CN1503007A - Film-coating method by means of film stress balance - Google Patents
Film-coating method by means of film stress balance Download PDFInfo
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- CN1503007A CN1503007A CNA021523002A CN02152300A CN1503007A CN 1503007 A CN1503007 A CN 1503007A CN A021523002 A CNA021523002 A CN A021523002A CN 02152300 A CN02152300 A CN 02152300A CN 1503007 A CN1503007 A CN 1503007A
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Abstract
A filming method used in optical components for maintaining the film stress balance of the positive and negative faces of an optical base plate includes the following steps: optical film layers are coated on the positive face of the plate with predesigned layers and thickness and stress compensation film layers are coated on the negative side with the same or similar layers to the predesigned one to enable its general thickness to approach to that on the positive to maintain the balance of the stress on both sides of an optical base plate.
Description
Technical field
The invention relates to a kind of film plating process, and particularly relevant for being applied on the optical module, keep the film plating process of membrane stress balance of the pro and con of an optical substrate.
Background technology
Along with the traffics such as mobile phone and internet increase rapidly, the Optical Fiber Transmission amount that connects between main line and metropolitan district also rises suddenly and sharply thereupon.The optical communication assembly explodes for satisfying transmission quantity, and the specification of capacity optics, physical strength, environmental suitability is strict day by day.For example Thin Film Filter (the thin film filter) thin layer used of dense wave division multipurpose (DWDM, Dense Wavelength Division Multiplexing) system often surpasses 100 layers, and the physics thickness is more than the 20 μ m.Originally do not need the problem of the membrane stress paid attention to very much, along with the increase of the film number of plies, problem is appeared in one's mind one by one in the process of making.
When the Thin Film Filter that dwdm system is used is made, generally must be earlier on a bigger base material, after having plated wherein simultaneously required thin layer, be ground to needed thickness again, then, plate another optical film, be generally anti-reflective film in the another side of this base material, at last, be cut to specification again.For example, as making Thin Film Filter, after having plated the more film of the number of plies, regular meeting finds the situation that thin layer comes off or substrate is cracked when cutting the circular base material of diameter 90mm.
Fig. 1 draws optical module produces stress after having plated thin layer possible case.After having comprised among the figure that base material plates optical thin film layer; may produce tension stress (tensile force) and pull open substrate; or generation compressive stress (compressive force) makes rete produce bubble; both produce suitable adverse influence to making; the Thin Film Filter of using as above-mentioned dwdm system; because the problem of thin layer stress, regular meeting finds the situation that thin layer comes off or substrate is cracked when cutting off.
Therefore, under the increasing situation of the number of plies of optical module plated film, solve the problem of thin layer stress, really do not allow to delay.
Summary of the invention
Therefore purpose of the present invention is providing a kind of film plating process exactly, with the problem that solves thin layer stress.
According to above-mentioned purpose of the present invention, a kind of film plating process is proposed, be applied on the optical module, be used for keeping the membrane stress balance of the pro and con of an optical substrate.This film plating process is described below: plate the optical thin film layer of a predetermined number of layers or thickness in the front of this optical substrate, plate the stress compensation rete of approximate predetermined number of layers or thickness at the reverse side of this optical substrate.
According to a preferred embodiment of the present invention, plate high index of refraction and low refractive index film layer in the front of optical substrate, plate the approximate thin layer of thickness at reverse side, this thin layer comprises stress compensation rete and another optical film, and wherein the stress compensation rete can utilize invalid layers design method or optimization to reach the purpose of the optical property of keeping the optical substrate front.
According to another preferred embodiment of the present invention, the places different with last preferred embodiment are, this embodiment does not only use around partly at the reverse side of substrate that (light does not penetrate) plates and positive stress compensation rete with approximate thickness, and middle desire uses partly (light can penetrate during use) only to plate the optical film of another original design.Advantage is and can drops to the possible factor of the original optical effect of reverse side coating influence minimum.
From the above, the present invention is not influencing under the original optical effect, use the proportional relation of film thickness and curved substrate degree, the different refractivity membraneous material plates the film of identical or approximate thickness at the usable front panel and reverse panel of optical module substrate, to keep the balance of the double-edged stress of substrate, just can solve the problem of thin layer stress.
Brief Description Of Drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
Fig. 1 draws optical module produces stress after having plated thin layer possible case;
Fig. 2 draws the instrumentation plan and the computing formula of a membrane stress;
Fig. 3 draws a kind of membrane stress balance film plating process synoptic diagram according to a preferred embodiment of the present invention; And
Fig. 4 draws a kind of membrane stress balance film plating process synoptic diagram according to another preferred embodiment of the present invention.
Embodiment
Do not limiting under spirit of the present invention and the range of application, below promptly with an embodiment, introduce enforcement of the present invention; Be familiar with the people of this art, after the spirit of understanding this creation, should use the various making that is installed on of the present invention.
Before narration embodiment, the applied principle of the present invention is described earlier.With reference to Fig. 2, it draws the instrumentation plan and the computing formula of a membrane stress.Comprise before the substrate film coating among the figure and the state behind the plated film, formula (a) then is to be used for describing this action, if r, σ, Δ δ, v in the hypothesis formula (a)
s, E
sWhen being fixed value, formula (a) can be reduced to df=Const* Δ δ, just film thickness and curved substrate degree are directly proportional.In other words, we obtain a conclusion, and when film thickness was big more, the curved substrate degree was big more.
The present invention plates the approximate film of thickness on the two sides of substrate, just can produce identical membrane stress on the two sides of substrate.
To use MEMS (micro electro mechanical system) (MEMS, Micro-Electro Mechanical Systems) technology with an optical module below the present invention and be fabricated to example, further explain orally principle of the present invention.
Please refer to Fig. 3, it draws a kind of membrane stress balance film plating process synoptic diagram according to a preferred embodiment of the present invention.Wherein represent a high-index material film that quarter-wave film is thick with H, L represents a low-index material film that quarter-wave film is thick.In other words, the thickness of H or L can change with the demand of different optical wavelengths.In the present embodiment,, plate the different permutation and combination of H or L, wherein total 56H and 83L in the front of substrate 10.Reverse side then plates anti-reflecting layer 14, is made up of 6H and 4L.Therefore, the tow sides difference 50H and 79L.
Plate the principle of the identical or approximate film of thickness according to the two sides of substrate of the present invention, on reverse side, during plated film, need add the thickness of 50H and 79L, just can make substrate 10 tow sides thickness identical.It should be noted that except tow sides thickness was identical, 50H that reverse side increases and the thickness of 79L must not influence original optical effect.To be that the H film with plural number is adjacent be plated in adjacent being plated in together of L film that reaches plural number together to method used in the present invention, optically just is considered as stress compensation rete 12.In other words, reverse side increases 50H and the approximate thickness of 79L, and the balance that just can keep two sides stress can not influence original optical effect again.Therefore, in the foregoing description, though the tow sides difference 50H and 79L, only 50H that increases at reverse side and the thickness of 78L or 80L is not exactly in order to influence original optical effect.In addition, the thickness of substrate both sides does not need the certain identical or only poor one deck of control, as long as substrate film coating produces the quality that stress can not influence optical module, reasonable difference does not depart from the scope of the present invention.
Please refer to Fig. 4, it draws a kind of membrane stress balance film plating process synoptic diagram according to another preferred embodiment of the present invention.A present embodiment and a last embodiment difference are the film plating process of reverse side.For example,, plate the different permutation and combination of H or L, wherein total 56H and 83L in the front of substrate 10.Reverse side at substrate 10 does not only use part 16 to plate and positive stress compensation rete 12 (for example 56H and 82L film) with same thickness around, and middle desire is used and partly plated anti-reflecting layer (not drawing).The film plating process of the reverse side of aforesaid substrate, be that using mask (mask) mode uses part 18 (light can penetrate during use) to block middle desire, only do not use part (light does not penetrate) to plate the stress compensation rete 12 of approximate thickness around, plate anti-reflecting layer after middle desire use mask (not drawing) partly being removed.The advantage of present embodiment is to drop to the possible factor of the original optical effect of reverse side coating influence minimum.
Specify that above-mentioned two embodiment can positive plate and plate reverse side again in substrate tow sides process of plating, or the pros and cons in-turn system be plating to finish till.For example, can be after 56H and 83L have been plated in the front of substrate, once plate the stress compensation rete of 50H and 78L at reverse side, add another optical film, be assumed to be antireflection rete (forming) by 6H and 4L alternate combinations.Another kind of mode plates 6H and 4L in the front, then also plate 6H and 4L at reverse side, in regular turn at positive, reverse side plated film, have 56H and 83L up to the front, and reverse side has 56H and 78L then, and the antireflection rete.Use the front to plate the method for plating reverse side again, simpler and easy certainly with regard to making, but possibly can't be suitable for all situations.For example, when the thickness of substrate is 50 μ m, and need plate 50 layer films (thickness 4 μ m), may substrate just can't bear the stress of film and be out of shape when the front plates 25 layer films in substrate front side, just need front reverse side alternate plating this moment, to keep the balance of the double-edged stress of substrate.
By the invention described above preferred embodiment as can be known, the present invention is not influencing under the original optical effect, use the proportional relation of film thickness and curved substrate degree, plate the film of the similar thickness or the close number of plies at the tow sides of optical module substrate, to keep the balance of the double-edged stress of substrate, just can solve the problem of thin layer stress.What specify is, the stress compensation rete of the invention described above preferred embodiment designs with optics method for makings such as invalid layers design method or optimizations, certainly, other is as utilizing the designed stress compensation retes that form of optics method for making such as storehouse mode, spiritual place all according to the invention.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; any person skilled in the art; without departing from the spirit and scope of the present invention; should do various changes and modification, so protection scope of the present invention should be with according to being as the criterion that claims were defined.
Claims (11)
1, a kind of film plating process is applied on the optical module, keeps the membrane stress balance of optical substrate institute coatings, it is characterized in that:
Plate the optical thin film layer of at least one predetermined thickness at first face of this optical substrate; And
Second face at this optical substrate plates at least one stress compensation rete to compensate the film thickness difference between this second and this first.
2, according to the described film plating process of claim 1, it is characterized in that: wherein the optical thin film layer of this predetermined thickness comprises high index of refraction or low refractive index film layer.
3, according to the described film plating process of claim 1, it is characterized in that: wherein this stress compensation rete designs with invalid layers design method or optimization, so that the optical property of first of this of this optical substrate is unaffected.
4, according to the described film plating process of claim 1, it is characterized in that: wherein this stress compensation rete plates the height refraction of plural number and the combination of low refractive index film layer on this optical substrate.
5, according to the described film plating process of claim 1, it is characterized in that: wherein second obsolete part at this optical substrate plates at least one stress compensation rete to compensate the film thickness difference between this second and this first.
6, according to the described film plating process of claim 5, it is characterized in that: wherein before this obsolete part of second of this optical substrate plates this stress compensation rete, use part need plate another optical film in this desire of second of this optical substrate.
7, according to the described film plating process of claim 5, it is characterized in that: wherein the desire of second of this of this optical substrate uses part need not plate any optical film.
8, a kind of optical assembly structure is characterized in that:
One optical substrate;
At least one optical thin film layer is positioned on first of this optical substrate; And
At least one stress compensation rete is positioned on second of this optical substrate, to compensate the film thickness difference between this second and this first.
9, according to the described optical assembly structure of claim 8, it is characterized in that: wherein this at least one stress compensation rete can be positioned at second not using partly, to compensate the film thickness difference between this second and this first.
10, according to the described optical assembly structure of claim 9, it is characterized in that: wherein the desire of second of this of this optical substrate uses part to plate another optical thin film layer.
11, according to the described optical assembly structure of claim 9, it is characterized in that: wherein the desire of second of this of this optical substrate uses part not plate any optical thin film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021523002A CN100394214C (en) | 2002-11-21 | 2002-11-21 | Film-coating method by means of film stress balance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021523002A CN100394214C (en) | 2002-11-21 | 2002-11-21 | Film-coating method by means of film stress balance |
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| CN1503007A true CN1503007A (en) | 2004-06-09 |
| CN100394214C CN100394214C (en) | 2008-06-11 |
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| CNB021523002A Expired - Fee Related CN100394214C (en) | 2002-11-21 | 2002-11-21 | Film-coating method by means of film stress balance |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100468081C (en) * | 2005-06-03 | 2009-03-11 | 鸿富锦精密工业（深圳）有限公司 | Optical components and preparation method |
| CN100580485C (en) * | 2004-07-09 | 2010-01-13 | 株式会社大真空 | Optical filter and method of manufacturing optical filter |
| CN101988988A (en) * | 2009-08-04 | 2011-03-23 | 精工爱普生株式会社 | Light deflector, method of manufacturing light deflector, and image display device |
| CN102016654A (en) * | 2008-06-25 | 2011-04-13 | 柯尼卡美能达精密光学株式会社 | Imaging optical system, and imaging lens manufacturing method |
| CN104412136A (en) * | 2012-10-26 | 2015-03-11 | 京瓷株式会社 | Optical filter member and imaging device provided with same |
| CN106847554A (en) * | 2017-02-14 | 2017-06-13 | 江南大学 | A kind of preparation method based on bacteria cellulose carrying nano silver line flexible electrode |
| CN110730717A (en) * | 2017-05-31 | 2020-01-24 | 日东电工株式会社 | Optical film, peeling method, and method for manufacturing optical display panel |
| CN112956003A (en) * | 2018-11-07 | 2021-06-11 | 东京毅力科创株式会社 | Film forming method and semiconductor manufacturing apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01234818A (en) * | 1988-03-15 | 1989-09-20 | Showa Denko Kk | Spectacle lens made of plastic |
| JPH06186403A (en) * | 1992-12-18 | 1994-07-08 | Olympus Optical Co Ltd | Multilayer film optical member |
| US6392775B1 (en) * | 1998-01-13 | 2002-05-21 | Seagate Technology Llc | Optical reflector for micro-machined mirrors |
| US6011646A (en) * | 1998-02-20 | 2000-01-04 | The Regents Of The Unviersity Of California | Method to adjust multilayer film stress induced deformation of optics |
| US6134049A (en) * | 1998-09-25 | 2000-10-17 | The Regents Of The University Of California | Method to adjust multilayer film stress induced deformation of optics |
-
2002
- 2002-11-21 CN CNB021523002A patent/CN100394214C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100580485C (en) * | 2004-07-09 | 2010-01-13 | 株式会社大真空 | Optical filter and method of manufacturing optical filter |
| CN100468081C (en) * | 2005-06-03 | 2009-03-11 | 鸿富锦精密工业（深圳）有限公司 | Optical components and preparation method |
| CN102016654A (en) * | 2008-06-25 | 2011-04-13 | 柯尼卡美能达精密光学株式会社 | Imaging optical system, and imaging lens manufacturing method |
| CN101988988A (en) * | 2009-08-04 | 2011-03-23 | 精工爱普生株式会社 | Light deflector, method of manufacturing light deflector, and image display device |
| CN101988988B (en) * | 2009-08-04 | 2015-08-26 | 精工爱普生株式会社 | The manufacture method of light deflector, light deflector and image display device |
| CN104412136A (en) * | 2012-10-26 | 2015-03-11 | 京瓷株式会社 | Optical filter member and imaging device provided with same |
| CN106847554A (en) * | 2017-02-14 | 2017-06-13 | 江南大学 | A kind of preparation method based on bacteria cellulose carrying nano silver line flexible electrode |
| CN110730717A (en) * | 2017-05-31 | 2020-01-24 | 日东电工株式会社 | Optical film, peeling method, and method for manufacturing optical display panel |
| CN112956003A (en) * | 2018-11-07 | 2021-06-11 | 东京毅力科创株式会社 | Film forming method and semiconductor manufacturing apparatus |
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| Publication number | Publication date |
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| CN100394214C (en) | 2008-06-11 |
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