CN113984465A - Dissolving liquid and dissolving method for dissolving soldering tin solder - Google Patents
Dissolving liquid and dissolving method for dissolving soldering tin solder Download PDFInfo
- Publication number
- CN113984465A CN113984465A CN202111186609.9A CN202111186609A CN113984465A CN 113984465 A CN113984465 A CN 113984465A CN 202111186609 A CN202111186609 A CN 202111186609A CN 113984465 A CN113984465 A CN 113984465A
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- China
- Prior art keywords
- dissolving
- soldering tin
- tin solder
- solution
- solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 title claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 11
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 2
- 238000004090 dissolution Methods 0.000 description 9
- 239000000523 sample Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000009614 chemical analysis method Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000009089 cytolysis Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention relates to a dissolving solution for dissolving soldering tin solder and a dissolving method of the soldering tin solder, belonging to the field of solution formulas of material detection dissolving samples. A dissolving solution and a dissolving method for dissolving soldering tin solder are disclosed, wherein the dissolving solution consists of nitric acid and fluoboric acid, and the volume ratio of the nitric acid to the fluoboric acid is 2: 3. the invention has the following advantages: 1. the method is simple to operate and widely applied to a dissolving method for measuring soldering tin solder by adopting an inductively coupled plasma atomic emission spectrometry; 2. the method improves the analysis speed, meets the requirement of rapid determination in a production field, and is efficient, rapid and harmless.
Description
Technical Field
The invention relates to a dissolving solution for dissolving soldering tin solder and a dissolving method of the soldering tin solder, belonging to the field of solution formulas of material detection dissolving samples.
Background
The tin solder is widely used in military and civil goods production and life, and the commonly used national standard is the dissolved sample solution in GB10574.1 'determination of tin content by chemical analysis method of tin-lead solder' and GB10574.2 'determination of antimony content by chemical analysis method of tin-lead solder'. The operation is complicated and difficult to master. In the operation process, sulfuric acid is needed, and the operation safety performance cannot be ensured. In order to improve the analysis speed and meet the requirement of rapid measurement in a production field, the formula of the brazing solder dissolving solution is improved to a certain extent, and a high-efficiency, rapid and harmless dissolving sample method is obtained.
Disclosure of Invention
The invention aims to provide a dissolving solution for dissolving soldering tin solder, which is mainly used for rapidly dissolving soldering tin solder and providing an analysis sample for instrument analysis.
In order to achieve the purpose, the invention adopts the following technical scheme: a dissolving solution for dissolving soldering tin solder consists of nitric acid and fluoroboric acid, wherein the volume ratio of the nitric acid to the fluoroboric acid is 2: 3.
another object of the present invention is to provide a method for dissolving brazing solder, which is efficient, rapid and harmless, using the above dissolving solution.
Preferably, the brazing solder dissolving method comprises the following steps:
step one, weighing 0.1000g of soldering tin solder, and placing the soldering tin solder in a beaker;
step two, adding a certain amount of dissolving liquid into the beaker;
and step three, heating the beaker at the temperature of 250-300 ℃, and completely dissolving the soldering tin solder.
Preferably, in step two, no more than 25 ml of the lysis solution is added to the beaker.
Compared with the prior art, the invention has the following advantages:
1. the method is simple to operate and widely applied to a dissolving method for measuring soldering tin solder by adopting an inductively coupled plasma atomic emission spectrometry;
2. the method improves the analysis speed, meets the requirement of rapid determination in a production field, and is efficient, rapid and harmless.
Drawings
FIG. 1 is a flow chart of the method for detecting element content in examples 1 to 3 of the present invention.
Detailed Description
A dissolving solution for dissolving soldering tin solder consists of nitric acid and fluoroboric acid, wherein the volume ratio of the nitric acid to the fluoroboric acid is 2: 3.
the invention is described in further detail below with reference to the accompanying drawing 1:
the dissolving method of the soldering flux solder adopts the dissolving solution and comprises the following steps:
step one, accurately weighing 0.1000g of soldering tin solder by using an electronic balance, and placing the soldering tin solder into a beaker with the capacity of 250 mL;
step two, adding no more than 25 ml of dissolving solution into the beaker;
and step three, placing the beaker on an electric furnace with controllable temperature for heating, wherein 0.1000g of soldering tin solder can be completely dissolved within 30 minutes when the heating temperature is 250-300 ℃.
Example 1
The volume ratio of nitric acid to fluoroboric acid is 2: when 3, 0.1000g of soldering tin solder is dissolved, the soldering tin solder is S-Sn40PbSbA, and the heating temperature is 250 ℃.
The experimental results are as follows: the volume of the dissolution used was 20 ml and the time used was 16 minutes. The dissolution time of the sample is 25 minutes by adopting the dissolution solution of the original formula, and the turbidity phenomenon exists.
Example 2
The volume ratio of nitric acid to fluoroboric acid is 2: 3, dissolving 0.1000g soldering tin solder with the brand of S-Sn30PbSbA, and heating at 250 ℃.
The experimental results are as follows: the volume of the dissolution solution used was 20 ml and the time taken was 10 minutes. The dissolution time of the sample is 20 minutes by adopting the dissolution solution of the original formula, and the turbidity phenomenon exists.
Example 3
The volume ratio of nitric acid to fluoroboric acid is 2: 3, dissolving 0.1000g soldering tin solder with the brand of S-Sn60PbSbA, and heating at 300 ℃.
The experimental results are as follows: the volume of the dissolution used was 20 ml and the time used was 16 minutes. The dissolution time of the sample is 20 minutes by adopting the dissolution solution of the original formula, and the turbidity phenomenon exists.
Claims (4)
1. A dissolving solution for dissolving soldering tin solder is characterized in that: the dissolving solution consists of nitric acid and fluoroboric acid, and the volume ratio of the nitric acid to the fluoroboric acid is 2: 3.
2. a brazing solder dissolving method is characterized in that: the dissolving solution according to claim 1 is used.
3. The brazing solder dissolving method according to claim 2, characterized in that: the method comprises the following steps:
step one, weighing 0.1000g of soldering tin solder, and placing the soldering tin solder in a beaker;
step two, adding a certain amount of dissolving liquid into the beaker;
and step three, heating the beaker at the temperature of 250-300 ℃, and completely dissolving the soldering tin solder.
4. The brazing solder dissolving method according to claim 3, characterized in that: in the second step, no more than 25 ml of the dissolving solution is added into the beaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111186609.9A CN113984465A (en) | 2021-10-12 | 2021-10-12 | Dissolving liquid and dissolving method for dissolving soldering tin solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111186609.9A CN113984465A (en) | 2021-10-12 | 2021-10-12 | Dissolving liquid and dissolving method for dissolving soldering tin solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113984465A true CN113984465A (en) | 2022-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111186609.9A Pending CN113984465A (en) | 2021-10-12 | 2021-10-12 | Dissolving liquid and dissolving method for dissolving soldering tin solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113984465A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE8206447D0 (en) * | 1981-11-24 | 1982-11-12 | Occidental Chem Co | METAL STRIPPING COMPOSITION AND PROCESS |
| US4374744A (en) * | 1981-04-06 | 1983-02-22 | Mec Co., Ltd. | Stripping solution for tin or tin alloys |
| US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
| JPH01270511A (en) * | 1988-04-19 | 1989-10-27 | Tanaka Kikinzoku Kogyo Kk | Removal of tin from silver or palladium solution |
| JPH07159395A (en) * | 1993-12-08 | 1995-06-23 | Fuji Electric Co Ltd | Method for analyzing composition of solder alloy |
| CN102033101A (en) * | 2009-09-30 | 2011-04-27 | 北京有色金属研究总院 | Method for measuring metal impurities in high-purity MgO film material by using inductively coupled plasma mass spectrometer |
| CN110158121A (en) * | 2019-05-19 | 2019-08-23 | 南通弘扬金属制品有限公司 | Anti- tin must CP wire production technology |
| WO2020044365A1 (en) * | 2018-08-28 | 2020-03-05 | Indian Institute Of Technology Madras | Sequential extraction of metals from printed circuit boards by hydrometallurgical route using the same acid |
-
2021
- 2021-10-12 CN CN202111186609.9A patent/CN113984465A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374744A (en) * | 1981-04-06 | 1983-02-22 | Mec Co., Ltd. | Stripping solution for tin or tin alloys |
| SE8206447D0 (en) * | 1981-11-24 | 1982-11-12 | Occidental Chem Co | METAL STRIPPING COMPOSITION AND PROCESS |
| US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
| JPH01270511A (en) * | 1988-04-19 | 1989-10-27 | Tanaka Kikinzoku Kogyo Kk | Removal of tin from silver or palladium solution |
| JPH07159395A (en) * | 1993-12-08 | 1995-06-23 | Fuji Electric Co Ltd | Method for analyzing composition of solder alloy |
| CN102033101A (en) * | 2009-09-30 | 2011-04-27 | 北京有色金属研究总院 | Method for measuring metal impurities in high-purity MgO film material by using inductively coupled plasma mass spectrometer |
| WO2020044365A1 (en) * | 2018-08-28 | 2020-03-05 | Indian Institute Of Technology Madras | Sequential extraction of metals from printed circuit boards by hydrometallurgical route using the same acid |
| CN110158121A (en) * | 2019-05-19 | 2019-08-23 | 南通弘扬金属制品有限公司 | Anti- tin must CP wire production technology |
Non-Patent Citations (5)
| Title |
|---|
| 吕玉光: "仪器分析 在线学习版", 31 January 2016, 中国医药科技出版社, pages: 121 - 122 * |
| 孙汉文;谢淑兰;张红医;梁嘉恺;王洪;邵建辉;: "火焰原子吸收法测定铜线镀层中的锡铅比", 理化检验.化学分册, no. 02 * |
| 李昌树;安成强;郝建军;: "锡铅合金电镀液研究进展", 电镀与涂饰, no. 09 * |
| 段旭川;: "同时溶解和ICP-AES同时测定焊锡材料中的铅、锡和银", 分析测试学报, no. 01 * |
| 王泉 , 刘全: "铜铅锡三元合金电镀溶液的分析", 内燃机配件, no. 02, pages 191 - 193 * |
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