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CN1598051A - Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings - Google Patents

Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings Download PDF

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Publication number
CN1598051A
CN1598051A CNA2004100577392A CN200410057739A CN1598051A CN 1598051 A CN1598051 A CN 1598051A CN A2004100577392 A CNA2004100577392 A CN A2004100577392A CN 200410057739 A CN200410057739 A CN 200410057739A CN 1598051 A CN1598051 A CN 1598051A
Authority
CN
China
Prior art keywords
described method
metallizing
current
coating
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004100577392A
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Chinese (zh)
Inventor
赫尔穆特·霍斯特赫姆克
安德烈亚斯·默比乌斯
马利斯·克莱因菲尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of CN1598051A publication Critical patent/CN1598051A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38Chromatising
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method for the selective or complete rendering inert of substrates, workpieces, and components of the apparatus in the chemical deposition of metals by depositing nonreactive coatings thereon. A coating which is nonreactive with respect to the subsequent plating is electrolytically deposited on the sites of the substrate which are not to be plated from a solution containing an activator and an electrolyte. The inert, nonreactive coating is removable by means of dilute acids or alkaline media, without manual effort, after the subsequent chemical plating of the substrates, workpieces, or unit parts.

Description

By the reaction coating selectivity not or the method for passivation workpiece and equipment unit fully
Technical field
The present invention relates to by means of the not reaction coating in the electroless plating process of metal the method for selectivity or complete passivation matrix, workpiece and equipment unit.
Background technology
Except the electrolytic process of groundwork coated materials metal, known for a long time also have so-called no current cladding process (electroless plating).No foreign current or to also have chemical metallizing to be interpreted as nearly all metal and many idioelectric chemical surfaces refining.Different fully with plating metallizing coating on its chemistry and mechanical features.Therefore, currentless washing relates to the autocatalytically process.In this coating process, produce reaction on the surface of katalysis.In this case, the metal ion that contains in the sedimentation tank (electrolytic solution) is reduced into metal element, falls and the reductive agent that contains in electrolytic solution at least is oxidized.
Therefore, for matrix, workpiece or equipment unit adopt the selective coating of metal, need the not zone of metallizing, adopt the non electrically conductive material at that time of no katalysis to cover or passivation.From the known chemical nickel plating method of prior art as can be seen, each parts of the process device that uses, for example as the container of sedimentation tank, the support of the coating matrix of etc., want before use passivation, to avoid undesirable coating to have nickel and to cause the unnecessary consumption of electrolytic solution for this reason.For this reason, most of equipment unit of forming by stainless steel, for example as groove, pump, well heater or agitator etc. are handled passivation by concentrated nitric acid usually.In addition, for keeping passive state, on equipment unit, also anode potential to be set.Although these measures are arranged, still need by certain time interval nitric acid re-treatment.Yet for coating operation, not only time-consuming cost but also high because on the one hand necessary breaks in production because nitric acid is a kind of Hazardous substances, also must be taked to spend very high security measures on the other hand, prevents that environment and personnel from coming to harm.
In addition, known in the method for prior art, the workpiece not this covering in metallizing zone is generally undertaken by use lacquer or plastic material.Yet selectivity covers or these methods of passivation need the very high expense relevant with process equally.Thus, the most residual materials that can't utilize again of possible passivation layer of removing later and removing cause very high cleaning up cost.
Summary of the invention
Therefore purpose of the present invention is to provide a kind of method, be used for process in the no current coating of metal, in matrix, optionally or fully constitute a passivating coating on workpiece or the equipment unit, the chemistry metal deposition process can on this coating, not carry out, wherein, avoided workpiece or equipment unit definite zone unwanted coating and need not increase expense and time, wherein, the method that is used for the currentless deposition of metal can not have the nitric acid operation.
This purpose is achieved by a kind of method according to the present invention, this method is used for the process in metal deposition, with matrix, workpiece or equipment unit are optionally or fully passivation, matrix, activated solution is adopted in the processing of workpiece or equipment unit, the passivation layer of electrolytic deposition one viscosity on the zone of metallizing not.
By according to method of the present invention, eliminated in the prior art in the known defective in the metallizing optionally of the electrolytic deposition by passivation layer.In addition, can adopt the method for no nitric acid.The average coating time implements obviously to obtain shortening by the simplification of passivation, and cleaning up cost drops to bottom line, has obviously improved the economy of process thus.This point particularly is embodied on the composition with advantage of the employed electrolytic solution of passivation.True show unexpectedly, particularly contain the electrolytic solution of chromium by use, can be in matrix electrolysis deposit passivation layer on the zone of metallizing not, this layer at the representative metal of electroless plating as nickel, copper, silver, gold, tin, lead, zinc, palladium, bismuth, cobalt shows the characteristic of complete passivation in the process solution of platinum etc.Even with not as (for example workpiece or equipment unit etc. not the zone of coating) in the electrically contacting of the surface of the autocatalytic reaction of metal currentless deposition, can not activate yet, and therefore can not occur passive area yet and do not wish the coating that occurs.
Coating according to selectivity of the present invention or passivation is fully carried out on extremely different matrix with can having advantage.Therefore, the coating of workpiece or equipment unit can or also have plastics to form by metal and/or metallic compound, and wherein, plastics are in advance according to the additive method metallizing.This metallizing can partly or optionally carry out.
Another advantage according to the inventive method is that the deposition process of metal can constitute according to passivation of the present invention more economically by employed equipment unit.What have advantage is, by passivation to container with the electrolytic solution that is used for the no current metallizing, the mean life of electrolyzer, the enforcement of obvious prolongation and metallizing obtained simplifying, because wherein cancelled to keeping passive state that anode potential is set.For this reason, can limit security measures and corresponding cost is dropped to bottom line.What have advantage is, particularly equipment unit is carried out passivation, and for example as the container of sedimentation tank or have the not support of the coated workpieces of wanting of reaction surface, it is by metal and/or metallic compound, and preferably steel is especially preferably made by stainless steel.This passivation can be used as the very low material of this cost of existing steel and replace very expensive stainless steel.
According to which matrix needs by the selectivity passivation separately metallizing or metal level needs have which bells and whistles, matrix was activated before passivation.This point is necessary on non-conductive matrix particularly.The activation of matrix can be carried out according to the conventional method.What have advantage is that activation can be carried out simultaneously with passivation step.Fasten from this pass, fact proved that what have advantage is will be used for the electrolytic solution that passivation prepares and mix fluorochemical and/or fluorine-containing compound, so that make material surface, particularly stainless steel surface reaches enough activation, guarantees to have a kind of viscous coating of passivation layer thus.
Passivating process is by from the suitable electrolytic solution that preferably has chromium, and by applying under the anodic current, the electrolytic deposition of responding layer is not finished.Be generally the layer (particularly in so-called chromium groove) that deposition has chromium, require temperature in 40-70 ℃ of scope, current density is at 10-50A/dm 2In the scope.Yet because can cause total current to increase thus, this is not under any circumstance or all is a suitable expense concerning any passivating process, so fact proved that what have advantage is that passivation layer deposits in the less current density range.Have a kind of electrolytic solution of being to use of advantage, it can be at low temperatures, and preferably in 15-40 ℃ the scope, current density is at 10A/dm 2Below, be preferably in 5A/dm 2Below, produce a kind of viscous coating of responding layer not that has according to the present invention.This point can be described as so-called low temperature chromium groove.Also can use the chromium groove of other structures on chromium-(III)-compound basis in principle, for example be the groove of Trichrolyte as the Enthone Business Name.
Matrix not passive area no current metallizing subsequently can be carried out according to traditional way.What have advantage is to use employed electrolytic solution in the no current metallizing usually.
Selectivity applies passivation layer and can need not in a simple manner to start just can remove for this reason after the no current metallizing.Can be by immersing in the dilute acid, perhaps this acid constitutes dangerous to matrix, can use under the anodic current by immersing basic solution until removing passivation layer fully.
For describing the present invention in detail, introduce a kind of preferred implementation below, but the present invention is not limited thereto according to the inventive method.
Embodiment
Be used on matrix, making the not electrolytic solution of responding layer of selectivity according to the present invention at metal deposition process, by activated solution and one or more chromium base salt of the compound with fluorochemical and/or fluorine, preferably chromic acid or tervalent chromium cpd are formed in principle.
20 ℃ of groove temperature with apply 3A/dm 2Voltage under, from the electrolytic solution of following ingredients, deposit the smooth uniform coating of no bed thickness restriction:
200-300g/l chromium (VI) oxide compound
The 1-3g/l vitriol oil
0.02-0.03g/l fluorochemical
0.2-3g/l methylsulfonic acid or methylsulfonic acid derivative.
According to the inventive method and according to the application examples of electrolytic solution of the present invention is stainless steel coating, has and subsequently the relevant passivation chromium layer of metallizing.In this case, can cancel normally used impact type nickel groove in the prior art.Can adopt the chromium layer directly to select or complete coating.In another favourable application of foundation the inventive method and electrolytic solution, be used for the interior of the container coating of chemical metallizing groove, to prevent this face metallizing.In this case, can have advantage ground this container is added foundation electrolytic solution of the present invention until filling it up with, the container to chemical metallizing groove applies correspondent voltage subsequently.What have advantage in this case especially is, can abandon being container, pump, well heater, agitator etc. use very expensive stainless steel because by means of the surface of foundation electrolytic solution coating of the present invention with respect to the passivation of chromium coating metal trough.
The Another Application example is according in the method for the present invention or adopt according to electrolytic solution of the present invention, with bath outside after the chromium plating the inside zinc-plated.In addition, adopt according to method of the present invention or electrolytic solution, by the position nickel plating of selectivity passivation to weathering, and frayed face can chromium plating with ball valve.
In Another Application, can optionally apply the chromium layer of passivation to the heat exchanger component that the copper or the copper alloy of gas-heating apparatus are made, and for the rot-resistant reason, cavity has electroless nickel layer.The anti-awfully hot combustion gases in chromed external region, and the internal space of water flowing is water-fast or the corrosion of other heating agents.

Claims (12)

1. be used for the not reaction coating selectivity of metallochemistry deposition process or the method for complete coating substrate, workpiece or equipment unit, this process does not have nitric acid and carries out, and this method comprises activation step and in matrix electrolysis depositing adhesive responding layer not on the zone of metallizing not.
2. by the described method of claim 1, wherein, the metal of electroless plating is by copper, nickel, tin, cobalt, palladium, silver, at least a metal of gold or platinum composition group.
3. by claim 1 or 2 described methods, wherein, the preferred use of activation contains the solution of fluorochemical.
4. by one of claim 1-3 described method, wherein, use by metal and/or metallic compound workpiece or equipment unit that alloy or plastics constitute as matrix optimization.
5. by one of claim 1-4 described method, wherein, be zone-coating, the layer that deposition is made of the ionogen with chromium to non-no current metallizing.
6. by one of claim 1-5 described method, wherein, nonreactive layer is wanted on the zone of coating in matrix by electrolytic deposition by applying cathodic current.
7. by one of claim 1-6 described method, wherein, responding layer is not deposited in the less zone of current density.
8. by one of claim 1-7 described method, wherein, responding layer does not deposit at low temperatures.
9. by one of claim 1-8 described method, wherein, matrix is not carried out the no current metallizing subsequently by means of the zone of not responding layer passivation.
10. by one of claim 1-9 described method, wherein, if desired, then behind the no current metallizing, remove not responding layer.
11., wherein, behind the no current metallizing, carry out the not possible removal of responding layer by means of acid by one of claim 1-10 described method.
12., wherein, under anodic polarization, carrying out the not possible removal of responding layer by means of basic solution behind the no current metallizing by one of claim 1-10 described method.
CNA2004100577392A 2003-08-14 2004-08-16 Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings Pending CN1598051A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03018449A EP1507026A1 (en) 2003-08-14 2003-08-14 Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings
EP03018449.3 2003-08-14

Publications (1)

Publication Number Publication Date
CN1598051A true CN1598051A (en) 2005-03-23

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CNA2004100577392A Pending CN1598051A (en) 2003-08-14 2004-08-16 Process for selective or complete inertisation of workpieces and system parts by means of non-reactive platings

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US (1) US20050034996A1 (en)
EP (1) EP1507026A1 (en)
JP (1) JP3987514B2 (en)
CN (1) CN1598051A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019125747A (en) 2018-01-18 2019-07-25 株式会社東芝 Semiconductor device and method for manufacturing the same
US10668511B2 (en) * 2018-03-20 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method of cleaning process chamber

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2587651A (en) * 1945-12-22 1952-03-04 Floricel A Rojas Method and means for the electro-deposition of chromium
US2570174A (en) * 1947-11-12 1951-10-02 Gen Electric Metal cleaning and plating process
US3041257A (en) * 1960-08-25 1962-06-26 Westinghouse Electric Corp Chromium electroplating
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
US3592744A (en) * 1968-12-02 1971-07-13 Macdermid Inc Method of preventing rack plating in continuous plating cycle for nonconductive articles
DE2422076A1 (en) * 1973-08-30 1975-04-10 M & T Chemicals Inc PROCESS AND BATH FOR DEPOSITING CHROME
US4139942A (en) * 1977-12-16 1979-02-20 The Gillette Company Process for producing corrosion resistant carbon steel razor blades and products made thereby
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
ATE405694T1 (en) * 2000-11-11 2008-09-15 Enthone METHOD FOR ELECTROLYTIC DEPOSITION FROM A SOLUTION CONTAINING CHROME

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Publication number Publication date
JP3987514B2 (en) 2007-10-10
JP2005060843A (en) 2005-03-10
US20050034996A1 (en) 2005-02-17
EP1507026A1 (en) 2005-02-16

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Open date: 20050323