CN113784017B - Camera module and assembling method for camera module - Google Patents
Camera module and assembling method for camera module Download PDFInfo
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- CN113784017B CN113784017B CN202010517990.1A CN202010517990A CN113784017B CN 113784017 B CN113784017 B CN 113784017B CN 202010517990 A CN202010517990 A CN 202010517990A CN 113784017 B CN113784017 B CN 113784017B
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Abstract
The application relates to a camera module and an assembly method thereof. The camera module comprises a photosensitive assembly with a photosensitive chip and a lens assembly, and the method comprises the following steps: disposing a first adhesive paste on one surface of the photosensitive member; irradiating the first adhesive material by using ultraviolet light with a first wavelength to enable the first adhesive material to start first solidification; adjusting the relative position of the lens assembly and the photosensitive assembly during the first curing of the first adhesive material, contacting the lens assembly with the first adhesive material, and irradiating the first adhesive material with ultraviolet light having a second wavelength to complete the second curing of the first adhesive material, wherein the first adhesive material is partially cured in the second curing step, and the second wavelength is different from the first wavelength; and waiting for the first curing of the first adhesive material to end.
Description
Technical Field
The present application relates to the field of optical imaging technology. More particularly, the present application relates to an image pickup module and an assembling method for assembling the image pickup module using an exposure technique.
Background
With the popularity of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices for helping users acquire images (e.g., videos or images) have been rapidly developed and advanced. In addition, in recent years, the camera module has been widely used in various fields such as medical treatment, security, industrial production, and the like.
In order to meet the increasingly wide market demands, high-pixel, small-size and large-aperture imaging modules are irreversible development trends. Currently, the market is providing an increasing demand for the imaging quality of camera modules. Factors affecting the resolution of a camera module of a given optical design include the quality of the optical imaging lens and manufacturing errors during assembly of the camera module.
Currently, in the assembly process of the camera module, an adhesive material such as a thermosetting adhesive, an Ultraviolet (UV) thermosetting adhesive, or the like is generally used to adhere the lens assembly and the photosensitive assembly together. Such thermosetting adhesives need to be cured by means of heat. However, the increase in temperature may affect various components in the lens assembly, thereby deteriorating the overall performance of the camera module and reducing the imaging quality. Meanwhile, because the thermal expansion coefficients of the circuit board, the photosensitive chip, the packaging body and other components in the photosensitive assembly are different, the expansion speed and the expansion amount of each component are unbalanced due to the temperature rise, the photosensitive chip is bent, and the imaging quality is reduced. Meanwhile, the color filter arranged on the top of the photosensitive assembly can also reduce the filtering performance due to the over high temperature.
Disclosure of Invention
According to an exemplary embodiment, the present application provides an assembly method for an imaging module. The camera shooting module comprises a photosensitive assembly with a photosensitive chip and a lens assembly with a plurality of lenses capable of being matched with the photosensitive chip for imaging. The assembly method for the camera module comprises the following steps: disposing a first adhesive paste on one surface of the photosensitive assembly; irradiating the first adhesive material by using ultraviolet light with a first wavelength to start first curing of the first adhesive material; during the first curing of the first adhesive glue: adjusting the relative position of the lens assembly and the photosensitive assembly, contacting the lens assembly with the first adhesive glue material, and irradiating the first adhesive glue material with ultraviolet light having a second wavelength to complete second curing of the first adhesive glue material, wherein the first adhesive glue material is partially cured in the step of second curing, and the second wavelength is different from the first wavelength; and waiting for the first curing of the first adhesive material to end.
In an embodiment, the second wavelength may be less than the first wavelength
In an embodiment, the first wavelength may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength may have a wavelength range of 300nm to 400 nm.
In an embodiment, the first adhesive may include: a first photoinitiator that catalyzes the first bonding glue to begin the first cure in response to irradiation of ultraviolet light having the first wavelength; and a second photoinitiator that catalyzes the first bonding glue to begin the second cure in response to irradiation of ultraviolet light having the second wavelength.
In embodiments, the first photoinitiator may be a cationic system photoinitiator; and the second photoinitiator may be a cationic system or a free radical system photoinitiator.
In an embodiment, the assembling method for the camera module may further include: controlling a curing time of the first curing by controlling an irradiation time and an irradiation energy of the ultraviolet light having the first wavelength; and controlling the curing time of the second curing by controlling the irradiation time and irradiation energy of the ultraviolet light with the second wavelength. Wherein the curing time of the first curing may be longer than the curing time of the second curing.
In an embodiment, the irradiation energy in the first curing step may be lower than the irradiation energy in the second curing step.
In an embodiment, in the second curing step, partially curing the first adhesive paste may include: and irradiating the first adhesive material along the peripheral edge of the camera module to cure the part, close to the outer side, of the first adhesive material.
In an embodiment, the photosensitive assembly may further include: and the first surface of the packaging body faces the photosensitive chip above the photosensitive chip. Wherein the step of disposing the first adhesive material may further include: the first adhesive material is disposed on a second surface of the package opposite the first surface.
In an embodiment, the photosensitive assembly may further include: the circuit board is positioned below the photosensitive chip. The assembly method for the camera module can further comprise the following steps: disposing the second adhesive glue between the package and the circuit board; irradiating the second adhesive material with ultraviolet light with the first wavelength to start first curing of the second adhesive material; irradiating the second adhesive material with ultraviolet light having a second wavelength during the first curing to complete the second curing of the second adhesive material; and waiting for the first curing of the second adhesive material to end.
In an embodiment, the photosensitive assembly may further include: the circuit board is positioned below the photosensitive chip. Wherein the step of disposing the first adhesive material may further include: the first adhesive material is disposed on a surface of the circuit board on which the photosensitive chip is disposed.
In an embodiment, the step of disposing the first adhesive material may further include: the first adhesive material is arranged in a ring shape extending around an outer edge of one surface of the photosensitive member.
According to an exemplary embodiment, the application further provides an image capturing module. The camera module may include: the photosensitive assembly comprises a photosensitive chip; the lens assembly comprises a plurality of lenses which can be matched with the photosensitive chip for imaging; and the first adhesive material is arranged between the photosensitive assembly and the lens assembly. Wherein, the first adhesive material may include: a first photoinitiator configured to catalyze the first bonding paste to begin a first cure in response to irradiation of ultraviolet light having a first wavelength; and a second photoinitiator configured to catalyze the first bonding glue to complete a second cure in response to irradiation of ultraviolet light having a second wavelength during the first cure, wherein the second wavelength is different from the first wavelength.
In an embodiment, the second wavelength may be less than the first wavelength.
In an embodiment, the first wavelength may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength may have a wavelength range of 300nm to 400 nm.
In embodiments, the first photoinitiator may be a cationic system photoinitiator and the second photoinitiator may be a cationic system or a free radical system photoinitiator.
In an embodiment, the photosensitive assembly may further include: and the first surface of the packaging body faces the photosensitive chip above the photosensitive chip. The first adhesive may be located between a second surface of the package and the lens assembly, wherein the second surface may be opposite to the first surface.
In an embodiment, the photosensitive assembly may further include: the circuit board is positioned below the photosensitive chip. And a second adhesive material which has the same material and property as the first adhesive material can be arranged between the circuit board and the packaging body.
In an embodiment, the photosensitive assembly may further include: the circuit board is positioned below the photosensitive chip. The first adhesive material may be located between the lens assembly and a surface of the circuit board on which the photosensitive chip is disposed.
In an embodiment, the first adhesive may be arranged in a ring shape extending around an edge of one surface of the photosensitive member.
Compared with the prior art, through using ultraviolet light curable's bonding adhesive material to assemble the module of making a video recording, this application has following at least one technical effect:
1) The method can prevent or reduce the bending of the photosensitive chip of the camera module caused by the temperature rise during the assembly, the reduced color filtering performance of the color filter and/or the degradation of the overall imaging quality of the camera module;
2) The whole curing process of the adhesive material can be completed under the condition that the station is kept unchanged, so that the transfer times of the camera module in the assembling process are reduced, and the risk of generating defects is reduced.
Drawings
Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a flowchart showing steps of an assembly method for an image pickup module according to an exemplary embodiment of the present application;
fig. 2A to 2D are sectional views showing steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application;
FIG. 3 is a top view corresponding to FIG. 2A, according to an exemplary embodiment of the present application;
FIG. 4 is a cross-sectional view illustrating another exemplary embodiment according to the present application;
FIG. 5 is a cross-sectional view illustrating yet another exemplary embodiment according to the present application; and
fig. 6 is a cross-sectional view illustrating still another exemplary embodiment according to the present application.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed description are merely illustrative of exemplary embodiments of the application and are not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in the present specification, the expressions of first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The features, principles, and other aspects of the present application are described in detail below.
Fig. 1 is a flowchart showing steps of an assembly method for an image pickup module according to an exemplary embodiment of the present application. Fig. 2A to 2D are sectional views showing steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application. Fig. 3 is a top view corresponding to fig. 2A, according to an exemplary embodiment of the present application.
Fig. 2D may be regarded as a sectional view of the camera module after the assembly is completed according to the present application, and a basic structure of the camera module according to the present application will be described with reference to fig. 2D. As shown in fig. 2D, the camera module 10 includes a photosensitive assembly 100 and a lens assembly 200 disposed above the photosensitive assembly 100, wherein the photosensitive assembly 100 may be configured to be disposed at a rear end of an optical path of the lens assembly 200 to receive image data from the lens assembly 200 and cooperate therewith to implement an imaging function of the camera module 10.
Specifically, in the present application, the photosensitive assembly 100 may include a photosensitive chip 100-1, a package body 100-2, a circuit board 100-3, a color filter 100-4, and an electronic component 100-5, wherein the photosensitive chip 100-1 may be mounted on the circuit board 100-3 by a second adhesive material AP2 or by soldering, and may be electrically connected to the circuit board 100-3 by metal leads or electrical contacts; the package body 100-2 may be configured to package the photosensitive chip 100-1, the color filter 100-4, the electronic component 100-5, and the like on the circuit board 100-3, and may be configured to have an open ring shape; the color filter 100-4 may be installed to cover the opening of the package body 100-2 and configured to filter unnecessary light such as infrared rays; the electronic component 100-5 may be electrically connected (e.g., soldered) to the circuit board 100-3.
The lens assembly 200 according to the present application may include a lens portion 200-1 and a lens receiving portion 200-2 receiving the lens portion 200-1, wherein the lens portion 200-1 includes at least one lens. Although the lens portion 200-1 is shown in the drawings of the present application as including 4 lenses, this is merely exemplary, and the number of lenses may be adjusted to any suitable number according to actual needs. The lens housing portion 200-2 may be, for example, a lens carrier or a motor depending on the type of camera module. Specifically, when the image pickup module is a fixed focus module, the lens housing portion 200-2 may be a lens carrier to house and support the lens portion 200-1; in another case, when the camera module is assembled by the lens portion 200-1 and the motor, the lens portion 200-1 can be driven by the motor to perform the moving, rotating and tilting actions, so that the camera module can realize the functions of auto-focusing or optical anti-shake.
Next, steps of an assembling method for an image pickup module according to an exemplary embodiment of the present application will be described in detail with reference to fig. 1 and fig. 2A to 2D.
According to an exemplary embodiment of the present application, there is provided an assembly method for an image pickup module, the method including steps S10 to S50.
In step S10, the first adhesive cement AP1 is disposed on one surface of the photosensitive assembly 100. Specifically, as shown in fig. 2A, in this step, the first adhesive paste AP1 may be disposed on the upper surface of the package body 100-2 of the photosensitive assembly 100, which is the surface opposite to the surface facing the photosensitive chip 100-1 in terms of on the photosensitive chip 100-1.
Fig. 3 shows a plan view of a specific arrangement of the first adhesive material AP1 in the case shown in fig. 2A. As shown in fig. 3, the first adhesive paste AP1 may be arranged in a ring shape continuously extending along an outer edge of the upper surface of the package body 100-2. However, the exemplary embodiment of the present application is not limited thereto, and the first adhesive material AP1 may be in a dot-like or bar-like form arranged discontinuously, may be in other suitable shapes such as "C", and may have any other suitable arrangement that can firmly adhere the photosensitive assembly 100 and the lens assembly 200.
In step S20, the first adhesive material AP1 is irradiated with ultraviolet light having a first wavelength, so that the first adhesive material AP1 starts to be first cured. Specifically, as shown in fig. 2A, a first ultraviolet light irradiator 300-1 (also referred to as an exposure apparatus) may emit ultraviolet light having a first wavelength λ1. In this step, the first ultraviolet irradiator 300-1 may be configured to irradiate ultraviolet light having a first wavelength λ1 from above the photosensitive assembly 100 toward the first adhesive cement AP1, thereby initiating the first curing process.
In an exemplary embodiment, a first photoinitiator may be included in the first adhesive material AP1. The first photoinitiator may catalyze the first adhesive cement AP1 to start a first curing process in response to ultraviolet light having a first wavelength λ1 directly irradiated on the first adhesive cement AP1. Further, the first curing process may be a delayed curing, i.e. the first curing process has a longer curing time, e.g. the first curing time may be more than 1min, even more than 1 hour. In the present application, the term "curing time" refers to the time required for the adhesive paste from the start of curing until the end of curing (i.e., the complete cured state is reached), and can also be understood as the reaction time of the photoinitiator included in the adhesive paste to the irradiation of ultraviolet rays.
In an exemplary embodiment, the first wavelength λ1 may have a wavelength range of 380nm to 460 nm. Ultraviolet light in a wavelength range of 380nm to 460nm may have a strong penetrating ability, and may sufficiently irradiate the first adhesive material AP1. Meanwhile, ultraviolet light in a wavelength range of 380nm to 460nm may have a lower irradiation energy, so that the first curing process may be easily controlled to have a longer curing time.
In an exemplary embodiment, the curing time of the first curing process may be controlled by an irradiation time (also referred to as an exposure time) and an irradiation energy (also referred to as an exposure energy) of ultraviolet light having the first wavelength λ1. Alternatively, the first irradiation time in the first curing process may be selected to be 0.1 seconds to 1 minute, and further, may also be selected to be 0.1 seconds to 5 seconds. Alternatively, the first irradiation energy in the first curing process may be selected to be 100mJ/m 2 To 1000mJ/m 2 . It should be understood that the first irradiation time and the first irradiation energy range of the exemplary embodiments of the present application are not limited thereto, and may be adjusted as needed.
In an exemplary embodiment, the first photoinitiator may be a cationic photoinitiator that catalyzes the first adhesive material AP1 under the irradiation of ultraviolet light having the first wavelength λ1, so that small molecules of the resin in the first adhesive material AP1 are slowly crosslinked to form a polymer chain. Thus, the first adhesive paste AP1 can be controlled to have a slow first curing process (i.e., to have a long curing time).
Referring back to fig. 1, during the first curing of the first adhesive material AP1, steps S30 and S40 are sequentially performed.
Specifically, during the first curing of the first adhesive material AP1, the relative positions of the lens assembly 200 and the photosensitive assembly 100 are adjusted, and the lens assembly 200 is contacted with the first adhesive material AP1 (step S30). Next, the first adhesive material AP1 is irradiated with ultraviolet light having the second wavelength λ2, so that the first adhesive material AP1 is subjected to the second curing (step S40).
In an exemplary embodiment, referring to fig. 2B, in step S30, the step of adjusting the relative positions of the lens assembly 200 and the photosensitive assembly 100 may include: the lens assembly 200 is picked up by the lens pick-up mechanism 400, and the lens assembly 200 is moved, rotated and/or tilted with reference to the position of the photosensitive assembly 100 so that the central axes of the two are substantially aligned, thereby ensuring that the assembled camera module has good imaging quality. Subsequently, the lens assembly 200 is controlled to move downward by the lens pickup mechanism 400 so as to be in contact with the first adhesive material AP1. Alternatively, after the lens assembly 200 is contacted with the first adhesive material AP1, a downward force may be continuously applied to the lens assembly 200 to form a slight pressing force therebetween, so that better adhesion can be performed at a later stage. It should be understood, however, that the pressing force should be controlled within a reasonable range and not be excessively large in order to prevent the first bonding adhesive AP1 from overflowing.
In an exemplary embodiment, referring to fig. 2C, in step S40, the first adhesive material AP1 may be irradiated again with the second ultraviolet light irradiator 300-2 after the lens assembly 200 is brought into contact with the first adhesive material AP1. The second ultraviolet light irradiator 300-2 may emit ultraviolet light having a second wavelength λ2. In this step, by irradiating the first adhesive cement AP1 with ultraviolet light having the second wavelength λ2, the first adhesive cement AP1 starts to perform a second curing process that can locally cure the first adhesive cement AP1, and that can be relatively rapid with respect to the first curing process, so that the second curing can be completed before the end of the first curing process.
Alternatively, in step S40, the second ultraviolet irradiator 300-2 may irradiate the first adhesive cement AP1 along the outer peripheral edge of the camera module 10, thereby curing the portion of the first adhesive cement AP1 near the outside. Specifically, by irradiating ultraviolet light from the outer peripheral edge, the first portion AP1-1 of the first adhesive material AP1 is cured, while the second portion AP1-2 thereof is not cured, wherein the first portion AP1-1 is closer to the outer edge of the camera module 10 than the second portion AP1-2, i.e., closer to the second ultraviolet light irradiator 300-2. Alternatively, the first portion AP1-1 may occupy 50% or more of the entire first adhesive paste AP1. The partial curing achieved at this time may provide sufficient adhesive force and adhesive strength to fix and support the lens assembly 200 on the photosensitive assembly 100.
In an exemplary embodiment, the second wavelength λ2 may be different from the first wavelength λ1, e.g., the second wavelength λ2 may be less than the first wavelength λ1. Alternatively, the second wavelength λ2 may have a wavelength range of, for example, 300nm to 400 nm.
In an exemplary embodiment, a second photoinitiator different from the first photoinitiator may be further included in the first adhesive cement AP1. The second photoinitiator may catalyze the first adhesive cement AP1 to start a second curing process in response to ultraviolet light having a second wavelength λ2 directly irradiated on the first adhesive cement AP1. In particular, the second photoinitiator is different from the first photoinitiator, which is more sensitive to ultraviolet light of a shorter wavelength. Thus, the second photoinitiator may catalyze the first adhesive cement AP1 under irradiation with a shorter second wavelength λ2.
Alternatively, the second photoinitiator may be a photoinitiator of a cationic system or a photoinitiator of a free radical system, for example. Under the condition that the second photoinitiator is a cationic system photoinitiator, the second photoinitiator has a catalytic action on the first adhesive material AP1 under the irradiation of ultraviolet light with a second wavelength lambda 2, so that resin small molecules in the first adhesive material AP1 are quickly crosslinked to form a high polymer chain. In addition, in the case that the second photoinitiator is a photoinitiator of a radical system, it may be combined with the resin small molecules in the first adhesive cement AP1 under the irradiation of the ultraviolet light having the second wavelength λ2 to undergo rapid crosslinking to form a polymer chain. Thereby, the first adhesive cement AP1 can be controlled to have a rapid curing process (i.e., to have a short curing time) during the second curing process.
In an exemplary embodiment, as described above, the second curing process is a relatively rapid curing process compared to the first curing process, in other words, the curing time of the second curing may be shorter than that of the first curing. Alternatively, the second curing time may be, for example, less than 2 minutes, even less than 1 minute.
In an exemplary embodiment, the curing time of the second curing process may be controlled by the irradiation time and irradiation energy of the ultraviolet light having the second wavelength λ2. Alternatively, the second irradiation time in the second curing process may be selected to be 0.1 seconds to 1 minute, and further, may also be selected to be 0.1 seconds to 5 seconds.Alternatively, the second irradiation energy in the second curing process may be selected to be 1200mJ/m 2 To 5000mJ/m 2 . It should be understood that the second irradiation time and the second irradiation energy range of the exemplary embodiments of the present application are not limited thereto, and may be adjusted as needed.
Referring back to fig. 1, after the second curing is completed during the first curing of the first adhesive material AP1, the first curing may be waited for (step S50), i.e., the first adhesive material AP1 is waited for to be completely cured. The fully cured first bonding paste AP1 is shown in fig. 2D.
According to another embodiment of the present application, the method of assembling an image pickup module using an ultraviolet light curable adhesive paste described above may be applied to the assembly of a photosensitive member, for example, the assembly of the package body 100-2 and the circuit board 100-3. A cross-sectional view of an assembled camera module according to this embodiment is shown in fig. 4. The exemplary embodiment will be briefly described below with reference to fig. 4, and the same description as that described with reference to fig. 1 to 3 will be omitted.
Specifically, the third adhesive material AP3 may be first disposed at the upper surface of the circuit board 100-3 on which the photosensitive chip 100-1 is disposed. Wherein the third adhesive gel material AP3 may have the same material and properties as the first adhesive gel material AP1, for example, may have a first photoinitiator and a second photoinitiator in response to ultraviolet light irradiation of different wavelengths. In addition, the third adhesive material AP3 may be arranged in a ring shape along the outer side edge of the circuit board 100-3, similar to the arrangement of the first adhesive material AP1.
Next, the third adhesive material AP3 may be irradiated with ultraviolet light having the first wavelength λ1 using the first ultraviolet light irradiator 300-1, so that the third adhesive material AP3 starts the first curing.
Next, during the first curing of the third adhesive material AP3, the package body 100-2 may be moved downward from above the circuit board 100-3 to be in contact with the third adhesive material AP3 disposed on the upper surface of the circuit board 100-3 and/or to be further slightly pressed. Subsequently, the third adhesive paste AP3 may be irradiated with ultraviolet light having a second wavelength λ2 using the second ultraviolet light irradiator 300-2, so that the third adhesive paste AP3 is partially cured during the first curing of the third adhesive paste AP3 to complete the second curing of the third adhesive paste AP 3.
Then, the first curing of the third adhesive material AP3 may be waited for.
Further, a cross-sectional view of an assembled camera module according to further exemplary embodiments of the present application is shown in fig. 5 and 6.
According to still another embodiment of the present application, as shown in fig. 5, the photosensitive assembly 100 'may not include a package, alternatively, the lens receiving portion 200-2' of the lens assembly 200 'may be in direct contact with the color filter 100-4 in the photosensitive assembly 100', and may have a greater thickness in the vertical direction so as to be capable of being in contact with the circuit board 100-3 at the time of assembly.
In the case of the exemplary embodiment as shown in fig. 5, the assembly process of the lens assembly 200' and the photosensitive assembly 100' is different from the method described above with reference to fig. 1 to 3 in that, in step S10, the first adhesive material AP1' is disposed on the upper surface of the circuit board 100-3 on which the photosensitive chip 100-1 is disposed. For brevity, descriptions of the remaining steps similar or identical to the previously described methods will be omitted herein.
According to still another embodiment of the present application as shown in fig. 6, which is different from the method described above with reference to fig. 4, the above-described method of assembling an image pickup module may be applied only to the assembly between the internal components of the photosensitive assembly 100 (i.e., the package 100-2 and the circuit board 100-3), and the assembly between the photosensitive assembly 100 and the lens assembly 200 may be completed using other coupling means. The particular assembly process of the internal components of photosensitive assembly 100 may be implemented as described with reference to fig. 4, which is not described in detail herein to avoid redundancy.
According to an embodiment of the present application, there is also provided a camera module. The camera module may include: the photosensitive assembly 100 comprises a photosensitive chip 100-1; a lens assembly 200 including a plurality of lenses capable of cooperating with the photosensitive chip 100-1 for imaging; and a first adhesive material AP1 disposed between the photosensitive assembly 100 and the lens assembly 200. Wherein, the first adhesive material AP1 may include: a first photoinitiator configured to catalyze a first bonding paste to begin a first cure in response to irradiation of ultraviolet light having a first wavelength λ1; and a second photoinitiator configured to catalyze the first adhesive to complete a second cure in response to irradiation of ultraviolet light having a second wavelength λ2 during the first cure, wherein the second wavelength λ2 is less than the first wavelength λ1.
In an embodiment, the first wavelength λ1 may have a wavelength range of 380nm to 460 nm.
In an embodiment, the second wavelength λ2 may have a wavelength range of 300nm to 400 nm.
In embodiments, the first photoinitiator may be a cationic system photoinitiator and the second photoinitiator may be a cationic system or a free radical system photoinitiator.
In an embodiment, the photosensitive assembly 100 may further include: package 100-2, a first surface of package 100-2 faces photosensitive chip 100-1 in terms of being on photosensitive chip 100-1. The first adhesive may be located between the second surface of the package body 100-2 and the lens assembly 200, wherein the second surface may be opposite to the first surface.
In an embodiment, the photosensitive assembly 100 may further include: the circuit board 100-3, the circuit board 100-3 is located under the photosensitive chip 100-1. A third adhesive may be disposed between the circuit board 100-3 and the package 100-2, and the third adhesive has the same material and properties as the first adhesive.
In an embodiment, the photosensitive assembly 100 may further include: the circuit board 100-3, the circuit board 100-3 is located under the photosensitive chip 100-1. Wherein, the first adhesive may be located between the lens assembly 200 and the surface of the circuit board 100-3 on which the photosensitive chip 100-1 is disposed.
In an embodiment, the first adhesive material AP1 may be arranged in a ring shape extending around an edge of one surface of the photosensitive assembly 100.
The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.
Claims (22)
1. An assembly method for a camera module including a photosensitive assembly having a photosensitive chip and a lens assembly having a plurality of lenses capable of cooperatively imaging with the photosensitive chip, the method comprising:
disposing a first adhesive paste on one surface of the photosensitive assembly;
irradiating the first adhesive material by using ultraviolet light with a first wavelength to start first curing of the first adhesive material;
during the first curing of the first adhesive glue:
adjusting the relative position of the lens assembly and the photosensitive assembly, and contacting the lens assembly with the first adhesive material; and
irradiating the first adhesive glue material with ultraviolet light having a second wavelength, causing the first adhesive glue material to complete a second curing, wherein the first adhesive glue material is partially cured in the step of the second curing, and the second wavelength is different from the first wavelength; and
and waiting for the first curing of the first adhesive material to finish.
2. The assembly method for an image capturing module of claim 1, wherein the second wavelength is less than the first wavelength.
3. The assembly method for an image pickup module according to claim 2, wherein the first wavelength has a wavelength range of 380nm to 460 nm.
4. A method of assembling a camera module according to claim 2 or 3, wherein the second wavelength has a wavelength range of 300nm to 400 nm.
5. The assembly method for an image pickup module according to claim 1, wherein the first adhesive material comprises: a first photoinitiator that catalyzes the first bonding glue to begin the first cure in response to irradiation of ultraviolet light having the first wavelength; and
a second photoinitiator that catalyzes the first bonding glue to begin the second cure in response to irradiation of ultraviolet light having the second wavelength.
6. The assembly method for a camera module of claim 5, wherein the first photoinitiator is a cationic system photoinitiator; and
the second photoinitiator is a cationic system or a free radical system photoinitiator.
7. The assembly method for an image pickup module according to claim 1, further comprising: controlling a curing time of the first curing by controlling an irradiation time and an irradiation energy of the ultraviolet light having the first wavelength;
controlling the curing time of the second curing by controlling the irradiation time and irradiation energy of the ultraviolet light of the second wavelength; and
the first cure has a longer cure time than the second cure.
8. The assembly method for the camera module according to claim 7, wherein the irradiation energy in the first curing step is lower than the irradiation energy in the second curing step.
9. The assembling method for an image pickup module according to claim 1, wherein, in the second curing step, partially curing the first adhesive paste includes:
and irradiating the first adhesive material along the peripheral edge of the camera module to cure the part, close to the outer side, of the first adhesive material.
10. The assembly method for an image capturing module of claim 1, wherein the photosensitive assembly further comprises: a package body, a first surface of which faces the photosensitive chip above the photosensitive chip; and
the step of disposing the first adhesive material further includes: the first adhesive material is disposed on a second surface of the package opposite the first surface.
11. The assembly method for an image capture module of claim 10, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the method further comprises the steps of:
disposing a second adhesive glue between the package and the circuit board;
irradiating the second adhesive material with ultraviolet light with the first wavelength to start first curing of the second adhesive material;
irradiating the second adhesive material with ultraviolet light having a second wavelength during the first curing, so that the second adhesive material completes a second curing; and
and waiting for the first curing of the second adhesive material to finish.
12. The assembly method for an image capturing module of claim 1, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the step of disposing the first adhesive material further includes: the first adhesive material is disposed on a surface of the circuit board on which the photosensitive chip is disposed.
13. The assembling method for an image pickup module according to claim 1, wherein in the step of disposing the first adhesive material further comprises: the first adhesive material is arranged in a ring shape extending around an outer edge of one surface of the photosensitive member.
14. A camera module, comprising:
the photosensitive assembly comprises a photosensitive chip;
the lens assembly comprises a plurality of lenses which can be matched with the photosensitive chip for imaging; and
the first bonding adhesive material is arranged between the photosensitive assembly and the lens assembly, and comprises:
a first photoinitiator configured to catalyze the first bonding paste to begin a first cure in response to irradiation of ultraviolet light having a first wavelength; and
a second photoinitiator configured to catalyze the first bonding glue to complete a second cure in response to irradiation of ultraviolet light having a second wavelength during the first cure, wherein the second wavelength is different from the first wavelength.
15. The camera module of claim 14, wherein the second wavelength is less than the first wavelength.
16. The camera module of claim 15, wherein the first wavelength has a wavelength range of 380nm to 460 nm.
17. The camera module of claim 15 or 16, wherein the second wavelength has a wavelength range of 300nm to 400 nm.
18. The camera module of claim 14, wherein the first photoinitiator is a cationic system photoinitiator and the second photoinitiator is a cationic system or a free radical system photoinitiator.
19. The camera module of claim 14, wherein the photosensitive assembly further comprises: a package body, a first surface of which faces the photosensitive chip above the photosensitive chip; and
the first adhesive is located between a second surface of the package body and the lens assembly, wherein the second surface is opposite to the first surface.
20. The camera module of claim 19, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
and a second adhesive material is arranged between the circuit board and the packaging body, and the second adhesive material and the first adhesive material have the same material and property.
21. The camera module of claim 14, wherein the photosensitive assembly further comprises: the circuit board is positioned below the photosensitive chip; and
the first adhesive material is positioned between the lens component and the surface of the circuit board on which the photosensitive chip is arranged.
22. The camera module of claim 14, wherein the first adhesive is arranged in an annular shape extending around an edge of one surface of the photosensitive assembly.
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|---|---|---|---|---|
| CN106937028A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Camera module assemble method and camera module |
| CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
| CN110794619A (en) * | 2019-10-16 | 2020-02-14 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937028A (en) * | 2015-12-30 | 2017-07-07 | 南昌欧菲光电技术有限公司 | Camera module assemble method and camera module |
| CN110275260A (en) * | 2018-03-16 | 2019-09-24 | 宁波舜宇光电信息有限公司 | It can image forming optics and its manufacturing method |
| CN110794619A (en) * | 2019-10-16 | 2020-02-14 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and manufacturing method thereof |
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