CN113651920B - Composition based on acrylic liquid crystal photosensitive resin and its application in 405nm 3D printing - Google Patents
Composition based on acrylic liquid crystal photosensitive resin and its application in 405nm 3D printing Download PDFInfo
- Publication number
- CN113651920B CN113651920B CN202111145723.7A CN202111145723A CN113651920B CN 113651920 B CN113651920 B CN 113651920B CN 202111145723 A CN202111145723 A CN 202111145723A CN 113651920 B CN113651920 B CN 113651920B
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- photosensitive resin
- parts
- acrylic liquid
- acrylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 68
- 239000011347 resin Substances 0.000 title claims abstract description 68
- 229920005989 resin Polymers 0.000 title claims abstract description 68
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 238000010146 3D printing Methods 0.000 title claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 15
- 229920002635 polyurethane Polymers 0.000 claims abstract description 12
- 239000004814 polyurethane Substances 0.000 claims abstract description 12
- 239000013530 defoamer Substances 0.000 claims abstract description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 9
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 9
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 8
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 8
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 7
- 239000000047 product Substances 0.000 claims description 30
- 239000003085 diluting agent Substances 0.000 claims description 20
- -1 4-((4-hydroxyphenoxy)carbonyl)phenyl 4-hydroxybenzoate Chemical compound 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 9
- 239000011342 resin composition Substances 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 4
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims description 4
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 claims description 4
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 claims description 4
- SHFJWMWCIHQNCP-UHFFFAOYSA-M hydron;tetrabutylazanium;sulfate Chemical compound OS([O-])(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC SHFJWMWCIHQNCP-UHFFFAOYSA-M 0.000 claims description 4
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 4
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 claims description 4
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 claims description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 claims description 4
- 229960000834 vinyl ether Drugs 0.000 claims description 4
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 3
- HRPUANCEDYZMFT-UHFFFAOYSA-N 2-(1-hydroxycyclohexyl)-1-phenylethanone Chemical compound C=1C=CC=CC=1C(=O)CC1(O)CCCCC1 HRPUANCEDYZMFT-UHFFFAOYSA-N 0.000 claims description 3
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims description 3
- OQBPCYUKFSJTDU-UHFFFAOYSA-N 4-Hydroxyphenyl-4-hydroxybenzoate Chemical compound C1=CC(O)=CC=C1OC(=O)C1=CC=C(O)C=C1 OQBPCYUKFSJTDU-UHFFFAOYSA-N 0.000 claims description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 3
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical group [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- DYUMLJSJISTVPV-UHFFFAOYSA-N phenyl propanoate Chemical compound CCC(=O)OC1=CC=CC=C1 DYUMLJSJISTVPV-UHFFFAOYSA-N 0.000 claims description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- DPAVORBDLHTGCY-UHFFFAOYSA-N 1,2-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(Cl)C(Cl)=CC=C3SC2=C1 DPAVORBDLHTGCY-UHFFFAOYSA-N 0.000 claims description 2
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 claims description 2
- UYEDESPZQLZMCL-UHFFFAOYSA-N 1,2-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C)C(C)=CC=C3SC2=C1 UYEDESPZQLZMCL-UHFFFAOYSA-N 0.000 claims description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 2
- DDPRYTUJYNYJKV-UHFFFAOYSA-N 1,4-diethylpiperazine Chemical compound CCN1CCN(CC)CC1 DDPRYTUJYNYJKV-UHFFFAOYSA-N 0.000 claims description 2
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 claims description 2
- FODCFYIWOJIZQL-UHFFFAOYSA-N 1-methylsulfanyl-3,5-bis(trifluoromethyl)benzene Chemical compound CSC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 FODCFYIWOJIZQL-UHFFFAOYSA-N 0.000 claims description 2
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 claims description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 2
- UAUCPJKNJJZFOE-UKTHLTGXSA-N 2,3-Bis(p-hydroxyphenyl)acrylonitrile Chemical compound C1=CC(O)=CC=C1\C=C(/C#N)C1=CC=C(O)C=C1 UAUCPJKNJJZFOE-UKTHLTGXSA-N 0.000 claims description 2
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 claims description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-Lutidine Substances CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 claims description 2
- PZVOOXOMADTHHD-UHFFFAOYSA-N 2-(2-hydroxy-4,6-dimethylphenyl)-3,5-dimethylphenol Chemical compound OC1=CC(C)=CC(C)=C1C1=C(C)C=C(C)C=C1O PZVOOXOMADTHHD-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 2
- 229940044119 2-tert-butylhydroquinone Drugs 0.000 claims description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 2
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 claims description 2
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- ZCZFEIZSYJAXKS-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COC(=O)C=C ZCZFEIZSYJAXKS-UHFFFAOYSA-N 0.000 claims description 2
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims description 2
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 claims description 2
- MKVYSRNJLWTVIK-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O.CC(=C)C(O)=O MKVYSRNJLWTVIK-UHFFFAOYSA-N 0.000 claims description 2
- 150000002191 fatty alcohols Chemical class 0.000 claims description 2
- 239000000706 filtrate Substances 0.000 claims description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- XKBGEWXEAPTVCK-UHFFFAOYSA-M methyltrioctylammonium chloride Chemical compound [Cl-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC XKBGEWXEAPTVCK-UHFFFAOYSA-M 0.000 claims description 2
- 239000002480 mineral oil Substances 0.000 claims description 2
- 235000010446 mineral oil Nutrition 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 claims description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 claims description 2
- 239000011780 sodium chloride Substances 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- CEYYIKYYFSTQRU-UHFFFAOYSA-M trimethyl(tetradecyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCC[N+](C)(C)C CEYYIKYYFSTQRU-UHFFFAOYSA-M 0.000 claims description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims 3
- AETNIHVBGMNBBT-UHFFFAOYSA-N 1-[4-[(2-morpholin-4-ylphenyl)methyl]phenyl]butan-2-one Chemical compound N1(CCOCC1)C1=CC=CC=C1CC1=CC=C(C=C1)CC(CC)=O AETNIHVBGMNBBT-UHFFFAOYSA-N 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- IOMIAOUACDJLGE-UHFFFAOYSA-M azanium tetraethylazanium dibromide Chemical compound [Br-].C(C)[N+](CC)(CC)CC.[NH4+].[Br-] IOMIAOUACDJLGE-UHFFFAOYSA-M 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- ZZAMUZWGTXZGKY-UHFFFAOYSA-N n-(6-aminohexyl)-3-(3,5-ditert-butyl-4-hydroxyphenyl)propanamide Chemical compound CC(C)(C)C1=CC(CCC(=O)NCCCCCCN)=CC(C(C)(C)C)=C1O ZZAMUZWGTXZGKY-UHFFFAOYSA-N 0.000 claims 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002518 antifoaming agent Substances 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004997 Liquid crystal elastomers (LCEs) Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VQVGJEIVVJBMCV-UHFFFAOYSA-N (4-octoxyphenyl)-phenyliodanium Chemical compound C1=CC(OCCCCCCCC)=CC=C1[I+]C1=CC=CC=C1 VQVGJEIVVJBMCV-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- BBJZBUKUEUXKDJ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n-[1-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoylamino]hexyl]propanamide Chemical compound C=1C(C(C)(C)C)=C(O)C(C(C)(C)C)=CC=1CCC(=O)NC(CCCCC)NC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BBJZBUKUEUXKDJ-UHFFFAOYSA-N 0.000 description 1
- JISNDAMZBNGEAC-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)CC1=CC=C(O)C=C1 JISNDAMZBNGEAC-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- YFPJFKYCVYXDJK-UHFFFAOYSA-N Diphenylphosphine oxide Chemical compound C=1C=CC=CC=1[P+](=O)C1=CC=CC=C1 YFPJFKYCVYXDJK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007777 multifunctional material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical compound C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- CFXXUPHGWZCTNG-UHFFFAOYSA-N propane-1,2-diol prop-2-enoic acid Chemical compound CC(O)CO.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C CFXXUPHGWZCTNG-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
本发明公开了基于丙烯酸液晶光敏树脂的组合物及其在405nm 3D打印中的应用。按重量计,它包括10~70份丙烯酸液晶光敏树脂,10~70份聚氨酯丙烯酸酯类树脂,0~25份聚乙二醇二甲基丙烯酸酯类树脂,0~25份烷氧化丙烯酸酯,0~25份稀释剂,0.1~10份光引发剂,0~5份消泡剂,0~5份流平剂和0~5份抗氧化剂。该基于丙烯酸液晶光敏树脂的组合物可用于405nm 3D打印,具有打印复杂结构的能力;同时保留了丙烯酸液晶光敏树脂的特性,所打印出的制品耐热性优异,机械性能良好,可广泛应用于精细电子器件、航空航天等领域。
The invention discloses a composition based on acrylic liquid crystal photosensitive resin and its application in 405nm 3D printing. By weight, it includes 10-70 parts of acrylic liquid crystal photosensitive resin, 10-70 parts of polyurethane acrylate resin, 0-25 parts of polyethylene glycol dimethacrylate resin, 0-25 parts of alkoxylated acrylate, 0~25 parts of thinner, 0.1~10 parts of photoinitiator, 0~5 parts of defoamer, 0~5 parts of leveling agent and 0~5 parts of antioxidant. The composition based on acrylic liquid crystal photosensitive resin can be used for 405nm 3D printing, and has the ability to print complex structures; while retaining the characteristics of acrylic liquid crystal photosensitive resin, the printed product has excellent heat resistance and good mechanical properties, and can be widely used in Fine electronic devices, aerospace and other fields.
Description
技术领域Technical Field
本发明涉及光敏树脂加工及其应用领域,尤其涉及基于丙烯酸液晶光敏树脂的组合物及其在405nm 3D打印中的应用。The present invention relates to photosensitive resin processing and application fields, and in particular to a composition based on acrylic liquid crystal photosensitive resin and application thereof in 405nm 3D printing.
背景技术Background Art
近年来,3D打印技术正处于高速发展阶段,吸引着越来越多的研究工作者。与传统的制造方法相比,3D打印无需使用模具,可以有效降低工业产品的生产周期和成本。随着3D打印技术的发展,其在航空航天技术、医学工程、建筑业和电子制造等领域都得到了更多的应用。在各种类型的3D打印技术中,立体光刻(SLA)因固化时间短、打印精度高和节能环保等诸多优点脱颖而出。此外,打印的制品在硬度、耐化学性和耐磨性方面具有优异的性能。In recent years, 3D printing technology is in a stage of rapid development, attracting more and more researchers. Compared with traditional manufacturing methods, 3D printing does not require the use of molds, which can effectively reduce the production cycle and cost of industrial products. With the development of 3D printing technology, it has been more widely used in aerospace technology, medical engineering, construction industry and electronic manufacturing. Among various types of 3D printing technologies, stereolithography (SLA) stands out due to its many advantages such as short curing time, high printing accuracy and energy saving and environmental protection. In addition, the printed products have excellent performance in hardness, chemical resistance and wear resistance.
随着3D打印技术的飞速发展,对光固化3D打印制品的质量提出了更高的要求。光敏树脂作为SLA技术的原材料,主要包括环氧树脂、丙烯酸树脂和聚酯树脂;这些材料可以打印出诸如珠宝、手术支架、手办模型等具有复杂结构的制品,但这些制品大多不能用于诸如航空、航天、汽车等领域。这些领域对于制品的热稳定性和机械性能要求较高,这就极大地限制了SLA技术的进一步发展。因此,开发用于光固化3D打印的新型高性能光敏材料对于学术和工业领域都具有重要意义。With the rapid development of 3D printing technology, higher requirements are placed on the quality of photocurable 3D printed products. Photosensitive resins, as raw materials for SLA technology, mainly include epoxy resins, acrylic resins and polyester resins; these materials can print products with complex structures such as jewelry, surgical stents, and hand-made models, but most of these products cannot be used in fields such as aviation, aerospace, and automobiles. These fields have high requirements for the thermal stability and mechanical properties of products, which greatly limits the further development of SLA technology. Therefore, the development of new high-performance photosensitive materials for photocurable 3D printing is of great significance to both academic and industrial fields.
液晶树脂因其取向的有序性等优点一直吸引着科学工作者的关注。经过多年的发展,其在3D打印中的应用也取得了一定成效。液晶弹性体(Liquid crystal elastomers,简称LCEs)是将液晶分子的各向异性序与轻交联聚合物网络的熵弹性相结合的软性多功能材料。LCEs具有特殊的力学特性,如高能量耗散、软弹性、可编程各向异性和负泊松比。目前已有研究者利用点击化学和墨水直写技术制造LCEs器件。但是用于立体光固化成型技术(SLA)3D打印液晶光敏树脂还未见报道。Liquid crystal resins have always attracted the attention of scientists due to their advantages such as the orderliness of their orientation. After years of development, their application in 3D printing has also achieved certain results. Liquid crystal elastomers (LCEs) are soft multifunctional materials that combine the anisotropic order of liquid crystal molecules with the entropic elasticity of lightly cross-linked polymer networks. LCEs have special mechanical properties such as high energy dissipation, soft elasticity, programmable anisotropy and negative Poisson's ratio. At present, researchers have used click chemistry and ink direct writing technology to manufacture LCEs devices. However, there have been no reports on liquid crystal photosensitive resins used for stereolithography (SLA) 3D printing.
液晶材料因其独特的分子形状和化学结构,在光学、电气和机械性能等多方面表现优异。丙烯酸酯液晶树脂在引发剂引发或热引发的条件下都可通过热固化获得固化树脂。但因引发体系和温度的限制,热固性丙烯酸酯液晶树脂一般采用光聚合。采用光聚合时聚合温度可在液相温度范围之内任意选择,并且取向、聚合两个过程可以完全独立,即液晶树脂可以充分取向之后再进行聚合。但该法比较适用于制备薄膜,不适用于厚度较大的制件。Liquid crystal materials have excellent optical, electrical and mechanical properties due to their unique molecular shape and chemical structure. Acrylic liquid crystal resin can be cured by thermal curing under the conditions of initiator initiation or thermal initiation. However, due to the limitations of the initiation system and temperature, thermosetting acrylic liquid crystal resins generally use photopolymerization. When photopolymerization is used, the polymerization temperature can be arbitrarily selected within the liquidus temperature range, and the orientation and polymerization processes can be completely independent, that is, the liquid crystal resin can be fully oriented before polymerization. However, this method is more suitable for the preparation of thin films and is not suitable for thicker parts.
立体光固化成型技术(SLA)可以通过激光逐层固化液晶树脂,迅速得到任意形状的三维结构制件。这一技术很好的克服了光固化对于制件厚度和形状的限制。若能将液晶树脂的液晶的特性保留下来应用到3D打印中,那么制品的机械性能必然得到一定程度的提高。因此,开发出一种新型液晶光敏树脂,其在3D打印中的应用将极具潜力。Stereolithography (SLA) technology can cure liquid crystal resin layer by layer through laser to quickly obtain three-dimensional structural parts of any shape. This technology has overcome the limitations of photocuring on the thickness and shape of the parts. If the liquid crystal properties of liquid crystal resin can be retained and applied to 3D printing, the mechanical properties of the product will inevitably be improved to a certain extent. Therefore, a new type of liquid crystal photosensitive resin has been developed, and its application in 3D printing will be very potential.
因而基于该思路,开发基于丙烯酸液晶树脂的405nm光固化3D打印用光敏树脂组合物,既扩宽了丙烯酸液晶树脂的应用,解决了其成型性差的缺点;又得到一种高性能的新型光敏树脂组合物,有利于405nm光固化3D打印技术的普及和推广。Therefore, based on this idea, a photosensitive resin composition for 405nm photocuring 3D printing based on acrylic liquid crystal resin was developed, which not only broadened the application of acrylic liquid crystal resin and solved its disadvantage of poor formability; but also obtained a new type of high-performance photosensitive resin composition, which is conducive to the popularization and promotion of 405nm photocuring 3D printing technology.
发明内容Summary of the invention
针对现有技术的情况和不足,本发明的目的在于提供一种热稳定性、机械性能优异的基于丙烯酸液晶光敏树脂的组合物及其在405nm3D打印中的应用。In view of the situation and shortcomings of the prior art, the object of the present invention is to provide a composition based on acrylic liquid crystal photosensitive resin with excellent thermal stability and mechanical properties and its application in 405nm 3D printing.
为了实现上述的技术目的,本发明采用的技术方案为:In order to achieve the above technical objectives, the technical solution adopted by the present invention is:
一种基于丙烯酸液晶光敏树脂的组合物,按重量计,其原料如下:A composition based on acrylic liquid crystal photosensitive resin, the raw materials of which are as follows by weight:
优选地,所述的丙烯酸液晶光敏树脂的合成路径参见附图1,其合成步骤包括:Preferably, the synthesis path of the acrylic liquid crystal photosensitive resin is shown in FIG1 , and the synthesis steps include:
(1)按摩尔计,将10份含介晶基元且端部带有-OH的化合物、50~500份环氧氯丙烷(EHC)和0.1~1.0份的催化剂1为原料进行混合,通入N2保护,然后在40~100℃下反应5~24小时,得到溶液A;(1) 10 parts by mole of a compound containing a mesogenic unit and having -OH at the end, 50 to 500 parts by mole of epichlorohydrin (EHC) and 0.1 to 1.0 parts by mole of
(2)按摩尔计,接着缓慢滴加20~50份NaOH溶液(浓度30%~60%)到溶液A中,反应生成的水用真空泵减压除去,继续反应0.1~4小时后将产物倒入分液漏斗内,过滤除去NaCl,所得滤液利用旋转蒸发仪除去多余的EHC,得到溶液B;(2) Slowly drop 20 to 50 parts of NaOH solution (
(3)溶液B与甲醇/丙酮溶液(比例1.0:0.1~1.0:10)混合,放入冰箱降温结晶,得到的结晶物用甲醇洗涤并抽滤,将产物于烘箱60~100℃烘干,得到乳白色固体即为液晶环氧树脂C;(3) Solution B is mixed with methanol/acetone solution (ratio 1.0:0.1 to 1.0:10), placed in a refrigerator for cooling and crystallization, the obtained crystals are washed with methanol and filtered, and the product is dried in an oven at 60 to 100° C. to obtain a milky white solid, which is liquid crystal epoxy resin C;
(4)按摩尔计,取10份液晶环氧树脂C、0.1~1.0份阻聚剂,加入烧瓶中,反应温度设置为90~150℃,待环氧树脂C完全融化后,缓慢滴加20~25份的丙烯酸,并滴加0.01~0.1份的催化剂2,反应0.5~5.0小时冷却后得到淡黄色粘稠树脂,即所述的丙烯酸液晶光敏树脂,合成路径如下:(4) On a molar basis, 10 parts of liquid crystal epoxy resin C and 0.1-1.0 parts of polymerization inhibitor are added to a flask, and the reaction temperature is set to 90-150° C. After the epoxy resin C is completely melted, 20-25 parts of acrylic acid are slowly added dropwise, and 0.01-0.1 parts of
其中,所述的含介晶基元且端部带有-OH的化合物为4-羟基苯基4-羟基苯甲酸酯、4,4′-联苯二酚、3,3',5,5'-四甲基联苯二酚、4-((4-羟基苯氧基)羰基)苯基4-羟基苯甲酸酯、2,3-双(4-羟基苯基)丙烯腈和4,4'-亚丙基双苯酚等中的一种或其组合;步骤(1)所述的催化剂1为四甲基氯化铵、四丁基溴化铵、四丁基氯化铵、四乙基溴化铵、四丁基硫酸氢铵、苄基三乙基氯化铵、三辛基甲基氯化铵、十二烷基三甲基氯化铵或十四烷基三甲基氯化铵等的一种或其组合;步骤(4)所述的阻聚剂为对苯二酚、苯醌、甲基氢醌、对羟基苯甲醚、2-叔丁基对苯二酚、2,5-二叔丁基対苯二酚的一种或其组合;步骤(4)所述的催化剂2为N,N-二乙基苯胺、N,N-二甲基对甲苯胺、N,N-二甲基苄胺、N,N-二甲基环己胺、N,N’-二甲基吡啶、N,N’-二乙基哌嗪等的一种或其组合。Wherein, the compound containing mesogens and having -OH at the end is one or a combination of 4-hydroxyphenyl 4-hydroxybenzoate, 4,4'-biphenol, 3,3',5,5'-tetramethylbiphenol, 4-((4-hydroxyphenoxy)carbonyl)phenyl 4-hydroxybenzoate, 2,3-bis(4-hydroxyphenyl)acrylonitrile and 4,4'-propylenebisphenol, etc.; the
优选地,所述的聚氨酯丙烯酸酯类树脂选自脂肪族聚氨酯丙烯酸酯齐聚物、芳香族聚氨酯丙烯酸酯齐聚物、聚氨酯二丙烯酸酯、二甲基丙烯酸氨基甲酸酯树脂中的至少一种。Preferably, the polyurethane acrylate resin is selected from at least one of aliphatic polyurethane acrylate oligomers, aromatic polyurethane acrylate oligomers, polyurethane diacrylate, and dimethacrylate urethane resin.
优选地,所述的聚乙二醇二甲基丙烯酸酯类树脂的聚合度为1~200。Preferably, the degree of polymerization of the polyethylene glycol dimethacrylate resin is 1-200.
优选地,所述的所述烷氧化丙烯酸酯单体选自丙氧化丙三醇三丙烯酸酯,乙氧化季戊四醇四丙烯酸酯中的至少一种。Preferably, the alkoxylated acrylate monomer is selected from at least one of propoxylated glycerol triacrylate and ethoxylated pentaerythritol tetraacrylate.
优选地,所述的稀释剂选自苯乙烯、丙烯酸酯类稀释剂、丙烯酸羟酯类稀释剂、乙烯基醚类稀释剂、环己烷类稀释剂中的至少一种;所述丙烯酸酯类稀释剂选自甲基丙烯酸甲酯、1,6-己二醇二丙烯酸酯、异冰片基丙烯酸酯、四氢呋喃丙烯酸酯酯、二缩三丙二醇二丙烯酸酯、己二醇二丙烯酸酯、双酚A二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、季戊四醇丙烯酸酯、丙烯酸异冰片酯、环三羟甲基丙烷甲缩醛丙烯酸酯中的至少一种;所述丙烯酸羟酯类稀释剂选自甲基丙烯酸羟乙酯、甲基丙烯酸羟丙酯、丙烯酸羟乙酯中的至少一种;所述乙烯基醚类稀释剂选自4-羟丁基乙烯基醚、二乙二醇二乙烯基醚中的至少一种;所述环己烷类稀释剂选自4-乙烯基环氧环己烷、4-乙烯基环氧环己烷中的至少一种。Preferably, the diluent is selected from at least one of styrene, acrylate diluents, hydroxyacrylate diluents, vinyl ether diluents, and cyclohexane diluents; the acrylate diluent is selected from at least one of methyl methacrylate, 1,6-hexanediol diacrylate, isobornyl acrylate, tetrahydrofuran acrylate, tripropylene glycol diacrylate, hexanediol diacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, pentaerythritol acrylate, isobornyl acrylate, and cyclotrimethylolpropane formal acrylate; the hydroxyacrylate diluent is selected from at least one of hydroxyethyl methacrylate, hydroxypropyl methacrylate, and hydroxyethyl acrylate; the vinyl ether diluent is selected from at least one of 4-hydroxybutyl vinyl ether and diethylene glycol divinyl ether; the cyclohexane diluent is selected from at least one of 4-vinyl epoxycyclohexane and 4-vinyl epoxycyclohexane.
优选地,所述光引发剂为二苯基-(4-苯基硫)苯基锍六氟锑酸盐、二苯基-(4-苯基硫)苯基锍六氟磷酸盐、4-辛氧基二苯碘六氟锑酸盐、双(4-叔丁苯基)碘鎓六氟磷酸盐、二苯基碘鎓六氟磷酸盐、4-异丙基-4’-甲基二苯基碘鎓四(五氟苯基)硼酸盐、三苯基锍四氟硼酸盐、三对甲苯基锍六氟磷酸盐、1-羟基-环己基-苯乙酮、α,α-二甲基-α-羟基苯乙酮、对异丙基苯基-2-羟基二甲基丙酮-1、二苯甲酮、氯化二苯甲酮、丙烯酸酯化二苯甲酮、4-苯基二苯甲酮、2-氯化硫杂蒽酮、异丙基硫杂蒽酮、2-羟基-2-甲基-1-苯基-1-丙酮、二甲基硫杂蒽酮、二乙基硫杂蒽酮、二氯硫杂蒽酮、2-苯基苄-2-二甲基胺-1-(4-吗啉苄苯基)丁酮中的至少一种。Preferably, the photoinitiator is diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate, diphenyl-(4-phenylthio)phenylsulfonium hexafluorophosphate, 4-octyloxydiphenyliodonium hexafluoroantimonate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, diphenyliodonium hexafluorophosphate, 4-isopropyl-4'-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate, triphenylsulfonium tetrafluoroborate, tri-p-tolylsulfonium hexafluorophosphate, 1-hydroxy-cyclohexyl-acetophenone, α, At least one of α-dimethyl-α-hydroxyacetophenone, p-isopropylphenyl-2-hydroxydimethylacetone-1, benzophenone, chlorinated benzophenone, acrylated benzophenone, 4-phenylbenzophenone, 2-chlorothioxanthone, isopropylthioxanthone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, dimethylthioxanthone, diethylthioxanthone, dichlorothioxanthone, and 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone.
优选地,所述消泡剂选自有机硅类消泡剂、矿物油类消泡剂、聚醚类消泡剂、脂肪醇类消泡剂中的至少一种。Preferably, the defoaming agent is selected from at least one of silicone defoaming agents, mineral oil defoaming agents, polyether defoaming agents, and fatty alcohol defoaming agents.
优选地,所述流平剂选自丙烯酸类流平剂、有机硅类流平剂、氟碳化合物类流平剂中的至少一种。Preferably, the leveling agent is selected from at least one of acrylic leveling agents, silicone leveling agents, and fluorocarbon leveling agents.
优选地,所述的抗氧化剂选自四(3,5-二叔丁基-4-羟基)苯丙酸季戊四醇酯、三(2,4-二叔丁基)亚磷酸苯酯、N,N′-双-(3-(3,5-二叔丁基-4-羟基苯基)丙酰基)己二胺、2,6-二叔丁基-4-甲基苯酚中的至少一种。Preferably, the antioxidant is selected from at least one of pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxy)phenylpropionate, tris(2,4-di-tert-butyl)phenyl phosphite, N,N′-bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl)hexanediamine and 2,6-di-tert-butyl-4-methylphenol.
优选地,所述的基于丙烯酸液晶光敏树脂组合物的应用,将基于液晶环氧光敏树脂组合物用于405nm光固化3D打印,得到成型件。将所得成型件进行紫外光后处理,紫外光的光强为100W/cm2,紫外光固化时间为0~10分钟。Preferably, the application of the acrylic liquid crystal photosensitive resin composition is to use the liquid crystal epoxy photosensitive resin composition for 405nm light curing 3D printing to obtain a molded part. The obtained molded part is subjected to ultraviolet light post-treatment, the ultraviolet light intensity is 100W/ cm2 , and the ultraviolet light curing time is 0 to 10 minutes.
采用上述的技术方案,本发明与现有技术相比,其具有的有益效果为:本发明将丙烯酸液晶光敏树脂引入到光敏树脂组合物当中,可以保留丙烯酸液晶光敏树脂的特性,所打印出的制品机械性能、热稳定性优异,使其可广泛应用于电子器件、航空航天等领域。同时本发明提供的3D打印用丙烯酸液晶光敏树脂组合物可打印性好,具有打印复杂结构的能力,且制备成本低,有效地降低了405nm3D打印树脂价格,为405nm3D打印技术的大规模应用奠定了基础。By adopting the above technical scheme, the present invention has the following beneficial effects compared with the prior art: the present invention introduces acrylic liquid crystal photosensitive resin into the photosensitive resin composition, which can retain the characteristics of acrylic liquid crystal photosensitive resin, and the printed products have excellent mechanical properties and thermal stability, so that they can be widely used in electronic devices, aerospace and other fields. At the same time, the acrylic liquid crystal photosensitive resin composition for 3D printing provided by the present invention has good printability, has the ability to print complex structures, and has low preparation cost, which effectively reduces the price of 405nm 3D printing resin and lays the foundation for the large-scale application of 405nm 3D printing technology.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明所涉及的丙烯酸液晶光敏树脂的合成路径。FIG. 1 is a synthetic route of the acrylic liquid crystal photosensitive resin involved in the present invention.
图2是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物的POM图。FIG. 2 is a POM diagram of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention.
图3是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物在405nm 3D打印机打印出的模型。FIG3 is a model printed by a 405 nm 3D printer of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention.
图4是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物与对比例在405nm3D打印机打印出的样条拉伸试验的应力-应变曲线。4 is a stress-strain curve of a tensile test of a sample strip printed by a 405 nm 3D printer for a composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention and a comparative example.
图5是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物与对比例在405nm3D打印机打印出的样条弯曲试验的应力-应变曲线。5 is a stress-strain curve of a strip bending test of a composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention and a comparative example printed by a 405 nm 3D printer.
图6是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物与对比例在405nm3D打印机打印出的样条的动态力学性能测试曲线。FIG6 is a dynamic mechanical property test curve of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention and the sample printed by the comparative example on a 405nm 3D printer.
具体实施方式DETAILED DESCRIPTION
以下结合具体实施方式对本发明方案做进一步的阐述:The present invention is further described below in conjunction with specific embodiments:
丙烯酸液晶光敏树脂:Acrylic liquid crystal photosensitive resin:
4-羟基苯基4-羟基苯甲酸酯基丙烯酸液晶光敏树脂,简写为A-1;4-Hydroxyphenyl 4-hydroxybenzoate-based acrylic liquid crystal photosensitive resin, abbreviated as A-1;
4,4′-联苯二酚基丙烯酸液晶光敏树脂,简写为A-2;4,4′-biphenyldiphenol-based acrylic liquid crystal photosensitive resin, abbreviated as A-2;
聚氨酯丙烯酸酯类树脂:Polyurethane acrylate resin:
脂肪族聚氨酯丙烯酸酯1:购自沙多玛公司,产品编号CN9010,简写为B-1;Aliphatic polyurethane acrylate 1: purchased from Sartomer, product number CN9010, abbreviated as B-1;
脂肪族聚氨酯丙烯酸酯2:购自沙多玛公司,产品编号CN991,简写为B-2;Aliphatic polyurethane acrylate 2: purchased from Sartomer, product number CN991, abbreviated as B-2;
聚乙二醇二甲基丙烯酸酯类树脂:Polyethylene glycol dimethacrylate resin:
聚乙二醇二甲基丙烯酸酯类树脂1:购自沙多玛公司,产品编号SR210,简写为C-1;Polyethylene glycol dimethacrylate resin 1: purchased from Sartomer, product number SR210, abbreviated as C-1;
聚乙二醇二甲基丙烯酸酯类树脂2:购自沙多玛公司,产品编号SR211,简写为C-2;Polyethylene glycol dimethacrylate resin 2: purchased from Sartomer, product number SR211, abbreviated as C-2;
烷氧化丙烯酸酯:Alkoxylated acrylates:
乙氧化季戊四醇四丙烯酸酯,购自沙多玛公司,产品编号SR494,简写为D-1;Ethoxylated pentaerythritol tetraacrylate, purchased from Sartomer, product number SR494, abbreviated as D-1;
丙氧化丙三醇三丙烯酸酯,购自沙多玛公司,产品编号SR9020,简写为D-2;Propylene glycol triacrylate, purchased from Sartomer, product number SR9020, abbreviated as D-2;
稀释剂:Thinner:
环三羟甲基丙烷甲缩醛丙烯酸酯:购自购自沙多玛公司,产品编号SR351,简写为E-1;Cyclotrimethylolpropane formal acrylate: purchased from Sartomer, product number SR351, abbreviated as E-1;
甲基丙烯酸羟丙酯:购自阿拉丁试剂(上海)有限公司,简写为E-2;Hydroxypropyl methacrylate: purchased from Aladdin Reagent (Shanghai) Co., Ltd., abbreviated as E-2;
甲基丙烯酸羟乙酯:购自阿拉丁试剂(上海)有限公司,简写为E-3;Hydroxyethyl methacrylate: purchased from Aladdin Reagent (Shanghai) Co., Ltd., abbreviated as E-3;
光引发剂:Photoinitiator:
2,4,6-(三甲基苯甲酰基)二苯氧化膦,购自阿拉丁试剂(上海)有限公司,产品编号光引发剂TPO,简写为F-1;2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number photoinitiator TPO, abbreviated as F-1;
苯基双(2,4,6-三甲基苯甲酰基)氧化膦:购自阿拉丁试剂(上海)有限公司,产品编号光引发剂XBPO,简写为F-2;Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide: purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number photoinitiator XBPO, abbreviated as F-2;
1-羟基-环己基-苯乙酮:购自阿拉丁试剂(上海)有限公司,产品编号光引发剂184,简写为F-3;1-Hydroxy-cyclohexyl-acetophenone: purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number photoinitiator 184, abbreviated as F-3;
消泡剂:Defoaming agent:
有机硅类消泡剂:购自德国毕克化学公司,产品编号BYK-088,简写为G-1;Silicone defoamer: purchased from BYK Chemical Company of Germany, product number BYK-088, abbreviated as G-1;
聚醚类消泡剂:购自广东中联精细化工有限公司,产品编号B-299,简写为G-2;Polyether defoamer: purchased from Guangdong Zhonglian Fine Chemical Co., Ltd., product number B-299, abbreviated as G-2;
流平剂:Leveling agent:
有机硅类流平剂:购自安徽嘉制信诺化工股份有限公司,产品编号WE-D5510,简写为H-1;Silicone leveling agent: purchased from Anhui Jiazhi Xinnuo Chemical Co., Ltd., product number WE-D5510, abbreviated as H-1;
聚丙烯酸类流平剂:购自安徽嘉制信诺化工股份有限公司,产品编号WE-D819,简写为H-2;Polyacrylic acid leveling agent: purchased from Anhui Jiazhi Xinnuo Chemical Co., Ltd., product number WE-D819, abbreviated as H-2;
抗氧化剂:Antioxidants:
2,6-二叔丁基-4-甲基苯酚:购自阿拉丁试剂(上海)有限公司,产品编号抗氧化剂BHT,简写为I-1;2,6-di-tert-butyl-4-methylphenol: purchased from Aladdin Reagent (Shanghai) Co., Ltd., product number antioxidant BHT, abbreviated as I-1;
四(3,5-二叔丁基-4-羟基)苯丙酸季戊四醇酯:购自广州凯茵化工有限公司,抗氧化剂1010,简写为I-2。Pentaerythritol tetrakis(3,5-di-tert-butyl-4-hydroxy)phenylpropionate: purchased from Guangzhou Kaiyin Chemical Co., Ltd., antioxidant 1010, abbreviated as I-2.
实施例1-8(即样品1#~样品8#的制备)Example 1-8 (i.e., preparation of
制备步骤如下:将适量的丙烯酸液晶光敏树脂、聚氨酯丙烯酸酯类树脂、聚乙二醇二甲基丙烯酸酯类树脂、烷氧化丙烯酸酯、稀释剂、消泡剂、流平剂、抗氧化剂混合升温至30~80℃,经搅拌混合均匀,冷却后再加入光引发剂,搅拌至均匀后得到黄色的粘稠状液体,即为本申请所述的基于丙烯酸液晶光敏树脂的组合物样品。The preparation steps are as follows: mix appropriate amounts of acrylic liquid crystal photosensitive resin, polyurethane acrylate resin, polyethylene glycol dimethacrylate resin, alkoxylated acrylate, diluent, defoamer, leveling agent, and antioxidant, and heat to 30-80° C., stir and mix evenly, add a photoinitiator after cooling, and stir until uniform to obtain a yellow viscous liquid, which is the composition sample based on acrylic liquid crystal photosensitive resin described in the present application.
样品编号与各组分的种类和配比的关系如表1所示。The relationship between the sample number and the type and ratio of each component is shown in Table 1.
表1Table 1
将配制的基于丙烯酸液晶光敏树脂的组合物倒入美国福姆莱布斯(Formlabs)公司生产的Form2 3D打印机中,通过计算机建模、构图及打印后成型。将所得制品进行紫外光固化和热固化处理;其中紫外光的光强为100W/cm2,紫外光固化时间为2min。The prepared acrylic liquid crystal photosensitive resin composition was poured into the Form2 3D printer produced by Formlabs, USA, and formed by computer modeling, composition and printing. The obtained product was subjected to UV curing and thermal curing treatment; the UV light intensity was 100W/ cm2 , and the UV curing time was 2min.
针对上述实施例所制得的产品,通过观察固化后成品的外观情况对光敏树脂组合物进行评价,结果如表2所示。For the products prepared in the above examples, the photosensitive resin composition was evaluated by observing the appearance of the finished products after curing. The results are shown in Table 2.
表2Table 2
参见附图2,它是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物的POM图。从图中可以看出随着温度的升高,可以看到丙烯酸液晶光敏树脂在室温下观察到的偏光显微镜图,可以观察到明显的条带织构和纹理织构,这是典型的向列型液晶织构。由此进一步证明了丙烯酸液晶光敏树脂在室温下即可表现出液晶性质。See Figure 2, which is a POM diagram of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention. From the figure, it can be seen that as the temperature rises, the polarized light microscope diagram of acrylic liquid crystal photosensitive resin observed at room temperature can be seen, and obvious stripe texture and texture texture can be observed, which is a typical nematic liquid crystal texture. This further proves that acrylic liquid crystal photosensitive resin can exhibit liquid crystal properties at room temperature.
参见附图3,它是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物在405nm 3D打印机打印出的模型。Referring to FIG3 , it is a model printed by a 405nm 3D printer of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention.
参见附图4和5,它们分别是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物与对比例在405nm 3D打印机打印出样条拉伸试验和弯曲试验的应力-应变曲线。从中可知,实施例1制备的基于丙烯酸液晶光敏树脂的组合物的拉伸强度为61.7MPa、断裂伸长率为17.5%、弯曲强度为91.3MPa,均优于对比例,可见其具有优异的机械性能。See Figures 4 and 5, which are stress-strain curves of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention and the comparative example in the 405nm 3D printer for the tensile test and bending test of the sample. It can be seen that the tensile strength of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 is 61.7MPa, the elongation at break is 17.5%, and the bending strength is 91.3MPa, which are all better than the comparative example, showing that it has excellent mechanical properties.
参见附图6,它是本发明实施例1制备的基于丙烯酸液晶光敏树脂的组合物与对比例在405nm 3D打印机打印出样条动态力学性能测试曲线。从中可知,实施例1制备的基于丙烯酸液晶光敏树脂的组合物的储能模量为2230MPa、玻璃化转变温度为89.8℃,均优于对比例,可见其具有优异的热稳定性。See Figure 6, which is a dynamic mechanical properties test curve of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 of the present invention and the comparative example printed out by a 405nm 3D printer. It can be seen that the storage modulus of the composition based on acrylic liquid crystal photosensitive resin prepared in Example 1 is 2230MPa and the glass transition temperature is 89.8°C, which are better than the comparative example, indicating that it has excellent thermal stability.
以上所述,仅是本申请的几个实施例,并非对本申请做任何形式的限制,虽然本申请以较佳实施例揭示如上,然而并非用以限制本申请,任何熟悉本专业的技术人员,在不脱离本申请技术方案的范围内,利用上述揭示的技术内容做出些许的变动或修饰均等同于等效实施案例,均属于技术方案范围内。The above are only a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with the profession, without departing from the scope of the technical solution of the present application, using the technical content disclosed above to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.
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CN112646085A (en) * | 2020-12-24 | 2021-04-13 | 泉州师范学院 | Bismaleimide resin-based photosensitive resin composition and application thereof in 405nm 3D printing |
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