CN113523557B - Brand-new laser cutting process method for electronic paper - Google Patents
Brand-new laser cutting process method for electronic paper Download PDFInfo
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- CN113523557B CN113523557B CN202110779390.7A CN202110779390A CN113523557B CN 113523557 B CN113523557 B CN 113523557B CN 202110779390 A CN202110779390 A CN 202110779390A CN 113523557 B CN113523557 B CN 113523557B
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- laser cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a brand-new laser cutting process method for electronic paper, which comprises the following steps: a special-shaped laser cutting path method and a laser cutting line intersection point processing method; the method for the special-shaped laser cutting path comprises the following steps: integrating the cutting paths on the whole row or whole column into a continuous path; the intersection point processing method in the laser cutting line comprises the following steps: and respectively extending each line segment of the two intersected line segments to the outside of the intersection point. The novel laser cutting process replaces the traditional laser single grain product cutting route cutting mode, solves the problems of low cutting efficiency and large leftover material residue after cutting of the cutting mode, truly realizes the standard laser cutting route, has extremely high product edge yield after cutting, has no dispersion of residual leftover materials after cutting, and is clean, convenient and efficient. The working time is reduced, the yield is improved, the efficiency is improved, and the yield is improved.
Description
Technical Field
The invention relates to the technical field of electronic paper displays, in particular to a brand-new laser cutting process method for electronic paper.
Background
In the production of electronic paper, the following technical problems still exist in the laser cutting process of electronic paper:
(1) The traditional laser cutting process is divided into two types, one type is that a single product is cut on a raw material in an array mode, the products are not connected with each other, the problem that the edge materials of the cut product are scattered is solved, but the problem that the cross line focal position of the edge of the cut product is easy to sinter and fail is solved.
(2) Simultaneously, between above-mentioned two kinds of laser cutting processes not only have different influences on rim charge and laser cutting effect, because scattered problem of material behind the laser cutting has increased the clean number of times of operation platform, if clean in time, also have very big influence to the cleanliness factor of product to influence the ultimate yield of product to a certain extent, and the loss of raw and other materials also can follow the increase.
Disclosure of Invention
In order to solve the technical problems provided by the background art, the invention provides a brand-new laser cutting process method for electronic paper, which is a brand-new laser cutting process, replaces the traditional laser single-particle product cutting route cutting mode, solves the problems of low cutting efficiency and large leftover material residue after cutting in the cutting mode, truly realizes the standardization of the laser cutting route, has extremely high product edge yield after cutting, does not disperse residual leftover materials after cutting, and is clean, convenient and efficient. The working time is reduced, the yield is improved, the efficiency is improved, and the yield is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a laser cutting process method for electronic paper comprises the following steps: a special-shaped laser cutting path method and a laser cutting line intersection point processing method;
the method for the special-shaped laser cutting path comprises the following steps: integrating the cutting paths on the whole row or the whole column into a continuous path;
the intersection point processing method in the laser cutting line comprises the following steps: and respectively extending each line segment of the two intersected line segments to the outside of the intersection point.
Further, the method also comprises the following product cutting arrangement specifications: and making 180-degree rotation dislocation arrangement requirements between rows or columns on the asymmetric products, and combining cutting paths of the whole row or column.
Further, in the method for cutting the special-shaped laser path, whether the whole row or the whole column is integrated is selected, the typesetting of the product is needed to be checked, if the row in the typesetting is longer than the column, the whole row is selected to be integrated, and if the column in the typesetting is longer than the row, the whole column is selected to be integrated.
Further, in the special-shaped laser cutting path method, the integrated path may include a straight line and an arc line.
Furthermore, in the method for processing the intersection point in the laser cutting line, each line segment of the two intersected line segments is respectively extended to be 0.3-0.5mm outside the intersection point.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a brand new laser cutting process method for electronic paper, which is a brand new laser cutting process, replaces the traditional laser single-particle product cutting route cutting mode, solves the problems of low cutting efficiency and large leftover material residue after cutting of the cutting mode, truly realizes the laser cutting route specification, has extremely high edge yield of the cut product, does not disperse the residual leftover material after cutting, and is clean, convenient and efficient. The working time is reduced, the yield is improved, the efficiency is improved, and the yield is improved.
Drawings
FIG. 1 is a schematic diagram of a laser cutting process for electronic paper according to the present invention;
FIG. 2 is a schematic diagram of the layout of the product according to the present invention;
in the figure: 1-integrating the cutting paths on the whole row or the whole column into a continuous path 2-respectively extending each line segment of the two intersected line segments to the outside of the intersection point 3-the electronic paper product.
Detailed Description
The following detailed description of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1, a laser cutting process method for electronic paper includes: a special-shaped laser cutting path method and a laser cutting line intersection point processing method;
the method for the special-shaped laser cutting path comprises the following steps: integrating the cutting paths on the whole row or whole column into a continuous path 1; the integrated path may include straight lines and arcs. In the method for cutting the special-shaped laser path, the whole row or the whole column is selected to be integrated, the typesetting of the product 3 is needed to be checked, the whole row is selected to be integrated if the row in the typesetting is longer than the column, and the whole column is selected to be integrated if the column in the typesetting is longer than the row.
The intersection point processing method in the laser cutting line comprises the following steps: respectively extending each line segment of the two intersected line segments to the outside of the intersection 2; each line segment of the two intersected line segments is respectively extended to 0.3-0.5mm outside the intersection point. The method solves the problem of intersection point sintering height caused by hardware factors of the laser cutting equipment, so that the product 3 is poor, the laser cutting sintering height at the intersection point reaches the inspection standard, and the product percent of pass is increased.
As shown in fig. 2, the product cutting arrangement specification is also included: and making 180-degree rotation dislocation arrangement requirements between rows or columns of the asymmetric products 3, and combining cutting paths of the whole row or column.
The invention is a brand new laser cutting process, replaces the traditional laser single grain product cutting route cutting mode, solves the problems of low cutting efficiency and large leftover material residue after cutting in the cutting mode, truly realizes the standard laser cutting route, has extremely high product edge yield after cutting, does not disperse the residual leftover material after cutting, and is clean, convenient and efficient. The working time is reduced, the yield is improved, the efficiency is improved, and the yield is improved.
The above embodiments are implemented on the premise of the technical solution of the present invention, and detailed embodiments and specific operation procedures are given, but the scope of the present invention is not limited to the above embodiments. The methods used in the above examples are conventional methods unless otherwise specified.
Claims (3)
1. A laser cutting process method for electronic paper is characterized by comprising the following steps: a special-shaped laser cutting path method and a laser cutting line intersection point processing method;
the method for the special-shaped laser cutting path comprises the following steps: integrating the cutting paths on the whole row or whole column into a continuous path;
the intersection point processing method in the laser cutting line comprises the following steps: respectively extending each line segment of the two intersected line segments to the outside of the intersection point;
still include the product cutting standard of arranging: making 180-degree rotation dislocation arrangement requirements between rows or columns on the asymmetric products, and combining cutting paths of the whole row or column;
in the intersection point processing method in the laser cutting line, each line segment of two intersected line segments is respectively extended to 0.3-0.5mm outside the intersection point.
2. The laser cutting process for electronic paper as claimed in claim 1, wherein in the method for laser cutting path with special shape, the selection of whether to integrate the whole row or the whole column requires to see the typesetting of the product, the selection of integrating the whole row is made if the row in the typesetting is longer than the column, and the selection of integrating the whole column is made if the column in the typesetting is longer than the row.
3. The laser cutting process method for electronic paper according to claim 1, wherein in the method for laser cutting a special-shaped path, the integrated path includes a straight line and an arc line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110779390.7A CN113523557B (en) | 2021-07-09 | 2021-07-09 | Brand-new laser cutting process method for electronic paper |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110779390.7A CN113523557B (en) | 2021-07-09 | 2021-07-09 | Brand-new laser cutting process method for electronic paper |
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| Publication Number | Publication Date |
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| CN113523557A CN113523557A (en) | 2021-10-22 |
| CN113523557B true CN113523557B (en) | 2023-04-14 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115255560B (en) * | 2022-07-28 | 2024-04-26 | 湖南中联重科履带起重机有限公司 | Plate cutting method |
| CN115351438B (en) * | 2022-10-20 | 2022-12-20 | 佛山市澳亚机电有限公司 | Laser striping process and laser striping device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101284332A (en) * | 2007-04-11 | 2008-10-15 | 陈锡富 | Electronic paper laser cutting process |
| CN101774057B (en) * | 2010-03-17 | 2011-12-28 | 昆山工研院工业机器人研究所有限公司 | Method and device for planning cutting track for cutting workpiece by flame three cutting torch device |
| CN104625435B (en) * | 2015-01-23 | 2017-04-19 | 大族激光科技产业集团股份有限公司 | Laser flight cutting method and system |
| CN105537781B (en) * | 2016-03-15 | 2017-04-12 | 深圳市创鑫激光股份有限公司 | Method and device for achieving quick cutting of laser cutting device |
| CN206316556U (en) * | 2016-12-05 | 2017-07-11 | 烟台正海科技股份有限公司 | A kind of radium-shine map file of touch-screen |
| CN109702357A (en) * | 2019-01-29 | 2019-05-03 | 大族激光科技产业集团股份有限公司 | A kind of laser processing disk method and system |
| CN111884442A (en) * | 2020-08-19 | 2020-11-03 | 苏州英磁新能源科技有限公司 | Wedge-shaped iron core integral cutting tool and method |
| CN112876058B (en) * | 2021-01-15 | 2022-10-11 | 厦门天马微电子有限公司 | Cutting method of special-shaped display panel and special-shaped display panel |
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