CN113848601A - Substrate module and preparation method thereof - Google Patents
Substrate module and preparation method thereof Download PDFInfo
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- CN113848601A CN113848601A CN202111143199.XA CN202111143199A CN113848601A CN 113848601 A CN113848601 A CN 113848601A CN 202111143199 A CN202111143199 A CN 202111143199A CN 113848601 A CN113848601 A CN 113848601A
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- substrate body
- shading
- light
- film
- metal
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- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims description 24
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 21
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 239000001301 oxygen Substances 0.000 claims description 21
- 238000001704 evaporation Methods 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008033 biological extinction Effects 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 2
- 229910001882 dioxygen Inorganic materials 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 17
- 230000002411 adverse Effects 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 description 10
- 230000008020 evaporation Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 5
- 238000010884 ion-beam technique Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910017107 AlOx Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/003—Light absorbing elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a substrate module and a preparation method thereof, and relates to the technical field of optical devices. The shading film of the substrate module is formed by shading metal and incomplete oxide of the shading metal, so that the substrate body can reflect black in visible light wave bands, the shading effect is good, the melting point is high, the phenomenon of high-temperature air release does not exist, and adverse effects on formed electronic elements can not be caused.
Description
Technical Field
The invention relates to the technical field of optical devices, in particular to a substrate module and a preparation method thereof.
Background
A display screen of an electronic component such as a mobile phone or an image pickup apparatus generally includes a display region and a non-display region, and the non-display region is generally covered with a light-shielding film so that a reflection color thereof appears black in a visible light band.
The prior art generally covers the non-display area of the display screen with ink, however, the electronic component generates a certain amount of heat inside during operation to cause temperature rise, and the ink mainly comprises a binder (resin), a pigment, a filler, an auxiliary agent, a solvent and the like, and is easy to outgas under the condition of high temperature, and the gas can reduce the performance of the electronic component.
Disclosure of Invention
The invention aims to provide a substrate module and a preparation method thereof, which can reflect black color in a visible light wave band and resist high temperature.
The embodiment of the invention is realized by the following steps:
a substrate module comprises a substrate body and a shading film covering the surface of the substrate body, wherein the shading film comprises a mixture of shading metal and incomplete oxide of at least one of the shading metal, and the shading film can absorb visible light.
Optionally, as a practical way, the thickness of the light-shielding film is 300-3000 nm.
Optionally, as an implementation manner, the material of the substrate body is sapphire, and the material of the light shielding film is a mixture of aluminum and an incomplete oxide of aluminum.
Optionally, as an implementable manner, the light-shielding film has a refractive index of 1.7 to 1.9 for visible light and an extinction coefficient of more than 0.05.
A method for preparing a substrate module comprises plating a shading film on the surface of a substrate body, wherein the shading film comprises a mixture of shading metal and incomplete oxide of at least one of the shading metal, and the shading film can absorb visible light.
Optionally, as an implementable manner, the plating of the light shielding film on the surface of the substrate body includes: placing the substrate body in a vacuum chamber; and evaporating shading metal on the surface of the substrate body to enable the shading metal and oxygen to generate oxidation reaction until a shading film with a preset thickness is formed on the surface of the substrate body.
Optionally, as an implementable manner, after the substrate body is placed in the vacuum chamber, the method further includes: the ion source performs ion precleaning on the substrate body.
Optionally, as an implementable manner, the vacuum chamber has a vacuum degree of less than 2.0E-3 Pa.
Optionally, as an implementable manner, evaporating the light-shielding metal on the surface of the substrate body to enable the light-shielding metal and the oxygen to generate an oxidation reaction until the light-shielding film with a predetermined thickness is formed on the surface of the substrate body includes: evaporating shading metal on the surface of the substrate body; the ion source and the vacuum chamber simultaneously add oxygen to the surface of the substrate body until a light shielding film of a predetermined thickness is formed on the surface of the substrate body.
Optionally, as an implementable manner, the evaporation rate of the light-shielding metal is 5-50nm/s, the oxygen flow rate of the ion source is 10-100sccm, and the oxygen flushing flow rate of the chamber is 50-500 sccm.
The embodiment of the invention has the beneficial effects that:
the substrate module comprises a substrate body and a shading film covering the surface of the substrate body, wherein the shading film comprises shading metal and a mixture of incomplete oxides of at least one of the shading metal, and the shading film can absorb visible light. The shading film of the substrate module is formed by shading metal and incomplete oxide of the shading metal, so that the substrate body can reflect black in visible light wave bands, the shading effect is good, the melting point is high, the phenomenon of high-temperature air release does not exist, and adverse effects on formed electronic elements can not be caused.
The preparation method of the substrate module comprises the step of plating a shading film on the surface of a substrate body, wherein the shading film comprises shading metal and a mixture of incomplete oxides of at least one of the shading metal, and the shading film can absorb visible light. The substrate module prepared by the method has good shading effect, does not have high-temperature air release phenomenon, and does not have adverse effect on formed electronic elements.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of a substrate module according to an embodiment of the present invention;
FIG. 2 is a graph of reflectivity of the substrate and the light-shielding film under the irradiation of visible light in the 400-700nm band when the refractive index of the light-shielding film is 1.781;
FIG. 3 is a graph of transmittance of the substrate and the light-shielding film under visible light irradiation in the 400-700nm band when the refractive index of the light-shielding film is 1.781;
FIG. 4 is a flowchart illustrating a method for fabricating a substrate module according to an embodiment of the present invention;
FIG. 5 is a second flowchart of a method for manufacturing a substrate module according to an embodiment of the present invention;
fig. 6 is a third flowchart of a method for manufacturing a substrate module according to an embodiment of the invention.
Icon: 10-a substrate module; 11-a substrate body; 12-light-shielding film.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "vertical", "horizontal", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally put in use of products of the present invention, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present embodiment provides a substrate module 10, which includes a substrate body 11 and a light shielding film 12 covering a surface of the substrate body 11, wherein the light shielding film 12 includes a mixture of a light shielding metal and an incomplete oxide of at least one of the light shielding metals, and the light shielding film can absorb visible light.
The substrate module 10 includes a substrate body 11 and a light shielding film 12, wherein the light shielding film 12 covers the surface of the substrate body 11, so that the substrate body 11 reflects black in the visible light band. The composition of the light-shielding film 12 includes a mixture of a light-shielding metal and an incomplete oxide of the light-shielding metal.
The light-shielding metal has light absorption and can absorb visible light. Preferably, the refractive index of the light shielding metal is similar to that of the substrate body 11, so as to reduce the reflectivity of visible light and achieve a better light shielding effect. It is understood that the closer the refractive index of the light-shielding metal is to that of the base body 11, the lower the reflectance of the light-shielding film 12 to visible light is formed.
The material of the substrate body 11 may be sapphire, resin, glass, crystal, etc., and accordingly, the light-shielding metal should be adjusted according to the main components of the substrate body 11 to achieve a better light-shielding effect.
As described above, the substrate module 10 includes the substrate body 11 and the light shielding film 12 covering the surface of the substrate body 11, the light shielding film 12 includes a mixture of a light shielding metal and an incomplete oxide of at least one of the light shielding metals, and the light shielding film is capable of absorbing visible light. The shading film 12 of the substrate module 10 is formed by shading metal and incomplete oxide of the shading metal, so that the substrate body 11 can reflect black color in a visible light wave band, the shading effect is good, the melting point is high, the phenomenon of high-temperature air release does not exist, and adverse effects on formed electronic elements can not be caused.
Optionally, in an implementation manner of the embodiment of the invention, the thickness of the light shielding film 12 is 300-3000 nm.
The thickness of the light-shielding film 12 affects the visible light transmittance, and it is understood that the thicker the light-shielding film 12, the lower the visible light transmittance, but the corresponding cost increases, so that the transmittance and the cost need to be considered together to determine the thickness of the light-shielding film 12.
When the thickness of the light shielding film 12 is between 300-3000nm, the light shielding film 12 has a better light shielding effect and a lower cost, and the thickness of the light shielding film 12 can be reasonably selected according to actual requirements within the range; when the thickness of the light shielding film 12 is less than 300nm, the light shielding effect is poor, and the reflection color of the substrate body 11 in the visible light wave band cannot be black; when the thickness of the light shielding film 12 is larger than 3000nm, the manufacturing cost is high.
Optionally, in an implementation manner of the embodiment of the present invention, the material of the substrate body 11 is sapphire, and the material of the light shielding film 12 is a mixture of aluminum and an incomplete oxide of aluminum.
The sapphire has the advantages of high hardness, scratch resistance, good heat resistance, high light transmittance, stable chemical property and the like, and can meet the requirements of anti-falling and scratch resistance of electronic elements such as mobile phones, watches and the like. In addition, the production technology of the sapphire is mature, and the obtained product has good quality.
The main component of sapphire is alumina (Al)2O3) Accordingly, the light shielding metal is selected to be aluminum, and an incomplete oxide of aluminum is AlOx, where x is 1, 2, and 3. The light-shielding film 12 made of aluminum and an incomplete oxide of aluminum has a refractive index close to that of sapphire, and not only has a good light-absorbing effect, but also has a lower reflectance.
Optionally, in an achievable manner of the embodiment of the present invention, the refractive index of the light shielding film 12 for visible light is 1.7 to 1.9, and the extinction coefficient is greater than 0.05.
By controlling the flow of oxygen, the refractive index of the light shielding film 12 for visible light is 1.7-1.9, and the extinction coefficient is greater than 0.05, so as to ensure that the refractive index of the light shielding film 12 is close to that of the substrate body 11, and the obtained substrate module 10 has excellent parameters such as reflectivity, transmittance and chromaticity.
For example, the refractive index of the light-shielding film 12 is controlled to be 1.781, and the reflectance and transmittance of the substrate body 11 and the light-shielding film 12 to visible light obtained under the irradiation of visible light in the 400-and 700nm wavelength band are shown in fig. 2 and 3, where the abscissa in fig. 2 is the wavelength band of visible light and the ordinate is the reflectance of the substrate body 11 and the light-shielding film 12, and the abscissa in fig. 3 is the wavelength band of visible light and the ordinate is the transmittance of the substrate body 11 and the light-shielding film 12.
The embodiment of the invention also discloses a preparation method of the substrate module 10, which comprises the step of plating the shading film 12 on the surface of the substrate body 11, wherein the shading film 12 comprises shading metal and a mixture of incomplete oxides of at least one of the shading metals, and the shading film 12 can absorb visible light.
A light shielding film 12 is formed on the surface of the substrate body 11, and the light shielding film 12 includes a mixture of a light shielding metal and an incomplete oxide of the light shielding metal.
First, the light shielding film 12 is not limited to be formed in this embodiment, as long as it can uniformly cover the surface of the substrate body 11 and make the substrate body 11 appear black in the reflection color of the visible light band. For example, the light shielding film 12 may be formed on the base body 11 by vacuum deposition, that is, the material to be deposited and the substrate to be plated are placed in a vacuum chamber, and the material to be deposited is heated by a certain method to be evaporated or sublimated and then sputtered onto the surface of the substrate to be plated to form a film.
Second, the material of the light-shielding metal is not limited as long as it has light absorption and can absorb visible light.
As described above, the method for manufacturing the substrate module 10 includes plating the light shielding film 12 on the surface of the substrate body 11, where the light shielding film 12 includes a mixture of a light shielding metal and an incomplete oxide of at least one of the light shielding metals, and the light shielding film 12 can absorb visible light. The substrate module 10 prepared by the method has good shading effect, does not have high-temperature air release phenomenon, and does not have adverse effect on formed electronic elements.
Referring to fig. 4, in an optional manner of the embodiment of the present invention, the step of plating the light shielding film 12 on the surface of the substrate body 11 includes:
s100: the substrate body is placed in a vacuum chamber.
The substrate body 11 is placed in a vacuum chamber, and the substrate body 11 is subjected to a plating operation in a vacuum state. The film formation under the vacuum condition can reduce the collision of atoms and molecules of the shading metal with gas molecules in the process of flying to the substrate body 11, reduce the chemical reaction between active molecules in the gas and the shading metal, and reduce the amount of impurities formed by the gas molecules entering the shading film 12 in the film formation process, thereby improving the density, purity, deposition rate and adhesive force with the substrate body 11 of the shading film 12. For example, the substrate body 11 may be placed in a vacuum evaporation coater for coating.
S300: and evaporating shading metal on the surface of the substrate body to enable the shading metal and oxygen to generate oxidation reaction until a shading film with a preset thickness is formed on the surface of the substrate body.
The substrate body 11 and the light-shielding metal are placed in a vacuum chamber at the same time, the light-shielding metal is heated to be evaporated or sublimated and splashed onto the substrate body 11, and at the same time, oxygen is added to the surface of the substrate body 11, so that the light-shielding metal is subjected to oxidation reaction in the condensation film-forming process to form an incomplete oxide of the light-shielding metal, and the obtained light-shielding film 12 comprises the light-shielding metal and the incomplete oxide thereof.
After the light shielding film 12 reaches a predetermined thickness, the evaporation is stopped. The predetermined thickness is the required thickness of the light shielding film 12, and the predetermined thickness affects the transmittance of the light shielding film 12 to visible light. Preferably, the predetermined thickness is 300-3000nm, and the light-shielding film 12 in this thickness range has a better light-shielding effect and a lower cost.
Optionally, in an achievable manner of the embodiment of the invention, the vacuum chamber has a vacuum degree of less than 2.0E-3 Pa.
The vacuum degree of the vacuum chamber is less than 2.0E-3Pa, so that the compactness, the purity, the deposition rate and the adhesive force with the substrate body 11 of the shading film 12 can be ensured. In general, the farther the distance between the light-shielding metal and the base body 11 is, the higher the quality requirement for the light-shielding film 12 is, the lower the degree of vacuum is.
Referring to fig. 5, in an alternative implementation manner of the embodiment of the present invention, after the substrate body 11 is placed in the vacuum chamber, the method further includes:
s200: the ion source performs ion precleaning on the substrate body.
The ion source emits ion beams to bombard the surface of the substrate body 11, and the surface pollution layer of the substrate body 11 is removed under the condition of higher vacuum degree, so as to achieve the purpose of thorough cleaning. Compared with other methods for cleaning the surface of a material in a dry and wet manner, the method has the advantages that the surface cleaning effect of the ion beam is the most thorough, and the flexibility of the ion beam cleaning process is the strongest due to the strong ion beam directionality, the low working gas pressure and the easy independent control of ion sputtering parameters. Meanwhile, the surface of the substrate body 11 bombarded by the ion beam is beneficial to enhancing the adhesion of the shading film 12.
Referring to fig. 6, in an optional manner of the embodiment of the present invention, depositing a light-shielding metal on the surface of the substrate body 11 to perform an oxidation reaction between the light-shielding metal and oxygen until a light-shielding film 12 with a predetermined thickness is formed on the surface of the substrate body 11 includes:
s310: and evaporating light-shielding metal on the surface of the substrate body.
The substrate body 11 and the light shielding metal are placed in a vacuum chamber at the same time, and the light shielding metal is heated to be evaporated or sublimated and sputtered onto the substrate body 11.
S320: the ion source and the vacuum chamber simultaneously add oxygen to the surface of the substrate body until a light shielding film of a predetermined thickness is formed on the surface of the substrate body.
In the process of evaporating the light-shielding metal, the ion source and the vacuum chamber simultaneously add oxygen to the surface of the substrate body 11 to ensure that the content of oxygen in the vacuum chamber is sufficient for forming incomplete oxide of the light-shielding metal and to conveniently control the flow of the oxygen.
Optionally, in an implementation manner of the embodiment of the present invention, the evaporation rate of the light-shielding metal is 5-50nm/s, the oxygen flow rate of the ion source is 10-100sccm, and the oxygen flushing flow rate of the chamber is 50-500 sccm.
The evaporation rate of the shading metal is 5-50nm/s, and in the range, the evaporation speed is high, the stability of evaporation can be ensured, and larger pressure can not be caused to evaporation equipment. The evaporation rate is lower than 5nm/s, the productivity is lower than 50nm/s, a large amount of oxygen needs to be injected into the chamber in a short time, the stability is lower, the energy is higher, and the evaporation equipment is easy to damage. The oxygen flow of the ion source is 10-100sccm, the oxygen flushing flow of the chamber is 50-500sccm, and the two can be matched with each other, so that not only can a larger oxygenation flow be ensured, but also flexible adjustment can be realized, the refractive index of the shading film 12 is ensured to be close to that of the substrate body 11, and the obtained substrate module 10 has better parameters such as reflectivity, transmittance, chromaticity and the like.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A substrate module is characterized by comprising a substrate body and a shading film covering the surface of the substrate body, wherein the shading film comprises a mixture of shading metal and incomplete oxide of at least one of the shading metal, and the shading film can absorb visible light.
2. The substrate module as set forth in claim 1, wherein the light-shielding film has a thickness of 300-3000 nm.
3. The substrate module as set forth in claim 1, wherein the substrate body is made of sapphire, and the light shielding film is made of a mixture of aluminum and an incomplete oxide of aluminum.
4. The substrate module of claim 3, wherein the light-shielding film has a refractive index of 1.7-1.9 and an extinction coefficient greater than 0.05 with respect to the visible light.
5. A method for preparing a substrate module, comprising:
the surface of the substrate body is plated with a shading film, the shading film comprises a mixture of shading metals and incomplete oxides of at least one of the shading metals, and the shading film can absorb visible light.
6. The method as claimed in claim 5, wherein the step of plating a light-shielding film on the surface of the substrate body comprises:
placing the substrate body in a vacuum chamber;
and evaporating shading metal on the surface of the substrate body to enable the shading metal and oxygen to generate oxidation reaction until a shading film with a preset thickness is formed on the surface of the substrate body.
7. The method of claim 6, wherein after the placing the substrate body in the vacuum chamber, the method further comprises:
and the ion source carries out ion pre-cleaning on the substrate body.
8. The method of claim 6, wherein the vacuum chamber has a vacuum degree of less than 2.0E-3 Pa.
9. The method as claimed in claim 7, wherein the depositing a light shielding metal on the surface of the substrate body to oxidize the light shielding metal with oxygen until the light shielding film with a predetermined thickness is formed on the surface of the substrate body comprises:
evaporating shading metal on the surface of the substrate body;
the ion source and the vacuum chamber simultaneously add oxygen to the surface of the substrate body until the light shielding film with a preset thickness is formed on the surface of the substrate body.
10. The method as claimed in claim 9, wherein the deposition rate of the light-shielding metal is 5-50nm/s, the flow rate of the oxygen gas in the ion source is 10-100sccm, and the flow rate of the oxygen gas in the chamber is 50-500 sccm.
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