CN113690165A - Integrated circuit processing method and processing equipment - Google Patents
Integrated circuit processing method and processing equipment Download PDFInfo
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- CN113690165A CN113690165A CN202111103902.4A CN202111103902A CN113690165A CN 113690165 A CN113690165 A CN 113690165A CN 202111103902 A CN202111103902 A CN 202111103902A CN 113690165 A CN113690165 A CN 113690165A
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- integrated circuit
- soldering
- wall
- circuit board
- tin
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- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 98
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 87
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010923 batch production Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an integrated circuit processing method and processing equipment, which comprises a base, wherein a positioning plate is fixedly arranged at the top of the base through a support, a control console is fixedly arranged on one side of the top of the positioning plate, two tin wire fixing plates are fixedly arranged at the top of the positioning plate through the support, two tin soldering plates are fixedly arranged on the inner walls of the two tin wire fixing plates, a downward inclined tin soldering plate is fixedly arranged on the outer wall of one side of each tin soldering plate, a fixing groove is formed in the outer wall of the top of each tin soldering plate, and a fixing sleeve is fixedly arranged on the inner wall of the fixing groove. According to the invention, the lead sleeves are matched with the laser tin melting spot lamps to weld the top of the integrated circuit board, and after the integrated circuit board is moved to the bottom of the soldering plate and the bottom of the soldering plate, the top of the integrated circuit board is soldered, so that the soldering efficiency of the top of the integrated circuit board is greatly improved, the using effect is good, and the integrated circuit board is suitable for large-scale batch processing of the integrated circuit board in the existing factory.
Description
Technical Field
The invention relates to the field of integrated circuit processing, in particular to an integrated circuit processing method and integrated circuit processing equipment.
Background
An integrated circuit board is manufactured by adopting a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a smaller single crystal silicon chip, the components are combined into a complete electronic circuit by a multilayer wiring or tunnel wiring method, various working procedures are needed in the integrated circuit processing process, soldering is one of the working procedures, and the integrated circuit board is soldered by using machinery in the current batch production.
Disclosure of Invention
It is an object of the present invention to provide an integrated circuit processing method and apparatus that addresses the above-mentioned deficiencies in the background art.
In order to achieve the above purpose, the invention provides the following technical scheme: the integrated circuit processing method and the integrated circuit processing equipment comprise a base, wherein a positioning plate is fixedly arranged at the top of the base through a support, a control console is fixedly arranged on one side of the top of the positioning plate, two tin wire fixing plates are fixedly arranged at the top of the positioning plate through the support, two tin soldering plates are fixedly arranged on the inner walls of the tin wire fixing plates, a tin soldering plate inclined downwards is fixedly arranged on the outer wall of one side of the tin soldering plate, a fixing groove is formed in the outer wall of the top of the tin soldering plate, a fixing sleeve is fixedly arranged on the inner wall of the fixing groove, a lead sleeve is inserted into the inner wall of the fixing sleeve, and the inner wall of the fixing sleeve is inserted into the lead sleeve, so that articles in the lead sleeve can be conveniently replaced and maintained.
Preferably, a display is arranged on one side of the top of the console, a control button is arranged on one side of the top of the console, a USB data interface is arranged on the outer wall of the console, and the point positions, needing to be welded, of the integrated circuit can be input into the console by using a USB flash disk through the USB data interface.
Preferably, the top central point of locating plate puts and opens there is the spout, open the top both sides of locating plate has the slip passageway, the fixed linear electric motor that is equipped with of bottom outer wall of locating plate, the fixed slider that is equipped with on linear electric motor's the output piece, the outer wall of slider passes through the fixed four locating pieces that are equipped with of support, four the outer wall of locating piece and the inner wall sliding connection of two slip passageways.
Preferably, the top outer wall of locating plate is equipped with the locating plate, the top outer wall of locating plate is opened there is the locating hole that the equidistance distributes, the fixed slide rail that is equipped with in bottom central authorities position of locating plate, the outer wall of slide rail and the inner wall sliding connection of spout, four one side outer wall of locating piece and the outer wall fixed connection of locating plate can drive the slider through linear electric motor's output piece and remove, and the slider can drive the locating plate through the locating piece and remove, and the locating hole and the spout cooperation that are equipped with through the locating plate bottom can make the locating plate move at the top of locating plate steadily.
Preferably, the fixed stationary blade that is equipped with the equidistance and distributes in top one side of soldering board, open the top of stationary blade has the semi-arc fixed slot, and is adjacent the top of stationary blade has cup jointed the tin line through the semi-arc fixed slot and has rolled up, the outer wall of tin line book is around being connected with tin line main part, the fixed guide sleeve that is equipped with the equidistance and distributes in top one side of soldering board, open top one side of soldering board has the guiding hole that the equidistance distributes, is convenient for guide the tin line book outer wall through guide sleeve and guiding hole and winds the tin line main part of connecting.
Preferably, a positioning clamp strip is fixedly arranged on one side of the top of the lead sleeve, a miniature electric telescopic motor is fixedly arranged on the inner wall of the lead sleeve, a push block is fixedly arranged on an output block of the miniature electric telescopic motor, a wire outlet is formed in the central position of the bottom of the lead sleeve, the inner wall of the wire outlet is connected with the outer wall of the push block in a sliding mode, a wire pushing groove is formed in one side of the bottom of the push block, a wire inlet hole which is inclined downwards is formed in the outer wall of one side of the lead sleeve, and the wire inlet hole is communicated with the wire outlet.
Preferably, one end of the tin wire main body sequentially passes through the inner wall of the guide sleeve, the inner wall of the guide hole, the inner wall of the wire inlet hole and the inner wall of the wire outlet, the output shaft of the miniature electric telescopic motor drives the push block to move downwards, the wire pushing groove formed in the bottom of the push block supports the end of the tin wire main body to move downwards, and the tin wire main body can be extruded out of the inner wall of the wire outlet.
Preferably, the fixed strip that is equipped with in bottom one side of soldering board, the fixed laser molten tin shot-light that is equipped with equidistance distribution in bottom one side of fixed strip can melt the tin silk through laser molten tin shot-light, makes tin solution welding integrated circuit board's solder joint, two the position of soldering board and soldering board is crisscross, the crisscross distance of soldering board and soldering board is 2/1 of adjacent lead wire sleeve distance, and is adjacent lead wire sleeve's distance is 2 times of the minimum distance of integrated circuit board soldering stitch, makes the integrated circuit board top all pass through lead wire sleeve's bottom.
Based on the integrated circuit processing equipment, the invention also provides an integrated circuit processing method, which comprises the following steps:
step 1: when the integrated circuit board is used, coordinates are added to the position, needing tin soldering, of the integrated circuit board, and data of the integrated circuit board are led into the console through the USB data interface by using the USB flash disk;
step 2: then, an output block of the linear motor is controlled through a control button arranged at the top of the console, the output block of the linear motor drives the sliding block to move, the sliding block drives the positioning plate to move through the positioning block, the positioning plate is moved to one side of the top of the positioning plate, which is close to the console, and then the integrated circuit board is placed at the top of the positioning plate through the positioning hole formed in the top of the positioning plate, so that one end, away from the soldering plate, of the integrated circuit board is returned to the original point;
and step 3: then, the output block of the linear motor is controlled to move towards the direction close to the soldering plates through the console, the integrated circuit board placed at the top of the positioning plate starts to move, the two soldering plates and the soldering plates are staggered with each other, the distance between the adjacent lead sleeves is 2 times of the minimum distance of soldering pins of the integrated circuit board, and the staggered distance between the soldering plates and the soldering plates is 2/1 of the distance between the adjacent lead sleeves, so that when the integrated circuit board arranged at the top of the positioning plate moves to the bottoms of the soldering plates and the soldering plates, the positions of the integrated circuit board needing soldering can pass through the positions under the positioning clamping bars;
and 4, step 4: when the position of the integrated circuit board to be welded is located right below the positioning clamping strip, the specified micro electric telescopic motor output block is controlled to operate for a period through data output by the U disk, the output block of the micro electric telescopic motor starts to move downwards, the push block moves downwards to push a tin wire unit downwards through a wire pushing groove formed in the bottom of the push block, then the push block contracts and returns to the original position, one end of the tin wire is located right above a welding point of the integrated circuit board to be welded, the specified laser tin melting shooting lamp starts to work to burn the tin wire at the moment to melt the tin wire, the welding point on the integrated circuit board is welded, and the laser tin melting shooting lamp is turned off after the welding is finished;
and 5: after the integrated circuit board passes through the tin soldering plate and the bottom of the tin soldering plate, the position needing to be welded on the surface of the integrated circuit board is welded, the integrated circuit board is taken out from the top of the positioning plate, and then the positioning plate is controlled to return to the original position through the linear motor.
In the technical scheme, the invention provides the following technical effects and advantages:
the data of the integrated circuit board is led into the console through the USB data interface by the USB flash disk, the position of the integrated circuit board to be welded is determined, the integrated circuit board is placed at the position of the original point at the top of the positioning plate, the integrated circuit board at the top of the positioning plate is driven to move by the output block of the linear motor, the integrated circuit board moves to the bottoms of the soldering plates and the soldering plates, the two soldering plates and the soldering plates are staggered with each other, the distance between the adjacent lead sleeves is 2 times of the minimum distance of the soldering pins of the integrated circuit board, and the staggered distance between the soldering plates and the soldering plates is 2/1 of the distance between the adjacent lead sleeves, so that the position of the integrated circuit board to be welded passes through the right lower part of the positioning clamping bar, the existing tin welding device can be prevented from moving the mechanical arm when the top of the integrated circuit board is welded, and the problem that the position of the integrated circuit board to be welded is inaccurate due to multiple times of calibration of the mechanical arm is avoided, and missing welding are prevented.
When the integrated circuit board needs to be positioned under the positioning clamping strip, the output block of the appointed micro electric telescopic motor runs for a period, the output block of the micro electric telescopic motor starts to move downwards, the push block moves downwards and pushes the tin wire downwards by a unit through a wire pushing groove formed in the bottom of the push block, then the push block shrinks to the original position, one end of the tin wire is positioned right above the welding point of the integrated circuit board to be welded, the appointed laser tin melting shooting lamp starts to work to burn the tin wire, the tin wire is melted, the welding point on the integrated circuit board is welded, the top of the integrated circuit board is welded by a plurality of lead sleeves matched with the laser tin melting spot lamps, after the integrated circuit board is moved at the bottoms of the soldering plates and the tin soldering plates, the top soldering of the integrated circuit board is completed, the soldering efficiency at the top of the integrated circuit board is greatly improved, the using effect is good, and the method is in line with the large-scale batch processing of the integrated circuit board in the existing factory.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic perspective view of a linear motor according to the present invention;
FIG. 3 is a schematic diagram of a solder wire fixing plate according to the present invention;
FIG. 4 is a schematic perspective view of a solder wire fixing plate according to the present invention;
FIG. 5 is a schematic bottom view of a solder wire fixing plate according to the present invention;
FIG. 6 is a schematic perspective view of a positioning plate according to the present invention;
FIG. 7 is a schematic perspective view of a solder plate according to the present invention;
FIG. 8 is a cross-sectional view of a lead sleeve according to the present invention.
Description of reference numerals:
the device comprises a base 1, a positioning plate 2, a console 3, a display 4, a control button 5, a USB data interface 6, a sliding channel 7, a linear motor 8, a sliding block 9, a positioning block 10, a sliding chute 11, a positioning plate 12, a positioning hole 13, a sliding rail 14, a positioning rod 16, a tin wire fixing plate 17, a tin soldering plate 18, a fixing plate 19, a half-arc fixing groove 20, a tin wire coil 21, a guide sleeve 22, a guide hole 23, a fixing groove 24, a fixing sleeve 25, a lead sleeve 26, a positioning clamping strip 27, a wire outlet 28, a wire pushing groove 29, a miniature electric telescopic motor 30, a pushing block 31, a wire inlet 32, a fixing strip 33, a laser molten tin shooting lamp 34 and a tin wire main body 35.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
Example one
Referring to the attached figures 1-8 of the specification, an integrated circuit processing method and processing equipment comprises a base 1, wherein the top of the base 1 is fixedly provided with a positioning plate 2 through a bracket, one side of the top of the positioning plate 2 is fixedly provided with a control console 3, the top of the positioning plate 2 is fixedly provided with two tin wire fixing plates 16 through a bracket, the inner walls of the two tin wire fixing plates 16 are fixedly provided with two soldering plates 17, the outer wall of one side of each soldering plate 17 is fixedly provided with a soldering plate 18 inclining downwards, the outer wall of the top of each soldering plate 18 is provided with a fixing groove 24, the inner wall of each fixing groove 24 is fixedly provided with a fixing sleeve 25, the inner wall of each fixing sleeve 25 is inserted with a lead sleeve 26, the inner wall of each fixing sleeve 25 is inserted with the lead sleeve 26 to facilitate replacing and maintaining objects in the lead sleeve 26, one side of the top of the control console 3 is provided with a display 4, one side of the top of the control console 3 is provided with a control button 5, the outer wall of the control console 3 is provided with a USB data interface 6, the point locations to which the integrated circuit needs to be soldered can be entered into the console 3 using a USB disk via the USB data interface 6.
Example two
Based on the first embodiment, the top center of the positioning plate 2 is provided with the sliding chute 11, the two sides of the top of the positioning plate 2 are provided with the sliding channels 7, the outer wall of the bottom of the positioning plate 2 is fixedly provided with the linear motor 8, the output block of the linear motor 8 is fixedly provided with the sliding block 9, the outer wall of the sliding block 9 is fixedly provided with four positioning blocks 10 through the bracket, the outer walls of the four positioning blocks 10 are slidably connected with the inner walls of the two sliding channels 7, the outer wall of the top of the positioning plate 2 is provided with the positioning plate 12, the outer wall of the top of the positioning plate 12 is provided with the positioning holes 13 which are distributed at equal intervals, the bottom center of the positioning plate 12 is fixedly provided with the sliding rail 14, the outer wall of the sliding rail 14 is slidably connected with the inner wall of the sliding chute 11, the outer wall of one side of the four positioning blocks 10 is fixedly connected with the outer wall of the positioning plate 12, the output block of the linear motor 8 can drive the sliding block 9 to move, the positioning plate 12 can be driven by the sliding block 9 through the positioning block 10 to move, the positioning plate 12 can be moved smoothly at the top of the positioning plate 2 by the cooperation of the positioning hole 13 formed at the bottom of the positioning plate 12 and the sliding slot 11.
EXAMPLE III
Based on the first embodiment, the fixing pieces 19 are fixed on one side of the top of the soldering board 17, the fixing pieces 19 are distributed equidistantly, the top of each fixing piece 19 is provided with a semi-arc fixing groove 20, the top of each adjacent fixing piece 19 is sleeved with a tin wire coil 21 through the semi-arc fixing groove 20, the outer wall of each tin wire coil 21 is wound with a tin wire main body 35, one side of the top of each soldering board 17 is fixed with a guide sleeve 22 distributed equidistantly, one side of the top of each soldering board 18 is provided with guide holes 23 distributed equidistantly, the tin wire main body 35 which is convenient for guiding the outer wall of each tin wire coil 21 to be wound through the guide sleeves 22 and the guide holes 23, one side of the top of each lead sleeve 26 is fixed with a positioning clamp strip 27, the inner wall of each lead sleeve 26 is fixed with a micro electric telescopic motor 30, the output block of the micro electric telescopic motor 30 is fixed with a push block 31, the central position of the bottom of each lead sleeve 26 is provided with a wire outlet 28, the inner wall of each wire outlet 28 is connected with the outer wall of the push block 31 in a sliding manner, a wire pushing groove 29 is formed in one side of the bottom of the pushing block 31, a wire inlet hole 32 which inclines downwards is formed in the outer wall of one side of the wire leading sleeve 26, the wire inlet hole 32 is communicated with the wire outlet 28, one end of the tin wire main body 35 sequentially passes through the inner wall of the guide sleeve 22, the inner wall of the guide hole 23, the inner wall of the wire inlet hole 32 and the inner wall of the wire outlet 28, the pushing block 31 is driven to move downwards through an output shaft of the miniature electric telescopic motor 30, the wire pushing groove 29 formed in the bottom of the pushing block 31 abuts against the end of the tin wire main body 35 to move downwards, and the tin wire main body 35 can be extruded out of the inner wall of the wire outlet 28.
Example four
Based on the first embodiment, the fixing bar 33 is fixedly arranged on one side of the bottom of the soldering plate 18, the laser tin melting spot lamps 34 which are distributed equidistantly are fixedly arranged on one side of the bottom of the fixing bar 33, the tin wires can be melted through the laser tin melting spot lamps 34, so that the tin solution can weld the welding points of the integrated circuit board, the positions of the two soldering plates 17 and the soldering plate 18 are staggered, the staggered distance between the soldering plates 17 and the soldering plate 18 is 2/1 of the distance between the adjacent lead sleeves 26, the distance between the adjacent lead sleeves 26 is 2 times of the minimum distance of the soldering pins of the integrated circuit board, and the point positions of the top of the integrated circuit board, which need to be welded, all pass through the bottom of the lead sleeves 26.
The working principle of the invention is as follows:
referring to the attached drawings 1-8 of the specification, when in use, firstly, coordinates are added to positions needing to be soldered on an integrated circuit board, data of the integrated circuit board are led into a console 3 through a USB data interface 6 by using a U disk, then, an output block of a linear motor 8 is controlled through a control button 5 arranged on the top of the console 3, the output block of the linear motor 8 drives a sliding block 9 to move, the sliding block 9 drives a positioning plate 12 to move through a positioning block 10, the positioning plate 12 is moved to one side of the top of the positioning plate 2, which is close to the console 3, then, the integrated circuit board is placed on the top of the positioning plate 12 through a positioning hole 13 formed in the top of the positioning plate 12, one end, away from a soldering plate 17, of the integrated circuit board is returned to an original point, then, the output block of the linear motor 8 is controlled to move towards the direction, which is close to the soldering plate 17, the integrated circuit board placed on the top of the positioning plate 12 starts to move through the console 3, the two soldering plates 17 and the soldering plates 18 are staggered with each other, the distance between the adjacent lead sleeves 26 is 2 times of the minimum distance of soldering pins of the integrated circuit board, the staggered distance between the soldering plates 17 and the soldering plates 18 is 2/1 of the distance between the adjacent lead sleeves 26, therefore, when the integrated circuit board arranged on the top of the positioning plate 12 moves to the bottoms of the soldering plates 18 and the soldering plates 17, the positions on the integrated circuit board which need to be soldered pass through the right lower part of the positioning clamping bar 27, and the positions on the integrated circuit board which need to be soldered are positioned right under the positioning clamping bar 27, at the moment, the output block of the designated micro electric telescopic motor 30 is controlled to run for one cycle through data output by a U disk, the output block of the micro electric telescopic motor 30 starts to move downwards, the push block 31 moves downwards to push a unit of tin wire downwards through the push groove 29 formed in the bottom of the push block 31, and then the push block 31 contracts to return to the original position, one end of the tin wire is positioned right above a welding point of the integrated circuit board to be welded, at the moment, the appointed laser tin melting spot lamp 34 starts to work to burn the tin wire to melt the tin wire, the welding point on the integrated circuit board is welded, the laser tin melting spot lamp 34 is closed after the welding is finished, the mechanical arm can be prevented from being moved by the existing tin welding device through the lead sleeves 26 and the laser tin melting spot lamps 34 which are distributed equidistantly, the phenomenon that the position needing to be welded on the integrated circuit board is not accurate due to the fact that the mechanical arm is calibrated for many times is avoided, missing welding and missing are prevented, the top of the integrated circuit board is welded through the lead sleeves 26 and the laser tin melting spot lamps 34, after the integrated circuit board is moved at the bottoms of the soldering plate 17 and the soldering plate 18, the top soldering of the integrated circuit board is completed, the top soldering efficiency of the integrated circuit board is greatly improved, the using effect is good, and after the integrated circuit board passes through the bottoms of the soldering plate 17 and the soldering plate 18, after the positions needing to be welded on the surface of the integrated circuit board are welded, the integrated circuit board is taken out from the top of the positioning plate 12, and then the positioning plate 12 is controlled to return to the original position through the linear motor 8.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (9)
1. An integrated circuit processing apparatus comprising a base (1), characterized in that: the top of base (1) is equipped with locating plate (2) through the support is fixed, the fixed control cabinet (3) that is equipped with in top one side of locating plate (2), the top of locating plate (2) is equipped with two tin wire fixed plates (16), two through the support is fixed the inner wall of tin wire fixed plate (16) is fixed and is equipped with two tin soldering boards (17), one side outer wall of tin soldering board (17) is fixed and is equipped with inclined downward tin soldering board (18), the top outer wall of tin soldering board (18) is opened there is fixed slot (24), the inner wall of fixed slot (24) is fixed and is equipped with fixed sleeve (25), the inner wall of fixed sleeve (25) is pegged graft and is had lead wire sleeve (26).
2. The integrated circuit processing apparatus of claim 1, wherein: display (4) are equipped with to top one side of control cabinet (3), top one side of control cabinet (3) is equipped with control button (5), the outer wall of control cabinet (3) is equipped with USB data interface (6).
3. The integrated circuit processing apparatus of claim 1, wherein: the utility model discloses a positioning device for the automobile seat, including locating plate (2), top central point puts and opens there are spout (11) locating plate (2), the top both sides of locating plate (2) are opened there are slide passage (7), the fixed linear electric motor (8) that are equipped with of bottom outer wall of locating plate (2), the fixed slider (9) that are equipped with on the output piece of linear electric motor (8), the outer wall of slider (9) is equipped with four locating pieces (10), four through the support is fixed the inner wall sliding connection of the outer wall of locating piece (10) and two slide passage (7).
4. An integrated circuit processing apparatus according to claim 3, wherein: the positioning device is characterized in that a positioning plate (12) is arranged on the outer wall of the top of the positioning plate (2), positioning holes (13) distributed at equal intervals are formed in the outer wall of the top of the positioning plate (12), a sliding rail (14) is fixedly arranged at the center of the bottom of the positioning plate (12), the outer wall of the sliding rail (14) is connected with the inner wall of a sliding groove (11) in a sliding mode, and the outer wall of one side of the positioning block (10) is fixedly connected with the outer wall of the positioning plate (12).
5. The integrated circuit processing apparatus of claim 1, wherein: fixed stationary blade (19) that are equipped with the equidistance and distribute in top one side of soldering board (17), open at the top of stationary blade (19) has semi-arc shape fixed slot (20), and is adjacent the top of stationary blade (19) has cup jointed tin line book (21) through semi-arc fixed slot (20), the outer wall of tin line book (21) has been around having tin line main part (35), fixed guide sleeve (22) that are equipped with the equidistance and distribute in top one side of soldering board (17), pilot hole (23) that have the equidistance and distribute are opened to top one side of soldering board (18).
6. The integrated circuit processing apparatus of claim 1, wherein: the fixed locator card strip (27) that is equipped with in top one side of lead wire sleeve (26), the inner wall of lead wire sleeve (26) is fixed and is equipped with miniature electronic flexible motor (30), the fixed ejector pad (31) that is equipped with of output block of miniature electronic flexible motor (30), open the bottom central point of lead wire sleeve (26) and have outlet (28), the inner wall of outlet (28) and the outer wall sliding connection of ejector pad (31), open bottom one side of ejector pad (31) has push away wire casing (29), open one side outer wall of lead wire sleeve (26) has slope decurrent entrance hole (32), entrance hole (32) and outlet (28) intercommunication.
7. The integrated circuit processing apparatus of claim 5, wherein: one end of the tin wire main body (35) passes through the inner wall of the guide sleeve (22), the inner wall of the guide hole (23), the inner wall of the wire inlet hole (32) and the inner wall of the wire outlet (28) in sequence.
8. The integrated circuit processing method of claim 1, wherein: the fixed strip (33) that is equipped with in bottom one side of soldering board (18), the fixed laser that is equipped with equidistance and distributes of bottom one side of fixed strip (33) melts tin shot-light (34), two the position of soldering board (17) and soldering board (18) is crisscross, the crisscross distance of soldering board (17) and soldering board (18) is 2/1 of adjacent lead wire sleeve (26) distance, and is adjacent the distance of lead wire sleeve (26) is 2 times of the minimum distance of integrated circuit board soldering stitch.
9. The integrated circuit processing method of the integrated circuit processing apparatus of any one of claims 1 to 8, further comprising the steps of:
step 1: when in use, coordinates are added to the position of the integrated circuit board to be soldered, and the data of the integrated circuit board is led into the console (3) through the USB data interface (6) by using a USB flash disk;
step 2: then, an output block of a linear motor (8) is controlled through a control button (5) arranged at the top of a console (3), the output block of the linear motor (8) drives a sliding block (9) to move, the sliding block (9) drives a positioning plate (12) to move through a positioning block (10), the positioning plate (12) is moved to one side, close to the console (3), of the top of a positioning plate (2), then an integrated circuit board is placed at the top of the positioning plate (12) through a positioning hole (13) formed in the top of the positioning plate (12), and one end, far away from a soldering plate (17), of the integrated circuit board is returned to an original point;
and step 3: then, the control console (3) starts to control the output block of the linear motor (8) to move towards the direction close to the soldering plates (17), the integrated circuit board placed at the top of the positioning plate (12) starts to move, the two soldering plates (17) and the soldering plates (18) are staggered with each other, the distance between the adjacent lead sleeves (26) is 2 times of the minimum distance of soldering pins of the integrated circuit board, and the staggered distance between the soldering plates (17) and the soldering plates (18) is 2/1 of the distance between the adjacent lead sleeves (26), so that when the integrated circuit board arranged at the top of the positioning plate (12) moves to the bottoms of the soldering plates (18) and the soldering plates (17), the positions of the integrated circuit board needing to be soldered pass through the position right below the positioning clamping bars (27);
and 4, step 4: when the position of the integrated circuit board needing to be welded is located right below the positioning clamping strip (27), the output block of the designated micro electric telescopic motor (30) is controlled to operate for a period through data output by the U disk, the output block of the micro electric telescopic motor (30) starts to move downwards, the push block (31) moves downwards to push a tin wire downwards for one unit through a push wire slot (29) formed in the bottom of the push block (31), then the push block (31) contracts and returns to the original position, one end of the tin wire is located right above the welding point of the integrated circuit board needing to be welded, the designated laser tin melting shooting lamp (34) starts to work to burn the tin wire at the moment, the tin wire is melted, the welding point on the integrated circuit board is welded, and the laser tin melting shooting lamp (34) is turned off after the welding is finished;
and 5: after the integrated circuit board passes through the bottoms of the soldering plate (17) and the soldering plate (18), the positions needing to be welded on the surface of the integrated circuit board are welded, the integrated circuit board is taken out from the top of the positioning plate (12), and then the positioning plate (12) is controlled to return to the original position through the linear motor (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111103902.4A CN113690165A (en) | 2021-09-22 | 2021-09-22 | Integrated circuit processing method and processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111103902.4A CN113690165A (en) | 2021-09-22 | 2021-09-22 | Integrated circuit processing method and processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113690165A true CN113690165A (en) | 2021-11-23 |
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ID=78586726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111103902.4A Pending CN113690165A (en) | 2021-09-22 | 2021-09-22 | Integrated circuit processing method and processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113690165A (en) |
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2021
- 2021-09-22 CN CN202111103902.4A patent/CN113690165A/en active Pending
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