CN113766801A - Immersion liquid cooling server and cooling device thereof - Google Patents
Immersion liquid cooling server and cooling device thereof Download PDFInfo
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- CN113766801A CN113766801A CN202011184345.9A CN202011184345A CN113766801A CN 113766801 A CN113766801 A CN 113766801A CN 202011184345 A CN202011184345 A CN 202011184345A CN 113766801 A CN113766801 A CN 113766801A
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- 239000007788 liquid Substances 0.000 title claims abstract description 56
- 238000007654 immersion Methods 0.000 title claims abstract description 49
- 238000001816 cooling Methods 0.000 title claims description 105
- 238000005192 partition Methods 0.000 claims abstract description 27
- 239000000110 cooling liquid Substances 0.000 claims description 61
- 239000012809 cooling fluid Substances 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 13
- 239000002826 coolant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 210000005069 ears Anatomy 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- General Engineering & Computer Science (AREA)
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- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An immersion liquid cooled server comprising: a housing including first and second opposing server panels, the housing having disposed therein: the server comprises a strong electricity partition, a first server panel and a second server panel, wherein the strong electricity partition is provided with a hard disk and is close to the first server panel, and the first server panel is provided with a strong electricity connecting component which is used for connecting a strong electricity power supply interface; and the weak current partition comprises a mainboard circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are arranged on the second server panel.
Description
Technical Field
The disclosure relates to the technical field of computers, in particular to an immersion liquid cooling server and a cooling device thereof.
Background
At present, most of the mainstream servers in the market adopt an air cooling heat dissipation device, a hard disk is placed right in front of a system, a fan module is placed in the middle of the system, a main board is placed in the middle of the system, a power supply is placed at the left rear part, and an I/O (input/output) port and an external card are placed at the right rear part.
In the course of implementing the disclosed concept, the inventors found that there are at least the following problems in the prior art: for a CPU larger than 300 watts, the air cooling device cannot meet the requirement of heat removal; the air cooling server has high heat removal cost, the high-speed fan has extremely high material cost and high Power consumption of a single fan, so that the purchase cost of the server is increased, and the requirement of Power Usage Efficiency (PUE) specified by the country and the place cannot be met; moreover, the high-speed fan causes the performance of the mechanical hard disk on the system to be reduced, and the requirement of a user on the performance of the hard disk cannot be met.
Disclosure of Invention
One aspect of the present disclosure provides an immersion liquid cooling server, comprising:
a housing including first and second opposing server panels, the housing having disposed therein:
the server comprises a strong electricity partition, a first server panel and a second server panel, wherein the strong electricity partition is provided with a hard disk and is close to the first server panel, and the first server panel is provided with a strong electricity connecting component which is used for connecting a strong electricity power supply interface;
and the weak current partition comprises a mainboard circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are arranged on the second server panel.
According to the embodiment of the present disclosure, the motherboard circuit includes at least one central processing unit CPU, and the CPU is provided with a flow control pump and an outlet of a coolant pipeline controlled by the flow control pump, for controlling the flow of the coolant at the CPU.
According to an embodiment of the present disclosure, the coolant pipe is a straight pipe.
According to an embodiment of the present disclosure, the cooling fluid duct may be disposed outside the electric power compartment, penetrating the electric power compartment and the first panel.
According to an embodiment of the present disclosure, the high electric connection member is a node upper electric clip.
According to the embodiment of the disclosure, the interface circuit comprises a network card interface circuit and an IO interface circuit.
According to an embodiment of the disclosure, the housing has a slide rail for enabling movement of the immersion liquid cooled server towards the first panel or the second panel.
According to another aspect of the present disclosure, there is provided a cooling apparatus for immersing a liquid cooling server, including:
a cooling tank having a cooling fluid therein, the immersion fluid cooling server being disposed in the cooling fluid;
and the strong current power supply interface is arranged in the cooling box and is used for being connected with a strong current connecting component of the immersion liquid cooling server.
According to an embodiment of the present disclosure, the cooling device further includes:
and the convection device is arranged in the cooling box and is used for realizing convection of the cooling liquid in the cooling box.
According to an embodiment of the present disclosure, the cooling liquid is a fluorinated liquid.
According to the embodiment of the disclosure, the problems that air cooling cannot meet the heat dissipation requirement of a high-power CPU and the cost is high can be at least partially solved, and the technical effects of improving the heat dissipation efficiency and reducing the cost of the heat dissipation device are achieved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments of the present disclosure with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a server structure of a conventional air cooling device;
fig. 2 is a schematic structural diagram of an immersion liquid cooled server according to an embodiment of the disclosure at a first view angle;
FIG. 3 is a schematic structural diagram of an immersion liquid cooled server according to an embodiment of the disclosure at a second viewing angle;
fig. 4 is a front view of an immersion liquid cooling server according to an embodiment of the disclosure;
fig. 5 is a schematic flow diagram of cooling fluid in a cooling fluid conduit of an immersion fluid cooling server according to an embodiment of the disclosure.
Description of the reference numerals
100-immersing a liquid cooling server; 110-a housing; 111-a front panel; 1111-mounting ears; 112-a rear panel; 113-side panel; 1131, a slide rail; 114-a backplane; 120-strong electric area; 1201-hard disk; 1202-electrical clip on node; 130-weak current partition; 1310-a motherboard circuit; 1311-CPU; 1320-interface circuitry; 1321-network card interface circuit; 1322-PCIe external card; 140-a flow control pump; 150-coolant line.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.
All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It is noted that the terms used herein should be interpreted as having a meaning that is consistent with the context of this specification and should not be interpreted in an idealized or overly formal sense.
Where a convention analogous to "at least one of A, B and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B and C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.). Where a convention analogous to "A, B or at least one of C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B or C" would include but not be limited to systems that have a alone, B alone, C alone, a and B together, a and C together, B and C together, and/or A, B, C together, etc.).
Fig. 1 is a schematic diagram of a server structure of a conventional air cooling device. As shown in fig. 1, most mainstream air-cooled servers place a hard disk right in front of the system, a fan module in the middle of the system, a main board in the middle of the system, a power supply at the left rear, and an I/O port and an external card at the right rear. However, the problems of heat dissipation, PUE and the like of the existing high-power-consumption CPU server cannot be solved by adopting the air cooling device for heat dissipation.
Embodiments of the present disclosure provide an immersion liquid cooling server and a cooling device thereof. The immersion liquid cooling server includes: a housing including first and second opposing server panels, the housing having disposed therein: the server comprises a strong electricity partition, a first server panel and a second server panel, wherein the strong electricity partition is provided with a hard disk and is close to the first server panel, and the first server panel is provided with a strong electricity connecting component which is used for connecting a strong electricity power supply interface; and the weak current partition comprises a mainboard circuit and an interface circuit, the weak current partition is close to the second server panel, and the interface circuit and an external interface are arranged on the second server panel.
A first illustrative embodiment of the present disclosure provides an immersion liquid cooling server. The immersion liquid cooling server is arranged in the box body filled with cooling liquid, so that the design of the fan module can be cancelled.
Fig. 2 is a schematic structural diagram of an immersion liquid cooling server according to an embodiment of the disclosure at a first viewing angle. Fig. 3 is a schematic structural diagram of an immersion liquid cooling server according to an embodiment of the disclosure at a second viewing angle. As shown in fig. 2-3, the immersion liquid cooling server 100 includes a housing 110, and the housing 110 includes a front panel 111 and a rear panel 112, a side panel 113, a bottom panel 114, and a top panel (not shown). In order to realize strong and weak current separation, a strong current partition 120 and a weak current partition 130 are arranged on the bottom 114 in the shell 110.
Further, for convenience of wire management and operation and maintenance operations, the strong electric partition 120 is disposed near the rear panel 112, and the weak electric partition 130 is disposed near the front panel 111. Specifically, the hard disk 1201 is provided in the heavy electric partition, and the node power-on clip 1202 for connecting to the power strip of the bottom of the tank filled with the cooling liquid is provided on the rear panel 112. The weak current partition 130 includes a main board circuit 1310 and an interface circuit 1320, and the interface circuit 1320 and an external interface are disposed on the front panel 111.
Illustratively, the node power-on clip 1202 is disposed perpendicular to the rear panel 112, and when the immersion liquid-cooled server 100 is placed, the rear panel 112 of the immersion liquid-cooled server 100 faces the bottom of the tank filled with cooling liquid, so that the node power-on clip 1202 is vertically inserted into the power strip at the bottom of the tank. The node upper electrical clamps 1202 have clamping portions that maintain a stable connection of the immersion liquid cooled server 100 to the tank.
The front panel 111 of the immersion liquid cooled server 100 is maintained near the coolant level. Fig. 4 is a front view of an immersion liquid cooling server 100 according to an embodiment of the disclosure. As shown in fig. 4, the interfaces of the interface circuit 1320 are disposed on the front panel 111, for example, the network card interface circuit 1321 and the PCIe external card 1322 of the interface circuit 1320 are disposed on the front panel 111, so as to facilitate interconnection with each switch and implement strong and weak current separation. Therefore, when the operation and maintenance are performed, the whole system can be pulled out for operation and maintenance as long as the weak current cable of the front panel 111 is pulled out.
As shown in fig. 2 to 3, mounting ears 1111 are further provided on both sides of the front panel 111, and the mounting ears 1111 have a holding portion and a fixing portion. The fixing portion is provided with a screw hole for matching with a bolt to realize the installation and fixation of the immersion liquid cooling server 100 and the cooling box. The grip is perpendicular to the front panel 111, which facilitates the user's handling of the immersion liquid cooling server 100, for example, pulling the immersion liquid cooling server 100 out of the tank during maintenance.
Preferably, the side panels 113 of the housing 110 have slide rails 1131 for conveniently realizing the movement of the immersion liquid cooling server 100 toward the front panel 111 or the rear panel 112.
In this embodiment, the motherboard circuit 1310 of the weak current partition 130 is disposed between the hard disk 1201 and the interface circuit 1320. The motherboard circuit 1310 includes at least one central processing unit CPU 1311. Since the most heat generating component of the server system is the CPU, one flow control pump 140 and the outlet of the coolant pipe 150 controlled by the flow control pump 140 are provided at each CPU 1311. Illustratively, a temperature sensor is disposed at the CPU1311 for monitoring the temperature of the CPU1311, and the flow control pump 140 intelligently controls the flow of the fluorinated liquid according to the temperature of the monitoring CPU1131, so as to precisely control the temperature of the CPU 1131.
The inlet of the coolant line 150 is provided at the heat exchanger of the coolant. In this embodiment, the heat exchanger for the cooling fluid is disposed at the bottom of the case filled with the cooling fluid, the cooling fluid pipe 150 penetrates through the back panel 112 and the strong electricity partition 120, and the cooling fluid with a lower temperature at the heat exchanger for the cooling fluid is delivered to the surface of the CPU1131, so as to reduce the temperature of the CPU1131 and realize the precise control of the temperature of the CPU 1131. In addition, the arrangement of the cooling liquid pipeline 150 is also beneficial to the convection of the cooling liquid in the cooling box, so that the temperature of the cooling liquid is uniform.
Fig. 5 is a schematic flow diagram of cooling fluid in a cooling fluid line of an immersion fluid cooling server 100 according to an embodiment of the disclosure.
As shown in FIG. 5, the low-temperature fluorination liquid reaches the surface of the CPU along the direction of an arrow, so that the heat-clearing efficiency is higher, and the energy is saved. As can be seen from fig. 2-3 and fig. 5, in the present embodiment, the cooling liquid duct 150 is disposed between the bottom of the hard disk 1201 and the bottom plate 114.
It is understood that in other embodiments, the heat exchanger of the cooling fluid may be disposed at other positions of the tank filled with the cooling fluid, and the cooling fluid pipe 150 may be adjusted according to the position of the heat exchanger of the cooling fluid, so as to ensure that the low-temperature cooling fluid at the heat exchanger of the cooling fluid is delivered to the CPU.
The immersion liquid cooling server 100 of the present disclosure achieves strong and weak current separation, and facilitates cable arrangement and operation and maintenance operations. Meanwhile, the flow control pump and the cooling liquid pipeline are arranged, so that the fluorinated liquid can accurately reach the surface of the CPU, and the technical effects of higher heat dissipation efficiency and more energy conservation are achieved.
In yet another exemplary embodiment of the present disclosure, a cooling apparatus to immerse a liquid cooling server 100 is provided. The cooling device of the immersion liquid cooling server 100 comprises a cooling box, a strong power supply interface and a cooling liquid heat exchanger.
Wherein, the cooling box is provided with a cooling liquid therein, and the immersion liquid cooling server 100 is arranged in the cooling liquid. Illustratively, the cooling liquid is a fluorinated liquid.
The strong power supply interface is arranged in the cooling box and is used for being connected with a strong power connecting part of the immersion liquid cooling server 100. Preferably, the strong power supply interface is a power supply socket and is arranged at the bottom of the cooling box.
In particular, the power strip may include a plurality of high power electrical sockets for mating with the electrical clips 1202 on the nodes of the rear panel of the immersion liquid cooled server 100. The plurality of immersion liquid cooling servers 100 are vertically inserted into a cooling tank filled with cooling liquid, and an interface of the front panel 111 is disposed near the liquid level of the cooling liquid, thereby saving space and facilitating wire management.
The cooling liquid heat exchanger is arranged in the cooling box and used for carrying out heat exchange and cooling on the cooling liquid heated by the server. In this embodiment, the cooling liquid heat exchanger is disposed at the bottom of the cooling tank, the inlet of the cooling liquid pipeline 150 is disposed at the heat exchanger of the cooling liquid, the cooling liquid with a lower temperature at the heat exchanger of the cooling liquid is delivered to the surface of the CPU1131, and the flow rate of the cooling liquid in the cooling liquid pipeline 150 is controlled by the flow control pump according to the temperature of the CPU, so as to accurately control the temperature of the CPU 1131. In addition, the arrangement of the cooling liquid pipeline 150 is also beneficial to the convection of the cooling liquid in the cooling box, so that the temperature of the cooling liquid is uniform.
In order to make the temperature of the cooling liquid more uniform, the cooling device may further include a convection device disposed in the cooling tank for achieving convection of the cooling liquid in the cooling tank.
In this embodiment, since the heat exchanger of the cooling liquid is disposed at the bottom of the cooling tank, the convection device is configured to realize the up-and-down convection of the cooling liquid, so that the temperature of the cooling liquid is more uniform.
In yet another exemplary embodiment of the present disclosure, a cooling apparatus to immerse a liquid cooling server 100 is provided. The cooling device of the immersion liquid cooling server 100 comprises a cooling box, a strong power supply interface and a cooling liquid heat exchanger.
Wherein, the cooling box is provided with a cooling liquid therein, and the immersion liquid cooling server 100 is arranged in the cooling liquid. Illustratively, the cooling liquid is a fluorinated liquid. The strong power supply interface is arranged in the cooling box and is used for being connected with a strong power connecting part of the immersion liquid cooling server 100. Preferably, the strong electric power interface is arranged at the bottom of the cooling box. The immersion liquid cooling server 100 is vertically inserted into a cooling tank filled with a cooling liquid, and an interface of the front panel 111 is disposed near the liquid level of the cooling liquid, thereby saving space and facilitating wire management.
The cooling liquid heat exchanger is arranged in the cooling box and used for carrying out heat exchange and cooling on the cooling liquid heated by the server.
In this embodiment, the cooling liquid heat exchanger is disposed on the side surface of the cooling box near the mounted CPU1131, the inlet of the cooling liquid pipeline 150 is disposed on the side surface of the cooling box near the heat exchanger of the cooling liquid, the cooling liquid pipeline 150 delivers the cooling liquid with a lower temperature at the heat exchanger of the cooling liquid to the surface of the CPU1131, and the flow rate of the cooling liquid in the cooling liquid pipeline 150 is controlled by the flow control pump according to the temperature of the CPU, so as to accurately control the temperature of the CPU.
In order to make the temperature of the cooling liquid more uniform, the cooling device may further include a convection device disposed in the cooling tank for guiding the cooling liquid with a lower temperature in the cooling tank to the bottom or the top of the cooling tank, so as to make the temperature of the cooling liquid more uniform.
Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Those skilled in the art will appreciate that various combinations and/or combinations of features recited in the various embodiments and/or claims of the present disclosure can be made, even if such combinations or combinations are not expressly recited in the present disclosure. In particular, various combinations and/or combinations of the features recited in the various embodiments and/or claims of the present disclosure may be made without departing from the spirit or teaching of the present disclosure. All such combinations and/or associations are within the scope of the present disclosure.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. An immersion liquid cooled server comprising:
a housing (110), the housing (110) including first and second opposing server panels, the housing (110) having disposed therein:
the server comprises a strong electric partition (120), wherein the strong electric partition (120) is provided with a hard disk (1201), the strong electric partition (120) is close to a first server panel, the first panel is provided with a strong electric connecting component, and the strong electric connecting component is used for connecting a strong electric power interface; and
the weak current partition (120), the weak current partition (120) includes a motherboard circuit (1310) and an interface circuit (1320), the weak current partition (120) is close to a second server panel, and the interface circuit (1320) and an external interface are both disposed on the second server panel.
2. The immersion liquid cooling server of claim 1, wherein the motherboard circuit (1310) includes at least one central processing unit (1311), the CPU (1311) having a flow control pump (140) and an outlet of a cooling liquid conduit (150) controlled by the flow control pump (140) for controlling a flow of cooling liquid at the CPU (1311).
3. The immersion liquid cooling server of claim 2, wherein the inlet of the cooling liquid conduit (150) is provided at a heat exchanger of the cooling liquid.
4. The immersion liquid cooling server of claim 1, wherein the strong electrical connection component has a clip.
5. The immersion liquid cooling server of claim 1, wherein the interface circuit (1320) includes a network card interface circuit (1321) and an IO interface circuit.
6. The immersion liquid cooling server of claim 1, wherein the housing (110) has a slide (1131) for enabling movement of the immersion liquid cooling server toward the first panel or the second panel.
7. A cooling apparatus of an immersion liquid cooling server as claimed in any one of claims 1 to 6, comprising:
a cooling tank having a cooling fluid therein, the immersion fluid cooling server being disposed in the cooling fluid;
the strong current power supply interface is arranged in the cooling box and is used for being connected with a strong current connecting component of the immersion liquid cooling server; and
and the cooling liquid heat exchanger is arranged in the cooling box and is used for carrying out heat exchange and cooling on the cooling liquid.
8. The cooling device of claim 7, wherein the cooling device further comprises:
and the convection device is arranged in the cooling box and is used for realizing convection of the cooling liquid in the cooling box.
9. The cooling device of claim 7, wherein the cooling liquid is a fluorinated liquid.
10. The cooling device according to claim 7, wherein the strong electric power source interface is provided at a bottom of the cooling box; and/or
The cooling liquid heat exchanger is arranged at the bottom of the cooling box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011184345.9A CN113766801B (en) | 2020-10-29 | 2020-10-29 | Immersed liquid cooling server and cooling device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011184345.9A CN113766801B (en) | 2020-10-29 | 2020-10-29 | Immersed liquid cooling server and cooling device thereof |
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| Publication Number | Publication Date |
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| CN113766801A true CN113766801A (en) | 2021-12-07 |
| CN113766801B CN113766801B (en) | 2024-04-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20230026424A1 (en) * | 2021-07-20 | 2023-01-26 | Dell Products, L.P. | Immersion cooling of information handling systems with on-node boost pumps |
| CN116301265A (en) * | 2023-05-23 | 2023-06-23 | 苏州浪潮智能科技有限公司 | Immersion liquid cooling system, control method thereof and server |
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| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN209149242U (en) * | 2019-01-18 | 2019-07-23 | 湖南航天捷诚电子装备有限责任公司 | The hermetically sealed reinforcement type module liquid cooled server of cabinet in a kind of 1U standard |
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| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN209149242U (en) * | 2019-01-18 | 2019-07-23 | 湖南航天捷诚电子装备有限责任公司 | The hermetically sealed reinforcement type module liquid cooled server of cabinet in a kind of 1U standard |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20230026424A1 (en) * | 2021-07-20 | 2023-01-26 | Dell Products, L.P. | Immersion cooling of information handling systems with on-node boost pumps |
| CN116301265A (en) * | 2023-05-23 | 2023-06-23 | 苏州浪潮智能科技有限公司 | Immersion liquid cooling system, control method thereof and server |
| CN116301265B (en) * | 2023-05-23 | 2023-08-04 | 苏州浪潮智能科技有限公司 | Immersion liquid cooling system, control method thereof and server |
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| CN113766801B (en) | 2024-04-05 |
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