CN1404957A - Cadmium-free silver-base solder - Google Patents
Cadmium-free silver-base solder Download PDFInfo
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- CN1404957A CN1404957A CN 01141756 CN01141756A CN1404957A CN 1404957 A CN1404957 A CN 1404957A CN 01141756 CN01141756 CN 01141756 CN 01141756 A CN01141756 A CN 01141756A CN 1404957 A CN1404957 A CN 1404957A
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Abstract
The composition of cadmiumless silver base brazing filler metal comprises (wt%) Cu 21-23, Zn 17-21, Sn 4.5-5.5, Mn 1-7, Ni 0.5-2 and the rest is Ag. Said invention adopts high-frequency induction furnace heating equipment and argon protection to make smelting, then utilizes hot-pressing and cold-drawing process to obtain the wire material with diameter 2 mm. The brazing filler metal made up by said materials is undergone the process of heat treatment of 460 deg.C/1.5 hr, its room temp. tensile strength is 499-564 MPa, and the room temperature shearing strength of the flame heated or induction heated brazing diamond composite sheet hard alloy joint is 223-258 MPa.
Description
Technical field: the present invention relates to a kind of cadmium-free silver-base solder that is used for the soldering carbide alloy.
Background technology: at present, the silver-base solder that is used for carbide quartz welding has multiple, and (in January, 1999) of publishing according to Zhang Qiyun, Zhuan Hongshou chief editor, China Machine Press, " disclosed several more common silver-base solders were as Ag80Mn, BAg85Mn, Ag40CuZnNi, Ag45CuZnNi, BAg49CuZnMnNi, BAg50CuZnCdNi and BAg40CuZnCdNi in the soldering handbook.But, because during welding diamond compact drill bit, require the fusing point of solder must not be greater than 700 ℃, and can not contain malicious element cadmium (Cd), room temperature tensile strength is again greater than 216MPa, and therefore, these solders just can not carry out for the soldering of diamond compact drill bit; Wherein Ag80Mn, BAg85Mn, Ag40CuZnNi, Ag45CuZnNi and BAg49CuZnMnNi solder melting temperature are higher than 700 ℃, though and two kinds of solder melting temperatures of BAg50CuZnCdNi and BAg40CuZnCdNi are lower than 700 ℃, but, they all contain poisonous element cadmium (Cd), human body there is great injury, is not suitable for a large amount of uses.
Summary of the invention: in order to reduce the fusing point of solder, improve the room temperature tensile strength of solder, and make solder nontoxic, the composition of solder is (wt%): Cu 21～23, and Zn 17～21, and Sn 4.5～5.5, and Mn 1～7, and Ni 0.5～2, surplus Ag.The solder technology of preparing is identical with general silver-base solder, promptly at first adopts HF induction heating apparatus and carries out melting with argon shield, is cast into the casting rod of φ 12～15mm; Secondly, adopt hot extrusion method, once the casting rod of φ 12～15mm is processed into the silk material of φ 2mm; The 3rd, for guaranteeing the surface smoothness of solder wire material, carry out a cover die cold-drawn, the room temperature tensile strength of solder wire material is 499～564MPa under the cold-drawn state; At last, be to improve the plasticity of solder wire material, the convenient use can be carried out 460 ℃/1.5h heat treatment, and after the heat treatment, the room temperature tensile strength of solder wire material slightly reduces, and is 483～492MPa, but plasticity greatly improves, and is increased to 17～25% from 2%.The room temperature shearing strength of flame heat or induction brazing diamond compact carbide alloy joint is 223～258MPa.Solder of the present invention has the excellent comprehensive performance, has at first removed noxious material cadmium (Cd) in the solder composition, has protected operator's health safety effectively; Secondly, solder has high room temperature tensile strength; The 3rd, the fusing point of solder is lower than 700 ℃, so brazing temperature is lower than 750 ℃, has solved the problem that adopts the too high infringement diamond compact of other cadmium-free silver-base solder brazing temperature quality.The solder of development provides the oil field to use now, and this solder also can be used for the soldering of other carbide alloy member and copper alloy, steel etc.
The specific embodiment:
The solder composition:
| Embodiment | Composition (wt%) | Fusion temperature (℃) | Soldering composite sheet shearing strength of joint (Mpa) | ||||||
| ??Cu | ??Zn | ???Sn | ???Mn | ??Ni | ????Ag | Solidus | Liquidus curve | ||
| ????1 | ??21 | ??20 | ???5.5 | ???4 | ??1 | Surplus | ????599 | ????690 | ????223 |
| ????2 | ??22 | ??18 | ???4.5 | ???6 | ??0.5 | Surplus | ????625 | ????695 | ????226 |
| ????3 | ??23 | ??21 | ???5.5 | ???1 | ??2 | Surplus | ????615 | ????695 | ????238 |
| ????4 | ??22 | ??19 | ???5 | ???2 | ??1 | Surplus | ????615 | ????685 | ????238 |
| ????5 | ??22 | ??17 | ???5 | ???3 | ??1 | Surplus | ????625 | ????677 | ????258 |
| ????6 | ??22 | ??17 | ???5 | ???5 | ??1 | Surplus | ????625 | ????689 | ????238 |
| ????7 | ??22 | ??17 | ???5 | ???7 | ??1 | Surplus | ????645 | ????685 | ????224 |
| ????8 | ??21.5 | ??17 | ???4.8 | ???7 | ??1.5 | Surplus | ????648 | ????683 | ????232 |
| ????9 | ??22.5 | ??19.5 | ???4.6 | ???1.5 | ??2 | Surplus | ????617 | ????692 | ????239 |
| ????10 | ??21 | ??20.5 | ???5.1 | ???2.5 | ??0.8 | Surplus | ????622 | ????680 | ????255 |
| ????11 | ??21.8 | ??18 | ???5.3 | ???3 | ??1.2 | Surplus | ????623 | ????682 | ????246 |
| ????12 | ??22.2 | ??17.1 | ???5.2 | ???3.5 | ??1.1 | Surplus | ????625 | ????678 | ????254 |
| ????13 | ??23 | ??17.3 | ???4.9 | ???4.3 | ??0.9 | Surplus | ????620 | ????683 | ????238 |
| ????14 | ??22.7 | ??20 | ???5 | ???4 | ??0.7 | Surplus | ????619 | ????679 | ????243 |
| ????15 | ??21.9 | ??17.2 | ???5.4 | ???5.6 | ??1.4 | Surplus | ????638 | ????682 | ????246 |
| ????16 | ??21 | ??17.7 | ???4.7 | ???6.5 | ??0.6 | Surplus | ????629 | ????690 | ????247 |
| ????17 | ??22.3 | ??19 | ???4.5 | ???2 | ??1.8 | Surplus | ????619 | ????690 | ????232 |
| ????18 | ??21.7 | ??19.3 | ???5.5 | ???2.8 | ??1.3 | Surplus | ????623 | ????681 | ????255 |
| ????19 | ??23 | ??18.6 | ???4.5 | ???3.2 | ??1 | Surplus | ????620 | ????680 | ????239 |
| ????20 | ??22.1 | ??17 | ???5.1 | ???2.9 | ??0.9 | Surplus | ????624 | ????678 | ????255 |
The preparation method is as follows:
1) adopts HF induction heating apparatus and carry out melting, be cast into the casting rod of φ 12～15mm with argon shield.
2) adopt hot extrusion method, once the casting rod of φ 12～15mm is processed into the silk material of φ 2mm.
3) cover die cold-drawn, the surface smoothness of raising solder wire material.
4) for improving the plasticity of solder wire material, the convenient use can be carried out 460 ℃/1.5h heat treatment.
Claims (5)
1. a cadmium-free silver-base solder that is used for carbide quartz welding is characterized in that, the composition of solder is (wt%): Cu 21～23, and Zn 17～21, and Sn 4.5～5.5, and Mn 1～7, and Ni 0.5～2, surplus Ag.
2. cadmium-free silver-base solder according to claim 1 is characterized in that, the composition of solder is (wt%): Cu 22, and Zn 17, and Sn 5, and Mn 3, and Ni 1, surplus Ag.
3. cadmium-free silver-base solder according to claim 1 is characterized in that, the composition of solder is (wt%): Cu 22, and Zn 17, and Sn 5, and Mn 5, and Ni 1, surplus Ag.
4. cadmium-free silver-base solder according to claim 1 is characterized in that, the composition of solder is (wt%): Cu 22, and Zn 17, and Sn 5, and Mn 7, and Ni 1, surplus Ag.
5. cadmium-free silver-base solder according to claim 1 is characterized in that, the composition of solder is (wt%): Cu 22, and Zn 19, and Sn 5, and Mn 2, and Ni 1, surplus Ag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01141756 CN1197683C (en) | 2001-09-18 | 2001-09-18 | Cadmium-free silver-base solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01141756 CN1197683C (en) | 2001-09-18 | 2001-09-18 | Cadmium-free silver-base solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1404957A true CN1404957A (en) | 2003-03-26 |
| CN1197683C CN1197683C (en) | 2005-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01141756 Expired - Lifetime CN1197683C (en) | 2001-09-18 | 2001-09-18 | Cadmium-free silver-base solder |
Country Status (1)
| Country | Link |
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| CN (1) | CN1197683C (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100352597C (en) * | 2005-11-25 | 2007-12-05 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN100377832C (en) * | 2005-11-22 | 2008-04-02 | 南京航空航天大学 | Cd-free silver solder containing Ga and Ce |
| CN101913033A (en) * | 2010-07-21 | 2010-12-15 | 蒋辉 | Solder and process for welding stainless steel net by using same |
| CN102172805A (en) * | 2011-01-18 | 2011-09-07 | 哈尔滨理工大学 | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof |
| CN102179586A (en) * | 2011-03-18 | 2011-09-14 | 北京航空航天大学 | Soldering preparation method for stainless steel laminate type inspirator |
| CN101554686B (en) * | 2009-05-15 | 2011-11-16 | 西安理工大学 | High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof |
| CN104057212A (en) * | 2014-07-01 | 2014-09-24 | 张家港市佳晟机械有限公司 | High-performance silver-based solder |
| EP2832488A1 (en) * | 2013-07-31 | 2015-02-04 | Umicore AG & Co. KG | Brazing alloys |
| CN104551434A (en) * | 2014-11-17 | 2015-04-29 | 浙江亚通焊材有限公司 | Cadmium-free silver-based medium-temperature solder and preparation method thereof |
| CN105081608A (en) * | 2015-09-15 | 2015-11-25 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN106216878A (en) * | 2016-08-16 | 2016-12-14 | 镇江市锶达合金材料有限公司 | A kind of cadmium-free silver brazing alloy |
| CN106563893A (en) * | 2016-10-21 | 2017-04-19 | 四川科力特硬质合金股份有限公司 | Silver brazing solder of cemented carbide and steel and silver brazing method thereof |
| CN109623066A (en) * | 2018-12-19 | 2019-04-16 | 中铁工程装备集团有限公司 | A kind of atmosphere protection soldering shield cutter technique |
| WO2019207823A1 (en) * | 2018-04-23 | 2019-10-31 | 田中貴金属工業株式会社 | Silver brazing material and joining method using said silver brazing material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101554685B (en) * | 2009-05-15 | 2011-07-06 | 西安理工大学 | High-entropy alloy solder used for welding copper and aluminum and preparation method thereof |
-
2001
- 2001-09-18 CN CN 01141756 patent/CN1197683C/en not_active Expired - Lifetime
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100377832C (en) * | 2005-11-22 | 2008-04-02 | 南京航空航天大学 | Cd-free silver solder containing Ga and Ce |
| CN100352597C (en) * | 2005-11-25 | 2007-12-05 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN101554686B (en) * | 2009-05-15 | 2011-11-16 | 西安理工大学 | High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof |
| CN101913033A (en) * | 2010-07-21 | 2010-12-15 | 蒋辉 | Solder and process for welding stainless steel net by using same |
| CN101913033B (en) * | 2010-07-21 | 2015-06-03 | 安徽荣辉造纸网有限公司 | Solder and process for welding stainless steel net by using same |
| CN102172805B (en) * | 2011-01-18 | 2013-01-02 | 哈尔滨理工大学 | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof |
| CN102172805A (en) * | 2011-01-18 | 2011-09-07 | 哈尔滨理工大学 | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof |
| CN102179586A (en) * | 2011-03-18 | 2011-09-14 | 北京航空航天大学 | Soldering preparation method for stainless steel laminate type inspirator |
| EP2832488A1 (en) * | 2013-07-31 | 2015-02-04 | Umicore AG & Co. KG | Brazing alloys |
| WO2015014968A1 (en) * | 2013-07-31 | 2015-02-05 | Umicore Ag & Co. Kg | Brazing alloys |
| CN104339097A (en) * | 2013-07-31 | 2015-02-11 | 尤米科尔股份公司及两合公司 | Brazing filler metals, use of the brazing filler metal, a combination of a brazing filler metal with a flux, and a method for joining metal parts by brazing |
| CN104057212A (en) * | 2014-07-01 | 2014-09-24 | 张家港市佳晟机械有限公司 | High-performance silver-based solder |
| CN104551434A (en) * | 2014-11-17 | 2015-04-29 | 浙江亚通焊材有限公司 | Cadmium-free silver-based medium-temperature solder and preparation method thereof |
| CN105081608B (en) * | 2015-09-15 | 2017-05-03 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN105081608A (en) * | 2015-09-15 | 2015-11-25 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN106216878A (en) * | 2016-08-16 | 2016-12-14 | 镇江市锶达合金材料有限公司 | A kind of cadmium-free silver brazing alloy |
| CN106563893A (en) * | 2016-10-21 | 2017-04-19 | 四川科力特硬质合金股份有限公司 | Silver brazing solder of cemented carbide and steel and silver brazing method thereof |
| WO2019207823A1 (en) * | 2018-04-23 | 2019-10-31 | 田中貴金属工業株式会社 | Silver brazing material and joining method using said silver brazing material |
| CN112004638A (en) * | 2018-04-23 | 2020-11-27 | 田中贵金属工业株式会社 | Silver solder and bonding method using the same |
| JPWO2019207823A1 (en) * | 2018-04-23 | 2021-05-20 | 田中貴金属工業株式会社 | Silver brazing material and joining method using the silver brazing material |
| TWI745631B (en) * | 2018-04-23 | 2021-11-11 | 日商田中貴金屬工業股份有限公司 | Silver brazing material and joining method using the silver brazing material |
| US11638973B2 (en) * | 2018-04-23 | 2023-05-02 | Tanaka Kikinzoku Kogyo K.K. | Silver brazing material and joining method using the silver brazing material |
| JP7290222B2 (en) | 2018-04-23 | 2023-06-13 | 田中貴金属工業株式会社 | Silver brazing material and joining method using said silver brazing material |
| CN109623066A (en) * | 2018-12-19 | 2019-04-16 | 中铁工程装备集团有限公司 | A kind of atmosphere protection soldering shield cutter technique |
| CN109623066B (en) * | 2018-12-19 | 2021-05-07 | 中铁工程装备集团有限公司 | Atmosphere protection brazing shield cutter process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1197683C (en) | 2005-04-20 |
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Granted publication date: 20050420 |