CN113477803B - Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board - Google Patents
Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board Download PDFInfo
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- CN113477803B CN113477803B CN202110750784.XA CN202110750784A CN113477803B CN 113477803 B CN113477803 B CN 113477803B CN 202110750784 A CN202110750784 A CN 202110750784A CN 113477803 B CN113477803 B CN 113477803B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D13/00—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form
- B21D13/02—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form by pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
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- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The embodiment of the application belongs to the technical field of precision imprinting line processing, and relates to an imprinting line processing die of a steel reinforcing sheet for a 5G chip circuit board, which comprises a first die and a second die, wherein the first die comprises a first body, the first die is a first punch with a stamping surface, and the stamping surface is a smooth plane provided with a first rib; the first ribbing forms a pattern of a line to be imprinted on the stamping surface, and the section of the first ribbing is rectangular; the second die comprises a second body, the second body is a second punch with a stamping surface, and the stamping surface is a smooth plane provided with a second rib pressing; the second ribbing forms a pattern of a required imprinting line on the stamping surface, and the section of the second ribbing is trapezoidal; the second rib pressing height is greater than the first rib pressing height. This application scheme is through designing two moulds, and one of them mould sets up the cross-section and is the first ribbing of rectangle, and another mould sets up the cross-section and is trapezoidal second ribbing, has solved the problem that can only use laser seal or etching process when accurate seal line processing.
Description
Technical Field
The application relates to the technical field of precise marking line processing, in particular to a marking line processing die and a technology of a steel reinforcing sheet for a 5G chip circuit board 。
Background
On the steel reinforcing sheet for the 5G chip circuit board, the processing of the marking line is mainly realized by a laser marking process and an etching process. In addition, a similar process for precision imprint lines is stamping. Compared with the stamping process, the laser engraving process and the etching process have lower forming efficiency and the stamping process has the highest forming efficiency. However, because the size of the punch of the die used in the precision marking line processing technology is very small, and the die is very easy to break and damage in the traditional stamping technology, a new die and related technology are urgently needed to ensure the precision marking line processing efficiency.
Disclosure of Invention
The embodiment of the application aims to provide an engraving line processing die and an engraving line processing technology of a steel reinforcing sheet for a 5G chip circuit board, so that the engraving line of the steel reinforcing sheet for the 5G chip circuit board can be processed efficiently.
In order to solve the technical problem, an embodiment of the application provides an imprint line processing mold for a steel reinforcing sheet for a 5G chip circuit board, which adopts the following technical scheme:
the mold comprises a first mold and a second mold, wherein
The first die comprises a first body, a second body and a third body, wherein the first body is a punch with a stamping surface, and the stamping surface is a smooth plane provided with a first pressing rib;
the first ribbing forms a pattern of a required imprinting line on the stamping surface, and the section of the first ribbing is rectangular;
the second die comprises a second body which is a punch with a stamping surface, and the stamping surface is a smooth plane provided with a second pressing rib;
the second ribbing forms a pattern of a line to be imprinted on the stamping surface, and the section of the second ribbing is trapezoidal;
the second rib pressing height is larger than the first rib pressing height.
Furthermore, the width of the first ribbing section is 0.05-0.15mm, and the height of the first ribbing section is 0.01-0.02mm.
Furthermore, the cross section of the second rib pressing is that the width of the lower bottom of the second rib pressing is 0.05-0.15mm, the width of the upper bottom is 0.025-0.075mm, the width of the upper bottom is smaller than that of the lower bottom, and the height of the second rib pressing is 0.03-0.05mm.
In order to solve the above technical problems, an embodiment of the present application provides a process for processing an imprint line of a steel reinforcing sheet for a 5G chip circuit board, which adopts the following technical scheme:
the process is based on the mold and comprises the following steps:
punching, namely punching positioning holes on the steel belt to obtain the steel belt with the positioning holes;
cutting edges at a time, and cutting a first outer contour of the steel reinforcing sheet on the steel belt;
secondary trimming, namely cutting a second outer contour of the steel reinforcing sheet on the steel belt; the second outer contour and the first outer contour constitute the basic shape of the steel reinforcing sheet; after the secondary trimming, the steel reinforcing sheet and the steel belt are provided with at least two connecting points;
a primary pressing line, wherein the first die is used for stamping the imprinting line for the first time to obtain a steel reinforcing sheet printed with the imprinting line to be modified;
and pressing the line for the second time, and performing secondary stamping line stamping through the second die to obtain the steel reinforcing sheet printed with the complete stamping line.
Further, after the step of secondary line pressing, the method also comprises the following steps:
and bending, namely bending the steel reinforcing sheet printed with the complete imprinting line.
Further, after the step of bending, the method further comprises the steps of:
and blanking, namely cutting off all connecting points of the steel reinforcing sheet and the steel belt to obtain a finished product of the steel reinforcing sheet.
Further, before the step of bending, the method further comprises the steps of:
and detecting, namely detecting the steel reinforcing sheet printed with the complete imprinting line, wherein the detection comprises width detection and depth detection of the imprinting line.
Compared with the prior art, the embodiment of the application mainly has the following beneficial effects:
according to the scheme, the problem that only laser engraving or etching technology can be used during precision engraving line machining is solved by designing two dies, wherein a first embossing rib with a rectangular cross section is arranged on a punch of one die, a second embossing rib with a trapezoidal cross section is arranged on a punch of the other die, and the engraving lines with the line width of 0.05-0.15mm and the depth of 0.03-0.05mm are used for machining the steel reinforcing sheet for the 5G chip circuit board in a matched mode. Meanwhile, the problem that the rib of the die is easy to collapse is solved, the actually measured processing times of the die reaches about 10 ten thousand times or even higher, the die is damaged after about 1000 times by using a common die, if the depth of the marking line exceeds 0.02mm, and if the depth of the marking line is lower than 0.02mm, the marking line is fuzzy and cannot meet the requirements of workpieces.
Drawings
In order to more clearly illustrate the solution of the present application, the drawings needed for describing the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
FIG. 1 is a schematic structural diagram of a first mold in a processing mold of a steel reinforcing sheet imprinting line for a 5G chip circuit board according to the present application;
FIG. 2 is a schematic structural view of a second mold in the imprint line processing mold for the steel reinforcing sheet for the 5G chip circuit board of the present application;
fig. 3 is a process flow diagram of the steel reinforcing sheet imprinting line for a 5G chip circuit board according to the present application.
Description of reference numerals: 1-first mould, 11-first ribbing, 2-second mould, 21-second ribbing.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the foregoing drawings are used for distinguishing between different objects and not for describing a particular sequential order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
Referring to fig. 1, the application embodiment provides an imprint line processing die of a steel reinforcing sheet for a 5G chip circuit board, comprising a first die 1 and a second die 2, wherein the die comprises a first die and a second die
The first die 1 comprises a first body which is a punch with a stamping surface, and the stamping surface is a smooth plane provided with a first rib 11;
the first ribbing 11 forms a pattern of a required imprinting line on the stamping surface, and the section of the first ribbing 11 is rectangular;
the second die 2 includes a second body which is a punch having a punching surface which is a smooth plane provided with the second beads 21;
the second ribbing 21 forms a pattern of a required imprinting line on the stamping surface, and the section of the second ribbing 21 is trapezoidal;
the height of the second beads 21 is greater than the height of the first beads 11.
Preferably, the width of the cross section of the first ribbing 11 is 0.05-0.15mm, and the height thereof is 0.01-0.02mm.
Preferably, the cross section of the second ribbing 21 is that the width of the lower bottom is 0.05-0.15mm, the width of the upper bottom is 0.025-0.075mm, the width of the upper bottom is smaller than that of the lower bottom, and the height is 0.03-0.05mm.
In this embodiment, the pattern of the imprinting line may be any predetermined pattern, such as an arrow shape shown in fig. one. The first die 1 and the second die 2 are a set of stamping dies which are matched with each other for use and are used for stamping the imprinting lines with the line width of 0.05-0.15mm and the depth of 0.03-0.05mm. Because the imprinting line is very small, in the embodiment, by designing two molds, the rib pressing height designed by the first mold 1 is lower than the depth of the imprinting line, and the rib pressing height of the second mold 2 is consistent with the depth of the imprinting line. That is to say, accomplish the seal line through the secondary mould punching and print, first ribbing 11 is used as first punching press process, and the punching press goes out semi-manufactured goods seal line, and second ribbing 21 is used as the second punching press process, and the finished product seal line is gone out in the punching press, finally reaches the effect of making the accurate seal line through stamping process, has solved the preparation accurate seal line because the ribbing easily collapses, can only lead to the lower technical problem of production efficiency through etching or laser seal. For example, an imprinting line with a line width of 0.10mm and a depth of 0.04mm needs to be manufactured, and the width of the cross section of the first ribbing 11 can be set to be 0.1mm, and the height of the cross section can be set to be 0.02mm; setting the width of the lower bottom of the section of the second rib 21 to be 0.1mm, the width of the upper bottom to be 0.05mm and the height of the section to be 0.04mm; when the stamping and engraving machine is used, the depth of the first stamping and engraving line is 0.02mm, the depth of the second stamping and engraving line is 0.04mm, and the engraving line width is 0.1mm. For another example, in another embodiment, an imprinting line with a line width of 0.05mm and a depth of 0.03mm needs to be manufactured, and the cross-sectional width of the first bead 11 may be set to 0.05mm and the cross-sectional height may be set to 0.18mm; setting the width of the lower bottom of the section of the second rib 21 to be 0.05mm, the width of the upper bottom to be 0.025mm and the height of the section to be 0.03mm; when the stamping and engraving machine is used, the depth of the first stamping and engraving line is 0.18mm, the depth of the second stamping and engraving line is 0.03mm, and the engraving line width is 0.05mm.
Referring to fig. 2, an application embodiment further provides a process for processing a steel reinforcing sheet imprinting line for a 5G chip circuit board, where based on the first mold 1 and the second mold 2, the process includes the steps of:
punching, namely punching positioning holes on the steel belt to obtain the steel belt with the positioning holes;
cutting edges once, and cutting a first outer contour of the steel reinforcing sheet on the steel belt;
secondary trimming, namely cutting a second outer contour of the steel reinforcing sheet on the steel belt; the second outer contour and the first outer contour constitute the basic shape of the steel reinforcing sheet; after the secondary trimming, the steel reinforcing sheet is also provided with at least two connecting points with the steel belt;
a primary pressing line, wherein the first die 1 is used for stamping the primary imprinting line to obtain a steel reinforcing sheet printed with the imprinting line to be modified;
and pressing the line for the second time, and performing secondary stamping line stamping through the second die 2 to obtain the steel reinforcing sheet printed with the complete stamping line.
In this embodiment, the positioning hole refers to a positioning hole having a precision of 0.001mm or more. During secondary edge cutting, at least two connecting points of the steel reinforcing sheet and the steel strip are kept, so that the steel reinforcing sheet can be still stably connected with the steel strip, and subsequent automatic treatment of the steel strip, such as stamping, bending, detection and the like, is facilitated.
In one embodiment, after the step of secondary line pressing, the method further comprises the steps of:
and bending, namely bending the steel reinforcing sheet printed with the complete imprinting line.
In one embodiment, after the bending step, the method further comprises the steps of:
and blanking, namely cutting off all connecting points of the steel reinforcing sheet and the steel belt to obtain a finished product of the steel reinforcing sheet.
In one embodiment, before the bending step, the method further includes the steps of:
and detecting, namely detecting the steel reinforcing sheet printed with the complete imprinting line, wherein the detection comprises width detection and depth detection of the imprinting line. Whether cracks occur in the first pressing rib 11 and the second pressing rib 21 can also be detected regularly to give early warning, so that the phenomenon that the mold is damaged and is continuously used to generate waste products is avoided.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields, and all the equivalent structures are within the protection scope of the present application.
Claims (4)
1. A process for preparing the steel reinforcing plate used for 5G chip circuit board includes such steps as preparing the die for preparing the steel reinforcing plate used for 5G chip circuit board
The first die comprises a first body, a second body and a third body, wherein the first body is a first punch head with a stamping surface, and the stamping surface is a smooth plane provided with a first rib;
the first ribbing forms a pattern of a required imprinting line on the stamping surface, and the section of the first ribbing is rectangular;
the second die comprises a second body, a second punch and a second pressing rib, wherein the second punch is provided with a stamping surface which is a smooth plane provided with a second pressing rib;
the second ribbing forms a pattern of a line to be imprinted on the stamping surface, and the section of the second ribbing is trapezoidal;
the second rib pressing height is greater than the first rib pressing height;
the width of the first rib pressing section is 0.05-0.15mm, the height of the first rib pressing section is 0.01-0.02mm, the width of the lower bottom of the second rib pressing section is 0.05-0.15mm, the width of the upper bottom of the second rib pressing section is 0.025-0.075mm, the width of the upper bottom of the second rib pressing section is smaller than the width of the lower bottom of the second rib pressing section, the height of the second rib pressing section is 0.03-0.05mm, a hole is punched, and a positioning hole is punched on the steel strip to obtain the steel strip with the positioning hole;
cutting edges once, and cutting a first outer contour of the steel reinforcing sheet on the steel belt;
secondary trimming, namely cutting a second outer contour of the steel reinforcing sheet on the steel belt; the second outer contour and the first outer contour constitute the basic shape of the steel reinforcing sheet; after the secondary trimming, the steel reinforcing sheet and the steel belt are provided with at least two connecting points;
a primary pressing line, wherein the first die is used for stamping the imprinting line for the first time to obtain a steel reinforcing sheet printed with the imprinting line to be modified;
and pressing the line for the second time, and performing secondary stamping line stamping through the second die to obtain the steel reinforcing sheet printed with the complete stamping line.
2. The process for fabricating an imprinting line of a steel reinforcing sheet for a 5G chip circuit board according to claim 1, further comprising, after the step of pressing the line twice, the steps of:
and bending, namely bending the steel reinforcing sheet printed with the complete imprinting line.
3. The process for machining the steel reinforcing sheet imprinting line for the 5G chip circuit board according to claim 2, further comprising, after the step of bending:
and blanking, and cutting off all connecting points of the steel reinforcing sheet and the steel belt to obtain a finished product of the steel reinforcing sheet.
4. The process for machining the steel reinforcing sheet imprinting line for the 5G chip circuit board according to claim 2, wherein the bending step further comprises the steps of:
and detecting, namely detecting the steel reinforcing sheet printed with the complete imprinting line, wherein the detection comprises width detection and depth detection of the imprinting line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110750784.XA CN113477803B (en) | 2021-07-01 | 2021-07-01 | Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110750784.XA CN113477803B (en) | 2021-07-01 | 2021-07-01 | Marking line processing die and technology of steel reinforcing sheet for 5G chip circuit board |
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| Publication Number | Publication Date |
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| CN113477803A CN113477803A (en) | 2021-10-08 |
| CN113477803B true CN113477803B (en) | 2023-04-07 |
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