by frame glue driving fit transparent cover plate and; At last transparency carrier and transparent cover plate are carried out pressing and solidify frame glue, to finish this encapsulating structure.
The invention has the beneficial effects as follows: the extent of polymerization of the then property between enhancement frame glue and glass, increase frame glue also reduces the water permeability of frame glue and can improve assembly life-span.
Description of drawings
Fig. 1 is the structure cutaway view of prior art.
Fig. 2 is a structure cutaway view of the present invention.
Fig. 3 is the vertical view and the end view of the cover plate of the present invention's use.
Fig. 4 is the water permeability of frame glue and the graph of relation of width.
Each step structure cutaway view that Fig. 5 to Fig. 9 encapsulates for the present invention.
Label declaration:
10 display of organic electroluminescence assemblies
12 glass substrates
14 organic light emission chips
16 frame glue
18 glass cover-plates
20 display of organic electroluminescence assemblies
22 transparency carriers
24 organic light emission chips
26 transparent cover plates
28 containing grooves
30 grooves
32 frame glue
34 hygroscopic materials
Embodiment
The beneficial effect that further specifies architectural feature of the present invention and reached below in conjunction with drawings and Examples.
As shown in Figure 2, the structure of a display of organic electroluminescence assembly 20 comprises a transparency carrier 22, is generally and uses the clear glass material; On these transparency carrier 22 surfaces, an organic light emission chip 24 is set; One transparent cover plate 26, it uses glass material, please consult structure shown in Figure 3 simultaneously, this transparent cover plate 26 has a containing groove 28 and at least one groove 30 that is located on around the containing groove 28, and transparent cover plate 26 circumferential surface cover layer protecting film (not shown) at least; One by frame glue 32 that macromolecular material constituted, it can be selected from ultraviolet sclerotic type glue or heating stiffening type glue, frame glue 32 is coated with is located at transparent cover plate 26 groove 30 tops on every side, transparency carrier 22 and transparent cover plate 26 are sealed and make containing groove 28 form a confined space, and then seal described organic light emission chip 24; And at the inner surface of the containing groove 28 of transparent cover plate 26 hygroscopic material 34 that is sticked, to adsorb the aqueous vapor that penetrates on a small quantity.
The material of said protection film can be selected from inorganic oxide or inorganic nitride, as silicon dioxide (SiO
2), silicon nitride (SiNx) or tin indium oxide (ITO), and described transparency carrier 202 circumferential surface also can plate one to several layers diaphragm; And hygroscopic material 214 can be alkaline earth metal oxide or sulfate, as calcium oxide (CaO), barium monoxide (BaO), magnesium oxide (MgO), lithium sulfate (Li
2SO
4) or calcium sulfate (CaSO
4) etc. material.
Fig. 4 is the graph of relation of the water permeability (WVPR) of frame glue to width, as shown in the figure, when frame glue width big more, then the water permeability is more little, and frame glue width can influence the water permeability as can be known, therefore, coating transparent cover plate frame glue width on every side in the present invention can adjust according to need and at any time, transparent cover plate frame glue width on every side is high more when coating, and then can damage more little to assembly so that the water permeability is low more.
According to structure shown in Figure 3, the present invention also proposes a kind of method for packing of display of organic electroluminescence assembly, and to shown in Figure 9, it is respectively each step structure cutaway view that the present invention encapsulates as Fig. 5.At first; as shown in Figure 5; one transparent cover plate 26 is provided; it has a containing groove 28 and the groove 30 around it; the formation of this containing groove 28 and groove 30 is to utilize methods such as sandblast, turning, ultrasonic drilling and chemical etching to process, and then utilizes vacuum evaporation, sputter or method of spin coating to plate one to several layers diaphragm (not shown) in transparent cover plate 26 circumferential surface.
Then as shown in Figure 6, at these containing groove 28 inner surfaces one deck hygroscopic material 34 that is sticked, then as shown in Figure 7, above the groove 30 around the transparent cover plate 26, utilize the ultraviolet sclerotic type glue of syringe coating circle or rectangle or heating stiffening type glue to form a frame glue 32; Then carry out Fig. 8, prepare a transparency carrier 22 in addition, one organic light emission chip 24 is installed earlier on it, and utilize mechanical contraposition or optical CCD alignment device to carry out contraposition the transparency carrier 22 that transparent cover plate 26 is installed organic luminescence chip 24 therewith, and the effect by described frame glue 32 makes transparent cover plate 26 and transparency carrier 22 driving fits together, and with its pressing and utilize irradiation ultraviolet radiation or the frame glue 32 that is heating and curing, form the structure of display of organic electroluminescence assembly 20 as shown in Figure 9 at last.
Below further illustrate characteristics of the present invention by experiment, use the sandblast mode that two soda-lime glass cover plates are dug out a width 0.5-1.5mm, the containing groove of degree of depth 0.1-0.7mm and be located on groove around the described containing groove, wherein a slice plates diaphragm, another sheet is protective film coating not then, these two soda-lime glass cover plates and other two glass substrates that plated diaphragm are cleaned up (containing oxygen plasma treatment), and insert in the nitrogen circulation case, then the barium monoxide powder that dewaters is also inserted in the nitrogen circulation case, then this barium monoxide is inserted in the containing groove of the soda-lime glass cover plate that plates diaphragm, and on the groove around the soda-lime glass cover plate, utilize syringe or similar device to be coated with the ultraviolet sclerotic type glue of 1.0mm or 1.5mm, cover the glass substrate that a slice plates diaphragm then, with as experimental group; Simultaneously, the barium monoxide powder that dewaters is inserted in the containing groove of another soda-lime glass cover plate that does not plate diaphragm, also on groove all around, utilize syringe or similar device coating thickness ultraviolet sclerotic type glue for 1.0mm or 1.5mm, cover the glass substrate that a slice plates diaphragm then, be used as control group; Then above two groups of test pieces, respectively place the glass of the 248g that load uses, utilize energy density 6J/cm then
2, power density 80mW/cm
2Ultraviolet ray shine, and through 100 ℃ of heating 60 minutes, measure test piece weight (to 0.1mg), and record, at last two groups of test pieces being moved into temperature and humidity is respectively in the environmental testing case of 60 ℃ and 95%RH, and take out test piece at set intervals, with record test piece weight (to 0.1mg).
Above-mentioned experimental result is shown in shown in Figure 10; experimental group shown in the solid line part plates the assembly of diaphragm on the soda-lime glass cover plate; gain in weight much smaller than the soda-lime glass cover plate that does not plate diaphragm of the control group shown in the dotted line; the result plates diaphragm in the soda-lime glass lid surface as can be known thus, can intercept the sodium cover-plate glass and diffuse out metal cation; can increase the extent of polymerization of frame glue; and reduce frame glue seepage rate, and it is tightr that frame glue and glass interface are followed, significantly the lifting subassembly life-span.
The present invention uses hygroscopic material and passivation layer simultaneously, and in conjunction with the structural design of transparent cover plate, can effectively promote then property between frame glue and glass, increase the extent of polymerization of frame glue and reduce the water permeability of frame glue, can improve assembly life-span, improve the described shortcoming that is present in the prior art.
Above-described embodiment is only in order to illustrate technological thought of the present invention and characteristics; its purpose makes those of ordinary skill in the art can understand content of the present invention and is implementing according to this; the scope of this patent also not only is confined to above-mentioned specific embodiment; be all equal variation or modifications of doing according to disclosed spirit, still be encompassed in protection scope of the present invention.
Claims (20)
1, a kind of structure of display of organic electroluminescence assembly is characterized in that comprising:
One transparency carrier;
One organic light emission chip is arranged on the described transparency carrier;
One transparent cover plate, its tool one containing groove and at least one groove that is located on around the described containing groove, and described transparent cover plate
Circumferential surface covers at least one diaphragm;
One frame glue is coated described transparent cover plate groove top on every side, makes described transparency carrier and described transparent cover plate be sealed in one
Rise and make described containing groove form a confined space, to seal described organic light emission chip; And
At least one hygroscopic material is attached at the described containing groove inner surface of described transparent cover plate.
2, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: described transparency carrier is a glass substrate.
3, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: described transparent cover plate is a glass cover-plate.
4, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: described transparency carrier circumferential surface covers at least one diaphragm.
5, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: described frame glue is macromolecular material.
6, the structure of display of organic electroluminescence assembly according to claim 5 is characterized in that: described macromolecular material is ultraviolet sclerotic type glue or heating stiffening type glue.
7, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: the material of described hygroscopic material is alkaline earth metal oxide or sulfate.
8, the structure of display of organic electroluminescence assembly according to claim 7 is characterized in that: described alkaline earth metal oxide can be calcium oxide, barium monoxide, magnesium oxide, and described sulfate can be lithium sulfate or calcium sulfate or its combination.
9, the structure of display of organic electroluminescence assembly according to claim 1 is characterized in that: the material of described diaphragm is inorganic oxide or inorganic nitride.
10, according to the structure of claim 9 a described display of organic electroluminescence assembly, it is characterized in that: the material of described diaphragm is silica or silicon nitride or tin indium oxide or its combination.
11, a kind of method for packing of display of organic electroluminescence assembly is characterized in that comprising the steps:
One transparent cover plate is provided, and it has a containing groove and at least one described containing groove groove on every side that is located on;
Plate in described transparent cover plate circumferential surface and to have a diaphragm at least;
At the containing groove inner surface of described transparent cover plate at least one hygroscopic material that is sticked;
Above the groove around the described transparent cover plate, be coated with a frame glue, and have by the described transparent cover plate of described frame glue driving fit and
The transparency carrier of one organic light emission chip; And
Described transparency carrier and described transparent cover plate are carried out pressing and solidify described frame glue.
12, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: described manufacture method with transparency carrier of organic light emission chip comprises:
One transparency carrier is provided; And
One organic light emission chip is installed on described transparency carrier.
13, the method for packing of display of organic electroluminescence assembly according to claim 11, it is characterized in that: before described transparency carrier and described transparent cover plate carry out pressing and solidify the step of described frame glue, also comprise the step that described transparent cover plate and described transparency carrier are carried out contraposition.
14, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: described diaphragm uses vacuum evaporation, sputter or method of spin coating to be plated on the described transparent cover plate circumferential surface.
15, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: described containing groove and described groove utilize methods such as sandblast, turning, ultrasonic drilling and chemical etching to process.
16, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: described frame glue uses syringe to be coated on described transparent cover plate described groove top on every side.
17, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: the pattern of described frame glue coating is circle or rectangle.
18, the method for packing of display of organic electroluminescence assembly according to claim 13 is characterized in that: described method of carrying out contraposition is that machinery is to method for position.
19, the method for packing of display of organic electroluminescence assembly according to claim 13 is characterized in that: described method of carrying out contraposition utilizes the optical CCD alignment device to implement.
20, the method for packing of display of organic electroluminescence assembly according to claim 11 is characterized in that: the method for described frame adhesive curing is to use irradiation ultraviolet radiation or heating to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410017412 CN1678138A (en) | 2004-04-01 | 2004-04-01 | Organic electroluminescence display assembly structure and package method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410017412 CN1678138A (en) | 2004-04-01 | 2004-04-01 | Organic electroluminescence display assembly structure and package method |
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| Publication Number | Publication Date |
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| CN1678138A true CN1678138A (en) | 2005-10-05 |
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ID=35050382
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410017412 Pending CN1678138A (en) | 2004-04-01 | 2004-04-01 | Organic electroluminescence display assembly structure and package method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531719A (en) * | 2013-10-25 | 2014-01-22 | 上海大学 | Packaging structure of OLED (organic light emitting diode) device |
| US8736163B2 (en) | 2006-06-30 | 2014-05-27 | Lg Display Co., Ltd. | Organic electro-luminescence display device and method for fabricating the same |
| TWI461094B (en) * | 2006-01-26 | 2014-11-11 | Samsung Display Co Ltd | Organic light emitting display device and manufacturing |
| CN104659269A (en) * | 2015-02-06 | 2015-05-27 | 深圳市华星光电技术有限公司 | OLED encapsulation method and OLED encapsulation structure |
| WO2016033888A1 (en) * | 2014-09-01 | 2016-03-10 | 京东方科技集团股份有限公司 | Packaging method, display panel, manufacturing method therefor, and display apparatus |
| CN106784382A (en) * | 2016-12-30 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | The encapsulating structure and method for packing of a kind of display device |
| CN115000105A (en) * | 2022-05-27 | 2022-09-02 | 长电科技管理有限公司 | Light-permeable chip packaging structure and manufacturing method |
-
2004
- 2004-04-01 CN CN 200410017412 patent/CN1678138A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI461094B (en) * | 2006-01-26 | 2014-11-11 | Samsung Display Co Ltd | Organic light emitting display device and manufacturing |
| US8736163B2 (en) | 2006-06-30 | 2014-05-27 | Lg Display Co., Ltd. | Organic electro-luminescence display device and method for fabricating the same |
| CN103531719A (en) * | 2013-10-25 | 2014-01-22 | 上海大学 | Packaging structure of OLED (organic light emitting diode) device |
| CN103531719B (en) * | 2013-10-25 | 2016-04-13 | 上海大学 | OLED encapsulating structure |
| WO2016033888A1 (en) * | 2014-09-01 | 2016-03-10 | 京东方科技集团股份有限公司 | Packaging method, display panel, manufacturing method therefor, and display apparatus |
| CN104659269A (en) * | 2015-02-06 | 2015-05-27 | 深圳市华星光电技术有限公司 | OLED encapsulation method and OLED encapsulation structure |
| CN104659269B (en) * | 2015-02-06 | 2017-05-17 | 深圳市华星光电技术有限公司 | OLED encapsulation method and OLED encapsulation structure |
| CN106784382A (en) * | 2016-12-30 | 2017-05-31 | 上海天马有机发光显示技术有限公司 | The encapsulating structure and method for packing of a kind of display device |
| CN106784382B (en) * | 2016-12-30 | 2019-04-05 | 上海天马有机发光显示技术有限公司 | A kind of encapsulating structure and packaging method of display device |
| CN115000105A (en) * | 2022-05-27 | 2022-09-02 | 长电科技管理有限公司 | Light-permeable chip packaging structure and manufacturing method |
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