CN113518516A - Manufacturing process of flexible circuit board - Google Patents
Manufacturing process of flexible circuit board Download PDFInfo
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- CN113518516A CN113518516A CN202110339931.4A CN202110339931A CN113518516A CN 113518516 A CN113518516 A CN 113518516A CN 202110339931 A CN202110339931 A CN 202110339931A CN 113518516 A CN113518516 A CN 113518516A
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- flexible circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000009713 electroplating Methods 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 9
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000004381 surface treatment Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 23
- 239000003607 modifier Substances 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 21
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- 230000004913 activation Effects 0.000 claims description 20
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- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000012190 activator Substances 0.000 claims description 13
- 229910052763 palladium Inorganic materials 0.000 claims description 13
- 238000005406 washing Methods 0.000 claims description 12
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- 239000002245 particle Substances 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
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- 238000004140 cleaning Methods 0.000 claims description 5
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- 230000035484 reaction time Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- RKMNQXFECVRTNI-UHFFFAOYSA-N 1-methylcyclohexa-2,4-dien-1-ol Chemical compound CC1(O)CC=CC=C1 RKMNQXFECVRTNI-UHFFFAOYSA-N 0.000 description 8
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 8
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 8
- -1 benzotriazole-2-thiophenol Chemical compound 0.000 description 8
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 8
- 229960001124 trientine Drugs 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
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- 238000005516 engineering process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 4
- 239000013543 active substance Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000003636 chemical group Chemical group 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- IYRGXJIJGHOCFS-UHFFFAOYSA-N neocuproine Chemical compound C1=C(C)N=C2C3=NC(C)=CC=C3C=CC2=C1 IYRGXJIJGHOCFS-UHFFFAOYSA-N 0.000 description 4
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
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- 230000000536 complexating effect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
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- 230000007613 environmental effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
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- 230000033228 biological regulation Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing process of a flexible circuit board, which belongs to the field of circuit boards and specifically comprises the steps of manufacturing a double-sided board by adopting a polyimide film, drilling a hole on the double-sided board to metalize the hole, then electroplating on the metalized hole to conduct the hole, and then sequentially carrying out circuit manufacturing, etching, surface mounting, pressing, resistance welding manufacturing, character printing and surface treatment to obtain the double-sided flexible circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing process of a flexible circuit board.
Background
In the traditional double-sided flexible circuit board production process, black hole process treatment is required before electroplating. The black hole process specifically comprises the following steps: the fine carbon powder particles are coated on the hole wall in a dipping way to form a conductive layer by utilizing the conductivity of carbon, so that the conductive layer plays a role in initial conduction for subsequent electroplating, but the production line in the production method has longer flow, higher investment cost, long production time, lower production efficiency and high material consumption, so that the production cost is higher and the environmental protection property is poorer, and therefore, a novel preparation process needs to be developed.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art and provides a manufacturing process of a flexible circuit board.
The technical solution of the invention is as follows:
a technology for manufacturing flexible circuit board includes such steps as making dual-surface board with polyimide film, drilling holes on dual-surface board, metallizing, electroplating, making holes, and sequentially making circuit, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
Preferably, the specific process for metallizing the holes is: modifying the drilled double-sided board to polarize the surface of the double-sided board, cleaning the double-sided board, putting the double-sided board into a regulator for pre-soaking for 8-12s, putting the double-sided board into an activator solution for activation after the pre-soaking is finished, so that a layer of uniform catalytic substance is obtained on the surface of the hole wall, and washing, accelerating, washing and copper deposition are carried out in sequence after the activation is finished.
The function of the pre-impregnation is to protect the activator solution, on the one hand from the subsequent hydrolysis of the tin-palladium colloidal activator, and on the other hand to balance the acidity and specific gravity of the activator solution.
Preferably, the specific process for polarizing the surface of the double-sided board is to put the double-sided board into the PI modifier for reaction at 50-60 ℃ for 80-140 s. Wherein the PI modifier is a surfactant containing a phenol group and/or an amine group.
Since the PI surface modifier contains a large amount of chemical groups of phenolic groups and amines, the PI surface modifier shows strong affinity to a PI substrate through hydrophobic interaction, hydrogen bonds and coordination bonds. The phenol group and the amino group have high affinity and complexing ability to palladium and copper atoms, and the adsorbed palladium is tightly combined on the base material through the modified intermediate bonding layer and can generate more stable and stronger adhesive force with the subsequent deposited chemical copper metal. After modification, Plasma physical modification and chemical modification of PI regulator can be replaced, and the running cost and the labor cost are reduced.
On the other hand, the surface modifier has a coupling bridging component, can couple the chemical copper metal with the organic matter modified by the base material, and the bridging layer fills the vacancy of the chemical groups in the bonding layer, increases the coverage of the deposited copper and strengthens the bonding capability.
Preferably, the regulator is a mixed solution of sulfuric acid, salt and an antioxidant ingredient.
Preferably, the activator solution is a tin-palladium colloidal activator, wherein the colloidal particle size is 50-100 nm.
Preferably, the activation temperature is 30-45 ℃, and the activation time is 25-35 s.
Preferably, the speed-up specific process is as follows: and (3) continuously activating the washed double-sided board in an activator solution for 8-12s at the activation temperature of 20-30 ℃, and enabling the catalytic substance to be in an optimal state through the treatment.
The invention relates to the following principle: refer to fig. 1.
The invention has at least one of the following beneficial effects:
(1) according to the manufacturing process of the flexible circuit board, the traditional black hole process is improved into the PI metallized hole process, the production process is optimized, a large number of devices are reduced, the production process is short, and compared with the traditional process, the manufacturing process has the advantages that the energy is saved, the consumption is reduced, the production materials are saved, and the environmental protection pressure is relieved.
(2) The invention relates to a manufacturing process of a flexible circuit board, which is characterized in that the traditional PI black hole process uses a plasma dry process to carry out functional treatment such as degumming, coarsening (physical etching) and surface modification (physical modification), a PI regulator (a main component potassium hydroxide KOH) is soaked before oil removal and hole finishing to carry out PI surface chemical etching and modification, and then a chemical copper process similar to a PCB is adopted to be applied and copper metal is deposited on the PI surface.
The invention effectively solves the problems of high cost and capacity limitation of the black hole process, enhances the function of surface chemical modification of PI, realizes the dual functions of replacing plasma treatment and PI regulation solution soaking in the traditional mode by the PI surface modifier, and simplifies the process flow.
(3) According to the manufacturing process of the flexible circuit board, the PI modifier is adopted to carry out polarization treatment on the double-sided board, and the PI modifier contains a large number of chemical groups of phenyl, phenolic groups and amine, so that strong affinity is shown for a PI substrate through hydrophobic interaction, hydrogen bonds and coordination bonds. The phenol group and the amino group have high affinity and complexing ability to palladium and copper atoms, and the adsorbed palladium is tightly combined on the base material through the modified intermediate bonding layer and can generate more stable and stronger adhesive force with the subsequent deposited chemical copper metal.
Drawings
Fig. 1 is a schematic diagram of the principles involved in the present invention.
Detailed Description
The technical solution of the present invention is further explained below in terms of specific embodiments.
The PI is a polyimide film.
Example 1
A technology for manufacturing flexible circuit board includes such steps as making dual-surface board with polyimide film, drilling holes on dual-surface board, metallizing, electroplating, making holes, and sequentially making circuit, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
The specific process for metallizing the holes comprises the following steps: putting the double-sided board into a PI modifier for reaction at 50 ℃ for 120s, polarizing the surface of the double-sided board, cleaning the double-sided board, putting the double-sided board into a regulator for pre-soaking for 8s, putting the double-sided board into an activator solution for activation at 30 ℃ for 30s after the pre-soaking is finished, washing, accelerating, washing and depositing copper in sequence after the activation is finished, and then entering the next electroplating process.
Specifically, the PI modifier is a mixed solution of triethylene tetramine and 1-methylphenol, and the addition concentration of the triethylene tetramine and the 1-methylphenol is 10 wt%.
The regulator is: 5g/L of sulfuric acid, 0.012g/L of sodium persulfate, 0.13g/L of benzotriazole-2-thiophenol and the balance of distilled water;
the active agent solution is: 0.05g/L of palladium sulfate, 3.5g/L of tin sulfate, 8g/L of sulfuric acid, 0.012g/L of sodium persulfate, 0.012g/L of 2, 9-dimethyl phenanthroline and 0.12g/L of benzodiazole-2-thiophenol; the balance of distilled water, and the colloid particle size is 50 nm.
Example 2
A technology for manufacturing flexible circuit board includes such steps as making dual-surface board with polyimide film, drilling holes on dual-surface board, metallizing, electroplating, making holes, and sequentially making circuit, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
The specific process for metallizing the holes comprises the following steps: putting the double-sided board into a PI modifier for reaction at 50 ℃ for 120s, polarizing the surface of the double-sided board, cleaning the double-sided board, putting the double-sided board into a regulator for pre-soaking for 10s, putting the double-sided board into an activator solution for activation at 30 ℃ for 30s after the pre-soaking is finished, washing, accelerating, washing and depositing copper in sequence after the activation is finished, and then entering the next electroplating process.
Specifically, the PI modifier is a mixed solution of triethylene tetramine and 1-methylphenol, and the addition concentration of the triethylene tetramine and the 1-methylphenol is 10 wt%.
The regulator is: 5g/L of sulfuric acid, 0.012g/L of sodium persulfate and 0.13g/L of benzodiazole-2-thiophenol;
the active agent solution is: 0.05g/L of palladium sulfate, 3.5g/L of tin sulfate, 8g/L of sulfuric acid, 0.012g/L of sodium persulfate, 0.012g/L of 2, 9-dimethyl phenanthroline and 0.12g/L of benzodiazole-2-thiophenol; the balance of distilled water, and the colloid particle size is 50 nm.
Example 3
A technology for manufacturing flexible circuit board includes such steps as making dual-surface board with polyimide film, drilling holes on dual-surface board, metallizing, electroplating, making holes, and sequentially making circuit, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
The specific process for metallizing the holes comprises the following steps: putting the double-sided board into a PI modifier for reaction at the temperature of 60 ℃ for 130s, polarizing the surface of the double-sided board, cleaning the double-sided board, putting the double-sided board into a regulator for presoaking for 12s, putting the double-sided board into an activator solution for activation at the temperature of 35 ℃ for 35s after presoaking, washing, accelerating, washing and depositing copper in sequence after activation, and then entering the next electroplating process.
Specifically, the PI modifier is a mixed solution of triethylene tetramine and 1-methylphenol, and the addition concentration of the triethylene tetramine and the 1-methylphenol is 10 wt%.
The regulator is: 5g/L of sulfuric acid, 0.012g/L of sodium persulfate and 0.13g/L of benzodiazole-2-thiophenol;
the active agent solution is: 0.05g/L of palladium sulfate, 3.5g/L of tin sulfate, 8g/L of sulfuric acid, 0.012g/L of sodium persulfate, 0.012g/L of 2, 9-dimethyl phenanthroline and 0.12g/L of benzodiazole-2-thiophenol; the balance of distilled water, and the colloid particle size is 50 nm.
Example 4
In this example, a variation is made on the basis of example 2, specifically, a mixed solution of triethylene tetramine and 1-methylphenol is used as the PI modifier, and the addition concentration of both is 20 wt%.
Example 5
In this example, a variation is made on the basis of example 2, specifically, a mixed solution of triethylene tetramine and 1-methylphenol is used as the PI modifier, and the added concentrations of the two are both 30 wt%.
Comparative example 1
A process for preparing flexible circuit board includes such steps as preparing dual-surface plate from polyimide film, drilling holes on said dual-surface plate, immersing the dual-surface plate in 20 wt% KOH solution, immersing it in carbon powder particles to form a conducting layer, electroplating on the metallized holes to make them be communicated, and sequentially preparing flexible circuit board by circuit making, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
Comparative example 2 (without PI modifier)
A technology for manufacturing flexible circuit board includes such steps as making dual-surface board with polyimide film, drilling holes on dual-surface board, metallizing, electroplating, making holes, and sequentially making circuit, etching, sticking, pressing, resistance welding, printing characters and surface treatment.
The specific process for metallizing the holes comprises the following steps: and (2) placing the double-sided board into a regulator for pre-soaking for 10s, placing the double-sided board into an activating agent solution for activation after the pre-soaking is finished, wherein the activation temperature is 30 ℃, the activation time is 30s, and after the activation is finished, sequentially washing, accelerating, washing and depositing copper, and then entering the next electroplating process.
The specific regulator is: 5g/L of sulfuric acid, 0.012g/L of sodium persulfate and 0.13g/L of benzodiazole-2-thiophenol;
the active agent solution is: 0.05g/L of palladium sulfate, 3.5g/L of tin sulfate, 8g/L of sulfuric acid, 0.012g/L of sodium persulfate, 0.012g/L of 2, 9-dimethyl phenanthroline and 0.12g/L of benzodiazole-2-thiophenol; the balance of distilled water, and the colloid particle size is 50 nm.
The following tests were conducted on the above examples and comparative examples. The adhesion between copper and the double-sided board is tested, and the test values are shown in table 1.
The adhesion test method comprises the following steps: and (3) forcibly scratching a plurality of parallel lines with the distance of 2mm on the plated part by using a hard scratching knife in a lattice shape, and ensuring that the cutting edge of the scratching knife is scratched below the base metal. The adhesive tape is tightly attached to the fracture, then the tearing is carried out, the repetition time is 20 times, the ratio (%) of the falling area of the grid drawing area is larger, and the surface adhesive force is poorer.
TABLE 1 test results of examples and comparative examples
| Test specimen | Adhesion (%) |
| Example 1 | 1 |
| Example 2 | 2 |
| Example 3 | 2 |
| Example 4 | 1 |
| Example 5 | 2 |
| Comparative example 1 | 4 |
| Comparative example 2 | 7 |
The analysis of comparative example 2 shows that the PI modifier is adopted to carry out polarization treatment on the double-sided board, and the PI modifier contains a large amount of chemical groups of phenyl, phenolic group and amine, and shows strong affinity to the PI substrate through hydrophobic interaction, hydrogen bond and coordination bond. The phenol group and the amino group have high affinity and complexing ability to palladium and copper atoms, and the adsorbed palladium is tightly combined on the PI base material through the modified intermediate bonding layer, so that more stable and stronger adhesive force can be generated with the subsequent deposited chemical copper metal.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
In the description of the embodiments of the present invention, it should be understood that "-" and "-" indicate the same range of two numerical values, and the range includes the endpoints. For example: "A-B" means a range of greater than or equal to A and less than or equal to B. "A to B" means a range of not less than A and not more than B.
In the description of the embodiments of the present invention, the term "and/or" herein is only one kind of association relationship describing an associated object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The above description is only a preferred embodiment of the present invention, and the technical solutions that achieve the objects of the present invention by basically the same means are all within the protection scope of the present invention.
Claims (7)
1. A manufacturing process of a flexible circuit board is characterized in that: the method comprises the steps of manufacturing a double-sided board by using a polyimide film, drilling a hole on the double-sided board to metalize the hole, electroplating the metalized hole to conduct the hole, and continuously performing circuit manufacturing, etching, surface mounting, pressing, solder resisting manufacturing, character printing and surface treatment in sequence to obtain the double-sided flexible circuit board.
2. The manufacturing process of the flexible circuit board according to claim 1, characterized in that: the specific process for metallizing the holes comprises: modifying the drilled double-sided board to polarize the surface of the double-sided board, cleaning the double-sided board, putting the double-sided board into a regulator for pre-soaking for 8-12s, putting the double-sided board into an activator solution for activation after the pre-soaking is finished, and sequentially washing, accelerating, washing and depositing copper after the activation is finished.
3. The manufacturing process of the flexible circuit board according to claim 2, characterized in that: the specific process for polarizing the surfaces of the double-sided boards comprises the steps of putting the double-sided boards into a PI modifier for reaction, wherein the reaction temperature is 50-60 ℃, and the reaction time is 80-140 s;
the PI modifier is a surfactant containing a phenol group and/or an amine group.
4. The manufacturing process of the flexible circuit board according to claim 2, characterized in that: the regulator is a mixed solution of sulfuric acid, salt and antioxidant components.
5. The manufacturing process of the flexible circuit board according to claim 2, characterized in that: the activator solution is a tin-palladium colloid activator, wherein the colloid particle size is 50-100 nm.
6. The manufacturing process of the flexible circuit board according to claim 2, characterized in that: the activation temperature is 30-45 ℃, and the activation time is 25-35 s.
7. The manufacturing process of the flexible circuit board according to claim 2, characterized in that: the speed-up specific process comprises the following steps: and (3) continuously activating the washed double-sided board in an activating agent solution for 8-12s at the activation temperature of 20-30 ℃.
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| CN202110339931.4A CN113518516A (en) | 2021-03-30 | 2021-03-30 | Manufacturing process of flexible circuit board |
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