CN1669680A - Nozzle cleaning device and substrate treating device - Google Patents
Nozzle cleaning device and substrate treating device Download PDFInfo
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- CN1669680A CN1669680A CNA2005100094086A CN200510009408A CN1669680A CN 1669680 A CN1669680 A CN 1669680A CN A2005100094086 A CNA2005100094086 A CN A2005100094086A CN 200510009408 A CN200510009408 A CN 200510009408A CN 1669680 A CN1669680 A CN 1669680A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
To improve washing effect in washing treatment of a discharge nozzle. A guide block 743 for approaching below a discharge port 41a of a slit nozzle 41 is provided at a washing section 74 for washing a slit nozzle 41. Gas nozzles 710 for blowing gaseous nitrogen and washing nozzles 750 for ejecting rinse liquid LQ are provided and further a suction mechanism sucks the lower part of the discharge port 41a of the slit nozzle 41. Thickness of the guide block 743 in a X-axis direction is made to be larger than the width of the discharge port 41a in the X-axis direction, and thereby adjustment is performed so that suction force by the suction mechanism may not directly act on the discharge port 41a. Thereby suction force of the suction mechanism can be raised and washing effect is improved.
Description
Technical field
The present invention relates to nozzle cleaning and substrate board treatment that the jetting nozzle to ejection predetermined process liquid cleans.
Background technology
Is known with flexible base, board, base board for optical mask, colored filter with the substrate board treatment of treatment fluids such as coating resist on the surface of substrate (below abbreviate " substrate " as) etc. with glass square substrate, semiconductor wafer, film liquid crystal to liquid crystal.By utilizing this substrate board treatment,, on substrate surface, form the coated film of resist liquid from jetting nozzle ejection resist liquid.
Figure 18 to Figure 20 is illustrated in resist liquid is coated in the substrate board treatment on the substrate by stages, and by applying processing repeatedly, the attachment of resist liquid remains in the schematic diagram of the situation on the jetting nozzle.Figure 18 is illustrated in original state, and the front end of slit jet nozzle 100 is in normal condition.In addition, Figure 19 represents tens substrates are applied state after the processing, and Figure 20 represents a hundreds of substrate is applied state after the processing.That is, in such substrate board treatment, when repeatedly substrate being applied processing, at the periphery of ejiction opening 101 and the leading section side residual gradually resist liquid R of slit jet nozzle 100.
Particularly, utilizing slit jet nozzle 100 to apply in the substrate board treatment (finedraw coating machine) of processing, as Figure 19 and shown in Figure 20, when the slit jet nozzle 100 with the state that is attached with uneven resist liquid R applied processing, the coating that strip takes place was irregular.Therefore handle in order to carry out stable coating, be necessary to clean termly and remove the resist liquid R that remains in ejiction opening 101 peripheries.Owing to this reason, proposed to carry out the scheme of the substrate board treatment that nozzle cleaning handles in the past, for example patent documentation 1 put down in writing like that.
Existing substrate board treatment has the washer jet that sprays cleaning fluid, in nozzle cleaning is handled, and general the employing from the method for this washer jet to the leading section supply cleaning fluid of jetting nozzle.Simultaneously, in order to improve this cleaning performance, in the supply that increases cleaning fluid, require promptly to attract to discharge the cleaning fluid that is used to clean.That is the attraction when, requiring to improve the leading section that attracts jetting nozzle.
Yet in existing substrate board treatment, when improving attraction, the resist liquid R that is filled in the jetting nozzle from ejiction opening is attracted, and existing can be with the problem of its sucking-off.Particularly, this problem is more remarkable when resist liquid (treatment fluid) is low viscosity.
State when Figure 21 represents that air is sneaked into the part that resist liquid R is sucked out.In addition, Figure 22 is illustrated in the state of sneaking into cleaning fluid (rinsing liquid LQ) in the part that resist liquid R is sucked out.Like this, in existing substrate board treatment, when attraction is risen, because the jetting nozzle after cleaning becomes the state deteriorating of inhomogeneous along its length grade, attraction is increased, and the cleaning performance that improves cleaning treatment has certain limit.
In addition, in existing substrate board treatment, even the state that finishes in the nozzle cleaning processing also exists the problem at the attachment of the residual strip in the leading section side of jetting nozzle.Figure 23 is illustrated in the existing substrate board treatment, the view of the attachment RL of the strip that occurs after nozzle cleaning is handled.Attachment RL shown in Figure 23 is near the extreme higher position in the cleaning fluid extent of supply of the leading section side of slit jet nozzle 100, delay of the resist liquid of dissolving and the mixed liquor of cleaning fluid etc. and forming.By such attachment RL, also can cause the deterioration of the state of the slit jet nozzle 100 after the cleaning.
Summary of the invention
The present invention forms in view of the above problems, its objective is the nozzle cleaning and the substrate board treatment of the cleaning performance that a kind of cleaning treatment that improves jetting nozzle is provided.
In order to address the above problem, the nozzle cleaning of first aspect present invention, the jetting nozzle that sprays predetermined process liquid from the ejiction opening of being located at leading section is cleaned, it is characterized in that, comprise: the cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle from ejiction opening; Suction device, it adjusts the attraction of aforementioned suction device by attracting mouthful to attract the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, and making becomes the roughly dwell point of aforementioned predetermined process liquid near the aforementioned ejiction opening.
In addition, the nozzle cleaning of second aspect present invention, be in the described nozzle cleaning of first aspect, also comprise shading member, it has width or its above thickness of the ejiction opening width of aforementioned jetting nozzle, be configured near the below of ejiction opening of aforementioned jetting nozzle, the attraction mouth by aforementioned suction device attracts from the below of aforementioned shading member, adjusts near the attraction of the aforementioned suction device the ejiction opening of aforementioned jetting nozzle.
In addition, the nozzle cleaning of third aspect present invention is in the described nozzle cleaning of second aspect, and aforementioned shading member has the spigot surface that the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply is guided downwards.
In addition, the nozzle cleaning of fourth aspect present invention is in the described nozzle cleaning of first aspect, aforementioned suction device, attract by leading section side, adjust near the attraction of the aforementioned suction device the ejiction opening of aforementioned jetting nozzle from aforementioned jetting nozzle.
In addition, the nozzle cleaning of fifth aspect present invention is in the described nozzle cleaning of fourth aspect, and the attraction mouth of aforementioned suction device is than the more close aforementioned jetting nozzle configuration of the ejiction opening of aforementioned cleaning fluid feeding mechanism.
In addition, the nozzle cleaning of sixth aspect present invention is in the described nozzle cleaning of fourth aspect, will be by the cleaning fluid of the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, discharge from the outlet of the leading section below that is arranged on aforementioned jetting nozzle.
In addition, the nozzle cleaning of seventh aspect present invention, be aspect the 6th in the described nozzle cleaning, also be provided with guide member, the leading section below that it is configured in aforementioned jetting nozzle has the spigot surface that the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply is guided downwards.
In addition, the nozzle cleaning of eighth aspect present invention is in the described nozzle cleaning of first aspect, also is provided with adjusting device, and its adjustment utilizes the supply position of cleaning fluid of the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply.
In addition, the nozzle cleaning of ninth aspect present invention is in the described nozzle cleaning of eight aspect, and aforementioned adjusting device is the distance piece with thickness of regulation.
In addition, the nozzle cleaning of tenth aspect present invention, be in the described nozzle cleaning of first aspect, the ejiction opening of aforementioned jetting nozzle is the finedraw that extends along the direction of regulation, also has the sweep mechanism that aforementioned cleaning fluid feeding mechanism is moved along the direction of aforementioned regulation.
In addition, the present invention the tenth nozzle cleaning on the one hand, be in the described nozzle cleaning of first aspect, the ejiction opening of aforementioned jetting nozzle is the finedraw that extends along the direction of regulation, aforementioned cleaning fluid feeding mechanism, on the whole width of the direction of the aforementioned regulation of the leading section of aforementioned jetting nozzle, supply the cleaning fluid of aforementioned regulation basically simultaneously.
In addition, the nozzle cleaning of the present invention the 12 aspect, be in the described nozzle cleaning of first aspect, the gas supply device that also comprises the gas of stipulating to the leading section supply of aforementioned jetting nozzle, utilize the supply position of the aforementioned regulation gas of aforementioned gas supply device supply, be positioned at the top of supply position of the cleaning fluid of the aforementioned regulation of utilizing aforementioned cleaning fluid feeding mechanism supply.
In addition, the nozzle cleaning of the present invention the 13 aspect cleans the jetting nozzle that sprays predetermined process liquid from the ejiction opening of being located at leading section, it is characterized in that, comprise: the cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle; Suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, aforementioned cleaning fluid feeding mechanism has a plurality of washer jets that spray the cleaning fluid of aforementioned regulation to the leading section of aforementioned jetting nozzle, utilize the supply position of the cleaning fluid of the aforementioned regulation of at least one washer jet supply in aforementioned a plurality of washer jet, supply position with respect to the cleaning fluid of the aforementioned regulation of the washer jet supply that utilizes other disposes on the differing heights direction.
In addition, the substrate board treatment of the present invention the 14 aspect, coating predetermined process liquid is characterized in that on substrate, comprising: the holding device that keeps substrate; Jetting nozzle, it is to the surface that remains on the substrate on the aforementioned holding device, from being located at the ejiction opening ejection predetermined process liquid of leading section; Clean the nozzle cleaning of aforementioned jetting nozzle, aforementioned nozzle cleaning comprises: the cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle, suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, adjust the attraction of aforementioned suction device, making becomes the roughly dwell point of aforementioned predetermined process liquid near the aforementioned ejiction opening.
In addition, the substrate board treatment of the present invention the 15 aspect, coating predetermined process liquid is characterized in that on substrate, comprising: the holding device that keeps substrate; Jetting nozzle, it is to the surface that remains on the substrate on the aforementioned holding device, from being located at the ejiction opening ejection predetermined process liquid of leading section; Clean the nozzle cleaning of aforementioned jetting nozzle, aforementioned nozzle cleaning comprises: the cleaning fluid feeding mechanism, and it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle; Suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, aforementioned cleaning fluid feeding mechanism has a plurality of washer jets that spray the cleaning fluid of aforementioned regulation to the leading section of aforementioned jetting nozzle, utilize the supply position of the cleaning fluid of the aforementioned regulation of at least one washer jet supply in aforementioned a plurality of washer jet, supply position with the cleaning fluid of the aforementioned regulation of the washer jet supply that utilizes other disposes on the differing heights direction.
Aspect first aspect to the 12 and in the described invention in the 14 aspect, by adjusting the attraction of suction device, make and become the roughly dwell point of predetermined process liquid near the ejiction opening, thereby promptly cleaning fluid and pollutant are discharged by attracting, can suppress the treatment fluid in the ejiction opening sucking-off jetting nozzle simultaneously.
In the described invention of second aspect, also comprise shading member, it has width or its above thickness of the ejiction opening width of jetting nozzle, be configured near the below of ejiction opening of aforementioned jetting nozzle, attraction mouth by suction device attracts from the below of shading member, near the attraction of the suction device the ejiction opening of adjustment jetting nozzle, thus can realize the described invention of first aspect easily.
In the described invention of the third aspect, by having the spigot surface that the cleaning fluid by the regulation of cleaning fluid feeding mechanism supply is guided downwards, thereby can more promptly discharge cleaning fluid.
In the described invention of fourth aspect, attract by leading section side from jetting nozzle, near the attraction of the suction device the ejiction opening of adjustment jetting nozzle, thus can realize the described invention of first aspect easily.
Aspect the 6th in the described invention, because by discharging from the outlet of the leading section below of being located at jetting nozzle by the cleaning fluid of the regulation of cleaning fluid feeding mechanism supply, just do not utilize suction device just can discharge cleaning fluid, so, the mechanism that can adopt low capacity as suction device.
Aspect the 7th in the described invention, the spigot surface by having the leading section below that is configured in jetting nozzle, will being guided downwards by the cleaning fluid of the aforementioned regulation of cleaning fluid feeding mechanism supply can more effectively carry out from the discharge of cleaning fluid outlet.
In the described invention of eight aspect,, can adjust the position of cleaning neatly according to the situation of adhering to of treatment fluid by also being equipped with the adjusting device of the supply position of the cleaning fluid of adjusting the regulation of supplying by the cleaning fluid feeding mechanism.
Aspect the 9th, in the described invention, be distance piece, can be easy to realize the described invention of eight aspect with thickness of regulation by adjusting device.
In the described invention, the ejiction opening of jetting nozzle is the finedraw that extends along prescribed direction, is equipped with the sweep mechanism that the cleaning fluid feeding mechanism is moved along prescribed direction, thereby can makes the device integral miniaturization aspect the tenth.
In the described invention of the tenth one side,, can shorten the required time of nozzle cleaning by the cleaning fluid feeding mechanism cleaning fluid that supply is simultaneously fixed on the whole width of the direction of the regulation of the leading section of jetting nozzle.
Aspect the 12 in the described invention, gas supply device is equipped with to the leading section supply regulation gas of jetting nozzle, the supply position of regulation gas that utilizes the gas supply device supply above the supply position of the regulation cleaning fluid that utilizes cleaning fluid feeding mechanism supply, thereby can promote the drying of cleaning fluid.
Aspect the 13 and in the described invention in the 15 aspect, by utilizing the supply position of the cleaning fluid of the regulation of at least one washer jet supply in a plurality of washer jets, supply position with respect to the cleaning fluid of the regulation of the washer jet supply that utilizes other, on the differing heights direction, dispose, thereby can prevent the attachment of residual strip on jetting nozzle.Thereby, can improve cleaning performance.
Description of drawings
Fig. 1 is the stereogram of expression substrate board treatment of the present invention.
Fig. 2 is the side view of the primary structure handled of the coating of the relevant substrate board treatment of expression.
Fig. 3 is the view of structure of the nozzle cleaning mechanism of first kind of form of implementation of expression.
Fig. 4 is the front view of subtend face of the ejection portion of first kind of form of implementation.
Fig. 5 is the stereogram of expression guide pad.
Fig. 6 is the state that moves of expression ejection portion and the view of slit jet nozzle.
Fig. 7 is the view of the configuration of each structure when being illustrated in the beginning that nozzle cleaning handles.
Fig. 8 is the view that is illustrated in the state of rinsing liquid ejection in the nozzle cleaning processing.
Fig. 9 is the view that is illustrated in the state of nitrogen ejection in the nozzle cleaning processing.
Figure 10 is the view of the state of presentation graphs 8 enlargedly.
Figure 11 is the view of structure of the nozzle cleaning mechanism of second kind of form of implementation of expression.
Figure 12 is the front view of subtend face of the ejection portion of second kind of form of implementation.
Figure 13 is the view that is illustrated in the state of rinsing liquid ejection in second kind of form of implementation.
Figure 14 is the view of effect of the attraction mechanism of second kind of form of implementation of explanation.
Figure 15 is the ejection portion of the third form of implementation of expression and the view of the position relation of the slit jet nozzle that is positioned at cleaning positions.
Figure 16 is the front view of the subtend face of ejection portion in the third form of implementation.
Figure 17 is the front view of subtend face of the ejection portion of variation.
Figure 18 is the view of original state of the leading section of expression slit jet nozzle.
To be expression apply the view of the state after the processing to about tens substrate to Figure 19.
To be expression apply the view of the state after the processing to the substrate about hundreds of to Figure 20.
Figure 21 is illustrated in the jetting nozzle of existing substrate board treatment, the view of the state of entrained air in the derivative part of resist liquid.
Figure 22 is illustrated in the jetting nozzle of existing substrate board treatment, sneaks into the view of the state of cleaning fluid (rinsing liquid) in the derivative part of resist liquid.
Figure 23 is illustrated in the existing substrate board treatment, the view of the attachment of the strip that occurs after nozzle cleaning is handled.
The specific embodiment
Below, the preferred implementing form that present invention will be described in detail with reference to the accompanying.
1, first kind of form of implementation
Fig. 1 is the stereogram of expression according to substrate board treatment 1 of the present invention.In addition, Fig. 2 is a side view of handling relevant primary structure in the expression substrate board treatment 1 with coating.
In addition, in Fig. 1, for the purpose of the convenience that illustrates and illustrate, carry out as giving a definition, Z-direction is represented vertical direction, and XY represents horizontal plane in the plane, but they just define in order to grasp the position relation easily, are not that all directions that the following describes are limited.For following figure also is same.
Main body 2 has workbench 3, and it has the function that mounting keeps the maintenance platform of substrate 90 usefulness, also has the function as the base of each attached mechanism simultaneously.Workbench 3 is the things made of stones for example in aggregates with rectangular shape, and its upper surface (maintenance face 30) and side are processed into tabular surface.
The upper surface of workbench 3 is a horizontal plane, becomes the maintenance face 30 of substrate 90.On maintenance face 30, distribute to form not shown a plurality of vacuum suction mouths, in substrate board treatment 1 treatment substrate 90 during in, by absorption substrate 90, substrate 90 is remained on the horizontal level of regulation.In addition, on maintenance face 30, but with a plurality of lifter pin LPs of proper spacing setting by not shown drive unit free lifting.Lifter pin LP is used for when taking off substrate 90 substrate 90 upwards being pushed away.
In maintenance face 30, across the both ends in the retaining zone of substrate 90 (zone that keeps substrate 90), fixedly install a pair of moving guide rail 31 that along continuous straight runs roughly extends in parallel.Moving guide rail 31, the most not shown supporting base of below with the both ends that are fixedly installed on portal structure 4, mobile (moving direction being limited in the direction of regulation) of guiding portal structure 4 constitutes the linear guide part that portal structure 4 is bearing in the top of maintenance face 30.
Above workbench 3, be provided with from the portal structure that sets up 4 of the two side portions approximate horizontal of this workbench 3.Portal structure 4 is that the nozzle support 40 of aggregate and the lowering or hoisting gear 43,44 that supports its two ends constitute by strengthening resin with graphite fibre mainly for example.
Lowering or hoisting gear left in the both sides of slit jet nozzle 41 in 43,44 minutes, was connected with slit jet nozzle with nozzle support 40.Lowering or hoisting gear 43,44 mainly is made of AC servo motor 43a, 44a and not shown ball-screw, according to the control signal from control part 8, generates the lifting driving force of portal structure 4.Thereby lowering or hoisting gear 43,44 makes slit jet nozzle 41 liftings with advancing side by side.In addition, lowering or hoisting gear 43,44 also is used to adjust the posture of slit jet nozzle 41 in the YZ plane.
Both ends at portal structure 4, along the lateral margin of the both sides of workbench 3, be set with a pair of AC coreless linear motor that has stator 50a and mover 50b and stator 51a and mover 51b separately (below abbreviate " linear motor " as) 50,51 respectively.In addition, at the both ends of portal structure 4, be set with the linear encoder 52,53 that has scale portion respectively and detect part respectively.Linear encoder 52,53 detects the position of linear motor 50,51.Based on these linear motors 50,51 and linear encoder 52,53, be configured for portal structure 4 and make it mobile device 5 mobile on workbench 3 the colleague who is moved guide rail 31 guiding.Control part 8, according to the result that detects from linear encoder 52,53, the action of control linear motor 50 is controlled at moving of portal structure 4 on the workbench 3, that is, and the scanning that control is undertaken by slit jet nozzle 41 to substrate 90.
On the maintenance face 30 of main body 2, retaining zone (X) direction side is provided with opening 32.Opening 32 and slit jet nozzle 41 coexist mutually and have length direction on the Y direction, and, the length of this length direction, substantially the same with the length of the length direction of slit jet nozzle 41.In addition, the inside of the main body 2 below opening 32 is provided with nozzle apparatus for initializing 7.Nozzle apparatus for initializing 7 uses when carrying out preliminary treatment (will be described later) before in the coating of resist liquid on substrate 90 (below be referred to as " formal coating is handled ").
Be located at the nozzle apparatus for initializing 7 in the opening 32, have preparation applying mechanism 73.Preparation applying mechanism 73 comprises: the rotating mechanism 730 that generates rotary driving force; Roller 731 by rotating mechanism 730 rotations; Roller 731 is received into the inner basket that is roughly box-shaped 732; Scrape off the liquid scraper 733 of the attachment of roller 731.
Roller 731, the mode of exposing a part with peristome above basket 732 disposes, and its cylinder sides becomes the applicator surface of coating resist liquid.In substrate board treatment 1, in the preparation coating is handled, spray the resist liquid from slit jet nozzle 41 to roller 731, in addition, so-called preparation coating is handled, be meant that before formal coating is handled by a spot of resist liquid of slit jet nozzle 41 ejections from the top that moves to roller 731, preparation property ground applies the processing of resist liquid on roller 731.In the substrate board treatment 1 of this form of implementation, to handle by the preparation coating, the state that makes slit jet nozzle 41 is along the Y direction homogenising.
The applicator surface of roller 731 is impregnated in the cleaning fluid of storing below basket 732 inside.That is, the applicator surface of coating resist liquid moves to the below by whirligig 730 in the preparation coating is handled, and utilizes cleaning fluid to clean.In addition, after the cleaning, utilize liquid scraper 733 to scrape off attached to the pollutant on the applicator surface that from cleaning fluid, is pulled up.Like this, roller 731 revolve turn around during in, applicator surface returns to the state of cleaning, when utilizing slit jet nozzle 41 to prepare coating to handle, can not pollute slit jet nozzle 41.
In addition, nozzle initialization mechanism 7 has nozzle cleaning mechanism 70.Fig. 3 is the view of the structure of expression nozzle cleaning mechanism 70.Nozzle cleaning mechanism 70 comprises: gas organization of supply 71, attraction mechanism 72, cleaning part 74, cleaning fluid organization of supply 75 and driving mechanism 76 are a kind of mechanisms that foregoing nozzle cleaning is handled that mainly carry out.In addition, though in Fig. 3, omitted diagram, but gas organization of supply 71, attraction mechanism 72, cleaning fluid organization of supply 75 and driving mechanism 76, be connected under the state that can carry out signal acceptance and transmission with control part 8 respectively, described these each mechanism is by controlling from the control signal of control part 8.
Gas organization of supply 71 is via the mechanism of supply pipe arrangement to cleaning part 74 the supply of nitrogen from not shown pump.Be supplied to the nitrogen of cleaning part 74, from the direction ejection (back detailed description) of gas nozzle 710 to regulation.In addition, in the substrate board treatment 1 of this form of implementation, use nitrogen as inert gas, but inert gas is not limited to nitrogen.In addition, so long as the gas of cleaning gets final product, also can utilize air (compressed air: pressurized air).
Attracting mechanism 72, is a kind of via the mechanism of discarded pipe arrangement from the resist liquid being located at attraction mouth 720 (Fig. 5) on the cleaning part 74 and attracting cleaning fluid and removed by cleaning fluid etc.As attracting mechanism 72, can adopt general known mechanism in the prior art in addition.For example can be the mechanism that utilizes vacuum generating device and compressor to attract, also can be the mechanism that is made of suction pump and gas-liquid separation BOX (case) etc.In addition, for example, also can use the exhaust equipment that is arranged in the factory as long as can obtain required making firmly.
Cleaning part 74, mainly constitute, have in nozzle cleaning is handled, to clean and remove owing to formally apply repeatedly and handle and attached to the function of the resist liquid of the leading section side of slit jet nozzle 41 by pedestal 740, distance piece 741, ejection portion 742, guide pad 743, supporting member 744.
Play pedestal 740, be connected, can move back and forth along Y direction by driving mechanism 76 with driving mechanism 76 as the base effect of each structure of cleaning part 74.
Like this, be replaced with the different distance piece of thickness with distance piece 741 between the ejection portion 742, can adjust the position of ejection portion 742 on Z-direction by suitably being configured in pedestal 740.As will be described, on the position of the regulation of ejection portion 742, washer jet 750 is set, adjusts the position of the Z-direction of ejection portion 742, be equivalent to adjust the height and position (position of Z-direction) of washer jet 750.Thereby the nozzle cleaning mechanism 70 in this form of implementation can be along the supply position of Z-direction adjustment by the cleaning fluid of cleaning fluid organization of supply 75 supplies.
Fig. 4 is the front view of the subtend face 742a of ejection portion 742.Ejection portion 742 is with gas nozzle 710 and washer jet 750 member with the regulation of the position relation configuration of regulation.Whereby, decision is reached the supply position of the cleaning fluid of being supplied by washer jet 750 by the supply position of the nitrogen of gas nozzle 710 supplies.In addition, the Z1 to Z4 among Fig. 4 is illustrated in the coordinate of the Z-direction of gas nozzle 710 on the subtend face 742a and washer jet 750.In addition, the ejection portion 742 in this form of implementation uniformly-spaced limiting Z1 to Z4, but is not limited thereto.
With the subtend face 742a of the leading section subtend of slit jet nozzle 41 configuration,, become the inclined-plane of inclination that has the angle of regulation with respect to the YZ plane corresponding to the inclination of the leading section of slit jet nozzle 41.As shown in Figure 3, gas nozzle 710 and washer jet 750 are distributed on the subtend face 742a, are connected with gas organization of supply 71 and cleaning fluid organization of supply 75 respectively.
Spray the nitrogen of supplying by gas organization of supply 71 to slit jet nozzle 41 from gas nozzle 710.Whereby, make expeditiously by the nozzle cleaning processing attached to the volatilization of the cleaning fluid on the slit jet nozzle 41 (perhaps blowing away).In addition, the cleaning fluid that gushes out from washer jet 750, by with slit jet nozzle 41 collisions, the high slightly position of height and position to than ejection time of dispersing.In the substrate board treatment 1 of this form of implementation, as shown in Figure 4, gas nozzle 710 is arranged on the top of washer jet 750, thereby makes the supply position of the nitrogen that utilizes gas nozzle 710 supply be positioned at the top of the position of dispersing of cleaning fluid.Whereby, in the dry processing of nozzle, can efficient more make slit jet nozzle 41 dryings in the highland.
In addition, gas nozzle 710 is made of below gas nozzle 710a and top gas nozzle 710b.On subtend face 742a, below gas nozzle 710a is configured on the height and position of Z3, and top gas nozzle 710b is configured on the height and position of Z4 of top of below gas nozzle 710a.
In addition, washer jet 750 is made of below washer jet 750a and top washer jet 750b.On subtend face 742a, below washer jet 750a is configured on the height and position of Z1, and top washer jet 750b is configured on the height and position of Z2 of top of below washer jet 750a.
Fig. 5 is the stereogram of the guide pad 743 of expression cleaning part 74.Guide pad 743 is to have along the Y direction uniform rod member in cross section basically, the thickness of its X-direction, and for the width (width of X-direction) of the ejiction opening 41a of slit jet nozzle 41 or more than it, and, less than the width of the X-direction of supporting member 744.
In addition, the upper surface of guide pad 743 constitutes the approaching face 743a near the leading section of slit jet nozzle 41.Approaching face 743a is towards the crooked downwards curved surface in the two ends of X-direction.In addition, in the side of guide pad 743, relative with ejection portion 742 to face, become spigot surface 743b with YZ plane almost parallel.Spigot surface 743 leaves distance with ejection portion 742, forms the space between them.
The supporting member 744 of (Y side) in a pair of supporting member 744 is provided with and attracts mouth 720, is connected with attracting mechanism 72 (Fig. 3) via previously described discarded pipe arrangement.Attracting mouth 720 is the holes that connect supporting member 744, is arranged on the below of the guide pad 743 that is installed on the supporting member 744.
Whereby, when attracting mechanism 72 to begin to attract, attract the following side space of guide pad 743.In addition, also can attract mouth 720, attract mechanism 72 to constitute from the mode that all directions attract according on two supporting members 744, being provided with.
Return Fig. 3, cleaning fluid organization of supply 75 is the mechanisms that are made of soda liquor container and liquid-feeding pump etc., supplies cleaning fluids via the supply pipe arrangement to cleaning part 74.
Driving mechanism 76 is to make cleaning part 74 along mechanism that Y direction moves.As driving mechanism 76, can adopt the general Direct Action Type mechanism that utilizes rotation motor and ball-screw.Fig. 6 is the state that moves of expression ejection portion 742 and the view of slit jet nozzle 41.In addition, the position of slit jet nozzle 41 shown in Figure 6 is referred to as " cleaning positions " below.
Like this, move back and forth along Y direction with respect to the leading section of the slit jet nozzle 41 that is positioned at cleaning positions by ejection portion 742, gas nozzle 710 and the washer jet 750 of being located at ejection portion 742 scan at the leading section of slit jet nozzle 41.In addition, driving mechanism 76 not only makes the action of carrying out at cleaning part 74 scanning slit jet nozzles 41, but also the action that cleaning part 74 is kept out of the way from the below of slit jet nozzle 41.Whereby, the leading section of slit jet nozzle 41 be inserted into that the back will describe treat in the machine barrel 77 time, cleaning part 74 can not disturb mutually with slit jet nozzle 41.
Returning Fig. 2, treat machine barrel 77, is the member that has with the roughly box-shaped of the substantially the same size of width of the length direction of slit jet nozzle 41.Solvent at the internal storage resist liquid for the treatment of machine barrel 77.Treating machine barrel 77, is formally not apply under the situation of processing in the long time, goes bad and the mechanism of setting near the resist liquid the particularly ejiction opening 41a that makes slit jet nozzle 41 is moist.
On the upper surface for the treatment of machine barrel 77, the peristome that the leading section of slit jet nozzle 41 is inserted into inner usefulness is set.Slit jet nozzle 41 further moves to the assigned position (below be referred to as " position of readiness ") of decline along Z-direction from cleaning positions in standby.When slit jet nozzle 41 was in this position of readiness, the leading section of slit jet nozzle 41 became the state that is inserted into the inside for the treatment of machine barrel 77 from peristome, by being exposed in the solvent environment, suppressed the drying of resist liquid.
Return Fig. 1, control part 8, its inside comprises: according to the various operation of data of routine processes portion 80; The storage part 81 of save routine and various data.In addition, the operating portion 82 of operator be equipped with on front surface, to the necessary indication usefulness of substrate board treatment 1 input; And the display part 83 that shows various data.
Control part 8 in Fig. 1, is electrically connected with each mechanism that is attached to main body 2 by not shown cable.Control part 8, according to from the input signal of operating portion 82 and from the signal of each not shown sensor etc., the lifting action that control is undertaken by lift 43,44, the shift action that is undertaken by travel mechanism 5, the resist liquid supply action of being undertaken by resist liquid organization of supply 6.And then, control the action of each driving mechanism, each rotating mechanism and each nozzle etc. of nozzle initialization mechanism 7, particularly control the supply flow of gas organization of supply 71 and cleaning fluid organization of supply 75.
In addition, specifically, temporarily store the RAM of data, the ROM that reads special use and disk set etc. and be equivalent to storage part 81.Perhaps, also can be mediums such as portable photomagneto disk and storage card, and their reading device etc.In addition, knob and Switch (comprising keyboard and mouse etc.) are equivalent to operating portion 82.Perhaps, also being, have the mechanism of the function of display part 83 concurrently as touch panel display.LCD and various lamps etc. are equivalent to display part 83.
The function and the structure of the substrate board treatment 1 in this form of implementation more than have been described.
Action (nozzle cleaning processing) when secondly, cleaning the leading section of slit jet nozzles 41 at nozzle cleaning mechanism 70 describes.Fig. 7 to Fig. 9 is the view of the state of expression nozzle cleaning processing.The position of the slit jet nozzle 41 among Fig. 7 to Fig. 9 is cleaning positions.In addition,, omitted diagram, simultaneously, represented guide pad 743 and slit jet nozzle 41 with profile type at supporting member 77 7 to Fig. 9.
At first, before nozzle cleaning was handled, control part 8 made the cleaning part 74 of keeping out of the way state move to the position of slit jet nozzle 41 being carried out cleaning treatment by control driving mechanism 76.In addition, control part 8, parallel with this processing, by control elevating mechanism 43,44 and travel mechanism 5, make slit jet nozzle 41 move to cleaning positions.
Thus, slit jet nozzle 41 and cleaning part 74 become configuration relation shown in Figure 7.At this moment, as shown in Figure 7,, handle owing to carried out coating repeatedly, and be attached with resist liquid in the leading section side of slit jet nozzle 41.In addition, in the substrate board treatment 1 of this form of implementation, in nozzle cleaning is handled, limit the cleaning positions of slit jet nozzle 41 in the lower end of slit jet nozzle 41 and the distance of the approaching face 743a of guide pad 743 (near the apart from) mode of about 1.5mm, certainly, be not limited thereto.Suitably set in advance according to the character of employed cleaning fluid and ejection flow etc. near distance.
By shift action so far, when nozzle cleaning handle ready the time, the state of opening by valve is become, the supply of cleaning fluid organization of supply 75 beginning cleaning fluids, as shown in Figure 8, washer jet 750 is to the leading section side of slit jet nozzle 41 ejection cleaning fluid.Parallel with the action of washer jet 750 ejection cleaning fluids, attract mechanism 72 to begin to attract from attracting mouth 720.
Figure 10 is the enlarged drawing of state shown in Figure 8.As shown in figure 10, from below washer jet 750a and top washer jet 750b ejection cleaning fluid (rinsing liquid LQ), the rinsing liquid LQ that gushes out, by with the leading section side collision of slit jet nozzle 41, carry out the cleaning of slit jet nozzle 41.
At this moment, by the rinsing liquid LQ that gushes out from below washer jet 750a, attached to the resist liquid R dissolving of the leading section side of slit jet nozzle 41.Whereby, on the leading section side of slit jet nozzle 41, exist the mixed liquor (concentration of resist liquid R is compared higher mixed liquor) of resist liquid R and rinsing liquid LQ.In existing mechanism, because the height and position of washer jet does not become jump ground to dispose, so owing to this mixed liquor forms as shown in figure 23 attachment RL.
But the substrate board treatment 1 of this form of implementation except that the washer jet 750a of below, also is equipped with top washer jet 750b.Thereby as shown in figure 10, by top washer jet 750b, than by below the higher position supply rinsing liquid LQ of supply position of rinsing liquid LQ of washer jet 750a supply.
That is, can be with rinsing liquid LQ by top remover liquid nozzle 750b supply, the mixed liquor by below washer jet 750a supply rinsing liquid LQ generates further washes downwards from the top.Thereby attachment RL that can residual strip resemble the existing apparatus improves the cleaning performance of nozzle cleaning in handling, so can recover the state of slit jet nozzle 41 well.
Rinsing liquid LQ by washer jet 750 gushes out flows downwards along the leading section side of slit jet nozzle 41, on the lower surface of its part attached to slit jet nozzle 41.But, attached to the rinsing liquid LQ on the lower surface of slit jet nozzle 41,, promptly be directed, and flow to the spigot surface 743b of both sides along approaching face 743a by contacting with approaching face 743a.Flow and the lower surface of cleaning slit jet nozzle 41 by this, simultaneously, the resist liquid R that is dissolved by rinsing liquid LQ is promptly removed.And then rinsing liquid LQ is directed to the spigot surface 743b guiding of piece 743 and flows to the below.
Like this, become crooked curved surface downwards by approaching face 743a, cleaning part 74 can promptly be discharged rinsing liquid LQ.In addition, have the spigot surface 743b that the rinsing liquid LQ by 75 supplies of cleaning fluid organization of supply is guided downwards, can promptly will discharge attached to the rinsing liquid LQ on the lower surface of slit jet nozzle 41 by guide pad 743.
As previously described, during washer jet 750 ejection rinsing liquid LQ, utilize to attract mechanism 72 to carry out the attraction of the below of slit jet nozzle 41.By this attraction that attracts mechanism 72 to produce, as shown in figure 10, directly do not affact by guide pad 743 partitions near the ejiction opening 41a.That is, the rinsing liquid LQ that uses in the cleaning is attracted from the upper opening portion that is formed on the space between ejection portion 742 and the spigot surface 743b (along the peristome of the finedraw shape of Y direction).
Be filled into the resist liquid R in the slit jet nozzle 41, mainly by in that (power that Z) acts on the direction is drawn.But, attract the attraction of mechanism 72, shown in the arrow down of Figure 10, in the time of on affacting the position of leaving ejiction opening 41a, near ejiction opening 41a, this attraction mainly affacts X-direction, along (Z) directive effect attraction die down.
At cleaning part 74, the attraction force acts that attracts mechanism 72 is to (Z) position on the direction is limited by the position of the spigot surface 743b of guide pad 743.Thereby, the thickness of the X-direction by adjusting guide pad 743, can corrective action the (Z) attraction of direction to the ejiction opening 41a.
In the cleaning part 74 of this form of implementation, be predetermined the thickness of guide pad 743 near the mode of the roughly dwell point that becomes resist liquid R the ejiction opening 41a, whereby, suppress the outflow of resist liquid R.In addition, become the below of the leading section side of slit jet nozzle 41, remove rinsing liquid LQ, promptly be attracted and be discharged to the below attached to the resist liquid R on the leading section side by the position of attraction force acts.In addition, utilize the thickness of the X-direction of guide pad 743, the interval between regulation ejection portion 742 and the guide pad 743, but should be narrow more at interval attracts the attraction of mechanism 72 concentrated more, affacts the attraction increase on the leading section side of slit jet nozzle 41.
Whereby, nozzle cleaning mechanism 70 in this form of implementation, because the attraction of the attraction mechanism 72 on the resist liquid R of the thickness abated effect that can utilize guide pad 743 in the ejiction opening 41a, so compare with conventional device, even use a large amount of rinsing liquid LQ, by the attraction that attracts mechanism 72 is risen, can promptly attract to discharge employed rinsing liquid LQ.Thereby, can improve the cleaning performance in the nozzle cleaning processing.
Move from the supply of cleaning fluid organization of supply 75 supply rinsing liquid LQ, and walk abreast, carry out the scanning motion of cleaning part 74 by the attraction action that attracts mechanism 72 to carry out.That is, driving mechanism 76 makes the action that cleaning part 74 moves back and forth on the whole width of slit jet nozzle 41 along Y direction.
Whereby, on the whole width of the Y direction of whole slit jet nozzle 41,, carry out nozzle cleaning and handle from washer jet 750 ejection rinsing liquid LQ.Like this, carry out the scanning of being undertaken by cleaning part 74, for example, there is no need on the whole width of slit jet nozzle 41, to dispose washer jet, can make mechanism's miniaturization by utilizing driving mechanism 76.In addition, the number of times that carries out this scanning motion repeatedly is arbitrarily, according to the number of times of the formal coating processing of carrying out after carrying out previous nozzle cleaning processing and the character of employed resist liquid etc., is redefined for suitable value.
When the scanning motion of stipulated number finishes, cleaning fluid organization of supply 75 stop supplies rinsing liquid LQ.Thereby the ejection of the rinsing liquid LQ that is undertaken by washer jet 750 stops.And then gas organization of supply 71 beginning the supply of nitrogen are from gas nozzle 710 ejection nitrogen.In addition, during this period, the scanning motion of the cleaning part 74 that is undertaken by driving mechanism 76 also continues.
Like this, to the leading section of slit jet nozzle 41 ejection nitrogen, one side moves along Y direction by making cleaning part 74 one side, promotes attached to the rinsing liquid LQ drying on the slit jet nozzle 41 from gas nozzle 710.As shown in Figure 4, on the subtend face 742a of ejection portion 742, because whole gas nozzle 710 is arranged on than on the high position of whole washer jet 750, so gas nozzle 710 can be effectively to the regional the supply of nitrogen that adheres to rinsing liquid LQ.In addition, the scanning motion number of times that makes rinsing liquid LQ drying is also set for the value of regulation.
When the scanning motion of stipulated number finished, control part 8 stopped by making driving mechanism 76, and the scanning motion of cleaning part 74 is finished, and controlled gas organization of supply 71 simultaneously, stopped the supply of nitrogen.Thereby, stop the ejection of the nitrogen that undertaken by gas nozzle 710, be used to make the scanning motion of slit jet nozzle 41 dryings to finish.
Finish the nozzle cleaning of substrate board treatment 1 in this form of implementation handles by above action.After this external nozzle cleaning processing finishes, prepare coating at preparation applying mechanism 73 and handle, after the state of adjusting slit jet nozzle 41, formally apply processing.But the action after nozzle cleaning is handled is not limited thereto, and knows up to formally applying and handles spended time and get final product, and also can make slit jet nozzle 41 move to position of readiness, with the drying of the resist liquid R that prevents slit jet nozzle 41.That is,, make cleaning part 74 keep out of the way the below of slit jet nozzle 41, slit jet nozzle 41 is further descended from cleaning positions, leading section is exposed in the solvent environment for the treatment of in the machine barrel 77 by driving mechanism 76.
As mentioned above, in the substrate board treatment 1 in this form of implementation, shown in Fig. 7 waits, guide pad 743, the width of width or its above thickness with ejiction opening 41a of slit jet nozzle 41, and near the below of the ejiction opening 41a of configuration slit jet nozzle 41, attract the attraction mouth 720 of mechanism 72, by adjusting the attraction that attracts mechanism 72, so that attract by below from guide pad 743, become the roughly dwell point of resist liquid R near the ejiction opening 41a of slit jet nozzle 41, promptly discharge cleaning fluid and pollutant by attracting to discharge, and, can suppress to draw resist liquid R in the slit jet nozzle 41 from ejiction opening 41a.
In addition, guide pad 743 by having the spigot surface 743b that the rinsing liquid LQ by 75 supplies of cleaning fluid organization of supply is guided downwards, can more promptly be discharged employed rinsing liquid LQ.
In addition, by being equipped with the distance piece 741 of the supply position of adjusting the rinsing liquid LQ that supplies by cleaning fluid organization of supply 75, can according to circumstances change cleaning positions, so, for example, even under the different situation of scope that resist liquid R adheres to, also can tackle neatly.
In addition, the adjustment of supply position, the distance piece 741 that has specific thickness by dismounting is realized, need not complicated mechanism and just can be easy to realize.
In addition, by the driving mechanism that outfit makes cleaning part 74 move along the length direction of slit jet nozzle 41, can be with whole equipment miniaturization.
In addition, outfit is to the gas organization of supply 71 of leading section the supply of nitrogen of slit jet nozzle 41, by making the supply position of the nitrogen that utilizes 71 supplies of gas organization of supply, Billy uses the more close top of supply position of the rinsing liquid LQ of cleaning fluid organization of supply 75 supplies, can promote the drying of cleaning fluid.
In addition, by will be by the supply position of the rinsing liquid LQ of top remover liquid nozzle 750b supply with respect to supply position by the rinsing liquid LQ of below washer jet 750a supply, short transverse differently disposes, and can prevent that the attachment RL (Figure 23) of strip from remaining on the leading section side of slit jet nozzle 41.Thereby, can improve cleaning performance.
In addition, in the substrate board treatment 1 of this form of implementation, below washer jet 750a and top washer jet 750b spray rinsing liquid LQ simultaneously.But, for example, also can utilize the pipe arrangement of other system that below washer jet 750a is connected with cleaning fluid organization of supply 75 with top washer jet 750b, and control, make in the scanning on the outlet (scanning of the slit jet nozzle 41 that is undertaken by ejection portion 742), only carry out ejection, in the scanning on the path of returning, only carry out ejection by top washer jet 750b by below washer jet 750a.
Also can in one side when washer jet 750 ejection rinsing liquid LQ simultaneously scan, carry out the ejection of nitrogen concurrently in addition.In this case, we can say, owing to above washer jet 750, form the screen of nitrogen, disperse to the top of slit jet nozzle 41 so can prevent the mist etc. of rinsing liquid LQ.
2, second kind of form of implementation
In first kind of form of implementation, the attraction mouth 720 of attraction mechanism 72 is arranged on the below of ejiction opening 41a, from the below attraction rinsing liquid LQ of guide pad 743, but with the attraction position that attracts mechanism 72 to attract (position that attracts mouth is set), is not limited thereto.
Figure 11 is the view of expression based on the structure of the nozzle cleaning mechanism 70 in second kind of form of implementation of this principle formation.Figure 12 is the front view of the subtend face of second kind of ejection portion in the form of implementation.
A pair of subtend face 745b, as with the substantially parallel face of subtend face 745a, be arranged on the both sides of the Y direction of subtend face 745a.In addition, each subtend face 745b forms in the mode of comparison to the leading section side of the more approaching slit jet nozzle 41 that is positioned at cleaning positions of face 745a, is provided with respectively to attract mouthfuls 721.Attract mouth 721, attract in the mechanism 72 via attracting pipe arrangement to be connected to.
Figure 13 is illustrated in the nozzle cleaning processing of second kind of form of implementation, sprays the view of the state of rinsing liquid LQ from washer jet 750.In addition, the various piece among Figure 13, as with parallel plane of XZ in, the section of the face that intersects with subtend face 745a and illustrating.
In Figure 11, view omits, but on the distance piece 740 in this form of implementation, become guide pad 743 below upper edge, position Y direction be the finedraw shape outlet 740a that waste liquid is used be set, by guide pad 743 be directed to the below rinsing liquid LQ, discharged from outlet 740a.Whereby, can replenish by the attraction discharge that attracts output mechanism 72 to carry out.
Figure 14 is the view of the effect of the attraction mechanism 72 in second kind of form of implementation of explanation.In addition, the various piece of Figure 14, as with parallel plane of XZ in illustrate with the section that attracts mouthful 721 faces that intersect.
As shown in figure 14, in the substrate board treatment 1 in this form of implementation, owing to attract mouthfuls 721 sides that are positioned at the leading section of the slit jet nozzle 41 that is in cleaning positions, so, by the attraction that attracts mechanism 72, carry out from the side of the leading section of slit jet nozzle 41.Thereby, affact the attraction of the attraction mechanism 72 on the resist liquid R that is filled in the slit jet nozzle 41, compare with the situation that leading section below from slit jet nozzle 41 attracts, weakened.
Like this, substrate board treatment 1 in this form of implementation, to attract mouth 721 to be arranged on the subtend face 745b of ejection portion 745, carry out the attraction of rinsing liquid LQ by side from the leading section of slit jet nozzle 41, can adjust, make ejiction opening 41a near become the roughly dwell point of resist liquid R.Thereby, even increase the attraction that attracts mechanism 72, also can suppress resist liquid R is drawn out to the generation of the phenomenon outside the slit jet nozzle 41, so, the cleaning performance that nozzle cleaning is handled can be improved.
Subtend face 745b compares with subtend face 745a in addition, near the leading section side of slit jet nozzle 41.Thereby, by relatively Figure 13 and Figure 14 as can be seen, attract mouthfuls 721 to dispose than the leading section side of washer jet 750 more close slit jet nozzles 41.Like this, by attracting mouthful 721 leading section sides, can more effectively attract to discharge rinsing liquid LQ attached to this leading section side near slit jet nozzle 41.
Among this external Figure 14, for the purpose of view is convenient, with what represent as the mode that does not have rinsing liquid LQ around the guide pad 743, but in fact in two ends of cleaning part 74a, the part of the rinsing liquid LQ that will use in also will cleaning by guide pad 743 is directed to the below, discharges from outlet 740a.
As mentioned above, even in the substrate board treatment 1 of second kind of form of implementation, also will attract mouth 721 to be arranged on the side of the leading section of slit jet nozzle 41, by utilize the attraction that attracts mechanism 72 to carry out from this position, thereby it is the same with first kind of form of implementation, can be adjusted to ejiction opening 41a near become the dwell point roughly of resist liquid R, so, can obtain same effect.
In addition, discharge rinsing liquid LQ, not only utilize to attract mechanism 72 can discharge rinsing liquid LQ by the outlet 740a below the leading section of being located at slit jet nozzle 41, so, as attracting mechanism 72, the mechanism that can adopt low capacity.Perhaps, owing to can promptly discharge rinsing liquid LQ, so, can improve the cleaning performance that nozzle cleaning is handled.
In addition, by being equipped with the front end below that is configured in slit jet nozzle 41, having approaching face 743a that rinsing liquid LQ is guided and the guide pad 743 of spigot surface 743b downwards, can more effectively carry out the discharge of rinsing liquid LQ from outlet 740a.
In addition as shown in figure 11, the substrate board treatment 1 of this form of implementation does not use distance piece 741.That is, according to the required height and position of washer jet 750, distance piece 741 is not to be the member that must use, and it can be unloaded yet.In the cleaning part 74a of this form of implementation, carry out the Height Adjustment of ejection portion 745 by utilizing distance piece 741, also can adjust for the distance of the leading section side that attracts mouth 721 and slit jet nozzle 41.In this case, preferably this distance is adjusted to about 0.1～5mm.
In the substrate board treatment 1 of this form of implementation, adopt and the same guide pad 743 of substrate board treatment 1 of first kind of form of implementation.But, in this form of implementation, owing to do not carry out discharging from the attraction of outlet 740a, so, mainly discharge rinsing liquid LQ from outlet 740a by the effect of gravity.Whereby, affact on the ejiction opening 41a (Z) power of direction (becoming the power of the reason of drawing resist liquid R) is mainly gravity.Thereby, even guide pad 743 is along the relatively thinner tabular member of the thickness of X-direction, also can adjust, making becomes the roughly dwell point of resist liquid R near the ejiction opening 41a.
3, the third form of implementation
Above at the nozzle cleaning mechanism 70 of above-mentioned form of implementation, carrying out the situation that nozzle cleaning handles by mechanism's (cleaning part 74 and driving mechanism 76) of limit ejection cleaning fluid scan edge slit jet nozzle 41 is illustrated, but, as long as the mechanism that carries out the nozzle cleaning processing can clean the periphery of the ejiction opening 41a of slit jet nozzle 41 equably along Y direction, be not limited to this form.
Figure 15 is that expression is according to the view of the ejection portion 746 in the third form of implementation of this principle formation with the configuration relation of the slit jet nozzle 41 that is positioned at cleaning positions.As can be seen from Figure 15, the size of the Y direction of the ejection portion 746 of this form of implementation equates basically with the width of the Y direction of the ejiction opening 41a of slit jet nozzle 41.In addition, be not shown specifically among the figure, but identical therewith, for pedestal 740, distance piece 741, and guide pad 743, the size of Y direction is according to the width decision of the Y direction of ejiction opening 41a.
Promptly, the cleaning part 74b of the substrate board treatment 1 of the third form of implementation, have the size that equates basically along the width of Y direction with the ejiction opening 41a of slit jet nozzle 41, in this, different with the cleaning part 74 of the substrate board treatment 1 of first kind of form of implementation.In addition, for the structure outside the cleaning part 74b, because the substrate board treatment 1 with first kind of form of implementation is identical basically, so suitably omit its explanation.
Figure 16 is the front view of the subtend face 746a of ejection portion 746 in the third form of implementation.On subtend face 746a, configuration gas nozzle 710 and washer jet 750.Gas nozzle 710, on subtend face 746a, become washer jet 750 above height and position on, alignment arrangements on the whole width of Y direction.In addition, in washer jet 750, top washer jet 750b, on subtend face 746a, below becoming washer jet 750a above height and position on the whole width of Y direction alignment arrangements.
Below, simple explanation is carried out in processing to the nozzle cleaning in this form of implementation with said structure.At first, the supply of cleaning fluid organization of supply 75 beginning rinsing liquid LQ, whole washer jets 750 is to the leading section ejection rinsing liquid LQ of the slit jet nozzle 41 that is in cleaning positions.Parallel with this action, attract mechanism 72 to begin to attract.
Whereby, carry out the cleaning of the leading section of slit jet nozzle 41.Because the washer jet 750 of this form of implementation, on the whole substantially width of the Y direction of slit jet nozzle 41, be provided with, so for the whole zone of this leading section, cleaning treatment is almost carried out basically simultaneously.In addition, there is no need the action (scanning motion) that cleaning part 74b is moved by driving mechanism 76 along ejiction opening 41a as illustrated in the above-mentioned form of implementation.This processing (describing in the back) with ejection nitrogen is identical.That is, the driving mechanism 76 of the third form of implementation only has the function that when cleaning positions moves to position of readiness cleaning part 74b is kept out of the way at slit jet nozzle 41.
In addition, the rinsing liquid LQ that in nozzle cleaning is handled, uses, the same with first kind of form of implementation, when guiding downwards,, it is attracted rapidly to discharge by the attraction that attracts mechanism 72 by the approaching face 743a of guide pad 743 and spigot surface 743b.
In the substrate board treatment 1 of this form of implementation, also become the state that ejiction opening 41a is covered by guide pad 743, attract the attraction of mechanism 72 directly not affact on the ejiction opening 41a.That is, adjust make ejiction opening 41a near become the roughly dwell point of resist liquid R.
When begin ejection from washer jet 750 after, when the official hour, cleaning fluid organization of supply 75 stops the supply of rinsing liquid LQ, stops to utilize the ejection of the rinsing liquid LQ that washer jet 750 carries out.
Then, the supply of gas organization of supply 71 beginning nitrogen, whole gas nozzles 710 is to the leading section ejection nitrogen of slit jet nozzle 41.Thereby, promote drying attached to the rinsing liquid LQ on the leading section of slit jet nozzle 41.In addition, during the supply of carrying out nitrogen by gas organization of supply 71, the attraction that utilize to attract mechanism 72 to carry out is also proceeded, and for example, can promptly attract to discharge the mist of the rinsing liquid LQ that blows afloat by the environment of the composition that contains rinsing liquid LQ and by nitrogen etc.
When the official hour, gas organization of supply 71 stops the supply of nitrogen after gas nozzle 710 begins ejection, stops the ejection of the nitrogen that undertaken by gas nozzle 710.Thereby the nozzle cleaning of finishing this form of implementation is handled.
Like this, in the substrate board treatment 1 of this form of implementation,, carry out each operation that nozzle cleaning is handled simultaneously to the Y direction of slit jet nozzle 41.Thereby, can improve the uniformity of the Y direction of nozzle cleaning in handling, the state that can make the slit jet nozzle 41 after the cleaning is in the Y direction homogenising.
As mentioned above, in the substrate board treatment 1 of the third form of implementation, also same with first kind of form of implementation, can adjust the attraction that attracts mechanism 72, make the ejiction opening 41a of slit jet nozzle 41 become the roughly dwell point of resist liquid R, can obtain the effect same with above-mentioned form of implementation.
In addition, cleaning part 74b (ejection portion 746), has the roughly the same size of width with the Y direction of the ejiction opening 41a of slit jet nozzle 41, in ejection portion 746, by with gas nozzle 710 and washer jet 750, be configured on the whole width of ejiction opening 41a, can on the whole width of slit jet nozzle 41, spray rinsing liquid LQ simultaneously.Thereby, can shorten nozzle cleaning and handle the required time.
4, variation
Above, form of implementation of the present invention is illustrated, but the present invention is not limited to above-mentioned form of implementation, can carry out various distortion.
For example, can be as the substrate board treatment 1 of second kind of form of implementation, the structure that employing is drawn rinsing liquid LQ from the ejiction opening 41a side draught of slit jet nozzle 41, meanwhile, as the substrate board treatment 1 of the third form of implementation, adopt the structure of the whole substantially width of the Y direction of cleaning ejiction opening 41a simultaneously.In this case, can be on the subtend face 746a of ejection portion 746, than below on the position of washer jet 750a below more leaning on, the attraction mouth that is connected with attraction mechanism 72 is set.In addition, in this case, preferably will attract mouth to make the finedraw shape that extends along Y direction.
In addition, in the ejection portion 742 in first kind of form of implementation, washer jet 750a below the both sides of the Y direction of subtend face 742a are provided with, washer jet 750b above the central portion of the Y direction of subtend face 742a is provided with, but the configuration of washer jet 750 is not limited to this configuration.Figure 17 is the front view of the subtend face 742a of the ejection portion 742 in the variation.Also can be like this above the both sides of the Y direction of subtend face 742a are provided with washer jet 750b, washer jet 750a below the central portion of the Y direction of subtend face 742a is provided with.
In addition, the position of the Y direction of below washer jet 750a, can with the position consistency of the Y direction of top washer jet 750b.That is, in ejection portion 742,745,746, also top washer jet 750b can be configured in below washer jet 750a directly over.
In addition, the shape of the peristome of gas nozzle 710 and washer jet 750 is not limited to circle, also can have along the shape of the finedraw shape of Y direction extension.
Claims (15)
1, a kind of nozzle cleaning cleans the jetting nozzle that sprays predetermined process liquid from the ejiction opening of being located at leading section, it is characterized in that, comprising:
The cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle from ejiction opening;
Suction device, it passes through to attract the cleaning fluid of mouthful attraction by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply,
Adjust the attraction of aforementioned suction device, making becomes the roughly dwell point of aforementioned predetermined process liquid near the aforementioned ejiction opening.
2, nozzle cleaning as claimed in claim 1 is characterized in that, also comprises shading member, and the width of ejiction opening width or its above thickness that it has aforementioned jetting nozzle are configured near the below of ejiction opening of aforementioned jetting nozzle,
Attraction mouth by aforementioned suction device attracts from the below of aforementioned shading member, adjusts near the attraction of the aforementioned suction device the ejiction opening of aforementioned jetting nozzle.
3, nozzle cleaning as claimed in claim 2 is characterized in that, aforementioned shading member has the spigot surface that the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply is guided downwards.
4, nozzle cleaning as claimed in claim 1 is characterized in that, aforementioned suction device attracts by the leading section side from aforementioned jetting nozzle, adjusts near the attraction of the aforementioned suction device the ejiction opening of aforementioned jetting nozzle.
5, nozzle cleaning as claimed in claim 4 is characterized in that, the attraction mouth of aforementioned suction device is than the more close aforementioned jetting nozzle configuration of the ejiction opening of aforementioned cleaning fluid feeding mechanism.
6, nozzle cleaning as claimed in claim 4 is characterized in that, will be by the cleaning fluid of the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply, discharge from the outlet of the leading section below that is arranged on aforementioned jetting nozzle.
7, nozzle cleaning as claimed in claim 6, it is characterized in that, also be provided with guide member, the leading section below that it is configured in aforementioned jetting nozzle has the spigot surface that the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply is guided downwards.
8, nozzle cleaning as claimed in claim 1 is characterized in that, also is provided with adjusting device, and its adjustment utilizes the supply position of cleaning fluid of the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply.
9, nozzle cleaning as claimed in claim 8 is characterized in that, aforementioned adjusting device is the distance piece with thickness of regulation.
10, nozzle cleaning as claimed in claim 1 is characterized in that, the ejiction opening of aforementioned jetting nozzle is the finedraw that extends along the direction of regulation,
Also has the sweep mechanism that aforementioned cleaning fluid feeding mechanism is moved along the direction of aforementioned regulation.
11, nozzle cleaning as claimed in claim 1 is characterized in that, the ejiction opening of aforementioned jetting nozzle is the finedraw that extends along the direction of regulation,
Aforementioned cleaning fluid feeding mechanism on the whole width of the direction of the aforementioned regulation of the leading section of aforementioned jetting nozzle, is supplied the cleaning fluid of aforementioned regulation basically simultaneously.
12, nozzle cleaning as claimed in claim 1 is characterized in that, also comprises the gas supply device of the gas of stipulating to the leading section supply of aforementioned jetting nozzle,
Utilize the supply position of the aforementioned regulation gas of aforementioned gas supply device supply, be positioned at the top of supply position of the cleaning fluid of the aforementioned regulation of utilizing aforementioned cleaning fluid feeding mechanism supply.
13, a kind of nozzle cleaning cleans the jetting nozzle that sprays predetermined process liquid from the ejiction opening of being located at leading section, it is characterized in that, comprising:
The cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle;
Suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply,
Aforementioned cleaning fluid feeding mechanism has a plurality of washer jets that spray the cleaning fluid of aforementioned regulation to the leading section of aforementioned jetting nozzle,
Utilize in aforementioned a plurality of washer jet the supply position of cleaning fluid of the aforementioned regulation of at least one washer jet supply, the supply position with respect to the cleaning fluid of the aforementioned regulation of the washer jet supply that utilizes other disposes on the differing heights direction.
14, a kind of substrate board treatment, coating predetermined process liquid is characterized in that on substrate, comprising:
The holding device that keeps substrate;
Jetting nozzle, it is to the surface that remains on the substrate on the aforementioned holding device, from being located at the ejiction opening ejection predetermined process liquid of leading section;
Clean the nozzle cleaning of aforementioned jetting nozzle,
Aforementioned nozzle cleaning comprises:
The cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle,
Suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply,
Adjust the attraction of aforementioned suction device, making becomes the roughly dwell point of aforementioned predetermined process liquid near the aforementioned ejiction opening.
15, a kind of substrate board treatment, coating predetermined process liquid is characterized in that on substrate, comprising:
The holding device that keeps substrate;
Jetting nozzle, it is to the surface that remains on the substrate on the aforementioned holding device, from being located at the ejiction opening ejection predetermined process liquid of leading section;
Clean the nozzle cleaning of aforementioned jetting nozzle,
Aforementioned nozzle cleaning comprises:
The cleaning fluid feeding mechanism, it supplies the cleaning fluid of regulation near the leading section of aforementioned jetting nozzle;
Suction device, it attracts the cleaning fluid by the aforementioned regulation of aforementioned cleaning fluid feeding mechanism supply,
Aforementioned cleaning fluid feeding mechanism has a plurality of washer jets that spray the cleaning fluid of aforementioned regulation to the leading section of aforementioned jetting nozzle,
Utilize in aforementioned a plurality of washer jet the supply position of cleaning fluid of the aforementioned regulation of at least one washer jet supply, the supply position with the cleaning fluid of the aforementioned regulation of the washer jet supply that utilizes other disposes on the differing heights direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004080188A JP4451175B2 (en) | 2004-03-19 | 2004-03-19 | Nozzle cleaning apparatus and substrate processing apparatus |
| JP2004080188 | 2004-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1669680A true CN1669680A (en) | 2005-09-21 |
| CN100381216C CN100381216C (en) | 2008-04-16 |
Family
ID=35041240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100094086A Active CN100381216C (en) | 2004-03-19 | 2005-02-21 | Nozzle cleaning device and substrate treating device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4451175B2 (en) |
| KR (1) | KR100642666B1 (en) |
| CN (1) | CN100381216C (en) |
| TW (1) | TWI293578B (en) |
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-
2004
- 2004-03-19 JP JP2004080188A patent/JP4451175B2/en not_active Expired - Fee Related
-
2005
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- 2005-02-11 KR KR1020050011627A patent/KR100642666B1/en active IP Right Grant
- 2005-02-21 CN CNB2005100094086A patent/CN100381216C/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4451175B2 (en) | 2010-04-14 |
| TWI293578B (en) | 2008-02-21 |
| KR20060041868A (en) | 2006-05-12 |
| KR100642666B1 (en) | 2006-11-10 |
| TW200534925A (en) | 2005-11-01 |
| CN100381216C (en) | 2008-04-16 |
| JP2005262127A (en) | 2005-09-29 |
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Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
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Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |