CN1546737A - One side electroplating method and apparatus therefor - Google Patents
One side electroplating method and apparatus therefor Download PDFInfo
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- CN1546737A CN1546737A CNA2003101089739A CN200310108973A CN1546737A CN 1546737 A CN1546737 A CN 1546737A CN A2003101089739 A CNA2003101089739 A CN A2003101089739A CN 200310108973 A CN200310108973 A CN 200310108973A CN 1546737 A CN1546737 A CN 1546737A
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Abstract
The invention relates to an one side electroplating method and apparatus, wherein the electroplating bath is provided with a voltage stabilization plate, a quantity limiting plate is arranged above the voltage stabilization plate and the electroplating bath port surface, a spout hole is arranged on the voltage stabilization plate and the quantity limiting plate for limiting the electric plating liquid, making the electric plating liquid flow out only through the spout hole on the quantity limiting plate, the electroplating is carried out through the mode wherein the galvanized object surface contacts the electroplating liquid.
Description
Technical field
The present invention relates to a kind of single face electric plating method, be specially adapted to the electroplated thing and need not the single face electric plating method and the device thereof that can carry out through special processing.
Background technology
As everyone knows, plating is a kind of electrolytic process, and the tinsel effect such as the anode of coated metal is provided, and electrolytic solution is generally the solion that is plating metal, plated body effect such as negative electrode.When between anode and the negative electrode in addition behind the voltage, attract the metal ion in the electrolytic solution to swim to negative electrode, promptly plating on plated body after the reduction.Simultaneously, the anodic metal dissolves again, to continue providing electrolytic solution more metal ion.Use insoluble anode in some cases, need add the additional metal ion that plating of electrolytic solution during plating.
Use the method that electrolytic reduction is reflected at a plating skim on the object, that uses at present has: general electrochemical plating (electroplating), composite plating method (composite plating), alloy plating method (alloyplating), local electroplating method (selectivc plating), an electrochemical plating (pen plating) etc.Owing to having the double effectiveness of decorating of protection, plate surface is widely used.Also have the plating of small part that other characteristics are provided, such as high conductivity, height light reflective or reduction toxicity, the most frequently used plated metal is nickel, chromium, tin, copper, silver and golden.
Traditional single face electro-plating method has two kinds of methods, a kind ofly is: the electroplated thing before immersion plating liquid, will be need not the galvanized side with patch on the sticker, tear patch after electroplated is finished off and the processing of removing photoresist.The problem of this method maximum is exactly at sticker and removes photoresist to handle and expend many Production Times, simultaneously because of using sticker and patch to make galvanized cost be difficult for reducing.
Another kind method is to adopt the light shield facture, and this method need be used many auxiliary instruments, add that to expend man-hour many, and efficient is low, so the unit cost of electronplate is very high.
Summary of the invention
In view of disappearance and the deficiency that above-mentioned traditional single face electro-plating method exists, the present invention proposes a kind of under the situation of not using patch and expensive light shield method, reaches the galvanized purpose of single face.
Be above-mentioned purpose, the present invention utilizes electroplating machine to finish single face and electroplates in the electroplating processes whole process.Electroplating machine comprises plating tank, is positioned at the plating tank on the electroplating machine, with plated body place plating tank top and with plating tank in electroplate liquid carry out electroplating processes.One voltage stabilizing plate is set, to hold the unlifting pressure that produces in whole plating tank Nei Shiyin electroplate liquid through input tube input electroplate liquid at electroplating machine in plating tank; Simultaneously be provided with the plate of limiting the quantity of above the voltage stabilizing plate with on the plating tank actinal surface; At the voltage stabilizing plate with limit the quantity of and be respectively equipped with the overflow weir of restriction electroplate liquid on the plate, make the electroplate liquid can only be by flowing out on the overflow weir on the plate of limiting the quantity of; Place the plate top of limiting the quantity of as plated body, then this electroplate liquid just contacts with plated body, and plated body is produced a buoyancy, allows plated body be affixed on the mode of electroplating liquid level with one side and suspends.The mode that the present invention promptly utilizes the plated body single face to contact with electroplate liquid is carried out galvanized, to reach the effect of single face plating.
Description of drawings
Fig. 1 is the synoptic diagram of the section of the inventive method apparatus structure.
Fig. 2 is the synoptic diagram of overlooking of the apparatus structure of the present invention's use.
Fig. 3 is the schematic perspective view of voltage stabilizing plate structure in the apparatus structure of the present invention's use.
The floor map of the plate structure of limiting the quantity of in the apparatus structure of Fig. 4 for the present invention's use.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
A kind of single face electro-plating method of the present invention, in the whole process of electroplating processes, utilize electroplating machine 10 to realize single face plating (as shown in Figure 1), it is by being positioned at the plating tank 20 on the electroplating machine 10, plated body 30 is placed it is contacted with the electroplate liquid 40 of groove realize electroplating processes.By the electrolytic process of electroplate liquid 40, provide plated body 30 to attract the metal ion in the electrolytic solution to swim to plated body 30 surfaces, promptly plating plated body 30 surfaces after the reduction.
Concrete grammar of the present invention is, by being located in the plating tank 20 voltage stabilizing plate 21, to hold at electroplating machine 10 by input tube 11 unlifting pressure that 12 input electroplate liquids 40,20 o'clock electroplate liquids 40 in whole plating tank produce through the input aperture; Simultaneously, above by voltage stabilizing plate 21 with on plating tank 20 actinal surfaces, be provided with a limit the quantity of plate 22 and on the voltage stabilizing plate 21 and the plate 22 of limiting the quantity of, be respectively equipped with the overflow weir 211 and the overflow weir 221 of restriction electroplate liquid 40, make the electroplate liquid 40 can only be by flowing out on the overflow weir 221 on the plate 22 of limiting the quantity of; Place plate 22 tops of limiting the quantity of as plated body 30, then electroplate liquid 40 just contacts with plated body 30, and plated body 30 is produced with a buoyancy, allows plated body 30 be affixed on the mode of electroplating liquid level with one side and suspends, and is galvanized to realize single face.
The device that a kind of single face electro-plating method of the present invention uses, comprise electroplating machine 10 and position plating tank 20, plated body 30, electroplate liquid 40 and electroplate liquid input tube 11 compositions thereon, it is by being provided with a voltage stabilizing plate 21 in plating tank 20, be provided with the plate 22 of limiting the quantity of with plating tank 20 actinal surfaces above it again, plated body 30 places plate 22 tops of limiting the quantity of, and is filled with electroplate liquid 40 in the plating tank 20.
The device that a kind of single face electro-plating method of the present invention uses, its voltage stabilizing plate 21 cross sections are the rectangular thing of ∏ font, input tube 11 is covered, its plane is provided with the overflow weir 211 that pluralizes, its aperture is being positioned at voltage stabilizing plate 21 intermediary for maximum, and the mode that reduces one by one to voltage stabilizing plate 21 two ends is arranged then.Can produce the pressure that an ensemble average rises as electroplate liquid 40 when overflow weir 211 flows out on voltage stabilizing plate 21.
The device that a kind of single face electro-plating method of the present invention uses, its plate 22 of limiting the quantity of is provided with overflow weir 221, and its hole width is not more than the width of plated body 30.And be provided with hole 222 by the plate 22 of limiting the quantity of and be fixed on the plating tank 20 through mounting block 223 plate 22 of will limiting the quantity of.
As mentioned above, owing to the plate 22 of limiting the quantity of is fixed on the plating tank 20, and the plate 22 of limiting the quantity of is provided with overflow weir 221; Therefore, via the 211 effusive electroplate liquids 40 of overflow weir on the voltage stabilizing plate 21, the overflow weir 221 on the plate 22 of limiting the quantity of limits its outflow direction and flow again, and electroplate liquid 40 can only upwards be released via the overflow weir on the plate 22 of limiting the quantity of 221.By the flow of control through overflow weir 221 effusive electroplate liquids 40, promptly may command is through the lifting height of overflow weir 221 effusive electroplate liquids 40.
And plated body 30 places when limiting the quantity of plate 22 tops, the height that rises when electroplate liquid 40 just contacts with electroplate liquid 40, then the pressure of electroplate liquid 40 risings produces a buoyancy to plated body 30, and plated body 30 is suspended on the electroplate liquid 40 in the mode that a single face is affixed on 40 of electroplate liquids; So far, the mode that contacts with electroplate liquid 40 with plated body 30 single faces of the present invention realizes that single face electroplates.
In sum, the invention process method is easy, and using appts is simple in structure, thing to be plated need not under the situation of pre-process, reaches the galvanized effect of single face.It is low that it has a cost, characteristics such as effective.
Claims (6)
1, single face electro-plating method, in the whole process of electroplating processes, utilize electroplating machine (10) to realize the single face plating, it is characterized in that: by being located at the voltage stabilizing plate (21) that is positioned at input tube (11) top in the plating tank (20), to hold at electroplating machine (10) through input tube (11) input electroplate liquid (40) unlifting pressure that electroplate liquid (40) produces when (20) in whole plating tank; Simultaneously by on voltage stabilizing plate (21) top and plating tank (20) actinal surface, being provided with a limit the quantity of plate (22) and on voltage stabilizing plate (21) and the plate of limiting the quantity of (22), be respectively equipped with overflow weir (211) and the overflow weir (221) of restriction electroplate liquid (40), make the electroplate liquid (40) can only be by upward outflow of the overflow weir (221) on the plate of limiting the quantity of (22); Place the plate of limiting the quantity of (22) top as plated body (30), then electroplate liquid (40) just contacts with plated body (30), and plated body (30) is produced with a buoyancy, allows plated body (30) be affixed on the mode of electroplating liquid level with one side and suspends, and electroplates to realize single face.
2, the device of single face electro-plating method use as claimed in claim 1, comprise electroplating machine (10) and position plating tank (20), plated body (30), electroplate liquid (40) and electroplate liquid input tube (11) composition thereon, it is characterized in that: in plating tank (20), be positioned at input tube (11) top one voltage stabilizing plate (21) is set, be provided with the plate (22) of limiting the quantity of with plating tank (20) actinal surface above it, plated body (30) places the plate of limiting the quantity of (22) top, and input has electroplate liquid (40) in the plating tank (20).
3, the device of single face electro-plating method use as claimed in claim 2, it is characterized in that: voltage stabilizing plate (21) is that its plane of rectangular thing that is the ∏ font is provided with the overflow weir (211) that pluralizes.
4, the device that uses as claim 2,3 described single face electro-plating methods, it is characterized in that: its aperture of overflow weir (211) is being positioned at voltage stabilizing plate (21) intermediary for maximum, and the mode that reduces one by one to voltage stabilizing plate (21) two ends is arranged on voltage stabilizing plate (20) plane then.
5, the device of single face electro-plating method use as claimed in claim 2, it is characterized in that: the plate of limiting the quantity of (22) is provided with overflow weir (221), and its hole width is not more than the width of plated body (30).
6, the device that uses of single face electro-plating method as claimed in claim 2 is characterized in that: the plate of limiting the quantity of (22) is provided with hole (222) and is fixed on the plating tank (20) through mounting block (223) plate (22) of will limiting the quantity of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101089739A CN1546737A (en) | 2003-11-28 | 2003-11-28 | One side electroplating method and apparatus therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101089739A CN1546737A (en) | 2003-11-28 | 2003-11-28 | One side electroplating method and apparatus therefor |
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| Publication Number | Publication Date |
|---|---|
| CN1546737A true CN1546737A (en) | 2004-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101089739A Pending CN1546737A (en) | 2003-11-28 | 2003-11-28 | One side electroplating method and apparatus therefor |
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| CN (1) | CN1546737A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900381B (en) * | 2006-07-04 | 2010-05-12 | 浙江大学 | Preparation device for single-sided anodized aluminum template |
| CN101481815B (en) * | 2008-12-30 | 2010-06-09 | 大连海事大学 | Fixture for single-film plating used in an inert environment |
| CN107604426A (en) * | 2007-12-04 | 2018-01-19 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| DE102020133581A1 (en) | 2020-12-15 | 2022-06-15 | Technische Universität Hamburg | Process and device for applying a nanolaminate to metallic workpieces |
-
2003
- 2003-11-28 CN CNA2003101089739A patent/CN1546737A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900381B (en) * | 2006-07-04 | 2010-05-12 | 浙江大学 | Preparation device for single-sided anodized aluminum template |
| CN107604426A (en) * | 2007-12-04 | 2018-01-19 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN107604426B (en) * | 2007-12-04 | 2019-08-30 | 株式会社荏原制作所 | Electroplanting device and electro-plating method |
| CN101481815B (en) * | 2008-12-30 | 2010-06-09 | 大连海事大学 | Fixture for single-film plating used in an inert environment |
| DE102020133581A1 (en) | 2020-12-15 | 2022-06-15 | Technische Universität Hamburg | Process and device for applying a nanolaminate to metallic workpieces |
| WO2022129231A1 (en) | 2020-12-15 | 2022-06-23 | Technische Universität Hamburg | Method for locally applying a metal nanolaminate in the region of a weld seam of a metal workpiece |
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