CN1302891C - Rare earth contained SnAgCuY tin based leadless solder and its preparation method - Google Patents
Rare earth contained SnAgCuY tin based leadless solder and its preparation method Download PDFInfo
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- CN1302891C CN1302891C CNB2004101012515A CN200410101251A CN1302891C CN 1302891 C CN1302891 C CN 1302891C CN B2004101012515 A CNB2004101012515 A CN B2004101012515A CN 200410101251 A CN200410101251 A CN 200410101251A CN 1302891 C CN1302891 C CN 1302891C
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 40
- 229910052761 rare earth metal Inorganic materials 0.000 title claims abstract description 28
- 150000002910 rare earth metals Chemical class 0.000 title claims abstract description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 38
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 51
- 239000000956 alloy Substances 0.000 abstract description 51
- 239000011833 salt mixture Substances 0.000 abstract description 32
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 abstract description 22
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 abstract description 22
- 235000011164 potassium chloride Nutrition 0.000 abstract description 11
- 239000001103 potassium chloride Substances 0.000 abstract description 11
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 5
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910052727 yttrium Inorganic materials 0.000 abstract description 2
- 238000013019 agitation Methods 0.000 abstract 1
- 238000005272 metallurgy Methods 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 29
- 238000005219 brazing Methods 0.000 description 17
- 239000010949 copper Substances 0.000 description 14
- 239000000155 melt Substances 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 230000004927 fusion Effects 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 230000005496 eutectics Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 229910020888 Sn-Cu Inorganic materials 0.000 description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910007637 SnAg Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005088 metallography Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention relates to a rare earth contained SnAgCuy tin-base lead-free solder and a preparation method thereof which belong to the technical field of manufacturing electronic packaging lead-free solder in microelectron industry. The solder has the components, in weight percentages, 2 to 5% of Ag, 0.2 to 1 % of Cu, 0.025 to 1.0 of commercial rare earth Y and Sn in balancing amount. The rare earth contained SnAgCuy tin-base lead-free solder has the preparation method that a salt mixture with the weight ratio of potassium chloride to lithium chloride of (1 to 1.6): (0.8 to 1.2) is melted and poured on Sn; after the Sn is melted, weighed Ag and Cu are added in a Sn solution to make the Ag and Cu melted; then, the commercial rare earth Y is pressed into the salt mixture and the Sn-Ag-Cu alloy by a bell jar of which the wall is provided with holes; and the bell jar is rotated, temperature is preserved for 1 to 2 hours, and the surface salt mixture is removed after agitation, stationary placement and solidification. The solder has the advantages of few alloy components, strong practicability, low cost and no pollution, and the wetting technological property, the microscopic structure and the metallurgy quality are obvious improved.
Description
Technical field
A kind of SnAgCuY tin base leadless soldering-flux that contains rare earth and preparation method thereof belongs to the assembling of microelectronic industry electronics and uses lead-free brazing manufacturing technology field.
Background technology
Over past ten years, researched and developed out multiple lead-free solder alloy both at home and abroad, patent just relates to hundreds of.The lead-free solder alloy of research mainly concentrates on three temperature sections and several alloy series at present.Wherein, most representative is the middle-temperature section lead-free solder alloy, as Sn-Cu, Sn-Ag, Sn-Zn binary system alloy, and ternary alloy such as Sn-Ag-Cu, Sn-Ag-Bi, Sn-Zn-Bi or multicomponent alloy more.
Basic demand to lead-free brazing should comprise: fusion temperature should be near the SnPb eutectic temperature, and fusion temperature is suitable little at interval; Wetability or soldering processes performance are preferably arranged, and good wetability can reduce weld defect, improve soldering productivity ratio; Good physical and mechanical property as the stability of intensity, creep-resistant property, heating power fatigue resistance, metallography tissue, satisfies the reliability requirement of electronic product; Performances such as good electricity is led, thermal conductance should be arranged in addition; Chemical property is also very important, makes soldered fitting that good corrosion resistance be arranged; Lead-free brazing should not comprise new toxic component; The solder cost is low, in order to applying etc.
From the domestic and international research present situation, most widely used middle-temperature section can realize aborning in a short time unleaded alternative will be Sn-Cu, Sn-Ag binary alloy system and Sn-Ag-Cu ternary alloy system or more multicomponent alloy solder based on this.The Sn-Cu solder will be mainly used in wave-soldering, and the Sn-Ag-Cu brazing filler metal will be mainly used in reflow welding.The Sn-Ag-Cu brazing filler metal alloy species that occurs in the world is a lot of at present, representational SnAgCu is that the patent brazing filler metal alloy has: Sn-(3.5-7.7) Ag-(1-4) Cu-(0-10) Bi[U.S. Pat P5527628], Sn-(2-5) Ag-(0-2.9) Cuu-(0.1-3) Ni[U.S. Pat P 5863493], Sn-3.0Ag-0.5Cu[Japan Patent JPP 3027441] and Sn-(2-5) Ag-(0.2-1) Cu-(0.025-1) RE[Chinese patent ZL 02123528.7] etc.
United States Patent (USP) 5,527, the eutectic composition Sn-4.7%Ag-1.7%Cu of the SnAgCu solder of 628 reports, its fusing point is 217 ℃, but this invention solder creep strength is not good.In addition, United States Patent (USP) 4,929,423 lead-free brazing Sn-(0.08-20%) Bi-(0.01-1.5%) Ag-(0.02-1.5%) Cu-0.01%P-(0-0.2%) mishmetals that provide be mainly used in the pipeline soldering, and the alloy constituent element are many, and practicality is relatively poor.United States Patent (USP) 6,361,742 have introduced two kinds of SnAg and SnAgCuBi lead-free brazings that add rare earth, but the wetability of SnAg solder is relatively poor, in brazing process, can cause the dissolving of copper matrix, and SnAgCuBi not only the alloy constituent element is many because solder contains Bi, easily produce low melting point eutectic, and rare earth is single rare earth element.Chinese patent 01128184.7 has been introduced a kind of lead-free brazing that contains rare earth that is applicable to Electronic Packaging and assembling and soldering, its middle rare earth is that the mishmetal of La and Ce or La and Ce mishmetal add one among Pr, the Nd or two kind, Sn-(0.1-5%) Ag-(0.1-1%) Cu-(0.1-8%) Bi-(0.1-7.5%) In-(0-8%) Sb-(0.01-2%) rare earth.This patent is pointed out, in order further to reduce fusing point, has added a certain amount of In, Bi element.Yet, along with the quickening of unleaded process, some big companies released one after another unleaded crest welder and unleaded Re-current welder, the peak temperature of its soldering can reach about 250 ℃, therefore, and under these circumstances, the fusing point problem of lead-free brazing no longer is very distinct issues.In addition, contain Bi solder easy generation when soldering and sting end defective, and easily form low melting point eutectic with lead, therefore responsive to lead contamination, and the fragility of Bi also is an adverse factors.In addition, Bi is plumbous byproduct, uses the solder that contains Bi must strengthen exploitation to lead ore, causes the pollution to environment.The abundance of In in the earth's crust is very low, and costs an arm and a leg, and is not suitable for extensive use.Therefore, add some,, obviously do not improve under the prerequisite of The comprehensive performance having, become no longer necessary as In, Bi etc. in order to reduce the element of solder fusing point.
Summary of the invention
The present invention is directed to problems of the prior art, provide a kind of alloy constituent element less, practical, cost is low, be easy to control impurity lead content, wettability is good, has suitable intensity and fusion temperature, and what microscopic structure and metallurgical quality were better than traditional SnAgCu solder contains rare earth SnAgCuY lead-free brazing and preparation method thereof.
The SnAgCuY tin base leadless soldering-flux that contains Rare Earth Y involved in the present invention is characterized in that: contain percentage by weight and be 2～5% Ag, and 0.2～1% Cu, 0.025～0.5% commercially available Rare Earth Y, all the other are Sn.
The invention provides a kind of preparation method who contains the SnAgCuY tin base leadless soldering-flux of Rare Earth Y, it is characterized in that:
(1) by weight with potassium chloride: lithium chloride=(1～1.6): the salt-mixture of (0.8～1.2) is watering on the tin that is weighing up after the fusing down at 450 ℃～550 ℃;
(2) temperature is risen to 600 ℃～800 ℃, treat tin fusing after, load weighted silver, copper are joined in the middle of the tin liquor of fusion, stir, form alloy;
(3) treat its fusing evenly after, commercially available Rare Earth Y is pressed into rapidly in the alloy of above-mentioned fusion with stainless steel bell jar with holes on the wall, rotate bell jar;
(4) treat that rare earth melts fully after, be incubated 1～2 hour, stir, make the alloy homogenising, leave standstill and come out of the stove, solidify the salt-mixture that the surface is removed in the back.
Contain performance after the Rare Earth Y lead-free brazing improves below by the test data of some examples with formal specification the present invention of chart, and compare with the traditional SnAgCu solder that obtains under the same conditions.
Table 1 is 9 kinds of tin base leadless soldering-flux and traditional SnAgCu solder component lists of containing Rare Earth Y, forms in the table all to be weight percentage, and Y represents the rare earth yttrium, gives the liquidus temperature and the solidus temperature of each solder simultaneously.The liquidus curve of solder and solidus temperature record by slow cooling curve.As can be seen from Table 1, example 1～9 of the present invention has close with the SnAgCu lead-free brazing or low slightly fusion temperature scope, and is special under the identical condition of Ag content, add trace rare-earth Y, generally can reduce fusion temperature, as shown in Figure 3, be fit to present unleaded soldering processes condition.
Table 2 is comparisons of example 1～9 of the present invention and traditional SnAgCu lead-free brazing shear strength and spreading area.As can be seen from the table, the shear strength of example 1～9 of the present invention is suitable with traditional SnAgCu solder, makes moderate progress but most embodiment sprawls processing performance, as shown in Figure 4, is applicable to the microelectronic industry surface-assembled.
Fig. 1 and Fig. 2 are respectively the contain tin base leadless soldering-flux of Rare Earth Y and the comparisons of traditional SnAgCu solder microscopic structure of the present invention.As can be seen, the solder microscopic structure of adding Rare Earth Y is tiny, and the crystalline structure that does not add Rare Earth Y is thick, high directivity, fragility are big.This has also disclosed from microcosmic angle and has contained the reason that the Rare Earth Y lead-free brazing can improve the solder metallurgical quality.
Description of drawings:
Fig. 1: the SnAgCuY that contains Rare Earth Y does not have the microscopic structure of lead solders.
Fig. 2: traditional SnAgCu does not have the microscopic structure of lead solders.
Fig. 3 Y is to the influence of Sn3.8Ag0.7Cu fusion temperature.
Fig. 4 Y is to the influence of Sn3.8Ag0.7Cu spreading area.
The specific embodiment
Example 1: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 95.475 gram tin after the fusing down at 450 ℃.Furnace temperature is risen to 800 ℃, 3.8 gram Ag and 0.7 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.025 gram.Be incubated 1 hour, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 360 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 2: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 95.45 gram tin after the fusing down at 450 ℃.Furnace temperature is risen to 780 ℃, 3.8 gram Ag and 0.7 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.05 gram.Be incubated 1.5 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 380 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 3: the potassium chloride and the 18 grams lithium chloride salt-mixtures of 23.4 grams are watered on 95.4 gram tin after the fusing down at 490 ℃.Furnace temperature is risen to 700 ℃, 3.8 gram Ag and 0.7 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.1 gram.Be incubated 1 hour, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 360 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 4: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 95.25 gram tin after the fusing down at 510 ℃.Furnace temperature is risen to 720 ℃, 3.8 gram Ag and 0.7 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.25 gram.Be incubated 2 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 400 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 5: the potassium chloride and the 25 grams lithium chloride salt-mixtures of 32.5 grams are watered on 95 gram tin after the fusing down at 500 ℃.Furnace temperature is risen to 720 ℃, 3.8 gram Ag and 0.7 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.5 gram.Be incubated 1.5 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 380 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 6: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 97.775 gram tin after the fusing down at 460 ℃.Furnace temperature is risen to 800 ℃, 2 gram Ag and 0.2 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.025 gram.Be incubated 2 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 400 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 7: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 96 gram tin after the fusing down at 550 ℃.Furnace temperature is risen to 600 ℃, 2 gram Ag and 1 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 1 gram.Be incubated 2 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 400 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 8: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 94.775 gram tin after the fusing down at 460 ℃.Furnace temperature is risen to 800 ℃, 5 gram Ag and 0.2 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 0.025 gram.Be incubated 2 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 400 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Example 9: the potassium chloride and the 20 grams lithium chloride salt-mixtures of 26 grams are watered on 93 gram tin after the fusing down at 460 ℃.Furnace temperature is risen to 800 ℃, 5 gram Ag and 1 gram Cu are joined in the middle of the tin liquor after making the fusing of tin and salt-mixture, constantly stir simultaneously, form alloy; Be pressed into rapidly in the middle of the above-mentioned molten alloy with stainless steel bell jar with holes on the wall Rare Earth Y, and constantly stir, till rare earth melts fully 1 gram.Be incubated 2 hours, constantly stir, make the alloy homogenising.Leave standstill and come out of the stove, treat to remove surperficial salt-mixture behind the alloy graining.Furnace temperature is reduced to 400 ℃ the solder piece reheated fusing, stand-by into strips at the angle bar top-pour then.
Table 1 brazing filler metal alloy composition and fusion temperature
| Example | Sn(wt％) | Ag(wt％) | Cu(wt％) | Y(wt％) | Liquidus temperature (℃) | Solidus temperature (℃) |
| Comparative Examples | 95.5 | 3.8 | 0.7 | 0 | 217.1 | 215.6 |
| Embodiment 1 | 95.475 | 3.8 | 0.7 | 0.025 | 217.1 | 213.9 |
| Embodiment 2 | 95.45 | 3.8 | 0.7 | 0.05 | 217.3 | 212.2 |
| Embodiment 3 | 95.4 | 3.8 | 0.7 | 0.1 | 216.7 | 210.4 |
| Embodiment 4 | 95.25 | 3.8 | 0.7 | 0.25 | 215.6 | 207.8 |
| Embodiment 5 | 95 | 3.8 | 0.7 | 0.5 | 216.9 | 215.6 |
| Embodiment 6 | 97.775 | 2 | 0.2 | 0.025 | 225.1 | 215.6 |
| Embodiment 7 | 96 | 2 | 1.0 | 0.5 | 219.9 | 213.0 |
| Embodiment 8 | 94.775 | 5 | 0.2 | 0.025 | 220.8 | 214.7 |
| Embodiment 9 | 93 | 5 | 1.0 | 0.5 | 216.0 | 213.0 |
Table 2 shear strength and spreading area
| Example | Shear strength (MPa) | Spreading area (mm 2) |
| Comparative Examples | 67.2 | 57.7 |
| Embodiment 1 | 68.0 | 58.9 |
| Embodiment 2 | 62.9 | 59.7 |
| Embodiment 3 | 63.8 | 59.1 |
| Embodiment 4 | 67.3 | 60.8 |
| | 65.5 | 58.8 |
| Embodiment 6 | 65.5 | 57.5 |
| Embodiment 7 | 51.9 | 55.9 |
| Embodiment 8 | 43.4 | 60.0 |
| Embodiment 9 | 64.6 | 55.8 |
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| CNB2004101012515A CN1302891C (en) | 2004-12-17 | 2004-12-17 | Rare earth contained SnAgCuY tin based leadless solder and its preparation method |
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| CN1302891C true CN1302891C (en) | 2007-03-07 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| US9175368B2 (en) | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| CN100409996C (en) * | 2006-08-28 | 2008-08-13 | 北京航空航天大学 | An oxidation-resistant tin-based lead-free solder capable of flux-free soldering in air |
| CN105033497A (en) * | 2015-08-07 | 2015-11-11 | 仲恺农业工程学院 | Sn-Ag-Ti-Ce low-temperature active solder |
| CN118046134A (en) * | 2024-04-02 | 2024-05-17 | 深圳市慧苗科技有限公司 | Lead-free soldering tin bar and manufacturing process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001321982A (en) * | 2000-05-18 | 2001-11-20 | Hitachi Ltd | Sn-Ag-Cu BASE SOLDER FOR ELECTRONIC APPARATUS |
| CN1152768C (en) * | 2002-07-02 | 2004-06-09 | 北京工业大学 | High creep resistance rareearth contained tin base leadless soldering-flux and preparation method thereof |
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| CN1544197A (en) * | 2003-11-21 | 2004-11-10 | 北京工业大学 | Low silver lead-free solder |
| JP2004330260A (en) * | 2003-05-09 | 2004-11-25 | Topy Ind Ltd | LEAD-FREE SnAgCu SOLDER ALLOY |
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- 2004-12-17 CN CNB2004101012515A patent/CN1302891C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001321982A (en) * | 2000-05-18 | 2001-11-20 | Hitachi Ltd | Sn-Ag-Cu BASE SOLDER FOR ELECTRONIC APPARATUS |
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| CN1152768C (en) * | 2002-07-02 | 2004-06-09 | 北京工业大学 | High creep resistance rareearth contained tin base leadless soldering-flux and preparation method thereof |
| JP2004330260A (en) * | 2003-05-09 | 2004-11-25 | Topy Ind Ltd | LEAD-FREE SnAgCu SOLDER ALLOY |
| CN1544197A (en) * | 2003-11-21 | 2004-11-10 | 北京工业大学 | Low silver lead-free solder |
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