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CN113835565A - Array substrate, handwriting board and manufacturing method - Google Patents

Array substrate, handwriting board and manufacturing method Download PDF

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Publication number
CN113835565A
CN113835565A CN202111140244.6A CN202111140244A CN113835565A CN 113835565 A CN113835565 A CN 113835565A CN 202111140244 A CN202111140244 A CN 202111140244A CN 113835565 A CN113835565 A CN 113835565A
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China
Prior art keywords
electrode
layer
driving circuit
film layer
forming
Prior art date
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Pending
Application number
CN202111140244.6A
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Chinese (zh)
Inventor
李井森
詹成勇
马健
胡金良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202111140244.6A priority Critical patent/CN113835565A/en
Publication of CN113835565A publication Critical patent/CN113835565A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/13338Input devices, e.g. touch panels
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses an array substrate applied to a handwriting board, the handwriting board and a manufacturing method, wherein the array substrate of one embodiment comprises the following components: the display device comprises a driving circuit layer arranged on a first substrate and a colored film layer arranged on the driving circuit layer. According to the array substrate provided by the invention, the colored film layer is arranged on the drive circuit layer, so that the manufacturing process and cost are effectively simplified, the problem of complicated manufacturing process existing in the prior art due to the fact that the colored film layer is arranged on the side, far away from the drive circuit layer, of the substrate is solved, and the array substrate has a wide application prospect.

Description

Array substrate, handwriting board and manufacturing method
Technical Field
The invention relates to the technical field of display, in particular to an array substrate, a handwriting board and a manufacturing method.
Background
In recent two years, paperless office becomes a new favorite for technical application, and a handwriting board with a writing display function is expected to replace some traditional writing tools such as blackboards and whiteboards in the fields of education and office. The handwriting board can write only by things similar to a pen without consuming auxiliary materials, and can ensure the physical health of teachers and students in the field of education. However, most of the current handwriting boards are complicated in manufacturing process.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the present invention provides an array substrate applied to a writing pad, including: the display device comprises a driving circuit layer arranged on a first substrate and a colored film layer arranged on the driving circuit layer.
For example, in some embodiments of the present application, there is provided an array substrate, further including:
a colored film layer disposed on the driving circuit layer;
a first electrode disposed on the colored film layer;
a passivation layer covering the first electrode.
For example, in some embodiments of the present application, there is provided an array substrate, further including:
a first electrode disposed on the driving circuit layer;
a colored film layer disposed on the first electrode.
For example, in the array substrate provided in some embodiments of the present application, the colored film layer is a black matrix film layer.
For example, in some embodiments of the present application, there is provided an array substrate, further including:
the first electrode is arranged on the driving circuit layer and is a colored electrode film layer;
a passivation layer covering the first electrode.
A second embodiment of the present invention provides a writing pad comprising the array substrate of the first embodiment, an upper substrate aligned with the array substrate, and a liquid crystal layer disposed between the array substrate and the upper substrate, wherein
The upper substrate includes a second substrate, a second electrode disposed on the second substrate, and a planarization layer disposed on the second electrode;
the liquid crystal layer includes cholesteric liquid crystal.
A third embodiment of the present invention provides a method for manufacturing an array substrate according to the first embodiment, including:
forming a driving circuit layer on a first substrate;
and forming a colored film layer on the driving circuit layer.
For example, in some embodiments of the present disclosure, the forming a colored film layer on the driving circuit layer further includes:
forming a colored film layer on the driving circuit layer;
forming a first electrode on the colored film layer;
forming a passivation layer covering the first electrode;
or
A first electrode disposed on the driving circuit layer;
a colored film layer disposed on the first electrode.
For example, in some embodiments of the present disclosure, the forming a colored film layer on the driving circuit layer further includes:
forming a first electrode on the driving circuit layer, wherein the first electrode is a colored electrode film layer;
forming a passivation layer covering the first electrode.
For example, in some embodiments of the present application, the forming a first electrode on the driving circuit layer further includes:
utilize pulse laser to make coloured electrode film layer, include:
forming an electrode material layer on the driving circuit layer;
adjusting parameters of a pulse laser emitting the pulse laser according to preset colored parameters;
vertically irradiating the electrode material layer with the pulsed laser to form the first electrode; or
The first electrode is formed using a colored electrode target.
The invention has the following beneficial effects:
aiming at the existing problems, the invention provides the array substrate applied to the handwriting board, the handwriting board and the manufacturing method, the colored film layer is arranged on the driving circuit layer of the array substrate applied to the handwriting board, the manufacturing process and the cost are effectively simplified, and therefore, the problem that the manufacturing process is complicated because the colored film layer is arranged on the side, far away from the driving circuit layer, of the substrate in the prior art is solved, and the array substrate applied to the handwriting board has a wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an array substrate according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an array substrate according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of an array substrate according to another embodiment of the present invention;
fig. 4 is a schematic structural diagram of an array substrate according to another embodiment of the present invention;
fig. 5 shows a flow chart of a method of fabrication according to an embodiment of the invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
It is noted that references herein to "on … …", "formed on … …" and "disposed on … …" can mean that one layer is formed or disposed directly on another layer or that one layer is formed or disposed indirectly on another layer, i.e., there is another layer between the two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, or the like using one mask plate.
In the prior art, a handwriting pad utilizes a bistable Cholesteric Liquid Crystal to realize a handwriting pad function, and specifically, the bistable Cholesteric Liquid Crystal (CLC) has three states of a P state (Planar Texture), an FC state (Focal Texture), and an H state (contextual Texture) under different conditions; the P state and the FC state are stable states and do not need voltage holding; the H state is unstable and appears in a continuous power-on state: when the liquid crystal film is pressed, the liquid crystal is pressed and overturned into a P state by pressure, when natural light irradiates the area, light with specific wavelength is reflected, and the rest light is absorbed by the substrate black film to form a writing with corresponding color; when erased, the liquid crystal is turned on and returns to the FC state. Namely, the writing board realizes the writing function and the erasing function by utilizing the P state and the FC state of the cholesteric liquid crystal.
The existing handwriting board has the following manufacturing procedures:
forming a first substrate, specifically comprising forming a driving circuit layer on a first substrate, forming a pixel electrode on the driving circuit layer, forming a planarization layer on the pixel electrode, forming a PS spacer on the driving circuit layer, coating PI polyimide, and coating seal frame glue on the periphery;
forming a second substrate, specifically forming a PET transparent film layer and a common electrode on a second substrate;
dripping liquid crystal into the liquid crystal box, forming a panel by the first substrate and the second substrate of the liquid crystal box, carrying out UV curing, cutting and binding the FPC flexible circuit board;
and attaching a black PET (polyethylene terephthalate) back film to one side of the first substrate, which is far away from the driving circuit layer, and assembling the whole machine to form the handwriting board.
According to the above-mentioned manufacturing process, the inventors have made extensive studies and experiments, and the reason why the manufacturing process in the prior art is complicated is that: there is flexible black PET notacoria attached on flexible panel in the preparation of handwriting pad, has the attached production mode of mantle and mantle promptly, and this production mode leads to the loaded down with trivial details problem of preparation flow.
In view of the above problem, as shown in fig. 1, an embodiment of the present application provides an array substrate applied to a tablet, including: the display device comprises a driving circuit layer arranged on a first substrate and a colored film layer arranged on the driving circuit layer.
In this embodiment, through with coloured rete setting on the drive circuit layer of array substrate, effectively simplify preparation flow and cost to solve among the prior art and keep away from the loaded down with trivial details problem of preparation flow that exists on one side of drive circuit layer because of coloured rete setting at the substrate, have extensive application prospect.
In a specific example, as shown in fig. 2, the array substrate further includes: a colored film layer disposed on the driving circuit layer; a first electrode disposed on the colored film layer; a passivation layer covering the first electrode.
In this example, the array substrate includes: a first substrate 100; a driving circuit layer 110 disposed on the first substrate 100, including a gate electrode 111 disposed on the first substrate 100, a gate insulating layer 112 covering the gate electrode, an active layer 113 disposed on the gate insulating layer 112, a source electrode 114 and a drain electrode 115 disposed on the active layer, and an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113; a colored film layer 120 disposed on the driving circuit layer 110, the colored film layer 120 being a black matrix film layer; a first electrode 130 disposed on the colored film layer 120, wherein the first electrode 130 is a pixel electrode; a passivation layer 140 disposed on the first electrode 130 for insulation protection of the first electrode 130; and a spacer PS150 disposed on the passivation layer 140.
The preparation method specifically comprises the following steps:
first, a driving circuit layer 110 is formed on a first substrate 100;
the method specifically comprises the following steps: patterning a gate electrode 111 on the first substrate 100, forming a gate insulating layer 112 covering the gate electrode, forming an active layer 113 on the gate insulating layer 112, forming a source electrode 114 and a drain electrode 115 on the active layer to be insulated from each other, and forming an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113;
secondly, forming a colored film layer 120 on the driving circuit layer 110, wherein the colored film layer 120 is a black matrix film layer;
thirdly, forming a first electrode 130 on the colored film layer 120, wherein the first electrode 130 is a pixel electrode;
next, forming a passivation layer 140 covering the first electrode 130, wherein the passivation layer 140 is used for insulating and protecting the first electrode 130;
finally, spacers PS150 are formed on the passivation layer 140.
In this embodiment, the colored film layer disposed between the driving circuit layer 110 and the pixel electrode 130 can effectively simplify the manufacturing process and the manufacturing cost, thereby solving the problem of the prior art that the manufacturing process is complicated due to the colored film layer disposed on the side of the substrate away from the driving circuit layer.
In view of the fact that the environment of the fabrication of the colored film layer and the environment of the subsequent fabrication steps are different in the actual fabrication process, in an alternative embodiment, as shown in fig. 3, the array substrate further includes: a first electrode disposed on the driving circuit layer; a colored film layer disposed on the first electrode.
In this example, the array substrate includes: a first substrate 100; a driving circuit layer 110 disposed on the first substrate 100, including a gate electrode 111 disposed on the first substrate 100, a gate insulating layer 112 covering the gate electrode, an active layer 113 disposed on the gate insulating layer 112, a source electrode 114 and a drain electrode 115 disposed on the active layer, and an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113; a first electrode 130 disposed on the driving circuit layer 110, the first electrode 130 being a pixel electrode; the colored film layer 120 is arranged on the first electrode 130, and the colored film layer 120 is a black matrix film layer and has insulating and shading functions; and a spacer PS150 disposed on the colored film layer 120.
The preparation method specifically comprises the following steps:
first, a driving circuit layer 110 is formed on a first substrate 100;
the method specifically comprises the following steps: patterning a gate electrode 111 on the first substrate 100, forming a gate insulating layer 112 covering the gate electrode, forming an active layer 113 on the gate insulating layer 112, forming a source electrode 114 and a drain electrode 115 on the active layer to be insulated from each other, and forming an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113;
next, a first electrode 130 is formed on the driving circuit layer 110, and the first electrode 130 is a pixel electrode;
thirdly, forming a colored film layer 120 on the first electrode 130, wherein the colored film layer 120 is a black matrix film layer and has insulating and shading functions;
finally, a spacer PS150 is formed on the colored film layer 120.
In this embodiment, the colored film layers disposed on the driving circuit layer 110 and the pixel electrode 130 reduce the number of insulating layers while realizing the handwriting function, thereby effectively simplifying the manufacturing process and the cost, and solving the problem of the prior art that the manufacturing process is complicated due to the colored film layer disposed on the side of the substrate away from the driving circuit layer.
In order to further simplify the manufacturing process and cost, in an alternative embodiment, as shown in fig. 4, the array substrate further includes: the first electrode is arranged on the driving circuit layer and is a colored electrode film layer; a passivation layer covering the first electrode.
In this example, the array substrate includes: a first substrate 100; a driving circuit layer 110 disposed on the first substrate 100, including a gate electrode 111 disposed on the first substrate 100, a gate insulating layer 112 covering the gate electrode, an active layer 113 disposed on the gate insulating layer 112, a source electrode 114 and a drain electrode 115 disposed on the active layer, and an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113; a first electrode 130 disposed on the driving circuit layer 110, where the first electrode 130 is a pixel electrode, and the first electrode is a colored electrode film layer, for example, the first electrode 130 is a black pixel electrode, that is, the first electrode is multiplexed as a pixel electrode and a colored film layer; a passivation layer covering the first electrode 130, the passivation layer 140 serving to protect the first electrode 130 from insulation; and a spacer PS150 disposed on the passivation layer 140.
The preparation method specifically comprises the following steps:
first, a driving circuit layer 110 is formed on a first substrate 100;
the method specifically comprises the following steps: patterning a gate electrode 111 on the first substrate 100, forming a gate insulating layer 112 covering the gate electrode, forming an active layer 113 on the gate insulating layer 112, forming a source electrode 114 and a drain electrode 115 on the active layer to be insulated from each other, and forming an insulating layer 116 covering the source electrode 114, the drain electrode 115, and the active layer 113;
secondly, a first electrode 130 is formed on the driving circuit layer 110, the first electrode 130 is a pixel electrode, and the first electrode is a colored electrode film layer, for example, the first electrode 130 is a black pixel electrode, that is, the first electrode is multiplexed as the pixel electrode and the colored film layer;
in the present embodiment, it is preferred that,
one method of fabricating the first electrode 130 is: manufacturing a colored electrode film layer by using pulse laser; the method specifically comprises the following steps: forming an electrode material layer on the driving circuit layer; adjusting parameters of a pulse laser emitting the pulse laser according to preset colored parameters; vertically irradiating the electrode material layer with the pulsed laser to form the first electrode.
Another method for fabricating the first electrode 130 is: the first electrode is formed using a colored electrode target.
In this embodiment, a method for manufacturing the first electrode 130 is not specifically limited, and a manufacturing principle of a colored pixel electrode is implemented, which is not described herein again.
Thirdly, forming a passivation layer 140 covering the first electrode 130, wherein the passivation layer 140 is used for insulating and protecting the first electrode 130;
finally, spacers PS150 are formed on the passivation layer 140.
In this embodiment, the colored pixel electrode 130 disposed on the driving circuit layer 110 is multiplexed into a pixel electrode, a colored film layer and the colored pixel electrode 130, so as to effectively simplify the manufacturing process and cost, and solve the problem of complex manufacturing process existing in the prior art when the colored film layer is disposed on the side of the substrate away from the driving circuit layer.
Based on the array substrate, one embodiment of the application provides a handwriting board, which comprises the array substrate, an upper substrate and a liquid crystal layer, wherein the upper substrate is paired with the array substrate, the liquid crystal layer is arranged between the array substrate and the upper substrate, the upper substrate comprises a second substrate, a second electrode arranged on the second substrate, and a planarization layer arranged on the second electrode; the liquid crystal layer includes cholesteric liquid crystal.
In this embodiment, a handwriting board is formed by aligning the upper substrate provided with the second substrate, the second electrode and the planarization layer and the array substrate into which the cholesteric liquid crystal is dropped, and the handwriting board has the characteristics of simple manufacturing method and low cost, and can solve the problem of complicated manufacturing method of the handwriting board in the prior art.
Corresponding to the array substrate provided in the foregoing embodiments, an embodiment of the present application further provides a manufacturing method for manufacturing the array substrate, and since the manufacturing method provided in the embodiment of the present application corresponds to the array substrates provided in the foregoing embodiments, the foregoing embodiment is also applicable to the manufacturing method provided in the embodiment, and is not described in detail in the embodiment.
As shown in fig. 5, based on the array substrate, an embodiment of the present application provides a manufacturing method for manufacturing the array substrate, including:
forming a driving circuit layer on a first substrate;
and forming a colored film layer on the driving circuit layer.
In this embodiment, through with coloured rete setting on the drive circuit layer of array substrate, effectively simplify preparation flow and cost to solve among the prior art and keep away from the loaded down with trivial details problem of preparation flow that exists on one side of drive circuit layer because of coloured rete setting at the substrate, have extensive application prospect.
In an optional embodiment, the forming a colored film layer on the driving circuit layer further includes:
forming a colored film layer on the driving circuit layer;
forming a first electrode on the colored film layer;
forming a passivation layer covering the first electrode.
In this embodiment, through the colored rete of setting between drive circuit layer and pixel electrode, can effectively simplify preparation flow and cost to solve among the prior art and keep away from the loaded down with trivial details problem of preparation flow that drive circuit layer one side exists because of colored rete setting at the substrate.
In an optional embodiment, the forming a colored film layer on the driving circuit layer further includes:
a first electrode disposed on the driving circuit layer;
a colored film layer disposed on the first electrode.
In this embodiment, through the colored rete that sets up on drive circuit layer and pixel electrode, reduce the insulating layer when realizing the function of writing by hand to effectively simplify preparation flow and cost, thereby solve among the prior art and keep away from the loaded down with trivial details problem of preparation flow that drive circuit layer one side exists because of colored rete setting at the substrate.
In an optional embodiment, the forming a colored film layer on the driving circuit layer further includes:
forming a first electrode on the driving circuit layer, wherein the first electrode is a colored electrode film layer;
forming a passivation layer covering the first electrode.
Specifically, the forming of the first electrode on the driving circuit layer further includes:
utilize pulse laser to make coloured electrode film layer, include:
forming an electrode material layer on the driving circuit layer;
adjusting parameters of a pulse laser emitting the pulse laser according to preset colored parameters;
vertically irradiating the electrode material layer with the pulsed laser to form the first electrode.
Specifically, the forming of the first electrode on the driving circuit layer further includes: the first electrode is formed using a colored electrode target.
In this embodiment, through the colored pixel electrode that sets up on the drive circuit layer, multiplex as pixel electrode and colored rete and colored pixel electrode promptly to effectively simplify preparation flow and cost, thereby solve among the prior art because of colored rete sets up the loaded down with trivial details problem of preparation flow that exists in the substrate keep away from drive circuit layer one side.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.

Claims (10)

1. An array substrate applied to a handwriting board is characterized by comprising: the display device comprises a driving circuit layer arranged on a first substrate and a colored film layer arranged on the driving circuit layer.
2. The array substrate of claim 1, further comprising:
a colored film layer disposed on the driving circuit layer;
a first electrode disposed on the colored film layer;
a passivation layer covering the first electrode.
3. The array substrate of claim 1, further comprising:
a first electrode disposed on the driving circuit layer;
a colored film layer disposed on the first electrode.
4. The array substrate of claim 2 or 3, wherein the colored film layer is a black matrix film layer.
5. The array substrate of claim 1, further comprising:
the first electrode is arranged on the driving circuit layer and is a colored electrode film layer;
a passivation layer covering the first electrode.
6. A handwriting board, comprising the array substrate of any one of claims 1-5, an upper substrate paired with the array substrate, and a liquid crystal layer disposed between the array substrate and the upper substrate, wherein
The upper substrate includes a second substrate, a second electrode disposed on the second substrate, and a planarization layer disposed on the second electrode;
the liquid crystal layer includes cholesteric liquid crystal.
7. A method for fabricating the array substrate according to any one of claims 1 to 5, comprising:
forming a driving circuit layer on a first substrate;
and forming a colored film layer on the driving circuit layer.
8. The method of manufacturing according to claim 7, wherein the forming a colored film layer on the driving circuit layer further comprises:
forming a colored film layer on the driving circuit layer;
forming a first electrode on the colored film layer;
forming a passivation layer covering the first electrode;
or
A first electrode disposed on the driving circuit layer;
a colored film layer disposed on the first electrode.
9. The method of manufacturing according to claim 7, wherein the forming a colored film layer on the driving circuit layer further comprises:
forming a first electrode on the driving circuit layer, wherein the first electrode is a colored electrode film layer;
forming a passivation layer covering the first electrode.
10. The method of manufacturing according to claim 7, wherein the forming a first electrode on the driving circuit layer further comprises:
utilize pulse laser to make coloured electrode film layer, include:
forming an electrode material layer on the driving circuit layer;
adjusting parameters of a pulse laser emitting the pulse laser according to preset colored parameters;
vertically irradiating the electrode material layer with the pulsed laser to form the first electrode; or
The first electrode is formed using a colored electrode target.
CN202111140244.6A 2021-09-28 2021-09-28 Array substrate, handwriting board and manufacturing method Pending CN113835565A (en)

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