CN113782255B

CN113782255B - Conductive adhesive film and display device

Info

Publication number: CN113782255B
Application number: CN202111135802.XA
Authority: CN
Inventors: 陈建军
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-09-27
Filing date: 2021-09-27
Publication date: 2024-06-21
Anticipated expiration: 2041-09-27
Also published as: CN113782255A

Abstract

The application discloses a conductive adhesive film and a display device, and belongs to the technical field of electronic materials. The conductive adhesive film comprises: a carrier layer; the first connecting adhesives are arranged on one side of the carrier layer at intervals, and gaps are reserved between the adjacent first connecting adhesives; and the conductive particles are distributed in each first connecting adhesive.

Description

Conductive adhesive film and display device

Technical Field

The application belongs to the technical field of electronic materials, and particularly relates to a conductive adhesive film and a display device.

Background

Anisotropic Conductive Film (ACF) is widely used as a connecting material in electronic products. The conventional anisotropic conductive adhesive film mainly comprises conductive particles, adhesive materials and carrier layers, wherein the conductive particles are distributed in the adhesive materials, and after the ACF is placed between two circuits to be connected, the ACF is pressed to deform the conductive particles in the ACF, so that the conduction between the upper circuit electrode and the lower circuit electrode is realized. However, the prior art has the following disadvantages: (1) chemical corrosion is likely to occur between adjacent electrodes; (2) Short circuit or large impedance easily occurs in the lamination process.

Disclosure of Invention

The embodiment of the application aims to provide a conductive adhesive film which can solve the problems that chemical corrosion occurs between adjacent electrodes and short circuit or short circuit occurs in the lamination process.

In a first aspect, an embodiment of the present application provides a conductive adhesive film, including:

A carrier layer;

The first connecting adhesives are arranged on one side of the carrier layer at intervals, and gaps are reserved between the adjacent first connecting adhesives;

and the conductive particles are distributed in each first connecting adhesive.

In a second aspect, an embodiment of the present application provides a display apparatus, including:

the screen body is provided with a first electrode at one side;

The first connecting glue is arranged on one side of the screen body at intervals, gaps are reserved between the adjacent first connecting glue, and the first connecting glue and the first electrode are correspondingly arranged;

conductive particles are distributed in each first connecting adhesive;

The circuit board, the circuit board set up in a plurality of first connection glues deviate from one side of screen body, the circuit board includes substrate and a plurality of second electrode, the second electrode set up in the substrate orientation one side of screen body, just the second electrode with first connection glues correspond the setting.

In a third aspect, an embodiment of the present application provides a method for preparing a conductive adhesive film, including:

setting a target pattern on a carrier layer by adopting patterning, wherein the target pattern corresponds to the shape of a bonding area of the conductive adhesive film;

Coating the slurry adhesive on the carrier layer according to the target pattern to generate first connecting adhesive;

And injecting the conductive particles into the first connecting adhesive according to the target incidence angle to obtain the conductive adhesive film.

In a fourth aspect, an embodiment of the present application provides a method for manufacturing a circuit board, including:

Setting a target pattern on one side of a base material of the circuit board by adopting patterning, wherein the target pattern corresponds to the shape of a bonding area of a conductive adhesive film to be connected with the circuit board;

And arranging an insulating support column on one side of the base material according to the target pattern to obtain the circuit board.

In the embodiment of the application, the contact between the conductive particles in the adjacent first connecting glue after the ACF is pressed is blocked by arranging the plurality of first connecting glue which are arranged at intervals and are distributed with the conductive particles, so that the risk of short circuit between the electrodes at adjacent positions is effectively avoided; in addition, when the ACF is used for connecting a circuit to be connected, the risk of electrochemical corrosion can be effectively reduced, and the service performance and the service life of a product can be improved.

Drawings

FIG. 1 is a schematic diagram of a conductive adhesive film according to an embodiment of the present application;

FIG. 2 is a second schematic diagram of a conductive adhesive film according to an embodiment of the present application;

FIG. 3 is a third schematic diagram of a conductive adhesive film according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a conductive film according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a display device according to an embodiment of the present application;

FIG. 6 is a second schematic diagram of a display device according to an embodiment of the application;

FIG. 7 is a third schematic diagram of a display device according to an embodiment of the application;

fig. 8 is a schematic flow chart of a method for preparing a conductive adhesive film according to an embodiment of the present application;

fig. 9 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment of the present application.

Reference numerals illustrate:

110: a carrier layer; 120: a first connection adhesive; 130: conductive particles;

140: a protective layer; 150: a second adhesive; 160: a void;

210: a screen body; 211: a first electrode;

220: a circuit board; 221: a second electrode; 222: insulating support columns.

Detailed Description

The technical solutions of the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the present application, fall within the scope of protection of the present application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The conductive adhesive film, the display device, the preparation method of the conductive adhesive film and the preparation method of the circuit board provided by the embodiment of the application are described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

The embodiment of the application provides a conductive adhesive film.

As shown in fig. 1, the conductive adhesive film includes: the carrier layer 110, a plurality of first connection adhesives 120 and conductive particles 130.

The carrier layer 110 is a release film for carrying the first adhesive 120. The first connection adhesive 120 is an adhesive material for connecting the upper and lower circuits to be connected with the conductive adhesive film.

The first connecting adhesives 120 are arranged at one side of the carrier layer 110 at intervals, and gaps 160 are reserved between the adjacent first connecting adhesives 120; and conductive particles 130 are distributed in each first connection glue 120. In some embodiments, the material of the first adhesive 120 may be epoxy adhesive.

In other embodiments, the material of the first adhesive 120 may be acrylic adhesive.

Of course, in other embodiments, the material of the first adhesive 120 may be polyimide, etc., which is not described in detail herein.

In the embodiment, the epoxy resin adhesive and the acrylic adhesive are utilized to have higher mechanical property, excellent adhesive property, smaller curing shrinkage and better manufacturability and stability, so that the stability of the product is improved, and the process production flow is optimized.

The conductive particles 130 have a multi-layered spherical structure, and include, from inside to outside: high molecular polymer plastic ball, metal nickel or gold plating layer and resin insulating layer.

Of course, in some cases, the conductive particles 130 may not include a resin insulating layer, such as ACF (anisotropic conductive film) used in a part of FOG, and FOG electrode width and adjacent electrode distance are large, so the conductive particles used in such ACF may not include an insulating layer.

In this embodiment, the first adhesive 120 is configured as a columnar structure, and is vertically disposed on one side surface of the carrier layer 110, and a space 160 is left between adjacent first adhesive 120.

A plurality of conductive particles 130 are distributed in each of the first bonding adhesives 120.

The arrangement manner of the plurality of conductive particles 130 in the first connection glue 120 may be a disordered arrangement, i.e. the conductive particles 130 are randomly distributed in the first connection glue 120 and have uneven density; or may be uniformly distributed, that is, the conductive particles 130 are arranged in a matrix in the first adhesive 120, and the density may be adjusted according to needs. The application is not limited.

It is understood that the conductive particles 130 in the first connection paste 120 are deformed by applying pressure to the first connection paste 120, and the insulating film of the outer layer of the conductive particles 130 is broken, so that the metal plating layers of the plurality of conductive particles 130 can be connected to each other. In the actual implementation process, the conductive adhesive film is placed between the upper circuit electrode and the lower circuit electrode to be connected, and the electrode contact communication of the upper circuit and the lower circuit can be realized only by applying certain pressure.

And simultaneously, a certain temperature is applied for a period of time to solidify the first connecting glue 120 of the ACF, so that the contact state of the conductive particles 130 and the upper and lower circuit electrodes can be maintained, and stable connection of the circuit is realized.

The inventor finds that in the research and development process, in the related ACF, whether the conductive particles are uniformly distributed or randomly distributed, when the ACF is pressed, circuit short circuit is easily generated between electrodes at adjacent positions, which is caused by aggregation of the conductive particles, in a partial area due to non-uniform distribution of the conductive particles, so that the function of a product is influenced.

In order to reduce the risk of short-circuiting between electrodes at adjacent positions, there is also a method of sputtering conductive particles only in the bonding paste corresponding to the bonding region by not sputtering conductive particles in the bonding paste of the non-bonding region in the related art. However, in the actual implementation process, after the ACF is pressed, conductive particles still overflow to cause short circuit between the electrodes at adjacent positions, and the method does not completely solve the problem of how to avoid the risk of short circuit between the electrodes at adjacent positions.

In addition, electrochemical corrosion exists between adjacent electrodes, thereby affecting the service life of the product.

In the present application, by arranging a plurality of first connection adhesives 120 arranged at intervals, the contact between the conductive particles 130 in the adjacent first connection adhesives 120 after the ACF is pressed can be blocked by the reserved gaps 160, so as to avoid the lateral communication of the conductive particles 130 in the adjacent first connection adhesives 120, and thus effectively avoid the risk of short circuit between adjacent electrodes.

When the ACF is applied to the case of connecting upper and lower circuits, the gaps 160 between adjacent first connection adhesives 120 can correspond to the intervals between adjacent electrodes, so that metal migration cannot occur between the adjacent electrodes due to the absence of electrolyte, thereby avoiding electrochemical corrosion and improving product performance.

It should be noted that, in the actual implementation process, the plurality of first connection adhesives 120 in the present application are required to be disposed corresponding to the electrodes of the circuit to be connected.

For example, when the conductive adhesive film provided in the embodiment of the present application is used to connect the circuit board 220 and the screen body 210, only one end of the plurality of first connection adhesives 120 is correspondingly connected to the second electrode 221 on the circuit board 220, the release film on the ACF is torn off, and the other end of the first connection adhesive 120 is correspondingly connected to the first electrode 211 on the screen body 210, so that the circuit of the screen body 210 and the circuit of the circuit board 220 can be communicated.

According to the conductive adhesive film provided by the embodiment of the application, the contact between the conductive particles 130 in the adjacent first connecting adhesive 120 after the ACF is pressed is blocked by arranging the plurality of first connecting adhesives 120 which are arranged at intervals and are distributed with the conductive particles 130, so that the risk of circuit short circuit between electrodes at adjacent positions is effectively avoided; in addition, when the ACF is used for connecting a circuit to be connected, the risk of electrochemical corrosion can be effectively reduced, so that the service performance and the service life of a product are improved.

As shown in fig. 2, in some embodiments, the plurality of first connection adhesives 120 are arranged in a target pattern, and the target pattern corresponds to the shape of the bonding region of the conductive adhesive film.

In this embodiment, the bonding region may be a bonding region of a circuit to be connected with the conductive adhesive film.

The circuit to be connected with the conductive adhesive film may be a screen 210 circuit, an FPC (flexible circuit board) circuit, an IC (chip) circuit, or the like.

For example, in COG (Chip on Glass), COP (Chip on Polyimide), and COF (Chip on Film) package scenarios, the circuits to be connected by the conductive adhesive film are the panel 210 circuit and the IC circuit; in FOG (FPC on Glass), FOF (FPC on FPC), and FOP (FPC on PI) package cases, the circuits to be connected by the conductive film are the panel 210 circuit and the FPC circuit.

The bonding area is a bonding area for connecting the electrodes.

It will be appreciated that when the ACF is used to connect the upper and lower circuits, the upper and lower circuits each include a plurality of electrodes, and the shape of the bonding region can be determined by the shape, position, and distance of all the electrodes.

The target pattern is a set area of the first connection glue 120.

The target pattern is generated based on the binding region patterning, and the shape of the target pattern corresponds to the shape of the binding region.

It is understood that, in the present application, the first adhesive 120 is disposed at a side of the carrier layer 110 at a distance from each other; moreover, the arrangement of the first bonding adhesives 120 is not disordered, but is arranged based on the target pattern.

Fig. 2 illustrates an arrangement manner of the first connection glue 120, in which conductive particles 130 are distributed in each first connection glue 120, and all areas where the first connection glue 120 is disposed are areas corresponding to target patterns, where any first connection glue 120 in the target patterns is located and the bonding area positions of the upper and lower circuits to be connected by the ACF are in one-to-one correspondence.

The blank area in the ACF, that is, the interval area between the first connection adhesives 120, corresponds to the electrode-free area of the upper and lower circuits to be connected by the ACF.

The inventor finds that after the relevant ACF is pressed, the impedance between the upper circuit and the lower circuit is larger or the circuit is opened because of insufficient quantity of conductive particles, so that the circuit is invalid; or most of the conductive particles are distributed in the electrodeless area, and do not contribute to the conduction of the upper circuit and the lower circuit, so that a large amount of conductive particles are wasted.

In the present application, on the one hand, the first connection glue 120 with the conductive particles 130 distributed therein is disposed corresponding to the electrode areas of the upper and lower circuits to be connected with the ACF, and the path of the conductive particles 130 moving to the adjacent first connection glue 120 is blocked by the arrangement of the interval, so that the conductive particles 130 can be limited to move in the areas corresponding to the upper and lower electrodes of the object in the lamination process, so as to ensure that enough conductive particles 130 exist in the areas corresponding to the upper and lower electrodes of the object, and thus ensure the stable communication of the upper and lower electrodes.

On the other hand, by disposing the interval region between the first connection adhesives 120 corresponding to the electrodeless region of the upper and lower circuits to be connected with the ACF, the conductive particles 130 are not present in the interval region, so that the conductive particles 130 are distributed in the electrodeless region, and the waste of the conductive particles 130 is avoided.

In addition, the inventor also found that in the related art, the connection glue is used as an electrolyte medium, so that under the condition of electrifying, electrochemical corrosion can occur between high and low voltage metal pins of adjacent circuit boards of the cathode and anode to generate copper migration, thereby causing the problem of short circuit between the adjacent pins, and further affecting the functionality of products, such as causing display screen black screen and the like.

In the present application, the first connection adhesive 120 is disposed on the carrier layer 110 in a pattern corresponding to the shape of the bonding region of the circuit to be connected with the conductive adhesive film, so that the adjacent electrodes cannot migrate due to the absence of electrolyte, thereby avoiding electrochemical corrosion and improving the product performance.

It should be noted that, the target pattern in the embodiment of the present application is not fixed, but varies with the shape of the bonding region of the circuit to be connected with the conductive adhesive film.

It is understood that the bonding regions corresponding to different circuits to be connected may be the same or different. In the actual implementation process, the target pattern should be determined according to the actual requirement, and the placement position of the first connection glue 120 on the carrier layer 110 should be determined based on the target pattern.

According to the conductive adhesive film provided by the embodiment of the application, the first connecting adhesive 120 which is provided with the conductive particles 130 and corresponds to the bonding area of the circuit to be connected with the conductive adhesive film is arranged on the carrier layer 110 in a patterning way, so that the circuit open circuit caused by insufficient quantity of the conductive particles 130 in the bonding area is avoided, and the electrochemical corrosion caused by the existence of electrolyte is also avoided, thereby obviously improving the performance of the product; in addition, the waste of a large amount of conductive particles 130 is avoided, and resources are effectively saved.

As shown in fig. 3, in some embodiments, the conductive adhesive film further includes a second connection adhesive 150, the second connection adhesive 150 is disposed on one side of the carrier layer 110, the second connection adhesive 150 is disposed corresponding to alignment targets on a circuit to be connected with the conductive adhesive film, and the conductive particles 130 are distributed in the second connection adhesive 150.

The second adhesive 150 may be disposed at two ends of all the first adhesive 120 on the carrier layer 110.

The shape and position of the second adhesive 150 should correspond to those of the alignment target.

The second adhesive 150 is used for aligning the conductive adhesive film with a circuit to be connected with the conductive adhesive film.

In an actual implementation process, two second bonding adhesives 150 may be disposed on one side of the carrier layer 110, and the conductive particles 130 may be arranged in the second bonding adhesives 150 in a cross shape as a solid alignment target, as shown in fig. 3.

Meanwhile, alignment targets with corresponding sizes, such as cross frame targets with consistent sizes, are manufactured on an upper circuit and a lower circuit connected with the ACF, and can be manufactured by using a metal or ITO coating and using an exposure etching mode.

When the ACF is attached and pressed, the solid targets formed by the ACF conductive particles 130 and the hollow targets on the upper circuit and the lower circuit are respectively grabbed by a camera of the attaching and pressing equipment, and the three targets are aligned, so that the conductive particle 130 area in the ACF and the circuit electrode area are accurately corresponding.

Of course, in other embodiments, other forms of alignment targets commonly used in the art may be used for alignment, which is not described herein.

According to the conductive adhesive film provided by the embodiment of the application, by arranging the second connection adhesive 150 and utilizing the second connection adhesive 150 to align with the alignment target, the area where the first connection adhesive 120 with the conductive particles 130 distributed in the ACF is located can be accurately corresponding to the circuit electrode area to be connected, the alignment precision is high, and the operation is simple.

As shown in fig. 4, in some embodiments, the conductive adhesive film further includes: and a protective layer 140.

The protective layer 140 is disposed on a side of the first adhesive 120 facing away from the carrier layer 110.

The protective layer 140 is a protective film for protecting the ACF.

The conductive adhesive film sequentially comprises a carrier layer 110, a first connecting adhesive 120 and a protective layer 140 from bottom to top. Wherein, the conductive particles 130 are distributed in the first adhesive 120.

In the actual implementation process, for example, when the ACF is applied to the upper and lower circuits, the protective layer 140 and the carrier layer 110 need to be torn off.

The ACF of the present embodiment is generally used in COP or FOP.

While in other embodiments, such as in FOG, the ACF may not include a protective film.

According to the conductive adhesive film provided by the embodiment of the application, the ACF can be effectively protected by arranging the protective film, so that the preservation life and the preservation quality of the ACF are improved.

The embodiment of the application also provides a display device.

As shown in fig. 5, the display device includes: the screen 210, the plurality of first connection adhesives 120, the conductive particles 130, and the circuit board 220.

In this embodiment, the screen 210 is a display screen 210, such as a display screen of an electronic device, and a plurality of first electrodes 211 are disposed on one side of the screen 210.

A first electrode 211 is provided at one side of the screen 210.

The plurality of first connection adhesives 120 are arranged at intervals on one side of the screen body 210, gaps 160 are reserved between adjacent first connection adhesives 120, and the first connection adhesives 120 are arranged corresponding to the first electrodes 211. Wherein, the conductive particles 130 are distributed in each first connection glue 120.

The circuit board 220 is disposed on a side of the first connection adhesive 120 facing away from the screen 210, the circuit board 220 includes a substrate and a plurality of second electrodes 221, the second electrodes 221 are disposed on a side of the substrate facing the screen 210, and the second electrodes 221 are disposed corresponding to the first connection adhesive 120.

The circuit board 220 may be an FPC, and the substrate is used for supporting electrical components on the circuit board 220, wherein a plurality of second electrodes 221 are disposed on the substrate.

In the actual implementation process, for example, in the process of packaging the mobile phone screen, the FPC circuit needs to be connected to the screen 210 circuit, and then the ACF needs to be used for connection.

The screen 210 is provided with a plurality of first electrodes 211, the FPC is provided with a plurality of second electrodes 221, and the first electrodes 211 and the second electrodes 221 are connected through the first connection glue 120 in the ACF, so that the FPC is communicated with the screen 210.

In the actual pressing process, the carrier layer 110 and the protective layer 140 on the ACF need to be removed, and only two ends of the first adhesive 120 in the ACF need to be respectively attached to the first electrode 211 and the second electrode 221.

As can be seen from the foregoing embodiments, in designing the ACF, the shape of the bonding region of the circuit to be connected with the ACF has been considered, and the target pattern corresponding to the region where the first connection glue 120 is arranged is patterned based on the shape of the bonding region.

In the packaging process, only one end of each first connecting adhesive 120 in the ACF is attached and fixed in one-to-one correspondence with the first electrode 211 on the screen body 210, and then the other end of the first connecting adhesive 120 is attached and fixed in one-to-one correspondence with the second electrode 221 on the FPC, so that the connection among the three can be realized.

As shown in fig. 5, the display device includes, from bottom to top: the screen 210, the first connection adhesive 120, and the FPC substrate. The plurality of first bonding adhesives 120 are disposed between the first electrode 211 and the second electrode 221, and a plurality of conductive particles 130 are distributed in each of the first bonding adhesives 120.

There is a gap 160 between each first connection paste 120, which is not filled with any substance, that is, between adjacent first electrodes 211 on the panel 210 and between adjacent second electrodes 221 on the FPC.

With continued reference to fig. 5, the conductive particles 130 are distributed in the first connection paste 120 connected to the first electrode 211 and the second electrode 221, and when a certain pressure and temperature are applied to the ACF, the conductive particles 130 are connected along the Z-axis direction, thereby realizing the connection of the first electrode 211 and the second electrode 221 in the Z-axis direction.

The Z-axis direction is a connecting direction of the first electrode 211 and the second electrode 221.

The electrode-free areas of the screen 210 and the circuit board 220 correspond to the gaps 160 between the first connecting glue 120, and the gaps 160 are not filled with glue and the conductive particles 130. Under the condition that certain pressure is applied to the ACF, the conductive particles 130 in the first connecting glue 120 cannot move into other first connecting glue 120, so that the conductive particles 130 can only move in the corresponding area, and the circuit conduction between the adjacent first electrodes 211 or the adjacent second electrodes 221 caused by the contact of the conductive particles 130 between the adjacent connecting glue is avoided, and the circuit short circuit is further caused; the insufficient number of the conductive particles 130 between the first electrode 211 and the second electrode 221 due to the outward movement of the conductive particles 130 in the first connection adhesive 120 is avoided, so that the circuit is opened, and the stable conduction of the circuit in the Z-axis direction is ensured.

In addition, by disposing the gaps 160 between the first connection paste 120 as the gaps 160 between the adjacent first electrodes 211 or the adjacent second electrodes 221, respectively, no electrolyte exists between the adjacent first electrodes 211 or the adjacent second electrodes 221, thereby avoiding chemical corrosion between the electrodes.

According to the display device provided by the embodiment of the application, the first connection glue 120 which is distributed with the conductive particles 130 and corresponds to the positions of the first electrode 211 of the screen 210 and the second electrode 221 of the circuit board 220 is graphically arranged between the screen 210 and the circuit board 220, so that the conduction of the first electrode 211 and the second electrode 221 along the connecting line direction is realized, and the interval is arranged to avoid the transverse conduction between the adjacent electrodes, thereby avoiding the waste of a large number of conductive particles 130 and the electrochemical corrosion between the adjacent electrodes, obviously improving the performance of the product and effectively saving the resources.

As shown in fig. 6, in some embodiments, a plurality of insulating support columns 222 are disposed at intervals on a side of the substrate facing the plurality of first connection adhesives 120, and the insulating support columns 222 are located in the gaps 160.

In this embodiment, the insulating support posts 222 serve to block contact of adjacent first connection glue 120.

One end of the insulating support column 222 is disposed on a side of the substrate of the circuit board 220 facing the screen 210.

The insulating support column 222 is made of insulating material, and may be any shape, such as a cylinder or a rectangular parallelepiped, which is not limited by the present application.

The length of the insulating support posts 222 should not exceed the distance between the screen 210 and the circuit board 220.

The width of the insulating support posts 222 should not exceed the distance between adjacent first connection bonds 120.

As shown in fig. 7, when the circuit board 220 is connected to the board body 210 using the first connection glue 120, the insulation support column passes through the space between the adjacent first connection glue 120, and the other end contacts with the side of the board body 210 facing the circuit board 220.

Namely, the arrangement structure of the display device from left to right is as follows: the first connection glue 120 and the insulating support columns 222 are alternately arranged, wherein conductive particles 130 are distributed in the first connection glue 120, and the upper end and the lower end of each first connection glue 120 are respectively contacted with the second electrode 221 and the first electrode 211.

According to the display device provided by the embodiment of the application, the insulating support columns 222 corresponding to the ACF interval regions are arranged on the circuit board 220, so that the conductive particles 130 in the adjacent first connection adhesive 120 can be further prevented from contacting each other, the circuit short circuit is avoided, and the stability of the circuit of the display device is improved.

With continued reference to fig. 7, in some embodiments, a gap is left between the insulating support posts 222 and the adjacent first connecting glue 120.

For example, the width of the insulating support posts 222 may be set to within 1/5 of the gap of the bonding position of the panel FOP to reserve sufficient space for deformation during lamination.

According to the display device provided by the embodiment of the application, a gap is reserved between the insulating support column 222 and the adjacent first connecting adhesive 120, so that enough space can be reserved for deformation of the ACF in the pressing process.

The method for preparing the conductive adhesive film is described below.

As shown in fig. 8, an embodiment of the present application further provides a method for preparing a conductive adhesive film, including: step 810, step 820 and step 830.

Step 810, setting a target pattern on the carrier layer 110 by adopting patterning, wherein the target pattern corresponds to the shape of the bonding area of the conductive adhesive film;

Step 820, coating the slurry adhesive on the carrier layer 110 according to the target pattern to generate a first connection adhesive 120;

In step 830, the conductive particles 130 are injected into the first adhesive 120 according to the target incident angle to obtain a conductive adhesive film.

The target pattern is used to determine the arrangement position of the first connection glue 120.

The target pattern corresponds to the shape of the bonding region of the circuit to which the conductive film is to be connected, i.e., the target pattern region should be consistent with the location region of the first electrode 211 on the screen 210 and the second electrode 221 on the circuit board 220.

In the actual implementation process, the paste adhesive for constructing the first connection adhesive 120 may be manufactured according to the general process mode of the ACF, and the conductive particles 130 are not added into the paste adhesive.

Determining a target pattern on the carrier layer 110, and Coating (Coating) a slurry adhesive on the carrier layer 110 along the target pattern to form an NCF layer; the Coating process may be performed by using a mask or screen printing manner, so that the paste adhesive is graphically disposed at a position corresponding to the bonding region of the circuit to be connected with the conductive adhesive film, so as to generate the first connection adhesive 120, which is used as a substrate for the next sputtering.

After the first connection glue 120 is obtained, the metal conductive particles 130 are injected into the NCF layer at high speed under the action of an electric field by using the PVD target sputtering principle, so that the conductive particles 130 are distributed in each first connection glue 120, and a conductive glue film is generated. The principle is as follows:

Gold ball particles are accelerated under the action of an E1 electric field and shot into a three-field environment (gravitational field/electric field magnetic field), metal conductive balls which can reach horizontal shooting to a mask substrate (pattern openings required by Bonding) are screened out, and the speed V is kept to be shot into the NCF substrate and mixed with the NCF substrate.

The Mask pattern is formed in the shape of an electrode (Pad) and the shape of an alignment Mark required for bonding, and the incidence of the metal ball is blocked elsewhere, so that the pattern required on the ACF is generated.

According to the preparation method of the conductive adhesive film provided by the embodiment of the application, the target pattern is determined based on the bonding area of the circuit to be connected with the conductive adhesive film, and the first connecting adhesive 120 is graphically arranged on the carrier layer 110 based on the target pattern, so that the circuit can be prevented from being opened or shorted after the ACF is pressed with the circuit board 220, and the stability of the circuit is improved; electrochemical corrosion can be avoided, so that the service life of the circuit is prolonged; in addition, the method also contributes to saving resources.

The method for manufacturing the circuit board is described below.

As shown in fig. 9, an embodiment of the present application further provides a method for manufacturing a circuit board, including: step 910 and step 920.

Step 910, a target pattern is set on one side of the substrate of the circuit board 220 by adopting patterning, wherein the target pattern corresponds to the shape of the bonding region of the conductive adhesive film to be connected of the circuit board 220;

in step 920, the insulating support columns 222 are disposed on one side of the substrate according to the target pattern, so as to obtain the circuit board 220.

In this embodiment, the target pattern is used to determine the placement position of the insulating support column 222.

The target pattern area should be consistent with the area of the second electrode 221 on the circuit board 220.

It should be noted that, the target pattern corresponding to the circuit board 220 should be consistent with the target pattern corresponding to the ACF corresponding to the circuit board 220.

For example, in manufacturing the FPC, a target pattern may be determined on a substrate of the FPC, and the insulating support pillars 222 may be patterned on the substrate according to the target pattern by a Photo exposure process, thereby obtaining the FPC in which the insulating support pillars 222 are disposed between the adjacent second electrodes 221.

After the FPC is pressed with the ACF obtained by the above embodiment, the insulating support columns 222 can be located exactly in the space between the adjacent first connection adhesives 120 in the ACF, thereby playing a good role of partition.

According to the preparation method of the conductive adhesive film provided by the embodiment of the application, the target pattern is determined based on the bonding area of the circuit board 220, and the insulation support columns 222 are graphically arranged on the substrate of the circuit board 220 based on the target pattern, so that the insulation support columns 222 can be just positioned in the interval between the adjacent first connection adhesives 120 in the ACF after being connected with the ACF, and the conductive particles 130 in the adjacent first connection adhesives 120 are further blocked from being contacted, so that the short circuit of the circuit is avoided, and the stability of the circuit is improved.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims

1. A conductive adhesive film, comprising:

A carrier layer (110);

The first connecting glue (120) is arranged at one side of the carrier layer (110) at intervals, and a gap (160) is reserved between every two adjacent first connecting glue (120);

conductive particles (130), wherein the conductive particles (130) are distributed in each first connecting glue (120);

The void (160) includes an insulating support post (222) therein.

2. The conductive adhesive film according to claim 1, wherein the plurality of first connection adhesives (120) are arranged in a target pattern corresponding to a shape of a bonding region of the conductive adhesive film.

3. The conductive adhesive film of claim 1, further comprising:

the second connecting glue (150), the second connecting glue (150) set up in one side of carrier layer (110), just second connecting glue (150) with the alignment target on the circuit that the conducting film is to be connected sets up correspondingly, it has in the second connecting glue (150) distribution conducting particle (130).

4. The conductive adhesive film as set forth in any one of claims 1 to 3, further comprising:

The protection layer (140), the protection layer (140) set up in a plurality of first connection glues (120) deviate from the one side of carrier layer (110).

5. A conductive adhesive film according to any one of claims 1 to 3, wherein the material of the first connection adhesive (120) comprises any one of an epoxy adhesive and an acryl adhesive.

6. A display device, comprising:

A screen body (210), wherein a first electrode (211) is arranged on one side of the screen body (210);

the first connecting glue (120) is arranged on one side of the screen body (210) at intervals, a gap (160) is reserved between every two adjacent first connecting glue (120), and the first connecting glue (120) and the first electrode (211) are correspondingly arranged;

The circuit board (220), the circuit board (220) is arranged on one side of the plurality of first connecting adhesives (120) facing away from the screen body (210), the circuit board (220) comprises a base material and a plurality of second electrodes (221), the second electrodes (221) are arranged on one side of the base material facing the screen body (210), and the second electrodes (221) are correspondingly arranged with the first connecting adhesives (120);

a plurality of insulating support columns (222) are arranged at intervals on one side, facing the first connecting glue (120), of the base material, and the insulating support columns (222) are located in the gaps (160).

7. The display device of claim 6, wherein a gap is left between the insulating support post (222) and the adjacent first connection glue (120).

8. The preparation method of the conductive adhesive film is characterized by comprising the following steps:

Setting a target pattern on a carrier layer (110) by adopting patterning, wherein the target pattern corresponds to the shape of a bonding area of the conductive adhesive film;

coating the slurry adhesive on the carrier layer (110) according to the target pattern to generate first connecting adhesive (120);

injecting conductive particles (130) into the first connecting adhesive (120) according to a target incidence angle to obtain the conductive adhesive film;

A gap (160) is reserved between the adjacent first connecting adhesives (120), and the gap (160) comprises an insulating support column (222).

9. A method of manufacturing a circuit board (220), comprising:

setting a target pattern on one side of a base material of the circuit board (220) by adopting patterning, wherein the target pattern corresponds to the shape of a bonding region of a conductive adhesive film to be connected of the circuit board (220);

Disposing an insulating support column (222) on the one side of the base material according to the target pattern to obtain the circuit board (220);

the conductive adhesive film comprises first connecting adhesives (120), a gap (160) is reserved between every two adjacent first connecting adhesives (120), and the gap (160) comprises an insulating support column (222).