CN113659425A - Transmitter TO-CAN encapsulation of parallel light-emitting - Google Patents
Transmitter TO-CAN encapsulation of parallel light-emitting Download PDFInfo
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- CN113659425A CN113659425A CN202111061292.6A CN202111061292A CN113659425A CN 113659425 A CN113659425 A CN 113659425A CN 202111061292 A CN202111061292 A CN 202111061292A CN 113659425 A CN113659425 A CN 113659425A
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- laser
- parallel light
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- transmitter
- package
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- 238000005538 encapsulation Methods 0.000 title description 2
- 230000003287 optical effect Effects 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims abstract description 10
- 238000010168 coupling process Methods 0.000 claims abstract description 10
- 238000005859 coupling reaction Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a transmitter TO-CAN package for emitting parallel light, which comprises: the device comprises a TO base, a laser assembly and a collimating lens assembly; the laser assembly is fixed on the TO base; the collimating lens component is coupled and arranged on the top of the light-emitting optical axis of the laser component. The invention discloses a transmitter TO-CAN package emitting light in parallel, wherein a laser chip is fixed on a chip carrier and is connected with an external circuit through a bound gold wire, and a collimating lens component at the top of the laser chip is coupled and fixed with the laser chip TO enable the light TO be emitted into parallel light beams, so that the problems of light splitting and parallel light coupling of an optical device are solved, the requirement of miniaturization and packaging of the optical device is met, and the cost rate of transmitting the TO-CAN is greatly reduced.
Description
Technical Field
The invention relates TO the technical field of optical communication, in particular TO a transmitter TO-CAN (TO-area network) package for emitting parallel light.
Background
In optical fiber transmission equipment, CWDM and DWDM are applied more and more, the wavelength interval between uplink light and downlink light is smaller and smaller, for example, the interval between the uplink light and the downlink light is 10-20 nm, and in the application process, integration and miniaturization packaging are required, for example, an SFP module, a QSFP module and the like.
At present, the packaging form of a main optical device is the packaging form of a traditional convergent light TO base, and the packaging form is divided into two modes, wherein the mode is that a convergent lens is arranged on a TO cap, the mode is a flat window TO cap, and then an external lens is arranged, so that convergent light beam emergent light or parallel light beam emergent light is formed. Although the two packaging modes of the convergent light TO base are simple and convenient, no matter the mode I or the mode II, the convergent light mode cannot separate beams with the distance of 10-20 nm between uplink and downlink light beams in an optical principle, the mode II can also adopt an external lens TO output parallel beams, but the structure is larger, the distance between the lens and a chip is far, and in the optical principle and lens selection, the subsequent optical power coupling efficiency is inevitably reduced, and finally, the optical module cannot meet the performance requirement, or the miniaturized packaging cannot be realized, so that the use requirement of optical fiber transmission equipment on miniaturization is difficult TO meet.
Therefore, it is an urgent technical problem TO be solved by those skilled in the art TO provide a TO-CAN package for realizing parallel light extraction of a TO-CAN and parallel light extraction required by a miniaturized package of an optical module.
Disclosure of Invention
The invention aims TO provide a transmitter TO-CAN package for emitting parallel light, which aims TO solve the problems that in the prior art, the TO-CAN package cannot separate beams with the distance of 10-20 nm between uplink light and downlink light, and cannot realize small-size packaging.
The purpose of the invention is realized by the following technical scheme:
the invention provides a transmitter TO-CAN (TO-CAN-area network) package for emitting parallel light, which comprises: the device comprises a TO base, a laser assembly and a collimating lens assembly;
the laser assembly is fixed on the TO base;
the collimating lens component is coupled and arranged at the top of the light-emitting optical axis of the laser component so as to ensure that the emergent light beam is a parallel light beam.
Has the advantages that: by arranging and coupling the collimating lens component in the TO-CAN and in front of the laser chip, the light-emitting of the TO-CAN parallel light is realized under the condition of not greatly changing the outline dimension of the TO-CAN, the light power coupling is improved compared with the light-splitting mode, and the requirement of optical module miniaturization packaging is met.
Preferably, in the above-mentioned transmitter TO-CAN package for emitting parallel light, the laser module includes: a chip carrier and a laser chip; the chip carrier is fixed on the TO base; the laser chip is fixed on the chip carrier; and the collimating lens component is coupled and arranged at the top of the light-emitting optical axis of the laser chip.
Has the advantages that: the chip carrier is connected with an external circuit through a binding gold wire to provide an electric signal to be converted for the laser chip. The chip carrier and the laser chip are used for ensuring the optical coupling efficiency of the laser chip, and the laser chip has the advantages of small size, low power consumption, low cost, high integration degree and the like.
Preferably, in the above transmitter TO-CAN package for emitting parallel light, further includes: transferring the cushion block; the switching cushion block is fixed on the TO base; the chip carrier and the collimating lens assembly are both fixed on the switching cushion block; and the collimating lens assembly is located at the top end of the chip carrier.
Preferably, in the above TO-CAN package for a transmitter emitting parallel light, the switching cushion block has a structure in a shape of Chinese character 'tu'; and the chip carrier and the collimating lens assembly are fixed on a plane which is vertical TO the transfer cushion block and the TO base.
Has the advantages that: the transmitting direction of the laser chip is adjusted to the vertical upward direction by arranging the switching cushion block, and finally the laser chip is connected with the TEC refrigerator.
Preferably, in the above transmitter TO-CAN package for emitting parallel light, further includes: a temperature control assembly; the temperature control assembly includes: the device comprises a temperature sensing unit, a TEC refrigerator and a control unit;
the temperature sensing unit is fixed on the chip carrier and used for sensing the temperature of the laser chip;
the TEC refrigerator is fixed on the TO base; the transfer cushion block is fixed on the TEC refrigerator;
the control unit is electrically connected with the temperature sensing unit and the TEC refrigerator respectively.
Wherein, it is required to be noted that: the temperature sensing unit is a thermistor.
Has the advantages that: the temperature sensing unit detects the working temperature of the laser chip by detecting the resistance value change of the thermistor, and when the temperature of the laser chip is overhigh, the control unit controls the TEC refrigerator to refrigerate; when the temperature of the laser chip is too low, the control unit controls the TEC to heat, and then the temperature of the laser chip is increased.
Preferably, in the above-mentioned transmitter TO-CAN package for emitting parallel light, the collimator lens assembly is actively coupled TO the laser chip.
Has the advantages that: the laser chip is aligned with the optical axis of the collimating lens component under the working state of the device through an external bias or current, and the emergent light beam is ensured to be a parallel light beam.
Preferably, in the above-described transmitter TO-CAN package for emitting parallel light, the type of the laser chip is any one of DFB, EML, FP, SOA + DFB, or SOA + EML.
Preferably, in the above-mentioned TO-CAN package of a transmitter emitting parallel light, the collimator lens assembly is fixed by an adhesive or laser welding.
Preferably, in the above-described transmitter TO-CAN package for parallel light outgoing, the input signal may be a double-ended input signal or a single-ended input signal.
Has the advantages that: according to different signal modulation modes adopted by the optical module, the input signal can be a single-ended input signal or a double-ended input signal.
Preferably, in the above-mentioned transmitter TO-CAN package for emitting parallel light, a TO cap is further included; the TO cap is hermetically buckled on the TO base; the TO cap is a flat window cap.
Wherein, it is required to be noted that: the collimating Lens assembly is a collimating Lens.
According TO the technical scheme, the TO-CAN package of the transmitter emitting the parallel light realizes the TO-CAN parallel light emitting without greatly changing the outline dimension of the TO-CAN by arranging and coupling the collimating lens component in the TO-CAN and in front of the laser chip, the light power coupling is improved compared with the light splitting converging mode, and the requirement of miniaturization package of an optical module is met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the internal structure of a single-ended output according to the present invention;
FIG. 3 is a schematic diagram of the internal structure of the dual output of the present invention;
FIG. 4 is a schematic diagram of another internal structure of a dual-ended output according to the present invention;
FIG. 5 is a schematic diagram of a laser assembly according to the present invention;
fig. 6 is a schematic structural diagram of the connection between the laser module and the conversion pad of the present invention.
In fig. 1-5:
the device comprises a base 1, a laser assembly 2, a chip carrier 21, a laser chip 22, a collimating lens assembly 3, a transfer cushion block 4, a temperature control assembly 5, a temperature sensing unit 51, a TEC refrigerator 52, a TO cap 6, a parallel light beam 7, a signal input pin I81 and a signal input pin II 82.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments described below do not limit the contents of the invention recited in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.
Referring TO fig. 1 TO 6, the present embodiment provides a parallel light emitting transmitter TO-CAN package, including: the device comprises a TO base 1, a laser assembly 2 and a collimating lens assembly 3;
the laser assembly 2 is fixed on the TO base 1;
the collimating lens component 3 is coupled and arranged on the top of the light-emitting optical axis of the laser component 2 to ensure that the emergent light beam is a parallel light beam.
Wherein, it is required to be noted that: the collimating Lens assembly is a collimating Lens.
In order to further optimize the above solution, the laser assembly 2 comprises: a chip carrier 21 and a laser chip 22; the chip carrier 21 is fixed on the TO base 1; the laser chip 22 is fixed on the chip carrier 21; the collimating lens component 3 is coupled and arranged on the top of the light-emitting optical axis of the laser chip 22.
In order TO further optimize the technical scheme, the TO-CAN package of the transmitter for emitting the parallel light further comprises: transferring the cushion block 4; the switching cushion block 4 is fixed on the TO base 1; the chip carrier 21 and the collimating lens component 3 are both fixed on the switching cushion block 4; and the collimator lens assembly 3 is located on top of the chip carrier 21.
The laser chip is fixed at the designated position of the chip carrier in an eutectic mode and then connected with the switching cushion block through the chip carrier.
In order to further optimize the technical scheme, the switching cushion block 4 is of a convex structure; the chip carrier 21 and the collimating lens component 3 are both fixed on the plane of the adapting cushion block 4 perpendicular TO the TO base 1.
In order TO further optimize the technical scheme, the TO-CAN package of the transmitter for emitting the parallel light further comprises: a temperature control component 5; the temperature control assembly 5 includes: a temperature sensing unit 51, a TEC refrigerator 52, and a control unit; the temperature sensing unit 51 is fixed on the chip carrier 21 and used for sensing the temperature of the laser chip 22; the TEC refrigerator 52 is fixed on the TO base 1; the transfer cushion block 4 is fixed on the TEC refrigerator 52; the control unit is electrically connected with the temperature sensing unit 51 and the TEC refrigerator 52, respectively.
The temperature control component 5 is a thermistor; the thermistor is fixed on the position of the chip carrier close to the laser chip in an adhesion mode and then fixed with the switching cushion block through the chip carrier. The TEC refrigerator is fixed at the corresponding position of the TO base in an eutectic or adhesive mode, the bottom plane of the transfer cushion block is fixed with the TEC refrigerator in an adhesive mode, and then the chip carrier is connected with one surface, perpendicular TO the bottom plane, of the transfer cushion block in an adhesive mode.
In order to further optimize the above solution, the collimator lens assembly is actively coupled to the laser chip.
In order to further optimize the technical scheme, the type of the laser chip is any one of DFB, EML, FP, SOA + DFB or SOA + EML.
In order to further optimize the above technical solution, the fixing mode of the collimating lens assembly 3 is glue fixing or laser welding.
In order to further optimize the above technical solution, the input signal is a double-ended input signal or a single-ended input signal.
In order TO further optimize the technical scheme, the parallel light emergent emitter TO-CAN package further comprises a TO cap 6; the TO cap 6 is hermetically buckled on the TO base 1; the TO cap 6 is a flat window cap.
The invention discloses a transmitter TO-CAN packaging of parallel light emergent light.A laser chip is fixed on a chip carrier and is connected with an external circuit through a bound gold wire, and a collimating lens component at the top of the laser chip is coupled and fixed with the laser chip TO enable the emergent light of the collimating lens component TO be a parallel light beam; and a temperature sensing unit is arranged beside the laser chip to monitor the temperature of the laser chip and feed back to the TEC refrigerator in real time through an external circuit control unit to maintain the stability of the emission wavelength of the laser chip. The invention sets and couples the collimating lens component in front of the laser chip in the TO-CAN, so that the light output by the collimating lens component is parallel light, thereby solving the problems of light splitting and parallel light coupling of the optical device, realizing the requirement of miniaturization packaging of the optical device, greatly reducing the cost rate of transmitting the TO-CAN, and having great market popularization and application values.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A transmitter TO-CAN package for emitting parallel light, comprising: the device comprises a TO base (1), a laser assembly (2) and a collimating lens assembly (3);
the laser assembly (2) is fixed on the TO base (1);
the collimating lens component (3) is arranged at the top of the light-emitting optical axis of the laser component (2) in a coupling mode so as to ensure that the emergent light beam is a parallel light beam.
2. The parallel light exiting transmitter TO-CAN package of claim 1, wherein the laser package (2) comprises: a chip carrier (21) and a laser chip (22); the chip carrier (21) is fixed on the TO base (1); the laser chip (22) is fixed on the chip carrier (21); the collimating lens component (3) is arranged at the top of the light-emitting optical axis of the laser chip (22) in a coupling mode.
3. The parallel light exiting transmitter TO-CAN package of claim 2, further comprising: a transfer cushion block (4); the switching cushion block (4) is fixed on the TO base (1); the chip carrier (21) and the collimating lens assembly (3) are fixed on the switching cushion block (4); and the collimating lens assembly (3) is located at the top end of the chip carrier (21).
4. The TO-CAN package of the transmitter for emitting the parallel light is characterized in that the switching cushion block (4) is in a convex structure; the chip carrier (21) and the collimating lens assembly (3) are fixed on a plane perpendicular TO the switching cushion block (4) and the TO base (1).
5. The parallel light exiting transmitter TO-CAN package of any one of claims 3 or 4, further comprising: a temperature control component (5); the temperature control assembly (5) comprises: the temperature sensing unit (51), the TEC refrigerator (52) and the control unit;
the temperature sensing unit (51) is fixed on the chip carrier (21) and used for sensing the temperature of the laser chip (22);
the TEC refrigerator (52) is fixed on the TO base (1); the transfer cushion block (4) is fixed on the TEC refrigerator (52);
the control unit is respectively and electrically connected with the temperature sensing unit (51) and the TEC refrigerator (52).
6. The parallel light exiting transmitter TO-CAN package of claim 5, wherein the collimating lens assembly is actively coupled TO the laser chip.
7. The parallel light extracting transmitter TO-CAN package according TO claim 5, wherein the laser chip has any one of DFB, EML, FP, SOA + DFB or SOA + EML.
8. The parallel light-emitting emitter TO-CAN package according TO claim 5, wherein the collimating lens assembly (3) is fixed by glue or laser welding.
9. The parallel-light-emitting transmitter TO-CAN package of claim 5, wherein the input signal is a double-ended input signal or a single-ended input signal.
10. The parallel light-emitting transmitter TO-CAN package according TO claim 5, further comprising a TO cap (6); the TO cap (6) is hermetically buckled on the TO base (1); the TO cap (6) is a flat window cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111061292.6A CN113659425A (en) | 2021-09-10 | 2021-09-10 | Transmitter TO-CAN encapsulation of parallel light-emitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111061292.6A CN113659425A (en) | 2021-09-10 | 2021-09-10 | Transmitter TO-CAN encapsulation of parallel light-emitting |
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| Publication Number | Publication Date |
|---|---|
| CN113659425A true CN113659425A (en) | 2021-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111061292.6A Pending CN113659425A (en) | 2021-09-10 | 2021-09-10 | Transmitter TO-CAN encapsulation of parallel light-emitting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115000797A (en) * | 2022-05-11 | 2022-09-02 | 武汉光迅科技股份有限公司 | Laser and optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106877167A (en) * | 2017-03-30 | 2017-06-20 | 厦门市芯诺通讯科技有限公司 | A kind of directly modulation laser |
| CN211603627U (en) * | 2020-04-21 | 2020-09-29 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN213905817U (en) * | 2020-12-07 | 2021-08-06 | 深圳市广盛浩科技有限公司 | Parallel light-emitting TO-CAN packaging device |
| CN216390026U (en) * | 2021-09-10 | 2022-04-26 | 瑞泰(威海)电子科技有限公司 | Transmitter TO-CAN encapsulation of parallel light-emitting |
-
2021
- 2021-09-10 CN CN202111061292.6A patent/CN113659425A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106877167A (en) * | 2017-03-30 | 2017-06-20 | 厦门市芯诺通讯科技有限公司 | A kind of directly modulation laser |
| CN211603627U (en) * | 2020-04-21 | 2020-09-29 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN213905817U (en) * | 2020-12-07 | 2021-08-06 | 深圳市广盛浩科技有限公司 | Parallel light-emitting TO-CAN packaging device |
| CN216390026U (en) * | 2021-09-10 | 2022-04-26 | 瑞泰(威海)电子科技有限公司 | Transmitter TO-CAN encapsulation of parallel light-emitting |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115000797A (en) * | 2022-05-11 | 2022-09-02 | 武汉光迅科技股份有限公司 | Laser and optical module |
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