Disclosure of Invention
It is an object of the present disclosure to provide a scintillation fiber optic detector that at least partially addresses the problems associated with the related art.
In order to achieve the above purpose, the disclosure provides a scintillation fiber detector, which comprises a plurality of groups of scintillation fiber bundles, two fixing brackets and two groups of photoelectric detection devices, wherein the groups of scintillation fiber bundles extend in parallel and are sequentially arranged side by side in the vertical direction of the extending direction, the two fixing brackets are respectively fixed at the end parts of the scintillation fiber bundles, and the two groups of photoelectric detection devices are respectively fixed on the corresponding fixing brackets and are attached to the end surfaces of the scintillation fiber bundles so as to be electrically coupled with the scintillation fiber bundles.
Optionally, the photodetection device is S i PM, the S i PM includes a chip, the scintillation fiber bundle penetrates from a first side to an opposite second side of the fixing support and is flush with the second side, the chip is coated with an optical silicone grease layer, and the chip is attached to the second side and completely covers an end face of the scintillation fiber bundle.
Optionally, the photoelectric detection device further comprises a circuit board, wherein the chip is attached to and protrudes out of the circuit board, and the circuit board is fixed on the fixing support and presses the chip against the end face of the scintillation fiber bundle.
Optionally, a sealing gasket surrounding the chip is further included, the sealing gasket filling a void between the circuit board and the second side of the mounting bracket.
Optionally, the circuit board and the sealing gasket are secured to the fixed bracket by threaded fasteners passing through the first through hole and the second through hole in sequence.
Optionally, the sealing gasket is in interference fit with the chip.
Optionally, the circuit board further comprises a heat conducting film, and the heat conducting film is fixed on one side, far away from the chip, of the circuit board in a fitting mode.
Optionally, the heat conducting film further comprises a radiator and a liquid cooling pipeline arranged on the heat conducting film, and the liquid cooling pipeline is communicated with the radiator.
Optionally, a constraint hole through which the scintillation fiber bundle passes is formed in the fixing support, and the scintillation fiber bundle is tightly inserted into the constraint hole and is cured into the fixing support through epoxy resin.
Optionally, the fixing bracket is configured as a strip extending along the arrangement direction of the plurality of groups of the scintillation fiber bundles.
Through the technical scheme, a plurality of scintillation optical fibers are grouped into a plurality of scintillation optical fiber bundles according to requirements through calculation according to detection requirements, and the scintillation optical fiber bundles which extend in parallel are arranged side by side, so that the invalid area of a detection layer formed by the optical fiber bundles can be reduced, and the bending reserved length is shorter due to the fact that the number of each group of optical fibers is smaller, and therefore the size and the weight of the scintillation optical fiber detector can be reduced.
Additional features and advantages of the present disclosure will be set forth in the detailed description which follows.
Detailed Description
Specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the disclosure, are not intended to limit the disclosure.
When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated.
Referring to fig. 1, the present disclosure provides a scintillation fiber optic detector including a plurality of groups of scintillation fiber optic bundles 10, two fixed brackets 20, and two groups of photo-detection devices respectively corresponding to the two brackets 20. Wherein the groups of scintillation fiber bundles 10 extend in parallel and are arranged side by side in sequence in a vertical direction of the extension direction, thereby forming a single-row configuration shown in fig. 1. Two fixing brackets 20 are fixed to the ends of the scintillation fiber bundles, respectively, that is, the ends of each group of scintillation fiber bundles 10 are fixed to the fixing brackets 20. The photodetection devices 30 are fixed on their corresponding fixing brackets 20 and attached to the end faces of the scintillation fiber bundle 10 to electrically couple with the scintillation fiber bundle 10 and receive detection signals.
The "scintillation fiber" refers to a functional material having both particle detection and optical signal transmission, and is composed of a core layer and a cladding layer, wherein the refractive index of the core layer is larger than that of the cladding layer. The scintillation optical fiber has the advantages of small granularity of the detection unit, long light attenuation length, short light-emitting attenuation time, strong plasticity and the like. The specific structure of the scintillation fiber is well known to those skilled in the art and will not be described in detail herein, in some embodiments, the scintillation fiber is selected from a plastic scintillation fiber, although in other embodiments, glass scintillation fiber, crystal scintillation fiber may be substituted. Each group of scintillation fiber bundles 10 is formed by aggregating a plurality of scintillation fibers, the number of the scintillation fibers of each group can be set according to actual demands, for example, the scintillation fibers can be divided into 10 groups when the total number of the scintillation fibers is 100, the number of each group can be 10, the scintillation fibers can be divided into 20 groups when the total number of the scintillation fibers is 500, the number of each group can be 25, the ratio of the number of groups to the total number of the scintillation fibers can be 1:10-1:30, and the ratio of the cross section area of each scintillation fiber to the cross section area of one group of scintillation fiber bundles 1 can be 1:20-1:40. In addition, the number of the scintillation fibers may be the same or different, and for convenience of description, only the case where the number of the scintillation fibers is the same will be described below as an example.
Through the technical scheme, after a plurality of scintillation optical fibers are grouped into bundles and arranged, a plurality of groups of scintillation optical fiber bundles are arranged in a single row, so that the invalid area of a detection layer formed by the optical fiber bundles can be reduced. Because the number of each group is smaller than the number of all the scintillation optical fibers after being bundled, the required bending reserved length is reduced, and the volume and the weight of the optical fiber detector are reduced.
In order to sequentially arrange the plurality of groups of the scintillation fiber bundles 10 side by side in the vertical direction of the extending direction, in some embodiments, the fixing bracket 20 is configured in a long strip shape extending along the arrangement direction of the plurality of groups of the scintillation fiber bundles 10 to minimize the volume of the fixing bracket 20. In addition, in other embodiments, the fixing support 20 may also be a long plate extending along the arrangement direction of the multiple groups of scintillation fiber bundles 10, which is not limited in the disclosure.
Here, the selection of the photodetection device 30 is not limited by the present disclosure, and for example, according to some embodiments, S i PM (Silicon photomultiplier ) may be selected as the photodetection device 30. Of course, the S i PM may also be replaced by other components with better photoelectric conversion performance, for example, a high-temperature photomultiplier, a low-background-radiation photomultiplier, and the disclosure is not limited thereto.
S i PM includes a chip 31 coated with an optical silicone grease layer, in order to better conform the scintillation fiber bundle 10 to the photodetector device 30, to maximize the acceptance of the optical signal transmitted by the scintillation fiber bundle 10, in some embodiments, the scintillation fiber bundle 10 extends from a first side of the mounting bracket 20 to an opposite second side and is flush with the second side, and the chip 31 is attached to the second side and completely covers the end face of the scintillation fiber bundle 10. Of course, in other embodiments, the optical silicone grease may be replaced by other optical couplers, such as silicone oils, and the present disclosure is not limited in this material selection.
Referring to fig. 2 and 3, the photodetector device 30 further includes a circuit board 32, the chip 31 is attached to and protrudes from the circuit board 32, and the chip 31 can be fixed to the end face of the scintillation fiber bundle 10 by fixing the circuit board 32 to the fixing bracket 20, specifically, the circuit board 32 is fixed to the fixing bracket 20 and presses the chip 31 against the end face of the scintillation fiber bundle 10. In addition, the chip 31 and the circuit board 32 may be separately provided, and the chip 31 may be fixed to the fixing bracket 20 by welding or fastening by bolts and attached to the end face of the scintillation fiber bundle 10, and the specific fixing method is not limited in this disclosure.
Referring to fig. 1 and 2, the scintillation fiber optic detector further includes a sealing gasket 40 surrounding the chip 31, the sealing gasket 40 filling a gap between the circuit board 32 and the second side of the stationary bracket 20 to prevent volatilization of the optical silicone grease. Of course, in other embodiments, a gap between the circuit board 32 and the second side of the mounting bracket 20 may be filled with a multi-layer hermetic film to avoid volatilization of the optical silicone grease from contact with air.
In order to fix the circuit board 32 and the sealing gasket 40 to the fixing bracket 20, referring to fig. 3, in some embodiments, a first through hole 321 may be formed in the circuit board 32, a second pipe through hole 41 may be formed in the sealing gasket 40 at a position corresponding to the first through hole 321, and the circuit board 32 and the sealing gasket 40 may be fixed to the fixing bracket 20 by a screw fastener sequentially passing through the first through hole 321 and the second through hole 41. Furthermore, in other embodiments, the circuit board 32 may be secured to the mounting bracket 20 by soldering and compress the sealing gasket 40, which is not limiting to the present disclosure.
Furthermore, in some embodiments, the sealing gasket 40 and the die 31 may be an interference fit such that no radial relative displacement occurs therebetween, and the sealing gasket 40 completely encapsulates the optical silicone grease to prevent volatilization.
In order to conduct out the heat generated by the operation of the circuit board 32, and avoid that the accumulated heat temperature is too high to make it work normally, referring to fig. 1 and 2, in some embodiments, the scintillation fiber optic detector may further include a heat conducting film 50, where the heat conducting film 50 is attached to a side of the plurality of circuit boards 32 far from the chip 31. Of course, in other embodiments, the heat conductive silicone grease may be used instead of the heat conductive film 50, which is not limited by the present disclosure.
Referring to fig. 1 and 2, in some embodiments, in order to dissipate heat from the thermal conductive film 50, the scintillation fiber optic detector further includes a heat sink and a liquid cooling circuit 51 disposed on the thermal conductive film 50, the liquid cooling circuit 51 being in communication with the heat sink. Furthermore, in other embodiments, the liquid cooling line 51 may be replaced by an air cooling line, and the present disclosure is not limited in the type of cooling line.
In order to stably fix the scintillation fiber bundle in the fixing bracket 20, in some embodiments, the fixing bracket 20 is provided with a restraining hole 21 through which the scintillation fiber bundle 10 passes, and the scintillation fiber bundle 10 is tightly inserted into the restraining hole 21 and is cured into the fixing bracket 20 by epoxy resin. Here, the epoxy resin may be replaced with silicone oil, which is not limited in the present disclosure. The arrangement of the plurality of scintillation fibers in the bundle 10 is set in accordance with the shape of the restriction hole 21, and for example, referring to fig. 1, the restriction hole 21 is configured as a square hole. Of course, in other embodiments, it may be rectangular, which is not limited by the present disclosure.
A specific example of the scintillation fiber optic detector of the present disclosure is given below, for example, the scintillation fiber optic detector is composed of 625 scintillation fibers, the cross section of each scintillation fiber is 1mm x 1mm square, and the scintillation fiber optic detector is divided into 25 groups, each group is 25, that is, one scintillation fiber optic bundle includes 25 fibers, the 25 fibers are arranged in five rows and five columns, that is, the end faces of the scintillation fiber optic bundles are 5mm x 5mm square, all the end faces of the scintillation fiber optic bundles respectively pass through the restraining holes 21 of the fixing support 20, here, the two fixing supports 20 respectively have 25 restraining holes 21, and the end face of each restraining hole 21 is 5mm x 5mm square.
The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details of the embodiments described above, and various simple modifications may be made to the technical solutions of the present disclosure within the scope of the technical concept of the present disclosure, and all the simple modifications belong to the protection scope of the present disclosure.
In addition, the specific features described in the foregoing embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, the present disclosure does not further describe various possible combinations.
Moreover, any combination between the various embodiments of the present disclosure is possible as long as it does not depart from the spirit of the present disclosure, which should also be construed as the disclosure of the present disclosure.